EP1906466A1 - Film piézoélectrique, son processus de fabrication et élément piézoélectrique - Google Patents

Film piézoélectrique, son processus de fabrication et élément piézoélectrique Download PDF

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Publication number
EP1906466A1
EP1906466A1 EP20070018953 EP07018953A EP1906466A1 EP 1906466 A1 EP1906466 A1 EP 1906466A1 EP 20070018953 EP20070018953 EP 20070018953 EP 07018953 A EP07018953 A EP 07018953A EP 1906466 A1 EP1906466 A1 EP 1906466A1
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EP
European Patent Office
Prior art keywords
piezoelectric film
film
target
forming
elements
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EP20070018953
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German (de)
English (en)
Inventor
Takamichi Fujii
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Fujifilm Corp
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Fujifilm Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/088—Oxides of the type ABO3 with A representing alkali, alkaline earth metal or Pb and B representing a refractory or rare earth metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based

Definitions

  • This invention relates to a process of forming a piezoelectric film by a phase growth method using plasma; a piezoelectric film formed by the process, a piezoelectric element using the piezoelectric film; and a liquid discharge system using the piezoelectric element.
  • a piezoelectric element comprising piezoelectric film having piezoelectricity where it is expanded and contracted according to the intensity of an applied electric field and an electrode for applying an electric field to the piezoelectric film has been used, for instance, as an actuator for an inkjet type recording head.
  • a piezoelectric material a perovskite oxide having a ferroelectricity such as zircon titanate (PZT) has been known.
  • the piezoelectric film can be formed by a vapor phase growth method such as sputtering.
  • a vapor phase growth method such as sputtering.
  • Pb loss is apt to be generated when the piezoelectric film is formed at a high temperature. Accordingly, in the piezoelectric film comprising a Pb-containing perovskite oxide, it is necessary to obtain a film-forming condition under which a perovskite crystal less in the pyrochlore phase is better grown, and the Pb loss is less apt to be generated.
  • Japanese Unexamined Patent Publication No. 6(1994)-049638 the relation between the film-forming pressure and the amount of Pb in the film is obtained. See Figures 1 and 2 of Japanese Unexamined Patent Publication No. 6(1994)-049638 .
  • Japanese Unexamined Patent Publication No. 6(1994)-049638 discloses that the film-forming pressure and the film-forming temperature are preferably 1 to 100mTorr and 600 to 700°C, respectively. See Claims 2 and 5 of Japanese Unexamined Patent Publication No. 6(1994)-049638 .
  • a stress is applied to the piezoelectric film in the cooling step during or after the film-forming step due to difference in the thermal expansion coefficient between the substrate and the piezoelectric film when the film-forming temperature is high and there is a fear that cracks or the like are generated in the film, whereby lower film-forming temperature is preferable.
  • the substrate may be of a glass or the like which is relatively low in thermal resistance, whereby width in selecting the substrate is increased, which is preferable.
  • Japanese Unexamined Patent Publication No. 2005-350735 there is disclosed a method where, in a method of making film of oxide by the sputtering by the use of metal atoms struck out from a target opposed to the substrate, a film-forming condition is controlled so that the average free stroke of the atoms of the target forming metal is longer than the substrate-target distance and that the film of the oxide can be preferentially oriented in a particular orientation by firing the film at a temperature not lower than a certain temperature after formation of the film.
  • Japanese Unexamined Patent Publication No. 2005-350735 does not overcome the problem of the present invention to provide a process of stably and efficiently forming high quality film by a vapor phase growth method using sputtering or the like.
  • the film-forming speed is too low, it is difficult to grow a high quality crystal.
  • the primary object of the present invention is to clear the factors of the film-forming condition which affect the characteristics of the film in a vapor phase growth method using sputtering or the like, thereby providing a piezoelectric film-forming process of stably and efficiently forming high quality piezoelectric film by a gas phase growth method using sputtering or the like.
  • the object of the present invention is to provide a process of forming a piezoelectric film in which a perovskite crystal less in the pyrochlore phase can be stably grown and a piezoelectric film formed by the film-forming method.
