Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
  • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/02—Structural details or components not essential to laser action
  • H01S5/022—Mountings; Housings
  • H01S5/0235—Method for mounting laser chips
  • H01S5/02355—Fixing laser chips on mounts
  • H01S5/02365—Fixing laser chips on mounts by clamping
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/02—Structural details or components not essential to laser action
  • H01S5/022—Mountings; Housings
  • H01S5/0235—Method for mounting laser chips
  • H01S5/02355—Fixing laser chips on mounts
  • H01S5/0237—Fixing laser chips on mounts by soldering
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/02—Structural details or components not essential to laser action
  • H01S5/024—Arrangements for thermal management
  • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
  • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
  • H01S5/4018—Lasers electrically in series
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
  • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
  • H01S5/4031—Edge-emitting structures

Definitions

• the invention relates to a laser device formed by a stack of laser diodes each arranged on a wafer formed of an electrically conductive material and a good conductor of heat. These plates provide on the one hand an electrical connection between the laser diodes to allow the passage of an electric supply current and on the other hand to conduct the heat produced by these laser diodes in the direction of a cooling body which evacuates or dissipate the heat of the laser diodes.
• the invention relates to a quasi-continuous or continuous light wave laser diode stack (QCW or CW laser diode).
• FIG 1 is shown partially a laser device of the type mentioned above.
• This device 2 comprises laser diodes 4 in bar form, shown schematically, and metal plates 6 between which the laser diodes are arranged.
• the plates 6 are provided electrically conductive.
• the electrical connection between the wafers 6 and the laser diodes 4 is performed in a manner known to those skilled in the art.
• the latter can be associated with a lower electrically insulating portion and of greater thickness than the material constituting the laser diode.
• the various elements or layers associated with a laser diode are schematically represented therewith in the form of a bar 4.
• the arrangement of the wafers 6 and the laser diodes thus allows the passage of an electric current in the direction X. Some heat transmission is also obtained in this direction X via the metal plates 6.
• the wafers 6 are copper.
• This cooling body conventionally presents a conduit 12 for a circulation of water. Since the electric current must pass through the diodes in the X direction, it is necessary that the wafers 6 are electrically insulated from one another. To do this, in the prior art of FIG. 1, an electrically insulating ceramic layer 14 is welded to the body 10 by means of a solder forming a film 16.
• each wafer 6 is welded to the layer 14 also at the same time. 18.
• the welding of the pads 6 must be carried out in a structured manner, to avoid short circuits between these plates 6. It is therefore necessary to prevent the solder between a wafer 6 and the ceramic layer 14 is in contact with the solder for welding another wafer.
• the device of the prior art described herein before has several disadvantages.
• performing a structured weld to attach the wafers to the insulating layer is a complex operation that requires special precautions.
• a weld defines an interface which forms a brake on the transfer of heat towards the cooling body 10.
• two solder layers are present on either side of the layer 14 , which decreases the cooling efficiency of the laser diodes.
• each plate is assembled in its lower part to an electrically insulating layer by welding.
• This insulating layer is flat and has the same dimensions as those of the end of the wafer.
• Each plate is therefore first welded to a clean insulating layer.
• each assembly thus formed is welded to the cooling body by means of a solder provided on the cooling body and structured to correspond to the separate zones provided for the plurality of "wafer-insulating layer" assemblies.
• This last embodiment of the prior art has manufacturing problems.
• the structured weld defines a precise location for each wafer on the cooling body. This poses a machining problem for the various elements, in particular tolerances for the thickness of the wafers and for the thickness of the diodes. Indeed, variations in these thicknesses cause a problem of alignment of the stack of diodes and platelets with solder areas. But decreasing the tolerances in the machining of wafers and diodes increases the manufacturing price.
• the thickness of the diodes can vary substantially in the standard assortment of a laser diode manufacturer. It should also be noted that this thickness is not standardized so that it also varies from one supplier to another.
• a method as described in document US 2004/0082112 thus poses a real problem of assembly.
• Another problem is that the layer of structured solder must be of low height to remain substantially in the separate areas provided.
• the tolerance in the machining of the height of the wafers is also critical. If during the prior assembly of the stack of wafers and laser diodes the lower ends of the wafers are arranged in the same geometrical plane to ensure that each wafer will rest well on the solder deposited in the corresponding zone on the cooling body during the welding of the wafers to this body, the laser diodes attached to the wafers on the side of their upper ends will not emit in the same emission plane, this which then poses a problem of collimation or focusing of the laser beam generated by the plurality of diodes.
• the present invention relates to a laser device formed by a stack of laser diodes each arranged between two wafers formed of an electrically conductive material and good heat conductor, each wafer being provided at its end on the side of a body cooling device to which it is fixed by a fastening material, an electrically insulating layer forming an interface between, on the one hand, the cooling body and the fastening material and, on the other hand, this wafer.
• the laser device is characterized in that the electrically insulating layer covers the lower face of said end and rises substantially up to a certain height along the lateral faces of the wafer, said fixing material covering this insulating layer on the side of said face. lower and also along said side faces without exceeding the height of the electrically insulating layer.
• the platelet attachment material to the cooling body defines a substantially continuous layer between the platelets with a thickness greater than the distance between the lower faces of the platelets and the cooling body.
• the fastening material can go up along these lateral faces substantially to a second height lower than this first height, without risk of short -electrical circuit.
