EP1889953A4 - Process for producing silicon carbide single crystal - Google Patents

Process for producing silicon carbide single crystal

Info

Publication number
EP1889953A4
EP1889953A4 EP06756481.5A EP06756481A EP1889953A4 EP 1889953 A4 EP1889953 A4 EP 1889953A4 EP 06756481 A EP06756481 A EP 06756481A EP 1889953 A4 EP1889953 A4 EP 1889953A4
Authority
EP
European Patent Office
Prior art keywords
single crystal
silicon carbide
carbide single
producing silicon
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06756481.5A
Other languages
German (de)
French (fr)
Other versions
EP1889953A1 (en
Inventor
Takamitsu Kawahara
Hiroyuki Nagasawa
Naoki Hatta
Kuniaki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of EP1889953A1 publication Critical patent/EP1889953A1/en
Publication of EP1889953A4 publication Critical patent/EP1889953A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/32Carbides
    • C23C16/325Silicon carbide
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42Silicides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
EP06756481.5A 2005-06-07 2006-05-23 Process for producing silicon carbide single crystal Withdrawn EP1889953A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005167326A JP4628189B2 (en) 2005-06-07 2005-06-07 Method for producing silicon carbide single crystal
PCT/JP2006/310225 WO2006132082A1 (en) 2005-06-07 2006-05-23 Process for producing silicon carbide single crystal

Publications (2)

Publication Number Publication Date
EP1889953A1 EP1889953A1 (en) 2008-02-20
EP1889953A4 true EP1889953A4 (en) 2014-03-19

Family

ID=37498286

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06756481.5A Withdrawn EP1889953A4 (en) 2005-06-07 2006-05-23 Process for producing silicon carbide single crystal

Country Status (7)

Country Link
US (1) US8133321B2 (en)
EP (1) EP1889953A4 (en)
JP (1) JP4628189B2 (en)
KR (1) KR20080009261A (en)
CN (1) CN101120124B (en)
TW (1) TW200708629A (en)
WO (1) WO2006132082A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032808A (en) * 2007-07-25 2009-02-12 Toshiba Corp Semiconductor device
JP5345499B2 (en) * 2009-10-15 2013-11-20 Hoya株式会社 Compound single crystal and method for producing the same
CN103857765B (en) * 2011-10-07 2015-11-25 旭硝子株式会社 Monocrystalline silicon carbide substrate and lapping liquid
JP6380663B2 (en) * 2015-04-17 2018-08-29 富士電機株式会社 Semiconductor manufacturing method and SiC substrate
CN104947181B (en) * 2015-07-07 2017-11-14 山东大学 A kind of method for reducing physical vapor transport growth SiC single crystal middle position dislocation density
JP6953843B2 (en) * 2017-07-07 2021-10-27 セイコーエプソン株式会社 Single crystal substrate and silicon carbide substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1143033A2 (en) * 2000-04-07 2001-10-10 Hoya Corporation Silicon carbide and method for producing the same
EP1288347A2 (en) * 2001-08-27 2003-03-05 Hoya Corporation Method of manufacturing compund single crystal
EP1288346A2 (en) * 2001-08-27 2003-03-05 Hoya Corporation Method of manufacturing compound single crystal

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6335546B1 (en) * 1998-07-31 2002-01-01 Sharp Kabushiki Kaisha Nitride semiconductor structure, method for producing a nitride semiconductor structure, and light emitting device
JP3576432B2 (en) * 1998-10-10 2004-10-13 Hoya株式会社 Silicon carbide film and method of manufacturing the same
EP1130135B1 (en) * 1999-10-08 2007-08-08 Hoya Corporation Silicon carbide film and method for manufacturing the same
US6475456B2 (en) * 2000-02-29 2002-11-05 Hoya Corporation Silicon carbide film and method for manufacturing the same
JP4563609B2 (en) * 2000-04-07 2010-10-13 Hoya株式会社 Method for producing silicon carbide
JP3754294B2 (en) * 2000-12-28 2006-03-08 株式会社東芝 Method for manufacturing silicon carbide single crystal substrate and method for manufacturing semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1143033A2 (en) * 2000-04-07 2001-10-10 Hoya Corporation Silicon carbide and method for producing the same
EP1288347A2 (en) * 2001-08-27 2003-03-05 Hoya Corporation Method of manufacturing compund single crystal
EP1288346A2 (en) * 2001-08-27 2003-03-05 Hoya Corporation Method of manufacturing compound single crystal