  • the object of the present invention is to provide a process of forming a piezoelectric film comprising a Pb-containing perovskite oxide such as PZT in which a perovskite crystal less in the pyrochlore phase can be stably grown and a generation of the Pb loss can be stably suppressed, and a piezoelectric film formed by the film-forming method.
  • a Pb-containing perovskite oxide such as PZT in which a perovskite crystal less in the pyrochlore phase can be stably grown and a generation of the Pb loss can be stably suppressed
  • the piezoelectric film forming process of the present invention comprises the step of forming on a substrate, a piezoelectric film comprising the elements of a target by opposing a target having a composition according to the composition of film to be formed, and releasing the elements from the target by a vapor phase growth method using plasma, wherein the following formulae (1) and (2) are satisfied.
  • the "film-forming temperature Ts (°C)" means a temperature at the center of the substrate on which the film is to be formed.
  • the distance between the substrate and the target is defined to be a distance between the center of the substrate surface facing the target and the target as measured perpendicularly to the target.
  • the “distance between the substrate and the target” is the average of the respective the substrate-target distances.
  • a second piezoelectric film forming process comprising the step of forming on a substrate, a piezoelectric film comprising the elements of a target by opposing a target having a composition according to the composition of film to be formed, and releasing the elements from the target by a vapor phase growth method using plasma, wherein the following formulae (3) and (4) are satisfied.
  • the film be formed at a film-forming speed not lower than 0.5 ⁇ m/h.
  • piezoelectric film comprising at least one kind of perovskite oxide (may include an unavoidable impurity).
  • the piezoelectric film forming process of the present invention is applicable to piezoelectric film comprising at least one kind of perovskite oxide (may include an unavoidable impurity) represented by the following general formula (P).
  • a a B b O 3 (P) (wherein A represents at least one kind of elements forming the A site including Pb, B represents at least one kind of elements forming the B site including an element selected from an element group consisting of Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Sc, Co, Cu, In, Sn, Ga, Zn, Cd, Fe, Ni, and lanthanide elements, O represents an oxygen atom and a and b may deviate from 1.0 in the range where perovskite structure is formed though a and b are 1.0 by standard.)
  • the piezoelectric film forming process of the present invention is also applicable to piezoelectric film comprising at least one kind of perovskite oxide (may include an unavoidable impurity) represented by the following general formula (P-1).
  • the piezoelectric film of the present invention is piezoelectric film comprising at least one kind of perovskite oxide (may include an unavoidable impurity) represented by the following general formula (P) and formed by a vapor phase growth method using plasma where a piezoelectric film comprising the elements of a target is formed by opposing a target having a composition according to the composition of film to be formed, and releasing the elements from the target, wherein the following formulae (1) and (2) are satisfied.
  • A represents at least one kind of elements forming the A site including Pb
  • B represents at least one kind of elements forming the B site including an element selected from an element group consisting of Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Sc, Co, Cu, In, Sn, Ga, Zn, Cd, Fe, Ni, and lanthanide elements
  • O represents an oxygen atom and a and b may deviate from 1.0 in the range where perovskite structure is formed though a and b are 1.0 by standard.
  • a second piezoelectric film comprising at least one kind of perovskite oxide (may include an unavoidable impurity) represented by the following general formula (P) and formed by a gas phase growth method using plasma where a piezoelectric film comprising the elements of a target is formed by opposing a target having a composition according to the composition of film to be formed, and releasing the elements from the target, wherein the following formulae (3) and (4) are satisfied.
  • P general formula
  • A represents at least one kind of elements forming the A site including Pb
  • B represents at least one kind of elements forming the B site including an element selected from an element group consisting of Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Sc, Co, Cu, In, Sn, Ga, Zn, Cd, Fe, Ni, and lanthanide elements
  • 0 represents an oxygen atom and though the number moles a of the A site elements is 1.0 and the number of moles b of the B site elements is 1.0 by standard, the number of moles of the A site elements and B site elements may deviate from 1.0 in the range where perovskite structure is formed
  • the piezoelectric film of the present invention is also applicable to at least one kind of the perovskite oxide represented by the following general formula (P-1).
