EP1937757A1 - Method for the fabrication of high surface area ratio and high aspect ratio surfaces on substrates - Google Patents
Method for the fabrication of high surface area ratio and high aspect ratio surfaces on substratesInfo
- Publication number
- EP1937757A1 EP1937757A1 EP06710193A EP06710193A EP1937757A1 EP 1937757 A1 EP1937757 A1 EP 1937757A1 EP 06710193 A EP06710193 A EP 06710193A EP 06710193 A EP06710193 A EP 06710193A EP 1937757 A1 EP1937757 A1 EP 1937757A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- plasma
- polymer
- fabrication
- etching
- surface area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 title claims description 10
- 230000003075 superhydrophobic effect Effects 0.000 claims abstract description 28
- 229920003023 plastic Polymers 0.000 claims abstract description 23
- 239000004033 plastic Substances 0.000 claims abstract description 23
- 229920000642 polymer Polymers 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 238000001020 plasma etching Methods 0.000 claims abstract description 11
- 238000000926 separation method Methods 0.000 claims abstract description 3
- 230000001590 oxidative effect Effects 0.000 claims abstract 2
- 229920005372 Plexiglas® Polymers 0.000 claims description 19
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 17
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 14
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 14
- 230000008021 deposition Effects 0.000 claims description 9
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 7
- 238000004811 liquid chromatography Methods 0.000 claims description 6
- 229920000620 organic polymer Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 238000004528 spin coating Methods 0.000 claims description 6
- 238000005251 capillar electrophoresis Methods 0.000 claims description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 5
- 230000002209 hydrophobic effect Effects 0.000 claims description 5
- 230000005684 electric field Effects 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 3
- 229920000592 inorganic polymer Polymers 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 230000001747 exhibiting effect Effects 0.000 claims description 2
- 238000011209 electrochromatography Methods 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 abstract description 13
- 239000007788 liquid Substances 0.000 abstract description 10
- 238000009736 wetting Methods 0.000 abstract description 8
- 210000002381 plasma Anatomy 0.000 description 34
- 238000009832 plasma treatment Methods 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 16
- 239000001301 oxygen Substances 0.000 description 16
- 229910052760 oxygen Inorganic materials 0.000 description 16
- 238000000576 coating method Methods 0.000 description 8
- -1 Poly(tetrafluoroethylene) Polymers 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 6
- 238000000089 atomic force micrograph Methods 0.000 description 5
- 238000002045 capillary electrochromatography Methods 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000002086 nanomaterial Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 244000025254 Cannabis sativa Species 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000005370 electroosmosis Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- 229920002313 fluoropolymer Polymers 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000005329 nanolithography Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 229920001600 hydrophobic polymer Polymers 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000005348 self-cleaning glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000002174 soft lithography Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
- B05D3/141—Plasma treatment
- B05D3/142—Pretreatment
- B05D3/144—Pretreatment of polymeric substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2033/00—Use of polymers of unsaturated acids or derivatives thereof as moulding material
- B29K2033/04—Polymers of esters
- B29K2033/12—Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C08J2333/10—Homopolymers or copolymers of methacrylic acid esters
- C08J2333/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
Definitions
- This invention relates to a method of fabricating randomly rough columnar-like surfaces of high surface area ratio on polymer/plastic materials and to the application of such for the control of the wetting properties of such surfaces, of the liquid transport on surfaces made employing this method, and of the separation of liquids moving in microchannels the interior surfaces of which are modified according to the method described in this invention.
- the wettability is an important property of a surface in practical applications, governed by both the chemical nature (surface free energy) and the geometrical structure (surface roughness) of the surface.
- Two descriptions have been proposed in the art to describe the dependence of the wetting behavior of a surface on the surface roughness: the Wenzel and the Cassie-Baxter description.
- the Wenzel model (R.N. Wenzel, Ind. Eng. Chem. 1936, 28, p.
- a Wenzel surface is referred to as "sticky” and is characterized by a high contact angle hysteresis and a high tilt angle
- a Cassie-Baxter surface is referred to as "slippery” characterized by a small contact angle hysteresis and a small tilt angle
- the Cassie-Baxter state of superhydrophobic surfaces is characterized as "slippery", in the sense that a droplet does not stick but rolls on such surface.
- the pressure-driven flow of liquids inside microchannels with super-hydrophobic interior surfaces necessitates smaller pressure difference to maintain the flow.
