EP1897126A4 - Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system - Google Patents

Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system

Info

Publication number
EP1897126A4
EP1897126A4 EP05765992A EP05765992A EP1897126A4 EP 1897126 A4 EP1897126 A4 EP 1897126A4 EP 05765992 A EP05765992 A EP 05765992A EP 05765992 A EP05765992 A EP 05765992A EP 1897126 A4 EP1897126 A4 EP 1897126A4
Authority
EP
European Patent Office
Prior art keywords
carrier
semiconductor wafer
supplying apparatus
polishing system
wafer polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05765992A
Other languages
German (de)
French (fr)
Other versions
EP1897126A1 (en
Inventor
Sung-Bum Seo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doosan Mecatec Co Ltd
Original Assignee
Doosan Mecatec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Mecatec Co Ltd filed Critical Doosan Mecatec Co Ltd
Publication of EP1897126A1 publication Critical patent/EP1897126A1/en
Publication of EP1897126A4 publication Critical patent/EP1897126A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Joints Allowing Movement (AREA)
EP05765992A 2005-06-28 2005-06-28 Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system Withdrawn EP1897126A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2005/002021 WO2007001100A1 (en) 2005-06-28 2005-06-28 Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system

Publications (2)

Publication Number Publication Date
EP1897126A1 EP1897126A1 (en) 2008-03-12
EP1897126A4 true EP1897126A4 (en) 2009-07-15

Family

ID=37595324

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05765992A Withdrawn EP1897126A4 (en) 2005-06-28 2005-06-28 Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system

Country Status (3)

Country Link
EP (1) EP1897126A4 (en)
CN (1) CN100524638C (en)
WO (1) WO2007001100A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101386149B (en) * 2007-09-12 2011-01-26 K.C.科技股份有限公司 Cleaning device for chemical mechanical polishing device
GB2513183B (en) * 2013-04-19 2019-11-13 Welleng Science & Tech Ltd Rotary coupling
DE102014017451A1 (en) * 2014-11-26 2016-06-02 Eisenmann Se Plant for treating a property
US10510563B2 (en) 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
CN107097120B (en) * 2017-05-27 2018-11-13 上海理工大学 Multi-channel magnetic rheology liquid supplying device
KR102378581B1 (en) * 2020-06-19 2022-03-24 씰링크 주식회사 Rotating shaft sealing device and processing apparatus for semiconductor substrate using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3192396B2 (en) * 1997-11-07 2001-07-23 日本ピラー工業株式会社 Rotary joint for fluid
JP3325547B2 (en) * 1999-11-16 2002-09-17 日本ピラー工業株式会社 Rotary joint
AU2001283529A1 (en) * 2000-07-31 2002-02-13 Asml Us, Inc. Apparatus and method for chemical mechanical polishing of substrates
KR20030039627A (en) 2001-11-14 2003-05-22 주식회사 케이티 Customized Service using A Number
KR100418278B1 (en) * 2003-04-11 2004-02-14 주식회사 신원기계부품 A rotary union
KR100490266B1 (en) * 2003-06-19 2005-05-17 두산디앤디 주식회사 Multiple fluid supply apparatus for polishing carrier and conditioner carrier of semiconductor wafer polishing system
KR100530742B1 (en) * 2003-12-31 2005-11-23 두산디앤디 주식회사 Multiple fluid supply apparatus for carrier of semiconductor wafer polishing system

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2007001100A1 *

Also Published As

Publication number Publication date
WO2007001100A1 (en) 2007-01-04
WO2007001100A9 (en) 2009-04-02
CN101208780A (en) 2008-06-25
CN100524638C (en) 2009-08-05
EP1897126A1 (en) 2008-03-12

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20071112

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE FR

A4 Supplementary search report drawn up and despatched

Effective date: 20090615

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20090903