  • a piezoelectric film which is free of the Pb loss and where 1.0 ⁇ a, and preferably 1. 0 ⁇ a ⁇ 1. 3 can be obtained.
  • the piezoelectric element of the present invention comprises piezoelectric film and an electrode for applying an electric field to the piezoelectric film.
  • a liquid discharge system comprising the piezoelectric electric element and a liquid storing/discharging member comprising a liquid storing chamber in which liquid is stored and a liquid discharge port through which the liquid is externally discharged.
  • the present invention clearly shows that, in the method of forming the piezoelectric film where piezoelectric film comprising the elements of a target is formed on a substrate by releasing the elements from the target having a composition according to the composition of film to be formed, with the target opposed to the substrate, by a vapor phase growth method using plasma such as the sputtering, the characteristics of the piezoelectric film and the film-forming speed to be formed largely depends upon two factors, the film-forming temperature Ts (°C) and the substrate-target distance D (mm).
  • the film-forming condition is determined on the basis of the relation between the above two factors which affect the characteristics of the film to be formed and the characteristics of the film to be formed. Accordingly, a higher quality piezoelectric film can be stably and more efficiently formed.
  • a perovskite crystal less in the pyrochlore phase in forming a piezoelectric film comprising perovskite oxide, a perovskite crystal less in the pyrochlore phase can be stably grown.
  • a piezoelectric film comprising Pb-containing perovskite oxide such as PZT in forming a piezoelectric film comprising Pb-containing perovskite oxide such as PZT, a perovskite crystal less in the pyrochlore phase can be stably grown and PB loss can be stably suppressed.
  • the piezoelectric film forming process of the present invention comprises the step of forming on a substrate, a piezoelectric film comprising the elements of a target by opposing a target having a composition according to the composition of film to be formed, and releasing the elements from the target by a gas phase growth method using plasma, wherein the film-forming condition is determined to satisfy the following formulae (1) and (2). 400 ⁇ Ts °C ⁇ 500 30 ⁇ D mm ⁇ 80
  • the second piezoelectric film forming process of the present invention comprises the step of forming on a substrate, a piezoelectric film comprising the elements of a target by opposing a target having a composition according to the composition of film to be formed, and releasing the elements from the target by a gas phase growth method using plasma, wherein the film-forming condition is determined to satisfy the following formulae (3) and (4).
  • Figure 1A is a cross-sectional view showing in brief an RF sputtering system
  • Figure 1B is a schematic cross-sectional view showing formation of film.
  • the RF sputtering system 1 briefly comprises a vacuum chamber 10 having therein a heater 11 on which a substrate B is mounted and which can heat the mounted substrate B to a predetermined temperature and a plasma electrode (cathode electrode) 12 which generates plasma.
  • the heater 11 and the plasma electrode 12 are spaced from each other so that they are opposed to each other and a target T having a composition according to the composition of the film to be formed is mounted on the plasma electrode 12.
  • the plasma electrode 12 is connected to a high frequency power source 13.
  • the substrate B and the target T are spaced from each other (the substrate-target distance) by D(mm).
  • a gas introduction tube 14 which introduces gas G necessary to form the film into the vacuum chamber 10 and a gas discharge tube 15 which discharge (V) the gas in the vacuum chamber 10 are mounted on the vacuum chamber 10.
  • the gas G Ar gas or a Ar/O 2 gas mixture or the like is employed.
  • the gas G introduced into the vacuum chamber 10 is turned to plasma in response to discharge of the plasma electrode 12 and plus ions Ip such as Ar ions are generated.
  • the generated plus ions Ip sputter the target T.
  • the elements Tp of the target T sputtered by the plus ions Ip are released from the target and deposited on the substrate B in a neutral state or an ionized state.
  • P denotes a plasma space.