- Surfaces of high aspect ratio have recently attracted interest for use in microfluidic devices for analytical purposes, where the chemistry of the walls becomes a significant component in the reaction.
- microstructures of high aspect ratio have been used in microfluidic devices for liquid chromatography or capillary electrochromatography, for providing high surface to volume ratio leading to enhancement of the analytical performance of the device (N. Lion et al., Electrophoresis 2003, 24, p.
- TiO 2 nanoparticles mixed with fluorinated copolymers were coated on substrates by spraying (C-T. Hsieh et al., Appl. Surf. Sci. 2005, 240, p. 318) to yield fluorinated surfaces of high surface roughness.
- Electrochemical deposition of Gold (F. Shi, et al., Adv. Mater. 2005, 17(8), p. 1005) and Silver (N. Zhao, et al., Langmuir 2005, 21, p. 4713) aggregates followed by chemisorption of a monolayer of n-dodecanothiol has been used for creating nanostructured surfaces of super-hydrophobic character.
- Electro-deposition of Copper has been also used in combination with lithography and etching to result in rough and patterned surfaces (dual scale roughness) of high surface area, which when hydrophobized gave superhydrophobic surfaces (NJ. Shirtcliffe, et al., Adv. Mater. 2004, 16(21), p. 1929, and Langmuir 2005, 21, p. 937).
- High-aspect-ratio-structured surfaces have been obtained by either polymer nanof ⁇ bers and aligned carbon nanotubes (Lin Feng, et al., Adv. Mat. 2002, 14(24), p.1857) or by photolithography and plasma etching of Si (M.
- a common feature of all the above mentioned methodologies is that the size and density of the (random or ordered) microstructures on the surfaces can be changed controllably in a way that water contact angles can increase with roughness and a transition between Wenzel type and Cassie-Baxter type (super-hydrophobic) surfaces is observed.
- the Cassie-Baxter surface state is not stable, as the corresponding energy is a local but not the global minimum (N. Patankar, Langmuir 2003, 19, p.
- the present invention provides a simple and fast process for the fabrication of random columnar-like high aspect ratio surfaces on a commercial silicone, a widespread material for the fabrication of microfluidic devices or any organic-inorganic polymer. Contrary to the above mentioned state of the art (N. Patankar, 2003) which requires that nanolithography is a necessary step for the fabrication of nanostructures, of which high aspect ratio nanolithography has high equipment and execution costs, the method provided by the present invention overcomes this step and thus, may be fulfilled in any laboratory having plasma etching equipment.
- the process described in the present invention may be applied for the fabrication of (a) surfaces of controlled wetting properties, (b) surfaces exhibiting low friction against droplet motion and the use of electric fields for control of droplet motion on these surfaces, (c) interior surfaces of micro-channels requiring reduced pressure for pressure- driven flow of liquids through these channels, (d) interior surfaces of micro-channels used in liquid chromatography or capillary electrochromatography or capillary electrophoresis of analytical microdevices. (e) surfaces of plastics with controlled wetting properties in combination with the desired transparency.
- the method of the present invention is applied, among others, to the plastics industry, micro-analytical devices, so called “smart” and self-cleaning surfaces of any size and nature, such as for example for the formation of substrates on glasswalls (self- cleaning glasses), on anti-corrosion surfaces, on vehicles, buildings etc. for protection of any surface exposed to the air and on which it is desirable to avoid deposition of pollutant particles.
- the surfaces on which the columnar structures are made are polymer/ plastic.
- the polymer contains elements in its volume and/or on its surface which have different etching behaviour (etchable versus un-etchable) in the plasma used.
- This invention also provides a method for the control of the wetting properties of the above surface, using columnar-like high aspect ratio structures with a proper chemical modification in plasmas, so as to render it highly hydrophilic or super-hydrophobic.
- Figure 1 is an SEM image of a tilted silicone surface (PDMS) after a 6 min SF 6 plasma treatment (initial film thickness: 6 ⁇ m). Nano-"grass” (i.e. nano-collumns) 1.45 ⁇ m-high is shown.
- Figure 2 is an AFM top view image of a silicone surface (PDMS) after 2 min treatment in SF 6 plasma. Roughness analysis gave an rms value of 133 nm and a periodicity of 240 nm. Initial film thickness: 20 ⁇ m.
- Figure 3 is an image of a water droplet- advancing 157°, receding 154°, hysteresis 3°- on a silicone surface (PDMS) after 2 min SF 6 plasma treatment and deposition of a 20 nm-thick fluorocarbon film. Initial PDMS film thickness: 2 ⁇ m.
