EP1936342A1 - Sensoranordnung zur Temperaturmessung - Google Patents

Sensoranordnung zur Temperaturmessung Download PDF

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Publication number
EP1936342A1
EP1936342A1 EP07122485A EP07122485A EP1936342A1 EP 1936342 A1 EP1936342 A1 EP 1936342A1 EP 07122485 A EP07122485 A EP 07122485A EP 07122485 A EP07122485 A EP 07122485A EP 1936342 A1 EP1936342 A1 EP 1936342A1
Authority
EP
European Patent Office
Prior art keywords
circuit carrier
sensor arrangement
temperature
measured
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07122485A
Other languages
German (de)
English (en)
French (fr)
Inventor
Gert Mau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sitronic Gesellschaft fuer Elektrotechnische Ausruestung mbH and Co KG
Original Assignee
Sitronic Gesellschaft fuer Elektrotechnische Ausruestung mbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sitronic Gesellschaft fuer Elektrotechnische Ausruestung mbH and Co KG filed Critical Sitronic Gesellschaft fuer Elektrotechnische Ausruestung mbH and Co KG
Publication of EP1936342A1 publication Critical patent/EP1936342A1/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element

Definitions

  • the invention relates to a sensor arrangement for measuring the temperature of a surface.
  • Such sensor arrangements preferably for the temperature measurement of approximately planar surfaces, are variously known.
  • a surface temperature sensor is known in which a heat-conducting surface contact part is pressed by means of a spring against the surface to be measured.
  • the surface contact part contains an electrically isolated mounted temperature sensor.
  • the invention has for its object to provide a cost-effective sensor arrangement, with which the temperature of an approximately flat surface, in particular a disc can be detected.
  • the sensor arrangement according to the invention for measuring the temperature of a surface has a circuit carrier, on which at least one temperature sensor is mounted, and a further circuit carrier, on which an electrical or electronic circuit is equipped, and at least two connecting elements between the circuit carriers. It is designed resiliently at least one of the connecting elements.
  • the structure is mounted to the surface to be measured so that an end face of the first circuit substrate contacts the surface. This causes the heat to flow from the surface to be measured to the temperature sensor.
  • the end face of the circuit carrier that touches the surface to be measured is metallized.
  • the metallization of the front side is connected to a metallization on the top side and / or bottom side of the circuit carrier. This metallization is again runs in the immediate vicinity of the temperature sensor or touches or encloses this.
  • the front side of the circuit carrier is preferably designed with a smooth and rounded at least at the edges surface. Thereby, it allows the sensor arrangement to be slidably displaced or rotated along the surface to be measured, which is particularly advantageous when installing or removing the sensor arrangement, e.g. when the sensor assembly is fastened by means of a bayonet closure.
  • the connecting elements between the circuit carriers are preferably metallic springs, in particular steel or bronze springs, which ensure a secure pressing of the first circuit carrier to the surface.
  • the connecting elements preferably have a good solderable surface.
  • the circuit carriers preferably have recesses in the area of the resilient connecting elements, which at least partially surround the connecting elements. These recesses are preferably at least partially metallized.
  • the recesses of the circuit carrier are constructed so that the ends of the resilient connecting elements abut the circuit carrier and the forces act perpendicular to the surface to be measured on the contact surface.
  • the recesses of the circuit carrier are constructed so that the ends of the resilient connecting elements on the circuit carrier have a gap to the vertical walls of the recess. This gap is filled during assembly, in particular with solder.
  • the two circuit carriers are rigidly connected to each other before mounting by webs of the same material as the circuit carrier. These bridges are in one operation after assembly of the connecting elements separately.
  • another temperature sensor which approximately determines the temperature of the sensor housing or of the interior is located on the second circuit carrier in the immediate vicinity of the surface to be measured.
  • the measured value of the temperature sensor which is located in the immediate vicinity of the surface to be measured and whose measured value corresponds to the temperature of the surface to be measured, is corrected by the measured value of the second temperature sensor.
  • further sensors are located on one of the circuit carriers, in particular Temperature sensors, humidity sensors or light sensors, attached.
  • the circuit carrier is preferably mounted in the interior of a motor vehicle and serves to measure the temperature of the windshield.
  • it can preferably be integrated into a rearview mirror base as a housing.
  • FIG. 1 is a sensor assembly 1 for measuring temperature on a nearly flat, formed by the windshield 2 of a motor vehicle surface.
  • the sensor arrangement 1 has a temperature sensor 3 , which is arranged on a circuit carrier 4 in the immediate vicinity of an end face 4 'of the circuit carrier 4.
  • the front side 4 ' is metallized and runs parallel to the surface of the windshield 2.
  • the circuit substrate 4 is connected by resilient elements 5 and 5' to a second circuit carrier 6 .
  • the sensor arrangement 1 is of a housing 10 which protects the sensor arrangement and has a leading function for the circuit carrier 4.
  • FIG. 2 A detailed view of the connection of the circuit carriers 4 and 6 is shown in FIG. 2 shown.
  • recesses 7 On the respective opposite sides of the circuit substrate 4 and 6 recesses 7 are mounted, which receive the resilient elements 5.
  • the gap between the resilient elements 5 and the walls 8 of the recesses 7, which receive the force of the resilient elements is filled with solder 9 , so that the forces act only perpendicular to solder joints.
  • the further sensors may include a temperature sensor 3 'for measuring the temperature of the interior and an air humidity sensor.
  • the two other sensors can be used together with the temperature sensor for measuring the surface temperature for determining the fogging of the windscreen.
EP07122485A 2006-12-22 2007-12-06 Sensoranordnung zur Temperaturmessung Withdrawn EP1936342A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006062115A DE102006062115B4 (de) 2006-12-22 2006-12-22 Sensoranordnung zur Temperaturmessung