  • the film-forming temperature As factors which affect the characteristics of the film to be formed, the film-forming temperature, the kind of the substrate, the composition of the under-film if there is film formed previously, the surface energy of the substrate, the film-forming pressure, the amount of oxygen in the environmental gas, the thrown electrode, the substrate-target distance, the temperature and density of the electrons in the plasma, or the density and life of the active elements in the plasma is conceivable.
  • the characteristics of the piezoelectric film to be formed largely depends upon the film-forming temperature Ts (°C) and the substrate-target distance D (mm) and by optimizing these factors, high quality piezoelectric film can be efficiently formed. That is, these inventor' s have found that when the characteristics are plotted with the film-forming temperature Ts and the substrate-target distance D, respectively taken as the abscissa and the ordinate, high quality piezoelectric film can be efficiently formed in a certain range (see Figure 11).
  • the piezoelectric film to which the film-forming process of the present invention is applicable need not be limited and the film-forming process of the present invention is applicable to piezoelectric film comprising at least one kind of perovskite oxide (may include an unavoidable impurity) represented by the following general formula (P).
  • A represents at least one kind of elements forming the A site including Pb
  • B represents at least one kind of elements forming the B site including an element selected from an element group consisting of Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Sc, Co, Cu, In, Sn, Ga, Zn, Cd, Fe, Ni, and lanthanide elements
  • O represents an oxygen atom and a and b may deviate from 1.0 in the range where perovskite structure is formed though a and b are 1.0 by standard.
  • perovskite oxide represented by the above general formula (P) lead-containing compounds such as lead titanate, zircon lead titanate (PZT), lead zirconate, lead titanate lanthanum, lead titanate lanthanum zirconate, magnesium niobate zircon lead titanate, and nickel niobate zircon lead titanate and non-lead-containing compounds such as barium titanate, bismuth sodium titanate, bismuth potassium titanate, sodium niobate, potassium niobate, and lithium niobate can be shown.
  • the piezoelectric film may be have a mixed crystal of these perovskite oxide.
  • the piezoelectric film-forming process of the present invention is suitably applicable to PZT represented by the following general formula (P-1) or B-site-substituted compounds thereof and compounds having a mixed crystal of these compounds.
  • X may be anyone of metal elements of VA, VB, VIA, VIB group elements, and preferably at least one kind of metal element selected from an element group consisting of V, Nb, Ta, Cr, Mo and W.
  • Pb loss is apt to occur when the piezoelectric film is formed at a high temperature in the sputtering.
  • Pb loss depends upon the substrate-target distance in addition to the film-forming temperature.
  • Pb Zr and Ti forming the PZT
  • Pb is the most in the sputtering ratio, and is the most apt to be sputtered.
  • That a substance is apt to be sputtered is that the sputtered atom of the substance is apt to be sputtered again after adhering to the surface of the substrate. It is conceivable that as the substrate-target distance is smaller, the sputtering ratio increases and the Pb loss is more apt to be generated. This is real in Pb-containing perovskite oxides other than PZT. Further, this is real in a vapor phase growth method using plasma other than sputtering.
  • the higher film-forming speed is more preferable from the viewpoint of producing efficiency and is preferably not lower than 0.5 ⁇ m/h and is more preferably not lower than 1.0 ⁇ m/h.
  • the film-forming speed is higher, as the substrate-target distance D is shorter.
  • Figure 5 shows the relation between the film-forming speed and the substrate-target distance D when a PZT film is formed by the use of the RF sputtering system 1.
  • the film-forming temperature Ts is 525°C and the power (rf power) thrown to the target is 2.5W/cm 2 .
  • a high quality film can be formed even at a high speed not lower than 1.0 ⁇ m/h in accordance with the present invention.
  • the film-forming speed is lower than 0.5 ⁇ m/h. In such a case, it is preferred that the power thrown to the target and the like be adjusted so that the film-forming speed becomes not lower than 0.5 ⁇ m/h.
  • the substrate-target distance D be as small as possible since the film-forming temperature is higher, as the substrate-target distance D is smaller, and when 400 ⁇ TS ⁇ 500, it is preferred that the substrate-target distance D be not larger than 80mm, while when 500 ⁇ TS ⁇ 600, it is preferred that the substrate-target distance D be not larger than 100mm.