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006132082A1 *

Also Published As

Publication number Publication date
EP1889953A1 (en) 2008-02-20
CN101120124A (en) 2008-02-06
JP4628189B2 (en) 2011-02-09
TW200708629A (en) 2007-03-01
KR20080009261A (en) 2008-01-28
US8133321B2 (en) 2012-03-13
TWI333509B (en) 2010-11-21
JP2006342010A (en) 2006-12-21
CN101120124B (en) 2012-05-23
US20080289570A1 (en) 2008-11-27
WO2006132082A1 (en) 2006-12-14

Similar Documents

Publication Publication Date Title
EP1895031A4 (en) Process for producing silicon carbide single crystal
TWI370855B (en) Method for producing silicon carbide single crystal
EP1978137A4 (en) PROCESS FOR PRODUCING SiC SINGLE CRYSTAL
EP1806437A4 (en) Method for preparing silicon carbide single crystal
EP1855312A4 (en) PROCESS FOR PRODUCING SiC SINGLE-CRYSTAL SUBSTRATE
TWI346356B (en) Process for producing silicon wafer
EP2083099A4 (en) Process for producing group iii element nitride crystal
EP1895573A4 (en) Silicon carbide single-crystal wafer and process for producing the same
EP2088626A4 (en) Process for producing silicon carbide semiconductor device
EP2297033A4 (en) Process for producing silicon carbide
EP1739211A4 (en) METHOD FOR PRODUCING SILICON CARBIDE (SiC) SINGLE CRYSTAL AND SILICON CARBIDE (SiC) SINGLE CRYSTAL OBTAINED BY SUCH METHOD
HK1100100A1 (en) Process for producing group III nitride substrate
EP1882675A4 (en) Method for producing silicon
EP2088628A4 (en) Silicon carbide semiconductor device and process for producing the same
EP1820777A4 (en) Process for producing polycrystalline silicon ingot
EP1828170A4 (en) Process for preparing voriconazole
EP2083448A4 (en) Silicon carbide semiconductor device and process for producing the same
EP1813700A4 (en) Apparatus for crystal production
EP2141267A4 (en) Process for producing group iii nitride crystal
EP1933386A4 (en) Process for producing silicon carbide semiconductor device
EP1975283A4 (en) Process for producing silicon single crystal wafer
EP2006269A4 (en) Porous silicon carbide and process for producing the same
EP1852527A4 (en) Silicon carbide single crystal, silicon carbide single crystal wafer, and process for producing the same
EP2056340A4 (en) Method for producing silicon carbide substrate and silicon carbide substrate
EP1930486A4 (en) Process for producing semiconductor substrate

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20070911

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB NL SE

RBV Designated contracting states (corrected)

Designated state(s): DE FR GB NL SE

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20140213

RIC1 Information provided on ipc code assigned before grant

Ipc: C23C 16/32 20060101ALI20140207BHEP

Ipc: C30B 23/02 20060101ALI20140207BHEP

Ipc: C30B 25/02 20060101ALI20140207BHEP

Ipc: C30B 25/18 20060101ALI20140207BHEP

Ipc: C23C 16/455 20060101ALI20140207BHEP

Ipc: C23C 16/02 20060101ALI20140207BHEP

Ipc: C30B 29/36 20060101AFI20140207BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20140320