Publications (1)

Publication Number Publication Date
EP1936342A1 true EP1936342A1 (de) 2008-06-25

Family

ID=39231052

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07122485A Withdrawn EP1936342A1 (de) 2006-12-22 2007-12-06 Sensoranordnung zur Temperaturmessung

Country Status (4)

Country Link
US (1) US7909509B2 (ja)
EP (1) EP1936342A1 (ja)
JP (1) JP2008209402A (ja)
DE (1) DE102006062115B4 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2241870A1 (en) * 2009-04-17 2010-10-20 Sensirion AG An assembly comprising a substrate and a sensor pressed against the substrate
DE102018004075A1 (de) * 2018-05-22 2019-11-28 Erwin Quarder Systemtechnik Gmbh Temperatursensoreinheit
DE102020200139A1 (de) * 2020-01-08 2021-07-08 Volkswagen Aktiengesellschaft Anordnung zur Temperaturmessung

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010003967B3 (de) * 2010-01-02 2011-02-10 Qundis Gmbh Heizkostenverteiler
DE102011103331B3 (de) * 2011-05-27 2012-11-29 Inor Process Ab Temperaturfühler für ein Kontaktthermometer
US10018514B2 (en) * 2014-02-17 2018-07-10 Haier Us Appliance Solutions, Inc. Cooktop temperature sensors and methods of operation
DE102014015586B3 (de) * 2014-10-21 2016-03-31 Webasto SE Heizgerät
DE102017122597A1 (de) * 2017-09-28 2019-03-28 Tdk Electronics Ag Sensor mit Anpressfederung
CN108168732B (zh) * 2017-12-21 2019-12-24 黄石永兴隆电子有限公司 一种测温样本制作冶具
JP7309744B2 (ja) 2018-03-23 2023-07-18 ワットロー・エレクトリック・マニュファクチャリング・カンパニー 熱絶縁を備えた温度検出プローブ
EP4123274A1 (en) * 2021-07-19 2023-01-25 MEAS France Sensor with printed circuit board based contact

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1028596A (en) * 1963-08-21 1966-05-04 Landis & Gyr Ag Temperature regulators
GB1379888A (en) * 1971-06-08 1975-01-08 Sonnenschein Accumulatoren Charging systems for batteries
DE10227454A1 (de) 2001-11-12 2003-05-22 Temperaturmestechnik Geraberg Verfahren zur Temperaturmessung sowie Anlegetemperaturfühler
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
DE69907493T2 (de) 1998-10-09 2004-03-18 Claud S. Gordon Co., Richmond Oberflächentemperatursensor
WO2006108367A1 (de) * 2005-04-12 2006-10-19 sitronic Ges. für elektrotechnische Ausrüstung mbH & Co. KG Sensoranordnung zur temperaturmessung