  • the plasma is instable when the substrate-target distance D is smaller than 30mm, there is a fear that the film is not formed in a high quality.
  • the substrate-target distance D be 50 ⁇ D ⁇ 70 either when 400 ⁇ TS ⁇ 500 or 500 ⁇ TS ⁇ 600.
  • the substrate-target distance D is determined to be not longer than 100mm in the present invention so that high quality piezoelectric film can be efficiently formed or stably at a high film-forming speed. That is, the substrate-target distance D according to the present invention is shorter than that of the film-forming method disclosed in Japanese Unexamined Patent Publication No. 2005-350735 , and accordingly, high quality piezoelectric film can be formed without a post-treatment such as the post-firing.
  • the present invention clears that the two factors that is, the film-forming temperature Ts(°C) and the substrate-target distance D (mm), affect the characteristics of the film and the film-forming speed in the method of forming the piezoelectric film where piezoelectric film comprising the elements of a target is formed on a substrate by opposing the target having a composition according to the composition of film to be formed, to the substrate and releasing the elements from the target by a gas phase growth method using plasma such as the sputtering.
  • the piezoelectric film-forming process in accordance with the present invention When the piezoelectric film-forming process in accordance with the present invention is employed, the conditions under which high quality piezoelectric film can be formed are easily found even if a different film-forming system is employed, whereby high quality piezoelectric film can be stably formed.
  • a perovskite crystal less in the pyrochlore phase in forming a piezoelectric film comprising perovskite oxide, a perovskite crystal less in the pyrochlore phase can be stably grown.
  • a piezoelectric film comprising Pb-containing perovskite oxide such as PZT in forming a piezoelectric film comprising Pb-containing perovskite oxide such as PZT, a perovskite crystal less in the pyrochlore phase can be stably grown and PB loss can be stably suppressed.
  • the following piezoelectric film of the present invention can be provided.
  • the piezoelectric film of the present invention is piezoelectric film comprising at least one kind of perovskite oxide (may include an unavoidable impurity) represented by the following general formula (P) and formed by a vapor phase growth method using plasma where a piezoelectric film comprising the elements of a target is formed by opposing a target having a composition according to the composition of film to be formed, and releasing the elements from the target, wherein the film is formed under the film-forming conditions where the following formulae (1) and (2) are satisfied.
  • P general formula
  • A represents at least one kind of elements forming the A site including Pb
  • B represents at least one kind of elements forming the B site including an element selected from an element group consisting of Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Sc, Co, Cu, In, Sn, Ga, Zn, Cd, Fe, Ni, and lanthanide elements
  • O represents an oxygen atom and a and b may deviate from 1.0 in the range where perovskite structure is formed though a and b are 1.0 by standard.
  • the piezoelectric film of the present invention is piezoelectric film comprising at least one kind of perovskite oxide (may include an unavoidable impurity) represented by the following general formula (P) and formed by a vapor phase growth method using plasma where a piezoelectric film comprising the elements of a target is formed by opposing a target having a composition according to the composition of film to be formed, and releasing the elements from the target, wherein the film is formed under the film-forming conditions where the following formulae (3) and (4) are satisfied.
  • P general formula
  • A represents at least one kind of elements forming the A site including Pb
  • B represents at least one kind of elements forming the B site including an element selected from an element group consisting of Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Sc, Co, Cu, In, Sn, Ga, Zn, Cd, Fe, Ni, and lanthanide elements
  • O represents an oxygen atom and a and b may deviate from 1.0 in the range where perovskite structure is formed though a and b are 1.0 by standard.
  • PZT represented by the following general formula (P-1) or B-site-substituted compounds thereof and compounds having a mixed crystal of these compounds.
  • piezoelectric film which is 1.0 ⁇ a and free from the Pb loss and at the same time there can be provided Pb-enriched piezoelectric film where 1.0 ⁇ a.
  • the upper limit of a need not be limited, and these inventors have found that when 1.0 ⁇ a ⁇ 1.3, there can be provided piezoelectric film which is excellent in piezoelectric performance.
