EP1887912A4 - Systemes et procedes de mise en oeuvre d'une interaction entre un laser forme en un faisceau lineaire et un film depose sur un substrat - Google Patents

Systemes et procedes de mise en oeuvre d'une interaction entre un laser forme en un faisceau lineaire et un film depose sur un substrat

Info

Publication number
EP1887912A4
EP1887912A4 EP06760377A EP06760377A EP1887912A4 EP 1887912 A4 EP1887912 A4 EP 1887912A4 EP 06760377 A EP06760377 A EP 06760377A EP 06760377 A EP06760377 A EP 06760377A EP 1887912 A4 EP1887912 A4 EP 1887912A4
Authority
EP
European Patent Office
Prior art keywords
implementing
interaction
substrate
systems
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06760377A
Other languages
German (de)
English (en)
Other versions
EP1887912A2 (fr
Inventor
Palash P Das
Thomas Hofmann
Jesse D Davis
Scot T Smith
William N Partlo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cymer LLC
Original Assignee
Cymer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/138,100 external-priority patent/US7390060B2/en
Application filed by Cymer Inc filed Critical Cymer Inc
Publication of EP1887912A2 publication Critical patent/EP1887912A2/fr
Publication of EP1887912A4 publication Critical patent/EP1887912A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
EP06760377A 2005-05-26 2006-05-25 Systemes et procedes de mise en oeuvre d'une interaction entre un laser forme en un faisceau lineaire et un film depose sur un substrat Withdrawn EP1887912A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/138,100 US7390060B2 (en) 2005-04-12 2005-05-26 Reclining chair
PCT/US2006/020223 WO2006127891A2 (fr) 2005-05-26 2006-05-25 Systemes et procedes de mise en oeuvre d'une interaction entre un laser forme en un faisceau lineaire et un film depose sur un substrat

Publications (2)

Publication Number Publication Date
EP1887912A2 EP1887912A2 (fr) 2008-02-20
EP1887912A4 true EP1887912A4 (fr) 2010-11-10

Family

ID=37452835

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06760377A Withdrawn EP1887912A4 (fr) 2005-05-26 2006-05-25 Systemes et procedes de mise en oeuvre d'une interaction entre un laser forme en un faisceau lineaire et un film depose sur un substrat

Country Status (2)

Country Link
EP (1) EP1887912A4 (fr)
WO (1) WO2006127891A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10012544B2 (en) * 2016-11-29 2018-07-03 Cymer, Llc Homogenization of light beam for spectral feature metrology

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01205891A (ja) * 1988-02-12 1989-08-18 Toshiba Corp レーザ加工装置の制御方法
US5376770A (en) * 1992-01-13 1994-12-27 Maho Aktiengesellschaft Process and device for machining workpieces by means of a laser beam
US20020030041A1 (en) * 1999-07-23 2002-03-14 Mikka Virtanen Laser cutting system
US20020031157A1 (en) * 1999-03-12 2002-03-14 Lambda Physik Ag Gas performance control system for gas discharge lasers

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6673531B2 (en) * 2001-03-01 2004-01-06 Fuji Photo Film Co., Ltd. Silver halide photographic light-sensitive material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01205891A (ja) * 1988-02-12 1989-08-18 Toshiba Corp レーザ加工装置の制御方法
US5376770A (en) * 1992-01-13 1994-12-27 Maho Aktiengesellschaft Process and device for machining workpieces by means of a laser beam
US20020031157A1 (en) * 1999-03-12 2002-03-14 Lambda Physik Ag Gas performance control system for gas discharge lasers
US20020030041A1 (en) * 1999-07-23 2002-03-14 Mikka Virtanen Laser cutting system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006127891A2 *

Also Published As

Publication number Publication date
WO2006127891A3 (fr) 2009-04-16
EP1887912A2 (fr) 2008-02-20
WO2006127891A2 (fr) 2006-11-30

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