- Figure 4 is an image of a water droplet during its rolling off (after being thrown on the surface) on a 6 ⁇ m thick silicone (PDMS) layer after treated for 6 min in SF 6 plasma and deposition of a 20 nm-thick fluorocarbon film.
- PDMS silicone
- Figure 5 shows line scans using a stylus profilometer of the surface of Plexiglass (PMMA- poly(methylmethacrylate)) sheets after Oxygen plasma treatment at various times (10, 30, 60, 120 min), as well as Atomic Force Microscope (AFM) scans after Oxygen plasma treatment for 2 and 5min.
- AFM Atomic Force Microscope
- Figure 6 is an image of a water droplet - advancing 155°, receding 148° , hysteresis 7°- on a commercial Plexiglas (PMMA-poly(methylmethacrylate) surface after 30min Oxygen plasma treatment in a high density plasma reactor, and spin coating deposition of a 20nm fluorocarbon film.
- the droplet is actually rolling on the plexiglass surface.
- Figure 7 shows the variation of the static, and advancing contact angle and hysteresis of a Plexiglass surface after Oxygen plasma treatment and spin-coating with 20nm fluorocarbon polymer, as a function of the time of plasma treatment.
- the surface becomes superhydrophobic after only 15min of plasma treatment. Shorter times of treatment are possible when plasma deposited fluorocarbon polymer is used.
- FIG. 8 shows Three-Dimensional Atomic-Force-Microscope (AFM) images of Plexiglass surfaces after Oxygen plasma treatment for 2 min (Fig. 8a) and 5 min (Fig. 8b).
- AFM Atomic-Force-Microscope
- the surface area ratio is 1.7 for 2min and 2.4 for 5min oxygen plasma treatment.
- a plasma treatment only between 5 to lOmin is enough to create high surface area ratio and lead to superhydrophobic surfaces after coating with plasma deposited fluorocarbon layer, which conforms better to the topography compared to the spin-coated fluorocarbon layer.
- the present invention presents a novel and easy to implement method for fabricating surfaces of high aspect ratio, based on plasma treatment of poly-dimethyl siloxane (PDMS).
- PDMS contains organic methyl (-CH 3 ) groups attached on an inorganic backbone (-[Si-O] n -).
- the present invention presents a novel and easy to implement technique for fabricating surfaces of high aspect ratio, based on plasma treatment of any other polymeric material containing elements of different plasma etching behavior.
- any commercial organic polymer/plastic such as Plexiglass (PMMA- poly(methylmethacrylate)) which contains components with different plasma etching behavior, and/or small amounts ( ⁇ 1%) of metallic elements (such as Al, Fe) as contaminants from the fabrication process of the polymer/plastic may be used for the realization of the invention.
- PMMA- poly(methylmethacrylate) which contains components with different plasma etching behavior, and/or small amounts ( ⁇ 1%) of metallic elements (such as Al, Fe) as contaminants from the fabrication process of the polymer/plastic may be used for the realization of the invention.
- any commercial organic polymer /plastic such as Plexiglass (PMMA- poly(methylmethacrylate)) which may have in addition to volume contaminants also surface contaminants (such as metallic or semiconducting elements or other material with different etching behaviour compared to that of the polymer) due to a previous sputtering or other nanometer thick coating process, may be used for the realization of the invention.
- PMMA- poly(methylmethacrylate) which may have in addition to volume contaminants also surface contaminants (such as metallic or semiconducting elements or other material with different etching behaviour compared to that of the polymer) due to a previous sputtering or other nanometer thick coating process.
- organic groups are expected to etch much faster compared to their inorganic etch resistant counterparts, which contribute to the formation of non- volatile products on etched surfaces and thus behave as masking materials to etching.
- siloxane As basic material, a commercial siloxane (Silguard 184 supplied by Dow Corning), thermally curable, is used. This is an innate hydrophobic material, widely used in the fabrication of microfluidic devices, giving a water contact angle of 105°.
- siloxane films by spin coating of the polymer and curing agent mixture on a substrate surface and subsequent thermal curing to result in 2 ⁇ m-2mm -thick films. These films are then exposed to SF 6 plasma treatment, in an inductively coupled plasma (ICP) reactor, under conditions ensuring high etch rates (pressure of 10 mTorr, plasma power 1900 W, and bias voltage -100 V).