  • FIG. 2 is a cross-sectional view of an important part of the ink jet recording head.
  • the components are depicted in suitable scales different from the real scales.
  • the piezoelectric element 2 of this embodiment comprises a lower electrode 30, piezoelectric film 40 and an upper electrode 50 superposed one on another on a substrate 20 in sequence.
  • the electric field is applied in the direction of thickness by the lower and upper electrodes 30 and 50.
  • the lower electrode 30 is formed over substantially the entire area of the substrate 20, and on the lower electrode 30, is formed the piezoelectric film 40 where the line protrusions 41 each of which extends from this side of Figure 2 to the other side of the lower electrode 30 are arranged in a stripe pattern, and the upper electrode 50 is formed on each of the protrusions 41.
  • the pattern of the piezoelectric film 40 need not be limited to the illustrated pattern but may be suitably designed.
  • the piezoelectric film 40 may be continuous. However, it is preferred that the piezoelectric film 40 be formed in a pattern of a plurality of the separate protrusions 41 so that expansion and contraction of each protrusion take place smoothly and a larger displacement can be obtained.
  • the substrate 20 may be basically formed of any material such as silicon, glass, stainless steel (SUS), yttrium-stabilized zirconia (YSZ), alumina, sapphire, silicon carbide, and the like.
  • the substrate 20 may even comprise a laminated circuit board such as an SOI board where SiO 2 oxide film is superposed on the surface of a silicon substrate.
  • the main component of the lower electrode 30 may basically comprises any material such as metal and metal oxide like Au, Pt, Ir, IRO 2 , RuO 2 , LaNiO 3 and SrRuO 3 and combinations thereof.
  • the main component of the upper electrode 50 may basically comprises any material such as electrode materials generally used in a semiconductor process like materials shown by way of example in the lower electrode 30, Al, Ta, Cr and Cu and combinations thereof.
  • the piezoelectric film 40 is piezoelectric film formed by the piezoelectric film-forming method of the present invention described above.
  • the piezoelectric film 40 comprises perovskite oxide represented by the above general formula (P).
  • the thickness of the lower and upper electrodes 30 and 50 basically need not be limited, and, for instance, about 200nm.
  • the thickness of the piezoelectric film 40 basically need not be limited, and normally not smaller than 1 ⁇ m and, for instance, 1 to 5 ⁇ m.
  • the ink jet recording head (liquid discharge system) 3 substantially comprises an ink nozzle (liquid storing/discharging member) 70 which is provided with ink chambers 71 for storing therein ink and an ink discharge port 72 through which ink is externally discharged from the ink chamber 71 and is mounted on the lower surface of the substrate 20 of the piezoelectric element 2 by way of the vibrating plate 60.
  • the ink chambers 71 are provided in a plurality corresponding to the number and the pattern of the protrusion 41 of the piezoelectric film 40.
  • the intensity of the electric field applied to the protrusions 41 of the piezoelectric element 2 is increased or reduced by the protrusions 4 thereby expanding or contracting the protrusions 4 to control the discharge of the ink from the ink chamber 71.
  • the piezoelectric element 2 and the ink jet recording head 3 of this embodiment are structured as described above.
  • Figure 3 is a block diagram showing the overall ink jet recording system
  • Figure 4 is a block diagram showing a part of the ink jet recording system.
  • the ink jet recording system 100 of this embodiment comprises a printing portion 102 having ink jet recording heads 3K, 3C, 3M and 3Y provided for each color of ink, an ink storing/loading portion 114 for storing ink to be supplied to heads 3K, 3C, 3M and 3Y, a paper supply portion 118 for supplying recording papers 116, a decurl portion 120 which removes the curl from the recording papers 116, a suction belt transfer portion 122 which is opposed to a nozzle surface (through which the ink is discharged) of the printing portion 102 and transfers the recording paper 116 while holding the flatness of the recording paper 116, a print detecting portion 124 which detects result of printing by the printing portion 102 and a paper discharge portion 126 which externally discharges printed recording paper (printings).
