EP1887912A4 - Systeme und verfahren zur implementierung eines zusammenwirkens zwischen einen als linienstrahl geformten laser und einen auf einem träger niedergeschlagenen film - Google Patents

Systeme und verfahren zur implementierung eines zusammenwirkens zwischen einen als linienstrahl geformten laser und einen auf einem träger niedergeschlagenen film

Info

Publication number
EP1887912A4
EP1887912A4 EP06760377A EP06760377A EP1887912A4 EP 1887912 A4 EP1887912 A4 EP 1887912A4 EP 06760377 A EP06760377 A EP 06760377A EP 06760377 A EP06760377 A EP 06760377A EP 1887912 A4 EP1887912 A4 EP 1887912A4
Authority
EP
European Patent Office
Prior art keywords
implementing
interaction
substrate
systems
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06760377A
Other languages
English (en)
French (fr)
Other versions
EP1887912A2 (de
Inventor
Palash P Das
Thomas Hofmann
Jesse D Davis
Scot T Smith
William N Partlo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cymer LLC
Original Assignee
Cymer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/138,100 external-priority patent/US7390060B2/en
Application filed by Cymer Inc filed Critical Cymer Inc
Publication of EP1887912A2 publication Critical patent/EP1887912A2/de
Publication of EP1887912A4 publication Critical patent/EP1887912A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
EP06760377A 2005-05-26 2006-05-25 Systeme und verfahren zur implementierung eines zusammenwirkens zwischen einen als linienstrahl geformten laser und einen auf einem träger niedergeschlagenen film Withdrawn EP1887912A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/138,100 US7390060B2 (en) 2005-04-12 2005-05-26 Reclining chair
PCT/US2006/020223 WO2006127891A2 (en) 2005-05-26 2006-05-25 Systems and methods interacting between a laser and film deposited

Publications (2)

Publication Number Publication Date
EP1887912A2 EP1887912A2 (de) 2008-02-20
EP1887912A4 true EP1887912A4 (de) 2010-11-10

Family

ID=37452835

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06760377A Withdrawn EP1887912A4 (de) 2005-05-26 2006-05-25 Systeme und verfahren zur implementierung eines zusammenwirkens zwischen einen als linienstrahl geformten laser und einen auf einem träger niedergeschlagenen film

Country Status (2)

Country Link
EP (1) EP1887912A4 (de)
WO (1) WO2006127891A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10012544B2 (en) * 2016-11-29 2018-07-03 Cymer, Llc Homogenization of light beam for spectral feature metrology

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01205891A (ja) * 1988-02-12 1989-08-18 Toshiba Corp レーザ加工装置の制御方法
US5376770A (en) * 1992-01-13 1994-12-27 Maho Aktiengesellschaft Process and device for machining workpieces by means of a laser beam
US20020031157A1 (en) * 1999-03-12 2002-03-14 Lambda Physik Ag Gas performance control system for gas discharge lasers
US20020030041A1 (en) * 1999-07-23 2002-03-14 Mikka Virtanen Laser cutting system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6673531B2 (en) * 2001-03-01 2004-01-06 Fuji Photo Film Co., Ltd. Silver halide photographic light-sensitive material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01205891A (ja) * 1988-02-12 1989-08-18 Toshiba Corp レーザ加工装置の制御方法
US5376770A (en) * 1992-01-13 1994-12-27 Maho Aktiengesellschaft Process and device for machining workpieces by means of a laser beam
US20020031157A1 (en) * 1999-03-12 2002-03-14 Lambda Physik Ag Gas performance control system for gas discharge lasers
US20020030041A1 (en) * 1999-07-23 2002-03-14 Mikka Virtanen Laser cutting system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006127891A2 *

Also Published As

Publication number Publication date
WO2006127891A2 (en) 2006-11-30
EP1887912A2 (de) 2008-02-20
WO2006127891A3 (en) 2009-04-16

Similar Documents

Publication Publication Date Title
EP1889000A4 (de) Systeme und verfahren zum implementieren und wechselwirken zwischen einem als linienstrahl geformten laser und einem auf einem substrat abgelagerten film
GB2437384B (en) Multiple fanned laser beam metrology system
GB0519761D0 (en) Laser systems
EP1952105A4 (de) System und verfahren zur formung von laserlicht als homogenen linienstrahl zur wechselwirkung mit einem auf einem substrat abgelagerten film
GB0521513D0 (en) Laser marking on substrates
EP1901797B8 (de) Gerät zur abgabe eines stents in ein ostium
GB2438510B (en) A self-leveling laser apparatus and a method for controlling the same
IL210302A0 (en) Optical tracking system for refueling
EP1782371A4 (de) Systeme und verfahren für software auf der basis von unternehmenskonzepten
EP1887106A4 (de) Metallbeschichtungsfolie, verfahren zu ihrer herstellung und metallverdrahtung
GB0621248D0 (en) Thermal management system for a high-energy laser
EP1890172A4 (de) Verfahren zur bildung eines antireflexfilms
WO2007001845A3 (en) Methods and systems for coating particles
ZA200707112B (en) Method for laminating flat support materials on substrates
GB2438600B (en) Method for patterning thin films on moving substrates
EP1856657B8 (de) Identifikation von datenquellen für ein neuronales netz
HK1095638A1 (en) Device for switching over a laser beam and laser machining device
TWI340055B (en) Laser machining system
GB2444163B8 (en) System and method for regulating the power of a laser beam.
EP1847315A4 (de) Verfahren zum beschichten eines teilchens mit lipidfilm
EP1887912A4 (de) Systeme und verfahren zur implementierung eines zusammenwirkens zwischen einen als linienstrahl geformten laser und einen auf einem träger niedergeschlagenen film
EP2101672B8 (de) Vorrichtungen, systeme und verfahren zur ausrichtung von laserstrahlen
IL180105A0 (en) Substrate handling device for a charged particle beam system
EP1961006A4 (de) Verfahren und systeme zur optischen in-track-positionierung
HK1104370A1 (en) Systems and methods for multi-layer optical medium

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20071219

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

DAX Request for extension of the european patent (deleted)
R17D Deferred search report published (corrected)

Effective date: 20090416

RIC1 Information provided on ipc code assigned before grant

Ipc: H01S 3/08 20060101ALI20090615BHEP

Ipc: H01L 29/04 20060101AFI20090615BHEP

A4 Supplementary search report drawn up and despatched

Effective date: 20101008

17Q First examination report despatched

Effective date: 20111020

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20150115

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: CYMER, LLC

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20150526