- ICP inductively coupled plasma
- Figure 1 shows an SEM image of a PDMS surface after a 6 min treatment in SF 6 plasma. This image reveals densely packed nanocollumns on the surface of PDMS of average height of 1.45 ⁇ m and of diameter of the order of 100 nm. This dense distribution of nanocollumns on the PDMS surface is further verified by AFM imaging, as shown in Fig. 2. An average collumn diameter of 130 nm is indicated and a surface fraction of about 25% can be calculated as covered by the collumn tops.
- FC fluorocarbon film
- the enhancement of the surface hydrophobicity from 118° (contact angle on a flat FC surface) to 147° (contact angle on a nano-textured surface) as given by the Cassie-Baxter Equation (2) indicates a water droplet in contact with the nano-collumn tops covering a surface fraction ⁇ s equal to 30%, in good agreement with the estimation of the surface fraction covered by the collumn top surface based on the AFM image in Fig. 2.
- siloxane surfaces treated as described above are used as surfaces of minimal friction to water droplet motion. This is due to the small contact area of the droplets with the surface and the low contact angle hysteresis, as it was described in the previous paragraph. Therefore, the motion of droplets on such surfaces can be controlled by external forces such as the electrostatic force exerted on a droplet resting on a siloxane plasma-treated surface by means of a voltage applied on an electrode located to a small distance from the droplet.
- relatively small voltages (below 100 V) applied by a metallic pin located a few hundred microns away from the droplet are sufficient to cause droplet motion.
- Example 3 In another preferred embodiment of the present invention, the method described above for fabrication of superhydrophobic surfaces is used to modify the interior surface of microchannels fabricated in PDMS or in other polymeric material through soft lithography or other patterning technique (for example, photolithography). If the flow inside the microchannels is pressure-driven, a small pressure difference would suffice to maintain the flow inside the microchannels, due to the non-sticky but slippery nature of the superhydrophobic interior surfaces of the microchannels.
- the method described above is used for the fabrication of columnar-like nanostructures inside the microchannels of an analytical microdevice (such as those used for liquid chromatography, or capillary electrochromatography or capillary electrophoresis or other relevant analytical technique).
- an analytical microdevice such as those used for liquid chromatography, or capillary electrochromatography or capillary electrophoresis or other relevant analytical technique.
- the height of the nano-columns is comparable to the height of the microchannel, and the density of the fabricated nanostructures can be adjusted according to the surface-to-volume requirements of the device for enhanced analytical performance (high resolution, short analysis time).
- the high surface area of the very rough microchannels can be used for adjustment of the zeta potential (surface charge) and the electroosmotic flow.
- Example 5 Example 5:
- Plexiglass Poly(methylmethacrylate) are treated in an oxygen plasma.
- the commercially available polymer in thicknesses from 1 to several mm, includes less than 1% metallic impurities which do not etch in the oxygen plasma, as we verified by EDAX analysis of the sheets.
- Plexiglass has a smooth surface, is transparent to visible light, and has a contact angle of 60°, and is a material widely used in microfluidic devices.
- ICP inductively coupled plasma
- FIG. 5 shows line scans using a profilometer or an Atomic Force Microscope (AFM) of a plexiglass surface after treatment in Oxygen plasma for several instances. This image reveals nanocolumns on the surface of plexiglass of peak to peak height ranging from 0.25 to 8 ⁇ m depending on the plasma treatment time.
- AFM Atomic Force Microscope
- FC hydrophobicity results in the enhancement of the contact angle of water droplets on the surface to more than 150° (Fig. 6), after a 15min treatment in Oxygen plasma.
- the dense "forest" of nano- collumns shown in the profilometer or AFM scans (Fig. 5) as well as the AFM images of Figures 8a and 8b cannot allow the water to penetrate and wet the surface of the collumns, thus water droplets are sitting on a composite solid and air surface, leading to low values of contact angle hysteresis (average of 7°).
- the low hysteresis is further evidenced by the rolling of water droplets when thrown on the surface (Fig. 6) and the inability to detach a droplet from the needle using contact with the surface. All these observations provide evidence that water droplets on these surfaces behave according to the Cassie-Baxter model.
- treatment times refer to spin coated fluorocarbon films, while shorter times are obtained with plasma deposited fluorocarbon films, when the surface becomes syperhydrophobic after approximately 5-10min of oxygen plasma treatment and plasma fluorocarbon deposition.