  • Each of the heads 3K, 3C, 3M and 3Y forming the printing portion 102 is an ink jet recording head 3 of the above embodiment.
  • the heating drum 130 heat is applied by the heating drum 130 to the recording paper 116 in the direction reverse to the direction in which the recording paper 116 tends to curl, and the recording paper 116 is decurled.
  • a cutter 128 is provided in the stage behind the decurl portion 120 to cut the rolled paper into a desired size as shown in Figure 3.
  • the cutter 128 comprises a stationary blade 128A having a length not shorter than the width of the transfer path of the recording paper 116 and a circular blade 128B which moves along the stationary blade 128A, and the stationary blade 128A is applied to the back side of the recording paper 116 and the circular blade 128B is opposed to the stationary blade 128A with the transfer path of the recording paper 116 intervening therebetween.
  • the cutter 128 is unnecessary.
  • the decurled and cut recording paper 116 is fed to the suction belt transfer portion 122.
  • the suction belt transfer portion 122 comprises a pair of rollers 131 and 132 and an endless belt 133 passed around the rollers 131 and 132, and at least a part thereof opposed to the nozzle surface and a sensor surface of the print detecting portion 124 of the printing portion 102 is flat.
  • the belt 133 has a width larger than the width of the recording paper 116 and a number of suction holes (not shown) are formed in the surface of the belt 133.
  • a suction chamber 134 is provided in a position opposed to the nozzle surface and a sensor surface of the print detecting portion 124 of the printing portion 102 inside the belt 133 passed around the rollers 131 and 132, and the recording paper 116 is suctioned and held against the belt 133 by sucking the suction chamber 134 to a negative pressure by a fan 135.
  • a belt cleaning portion 136 is provided to be opposed to the outer side of the belt 133 in a predetermined position (a suitable position outside the printing area).
  • a heating fan 140 is provided upstream of the printing portion 102.
  • the heating fan 140 blows heated air to the recording paper 116 before printing to heat the recording paper 116.
  • ink is apt to be dried after adhering to the recording paper 116.
  • the ink jet recording system 100 of this embodiment has a so-called full-line type head where the printing portion 102 forms a line type head with a length corresponding to a maximum paper width which is disposed in perpendicular to the paper-feed direction.
  • Each of the heads 3K, 3C, 3M and 3Y is formed by a line type head where a plurality of ink discharge ports (nozzle) are arranged over a length exceeding at least one side of a maximum recording paper 116 that is an object of the ink jet recording system 100.
  • the heads 3K, 3C, 3M and 3Y corresponding to the inks which are black (K), cyan (C) magenta (M) and yellow (Y) in color are disposed in this order from the upstream.
  • a color image is recorded on the recording paper 116 by discharging the ink from the respective heads 3K, 3C, 3M and 3Y while transferring the recording paper 116.
  • the print detecting portion 124 comprises a line sensor or the like for taking an image of a result of droplet-shooting by the printing portion 102, and detects a discharge defect such as clogging in the nozzle from a droplet-shooting image read by the line sensor.
  • an after drying portion 142 which comprises a heating fan or the like for drying the printed image. Since contact with the printed surface before the ink after printing is dried is preferably avoided, the system where heated air is blown is preferable.
  • an heating/pressing portion 144 for controlling the glossiness of the image surface.
  • surface irregularities are transferred to the image surface by pressing the image surface with pressing rollers 145 having predetermined surface irregularities on their surfaces while heating the image surface.
  • the printings thus obtained are discharged by the paper discharge portion 126.
  • the running image image obtained by printing a target image
  • a selecting means (not shown) is provided to separate the running image and the test printings and switches running paths and to feed the running image and the test printings to the respective paper discharge portions 126A and 126B.
  • a cutter 148 is provided to sever the test printings.
  • the ink jet recording system 100 of this embodiment is arranged as described above.
  • Piezoelectric film comprising PZT or Nb-PZT (Nb-doped PZT) was formed on a substrate under the conditions in a mixed atmosphere of Ar/O 2 where the degree of vacuum was 0.5Pa (the volume fraction of O 2 was 2.5%) by the sputtering system shown in Figure 1 by the use of a Pb 1.3 Zr 0.52 Ti 0.48 O 3 target.
