EP1900448A4 - Waschvorrichtung und waschverfahren - Google Patents

Waschvorrichtung und waschverfahren

Info

Publication number
EP1900448A4
EP1900448A4 EP06767496A EP06767496A EP1900448A4 EP 1900448 A4 EP1900448 A4 EP 1900448A4 EP 06767496 A EP06767496 A EP 06767496A EP 06767496 A EP06767496 A EP 06767496A EP 1900448 A4 EP1900448 A4 EP 1900448A4
Authority
EP
European Patent Office
Prior art keywords
washing
washing tank
treated body
cover
treatment liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP06767496A
Other languages
English (en)
French (fr)
Other versions
EP1900448A1 (de
EP1900448B1 (de
Inventor
Kazuyoshi Eshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of EP1900448A1 publication Critical patent/EP1900448A1/de
Publication of EP1900448A4 publication Critical patent/EP1900448A4/de
Application granted granted Critical
Publication of EP1900448B1 publication Critical patent/EP1900448B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
EP06767496A 2005-06-30 2006-06-28 Waschvorrichtung und waschverfahren Not-in-force EP1900448B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005192725A JP4672464B2 (ja) 2005-06-30 2005-06-30 洗浄装置および洗浄方法、ならびにコンピュータにより読取可能な記憶媒体
PCT/JP2006/312879 WO2007004485A1 (ja) 2005-06-30 2006-06-28 洗浄装置および洗浄方法

Publications (3)

Publication Number Publication Date
EP1900448A1 EP1900448A1 (de) 2008-03-19
EP1900448A4 true EP1900448A4 (de) 2009-05-27
EP1900448B1 EP1900448B1 (de) 2010-04-14

Family

ID=37604354

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06767496A Not-in-force EP1900448B1 (de) 2005-06-30 2006-06-28 Waschvorrichtung und waschverfahren

Country Status (6)

Country Link
US (1) US7900640B2 (de)
EP (1) EP1900448B1 (de)
JP (1) JP4672464B2 (de)
DE (1) DE602006013639D1 (de)
TW (1) TW200707570A (de)
WO (1) WO2007004485A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4630881B2 (ja) * 2007-03-05 2011-02-09 シャープ株式会社 基板洗浄装置
JP2009080035A (ja) 2007-09-26 2009-04-16 Olympus Corp 分析装置
US20090087566A1 (en) * 2007-09-27 2009-04-02 Masahiro Kimura Substrate treating apparatus and substrate treating method
JP5179282B2 (ja) * 2007-09-27 2013-04-10 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
US9027575B2 (en) * 2010-12-20 2015-05-12 Unified Brands, Inc. Fluid screen for pot and pan washing machine
DE102012001721A1 (de) * 2012-01-31 2013-08-01 Rena Gmbh Spüleinrichtung zum Abspülen einer Behandlungsflüssigkeit und Verfahren dazu
TWI569351B (zh) * 2015-04-30 2017-02-01 環球晶圓股份有限公司 晶圓旋轉裝置
WO2020236803A1 (en) * 2019-05-23 2020-11-26 Lam Research Corporation Chamber component cleanliness measurement system
CN112058774B (zh) * 2020-08-24 2021-11-30 台州市亿源塑业有限公司 一种湿法刻蚀清洗机构的溢流槽结构
CN115328219B (zh) * 2022-07-26 2025-03-25 海南大学 一种用于柔性机构的电磁驱动控制系统和方法
CN120714987A (zh) * 2024-03-27 2025-09-30 盛美半导体设备(上海)股份有限公司 槽盖及基板液处理槽

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0650775A1 (de) * 1993-10-27 1995-05-03 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Verfahren und Vorrichtung zur Behandlung von scheibenförmigen Werkstücken mit einer Flüssigkeit
US5727578A (en) * 1993-07-16 1998-03-17 Legacy Systems, Inc. Apparatus for the treatment and drying of semiconductor wafers in a fluid
US20020092547A1 (en) * 2001-01-12 2002-07-18 Dong-Jun You Semiconductor wafer washing system and method of supplying chemicals to the washing tanks of the system
US20050279389A1 (en) * 2004-06-21 2005-12-22 Yong-Myung Jun Wet cleaning apparatus including a cover for removing impurities thereon

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617610B2 (ja) * 1990-08-16 1997-06-04 山形日本電気株式会社 ウェーハ処理装置
JPH06104234A (ja) * 1992-09-18 1994-04-15 Matsushita Electric Ind Co Ltd 基板洗浄装置
JPH0652143U (ja) * 1992-12-25 1994-07-15 住友シチックス株式会社 洗浄装置
JP3464843B2 (ja) * 1995-03-30 2003-11-10 大日本スクリーン製造株式会社 基板処理装置における基板処理方法および基板処理装置
JP3534211B2 (ja) * 1995-09-29 2004-06-07 富士写真フイルム株式会社 感光性平版印刷版の自動現像装置
JP3336223B2 (ja) * 1997-04-15 2002-10-21 東京エレクトロン株式会社 洗浄システム及び洗浄方法
US6050446A (en) * 1997-07-11 2000-04-18 Applied Materials, Inc. Pivoting lid assembly for a chamber
JP2000031103A (ja) * 1998-07-14 2000-01-28 Sony Corp 洗浄方法、洗浄液置換方法、洗浄装置並びに洗浄槽
JP2001176833A (ja) * 1999-12-14 2001-06-29 Tokyo Electron Ltd 基板処理装置
JP2001338904A (ja) * 2000-05-30 2001-12-07 Konan Koki Kk ウェハの洗浄装置
JP2004358283A (ja) * 2003-05-30 2004-12-24 Seiko Epson Corp 薬液処理装置、薬液処理方法および回路基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5727578A (en) * 1993-07-16 1998-03-17 Legacy Systems, Inc. Apparatus for the treatment and drying of semiconductor wafers in a fluid
EP0650775A1 (de) * 1993-10-27 1995-05-03 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Verfahren und Vorrichtung zur Behandlung von scheibenförmigen Werkstücken mit einer Flüssigkeit
US20020092547A1 (en) * 2001-01-12 2002-07-18 Dong-Jun You Semiconductor wafer washing system and method of supplying chemicals to the washing tanks of the system
US20050279389A1 (en) * 2004-06-21 2005-12-22 Yong-Myung Jun Wet cleaning apparatus including a cover for removing impurities thereon

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007004485A1 *

Also Published As

Publication number Publication date
JP2007007577A (ja) 2007-01-18
JP4672464B2 (ja) 2011-04-20
US20090120466A1 (en) 2009-05-14
EP1900448A1 (de) 2008-03-19
US7900640B2 (en) 2011-03-08
TWI329894B (de) 2010-09-01
TW200707570A (en) 2007-02-16
DE602006013639D1 (de) 2010-05-27
EP1900448B1 (de) 2010-04-14
WO2007004485A1 (ja) 2007-01-11

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