- AFM images of Figures 8a and 8b show that the surface area ratio is 1.7 for 2min treatment, while it raises to 2.4 for 5min treatment.
- the superhydrophobic plexiglass or other oxygen plasma treated organic polymer may however be milky (less transparent) after the plasma treatment.
- the surface roughness and wettability can be adjusted without sacrificing the transparency of the plastic and in fact tuning the minimum cutoff wavelength of light transmission through the plastic.
- This can be accomplished by increasing the amount of unetchable metallic or other elements that exist as contaminants in the plastic and or changing the plasma etching conditions, such as the bias voltage.
- the surface roughness increased after oxygen plasma treatment and the surfaces become superhydrophobic after Teflon coating before losing their transparency.
- Plexiglass surfaces treated as described above are used as surfaces of minimal friction to water droplet motion. This is due to the small contact area of the droplets with the surface and the low contact angle hysteresis, as it was described in the previous paragraph.
- the method described above for the fabrication of superhydrophobic surfaces is used to modify the interior surface of microchannels fabricated in Plexiglass. If the flow inside the microchannels is pressure- driven, a small pressure difference would suffice to maintain the flow inside the microchannels, due to the non-sticky but slippery nature of the superhydrophobic interior surfaces of the microchannels.
- Example 9
- the method described above was used for the fabrication of columnar-like nanostructures inside the microchannels of an analytical microdevice (such as those used for liquid chromatography, or capillary electrochromatography or capillary electrophoresis or other relevant analytical technique).
- the height of the nano-columns may be comparable to the height of the microchannel, and the density of the fabricated nanostructures can be adjusted according to the surface-to- volume requirements of the device for enhanced analytical performance (high resolution, short analysis time).
- the high surface area of the very rough microchannels can be used for adjustment of the zeta potential (surface charge) and the electroosmotic flow.
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GR20050100473A GR1006890B (en) | 2005-09-16 | 2005-09-16 | Method for the fabrication of high surface area ratio and high aspect ratio surfaces on substrates |
PCT/GR2006/000011 WO2007031799A1 (en) | 2005-09-16 | 2006-03-08 | Method for the fabrication of high surface area ratio and high aspect ratio surfaces on substrates |
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EP1937757B1 EP1937757B1 (en) | 2018-10-17 |
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EP06710193.1A Not-in-force EP1937757B1 (en) | 2005-09-16 | 2006-03-08 | Method for the fabrication of high surface area ratio and high aspect ratio surfaces on substrates |
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US (1) | US20080296260A1 (en) |
EP (1) | EP1937757B1 (en) |
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GR1006618B (en) | 2008-06-13 | 2009-12-03 | Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος" | Method for the fabrication of periodic structures on polymers using plasma processes |
US9034277B2 (en) | 2008-10-24 | 2015-05-19 | Honeywell International Inc. | Surface preparation for a microfluidic channel |
KR101071778B1 (en) * | 2008-10-29 | 2011-10-11 | 현대자동차주식회사 | Fabrication method of Nano Structured Surface(NSS) on Proton Exchange Membrane(PEM) and Membrane Electrode Assembly(MEA) for Fuel Cells |
JP5435824B2 (en) | 2009-02-17 | 2014-03-05 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | Method for fabricating a microstructure |
US9085019B2 (en) * | 2010-10-28 | 2015-07-21 | 3M Innovative Properties Company | Superhydrophobic films |
US8968831B2 (en) | 2011-12-06 | 2015-03-03 | Guardian Industries Corp. | Coated articles including anti-fingerprint and/or smudge-reducing coatings, and/or methods of making the same |
CN102583233B (en) * | 2012-03-14 | 2015-01-14 | 北京大学 | Preparation method of superhydrophilic polydimethylsiloxane film on basis of nano forest template |
GR1009056B (en) | 2014-03-12 | 2017-06-23 | Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος" | Gaseous plasma nanotextured substrates for selective enrichment of cancer cells |