  • a Ti close contact layer 30 ⁇ m thick and an Ir lower electrode 150nm thick were formed on the a Si wafer in sequence, thereby preparing a substrate with electrode as a film-forming substrate.
  • the piezoelectric films were formed with the film-forming temperature of 525°C and the substrate-target distance D (mm) of 40, 60, 80, 100 and 120mm while an rf power of 2.5W/cm 2 was applied to the target.
  • the substrate-target distance D of 60mm Nb-PZT film was formed and at other D's, PZT film were formed.
  • Figure 5 is a view showing the relation between the substrate-target distance D and the film-forming speed when the film-forming temperature Ts is 525°C while an rf power of 2.5W/cm 2 was applied to the target. As shown in Figure 5, when the substrate-target distance D is 60(mm), for instance, the film-forming speed is 1.0 ⁇ m/h.
  • X-ray diffraction analysis was carried on each obtained piezoelectric film. XRD pattern of each obtained piezoelectric film is shown in Figures 6 to 10.
  • a perovskite crystal having a crystalline orientation can be obtained in the range where the substrate-target distance D is 40 to 100mm.
  • the film-forming speed is 0.5 ⁇ m/h to 1.2 ⁇ m/h and perovskite crystals can be obtained at a high manufacturing efficiency.
  • perovskite crystals having an excellent crystalline orientation could be obtained though including somewhat pyrochlore phases.
  • Figure 11 is a view where XRD was measured for all the samples in the embodiments 1 and 2 and other samples and the result of XRD measurement is plotted with the film-forming temperature Ts and the substrate-target distance D, respectively taken as the abscissa and the ordinate.
  • Figure 11 shows that a perovskite crystal which is less in pyrochlore phases can be stably grown, whereby a piezoelectric film which is of a high quality in the crystalline structure and the composition can be stably formed by setting the film-forming condition to satisfy the following formulae (1) and (2) or (3) and (4) in the PZT film or Nb-PZT film.
  • the piezoelectric film-forming method of the present invention is applicable when the film is to be grown by a vapor phase growth method using plasma, and is applicable to piezoelectric film for use in, for instance, an ink jet recording heads, ferroelectric memories (FRAM), and a pressure sensor.
  • FRAM ferroelectric memories

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  • Mechanical Engineering (AREA)
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  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Physical Vapour Deposition (AREA)
EP20070018953 2006-09-28 2007-09-26 Film piézoélectrique, son processus de fabrication et élément piézoélectrique Withdrawn EP1906466A1 (fr)

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JP5410686B2 (ja) * 2008-03-21 2014-02-05 富士フイルム株式会社 圧電体膜の製造方法、成膜装置および圧電体膜
JP5275698B2 (ja) * 2008-06-17 2013-08-28 富士フイルム株式会社 圧電体膜の分極方法および圧電素子構造体の製造方法
JP5135106B2 (ja) * 2008-07-31 2013-01-30 富士フイルム株式会社 成膜装置および成膜方法、並びに、液体吐出装置
JP2010084160A (ja) * 2008-09-29 2010-04-15 Fujifilm Corp 鉛含有ペロブスカイト型酸化物膜の成膜方法、圧電素子、および液体吐出装置
JP2011076725A (ja) 2009-09-29 2011-04-14 Fujifilm Corp 圧電型ｍｅｍｓ素子およびその製造方法
JP4564580B2 (ja) * 2009-12-08 2010-10-20 富士フイルム株式会社 圧電体膜の製造方法およびそれにより製造された圧電体膜
US10622540B2 (en) 2016-12-12 2020-04-14 Panasonic Intellectual Property Management Co., Ltd. Piezoelectric functional film, actuator, and ink-jet head
WO2018150844A1 (fr) 2017-02-16 2018-08-23 パナソニックＩｐマネジメント株式会社 Élément piézoélectrique, actionneur et tête d'éjection de gouttelettes liquides

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