• FIG. 1 already described, schematically represents a laser device with a stack of laser diodes according to the prior art
• FIG. 2 diagrammatically represents an embodiment of the present invention
• - Figure 3 partially shows a variant of the device of Figure 2 which shows some advantages of the invention.
• FIG. 2 shows a preferred embodiment of the invention.
• the laser device 22 comprises, as in the prior art, pads 6 formed of an electrically conductive material and good heat conductor.
• laser diodes 4 are arranged between the plates 6 so as to allow the passage of an electric supply current of these diodes.
• the number of diodes and platelets may vary, in particular depending on the intended application for the laser devices.
• the wafers 6 may be entirely of metal or of another metallized material on the surface.
• the plates 6 are arranged above a cooling body 10 having a conduit 12 for the circulation of a cooling fluid.
• the plates 6 and the cooling body 10 are made for example of copper. Other materials that are good conductors of heat are obviously conceivable.
• the wafers 6 are formed of an electrically conductive material with good thermal conductivity to allow evacuation of the heat produced by the laser diodes towards the cooling body 10.
• the wafers are attached at their lower end to the body of the cooling by means of a fixing material 26 selected so as to conduct the heat sufficiently.
• the fastening material 26 is also an electrical conductor.
• Each plate 6 has at its lower end, that is to say at the end fixed to the cooling body 10, an electrically insulating layer 28 which is arranged to form an interface between, on the one hand, the body 10 and the fixing material 26 and, on the other hand, the wafer concerned 6.
• the insulating layer 28 is a thin layer which covers the lower face 24 of the wafer and which rises to a first height H1 along the lateral faces 30 of each wafer 6.
• the fixing material 26, especially a solder covers the insulating layer 28 on the side of the lower face 24 of the wafer and also along its side faces 30 substantially on a second height H2 which is less than the first height H1.
• the height H2 may vary according to the place and rise more or less up along the lower portions of the plates 6. Thanks to the characteristics of the invention, the fastening material 26 can form a relatively thick through layer.
• solder 26 once the plates 6 are arranged facing the body 10. All welding methods known to those skilled in the art are available to optimize the method of fixing the wafers 6 to 10. The fact that the pads 6 have their lower parts immersed in the solder layer 26 to a certain height increases the heat transfer area between each plate and the solder layer, which increases the efficiency of the solder layer. heat transfer platelets 6 to the solder 26, then to the cooling body 10 on which the solder layer is disposed.
• Insulating layer 28 being relatively thin and in particular ceramic or synthetic diamond, the conduction of heat from the diodes to the cooling body is optimized.
• the device of Figure 2 requires a single weld between the plates 6 and the body 10.
• the thin layer 28 may be deposited by various techniques known to those skilled in the art other than a solder solder. Some methods of depositing the electrically insulating layer 28 on the lower parts of the wafers 6 will be described hereinafter without limitation. The deposition of such a layer may be obtained, according to a first variant of implementation, by a method dipping or the lower portions of the wafers are immersed in a bath so as to obtain a surface covering.
• the layer thus obtained has a relatively good thermal conductivity and good electrical insulation.
• Those skilled in the art know other conventional techniques to obtain a layer covering the lower part of the wafers 6.
• it also knows the use of a spray for depositing a layer or the method by centrifugation. It is thus possible to obtain layers with a thickness varying between about two microns and thirty microns.
• the thickness of the electrically insulating layer is particularly determined by its ability to maintain a given drop in potential, for example about twenty volts.
• the wafer may have one or more outer layers, including a nickel layer of about three microns and a gold surface layer of about one tenth of a micron.
• PVD physical type
• CVD chemical type
• a PVD deposit As an example, mention may be made of the cathode sputtering method or the ionic plating as a PVD deposit. With such techniques it is possible to obtain thin layers of a few microns.
• ceramic layers of the oxide type (for example AIOx) or nitride type (AIN), as well as synthetic diamond layers (DLC) can be deposited. These layers are functional with a thickness of 1 to 5 microns only.
• a thin layer can also be deposited by a vacuum evaporation technique.
• Figure 3 is shown partially in perspective a variant of the embodiment of Figure 2 which makes it possible to better see certain advantages of the present invention.
• the inserts 6, coated at their lower parts with an insulating layer 28 are pressed for a certain distance in a relatively thick brazing bath 26, for example of a thickness of 0.3 to 0.8 mm, it is possible to have platelets of different heights and aligned at their upper ends where the laser diodes are arranged. A machining tolerance of ⁇ 100 ⁇ m is for example possible on this dimension.
• the solder bath 26 forms a continuous layer, a variation of the width W of the wafers or a variation of the width D of the diodes is not critical.
• the W width of the wafers is for example between 200 and 300 microns and the width D of the diodes is between 100 and 150 microns.
• a machining tolerance for W and D dimensions of ⁇ 20 microns does not pose a problem for welding to the cooling body.
• the lateral surface is approximately 10 mm 2 and the transfer area is thus five times greater than that of the prior art.
• the heat transfer is further enhanced by the fact that it is possible to provide a thin insulating layer with a thickness of less than 20 microns. The efficiency of the heat dissipation produced by the diodes is therefore greatly improved with respect to the devices of the prior art described in the introduction to the present description of the invention.

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• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Electromagnetism (AREA)
• Optics & Photonics (AREA)
• Semiconductor Lasers (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Priority Applications (1)

Applications Claiming Priority (3)

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• 2006
  • 2006-05-10 EP EP06742865A patent/EP1889341A2/de not_active Withdrawn
  • 2006-05-10 WO PCT/EP2006/004389 patent/WO2006122691A2/fr not_active Application Discontinuation
  • 2006-05-10 US US11/914,341 patent/US7848371B2/en not_active Expired - Fee Related
  • 2006-05-10 EP EP06742866A patent/EP1889342A2/de not_active Withdrawn
  • 2006-05-10 WO PCT/EP2006/004390 patent/WO2006122692A2/fr active Application Filing

Non-Patent Citations (1)

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