US20170044340A1 (en) * | 2014-05-27 | 2017-02-16 | Sabic Global Technologies B.V. | Self-cleansing super-hydrophobic polymeric materials for anti-soiling |
GR1009057B (en) | 2014-06-03 | 2017-06-23 | Ευαγγελος Μιχαηλ Γογγολιδης | Method to fabricate chemically-stable plasma-etched substrates for direct covalent biomolecule immobilization |
GR1009425B (en) | 2015-09-09 | 2019-01-15 | Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων "Δημοκριτος" | Plasma micro/nano-structured polymeric microfluidic device for purifying nucleic acids |
CN105776125B (en) * | 2016-03-31 | 2017-06-09 | 东南大学 | A kind of super wellability surface of wedge shaped patternization and preparation method thereof |
CN110433881B (en) * | 2019-09-02 | 2021-10-22 | 丹娜(天津)生物科技股份有限公司 | Hydrophilic modification method for micro-fluidic chip micro-channel material |
GR1010186B (en) | 2019-09-25 | 2022-03-02 | Nanoplasmas Private Company, | Diagnostic chip for analyzing presence of bacteria in a sample |
CN113145418A (en) * | 2020-01-07 | 2021-07-23 | 中国石油天然气集团有限公司 | Preparation method of super-hydrophobic material and super-hydrophobic material |
CN113134709B (en) * | 2021-03-26 | 2023-08-22 | 中科听海(苏州)电子科技有限责任公司 | Preparation method of super-hydrophobic gradient coating for corrosion prevention of submarine sonar shell |
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US5290397A (en) * | 1992-08-21 | 1994-03-01 | Cornell Research Foundation, Inc. | Bilayer resist and process for preparing same |
JP3940546B2 (en) * | 1999-06-07 | 2007-07-04 | 株式会社東芝 | Pattern forming method and pattern forming material |
KR100480772B1 (en) * | 2000-01-05 | 2005-04-06 | 삼성에스디아이 주식회사 | Forming method of micro structure with surface roughness of nano scale |
US6783914B1 (en) * | 2000-02-25 | 2004-08-31 | Massachusetts Institute Of Technology | Encapsulated inorganic resists |
US6440637B1 (en) * | 2000-06-28 | 2002-08-27 | The Aerospace Corporation | Electron beam lithography method forming nanocrystal shadowmasks and nanometer etch masks |
US6518194B2 (en) * | 2000-12-28 | 2003-02-11 | Thomas Andrew Winningham | Intermediate transfer layers for nanoscale pattern transfer and nanostructure formation |
US6893705B2 (en) * | 2001-05-25 | 2005-05-17 | Massachusetts Institute Of Technology | Large area orientation of block copolymer microdomains in thin films |
US6746825B2 (en) * | 2001-10-05 | 2004-06-08 | Wisconsin Alumni Research Foundation | Guided self-assembly of block copolymer films on interferometrically nanopatterned substrates |
US6911400B2 (en) * | 2002-11-05 | 2005-06-28 | International Business Machines Corporation | Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same |
US7545010B2 (en) * | 2003-08-08 | 2009-06-09 | Canon Kabushiki Kaisha | Catalytic sensor structure |
US7268432B2 (en) * | 2003-10-10 | 2007-09-11 | International Business Machines Corporation | Interconnect structures with engineered dielectrics with nanocolumnar porosity |
US7262075B2 (en) * | 2004-01-08 | 2007-08-28 | Georgia Tech Research Corp. | High-aspect-ratio metal-polymer composite structures for nano interconnects |
US7030495B2 (en) * | 2004-03-19 | 2006-04-18 | International Business Machines Corporation | Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby |
US8287957B2 (en) * | 2004-11-22 | 2012-10-16 | Wisconsin Alumni Research Foundation | Methods and compositions for forming aperiodic patterned copolymer films |
US8133534B2 (en) * | 2004-11-22 | 2012-03-13 | Wisconsin Alumni Research Foundation | Methods and compositions for forming patterns with isolated or discrete features using block copolymer materials |
US7514764B2 (en) * | 2005-03-23 | 2009-04-07 | Wisconsin Alumni Research Foundation | Materials and methods for creating imaging layers |
JP4965835B2 (en) * | 2005-03-25 | 2012-07-04 | キヤノン株式会社 | Structure, manufacturing method thereof, and device using the structure |
EP1732121A1 (en) * | 2005-06-06 | 2006-12-13 | STMicroelectronics S.r.l. | Process for manufacturing a high-quality SOI wafer |
JP4421582B2 (en) * | 2006-08-15 | 2010-02-24 | 株式会社東芝 | Pattern formation method |
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US20080296260A1 (en) | 2008-12-04 |
EP1937757B1 (en) | 2018-10-17 |
WO2007031799A1 (en) | 2007-03-22 |
GR20050100473A (en) | 2007-04-25 |
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