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DE2706326C2 (de) * 1977-02-15 1982-04-15 Fa. Gustav Kolb, 5983 Balve Steckverbindung für ein Tauchthermoelement
GB2036966B (en) * 1978-10-16 1983-05-25 Comark Electronics Ltd Surface temperature measurement devices
US4524778A (en) * 1983-07-01 1985-06-25 American Thermometer Co., Inc. Skin temperature indicating and recording device
US4708020A (en) * 1986-04-07 1987-11-24 Macmillan Bloedel Limited Temperature compensating continuous panel tester
GB2209093B (en) * 1987-08-27 1992-04-08 Stc Plc Temperature probe
DE4244189C2 (de) * 1992-12-24 1995-06-01 Busch Dieter & Co Prueftech Anlegetemperaturfühler
US5441344A (en) * 1993-10-22 1995-08-15 Cook, Iii; Walter R. Temperature measurement and display of a cooking surface
US5492482A (en) * 1994-06-07 1996-02-20 Fluke Corporation Compact thermocouple connector
JPH09210802A (ja) * 1996-02-02 1997-08-15 Sharp Corp 表面実装用温度検出素子
JP3418407B2 (ja) * 1997-08-11 2003-06-23 大倉電気株式会社 プリント配線板の測温型外部接続機構
US6193414B1 (en) * 1998-01-06 2001-02-27 Alfiero Balzano Dual protected instant temperature detector
US6077228A (en) * 1998-11-04 2000-06-20 Schonberger; Milton Breast temperature scanner
US6504392B2 (en) * 1999-03-26 2003-01-07 International Business Machines Corporation Actively controlled heat sink for convective burn-in oven
DE19938812A1 (de) * 1999-08-19 2001-02-22 Diehl Stiftung & Co Elektronischer Heizkostenverteiler
JP2002006289A (ja) * 2000-06-21 2002-01-09 Seiko Epson Corp 液晶表示モジュール
DE10051867A1 (de) * 2000-10-19 2002-04-25 Eberspaecher J Gmbh & Co Heizgerät, insbesondere Fahrzeugheizgerät, mit Temperaturfühler
DE10214368B4 (de) * 2002-03-30 2007-09-13 Robert Bosch Gmbh Energiespeichermodul und dessen Verwendung für ein Elektrogerät
KR100698046B1 (ko) * 2002-12-24 2007-03-23 엘지.필립스 엘시디 주식회사 백라이트 유닛 어셈블리
US6877896B2 (en) * 2002-12-26 2005-04-12 Chunghwa Picture Tubes, Ltd. Ambient temperature control apparatus used for measuring display panel
US7197927B2 (en) * 2004-02-16 2007-04-03 Sitronic Gesellschaft für Elektrotechnische Ausrustüng mbH & Co. KG Sensor for determining the interior humidity and fogging up tendency and fastening device of the sensor
DE102006057339A1 (de) * 2005-12-23 2007-07-12 BSH Bosch und Siemens Hausgeräte GmbH Haltevorrichtung
US7416332B2 (en) * 2006-03-29 2008-08-26 Harris Corporation Flexible circuit temperature sensor assembly for flanged mounted electronic devices
US7465088B2 (en) * 2006-06-22 2008-12-16 Microsoft Corporation Thermal sensing system
DE202007001719U1 (de) * 2007-02-06 2007-05-10 Raytek Gmbh Temperaturmessvorrichtung
DE102008038875B3 (de) * 2008-08-13 2010-01-28 Abb Technology Ag Temperaturfühler für eine prozesstechnische industrielle Anlage

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1028596A (en) * 1963-08-21 1966-05-04 Landis & Gyr Ag Temperature regulators
GB1379888A (en) * 1971-06-08 1975-01-08 Sonnenschein Accumulatoren Charging systems for batteries
DE69907493T2 (de) 1998-10-09 2004-03-18 Claud S. Gordon Co., Richmond Oberflächentemperatursensor
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
DE10227454A1 (de) 2001-11-12 2003-05-22 Temperaturmestechnik Geraberg Verfahren zur Temperaturmessung sowie Anlegetemperaturfühler
WO2006108367A1 (de) * 2005-04-12 2006-10-19 sitronic Ges. für elektrotechnische Ausrüstung mbH & Co. KG Sensoranordnung zur temperaturmessung
DE102005016896B3 (de) 2005-04-12 2006-10-26 Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG Sensoranordnung zur Temperaturmessung

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2241870A1 (en) * 2009-04-17 2010-10-20 Sensirion AG An assembly comprising a substrate and a sensor pressed against the substrate
DE102018004075A1 (de) * 2018-05-22 2019-11-28 Erwin Quarder Systemtechnik Gmbh Temperatursensoreinheit
DE102020200139A1 (de) * 2020-01-08 2021-07-08 Volkswagen Aktiengesellschaft Anordnung zur Temperaturmessung

Also Published As

Publication number Publication date
US7909509B2 (en) 2011-03-22
US20080212645A1 (en) 2008-09-04
DE102006062115B4 (de) 2010-08-19
DE102006062115A1 (de) 2008-06-26
JP2008209402A (ja) 2008-09-11

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