EP1881371A4 - Process for producing radiation-sensitive resin composition - Google Patents

Process for producing radiation-sensitive resin composition

Info

Publication number
EP1881371A4
EP1881371A4 EP06732568A EP06732568A EP1881371A4 EP 1881371 A4 EP1881371 A4 EP 1881371A4 EP 06732568 A EP06732568 A EP 06732568A EP 06732568 A EP06732568 A EP 06732568A EP 1881371 A4 EP1881371 A4 EP 1881371A4
Authority
EP
European Patent Office
Prior art keywords
resin composition
sensitive resin
producing radiation
radiation
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06732568A
Other languages
German (de)
French (fr)
Other versions
EP1881371A1 (en
Inventor
Kouji Itou
Kouichirou Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of EP1881371A1 publication Critical patent/EP1881371A1/en
Publication of EP1881371A4 publication Critical patent/EP1881371A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D17/00—Separation of liquids, not provided for elsewhere, e.g. by thermal diffusion
    • B01D17/08—Thickening liquid suspensions by filtration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Materials For Photolithography (AREA)
EP06732568A 2005-05-13 2006-05-12 Process for producing radiation-sensitive resin composition Withdrawn EP1881371A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005141208 2005-05-13
PCT/JP2006/309587 WO2006121162A1 (en) 2005-05-13 2006-05-12 Process for producing radiation-sensitive resin composition

Publications (2)

Publication Number Publication Date
EP1881371A1 EP1881371A1 (en) 2008-01-23
EP1881371A4 true EP1881371A4 (en) 2010-06-09

Family

ID=37396668

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06732568A Withdrawn EP1881371A4 (en) 2005-05-13 2006-05-12 Process for producing radiation-sensitive resin composition

Country Status (5)

Country Link
US (1) US7705115B2 (en)
EP (1) EP1881371A4 (en)
JP (1) JP5071107B2 (en)
KR (1) KR101109808B1 (en)
WO (1) WO2006121162A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5136202B2 (en) * 2008-05-19 2013-02-06 Ｊｓｒ株式会社 Method for producing resin-containing solution for resist
JP5217627B2 (en) * 2008-05-22 2013-06-19 Ｊｓｒ株式会社 Method for producing resin-containing solution for resist
JP5509660B2 (en) * 2009-04-08 2014-06-04 Ｊｓｒ株式会社 Method for producing radiation-sensitive resin composition
WO2011121960A1 (en) * 2010-03-31 2011-10-06 住友ベークライト株式会社 Method for producing positive photosensitive resin composition, positive photosensitive resin composition, and filter
JP5886804B2 (en) 2013-09-02 2016-03-16 信越化学工業株式会社 Method for producing resist composition
JP6199686B2 (en) * 2013-10-04 2017-09-20 信越化学工業株式会社 Method for producing resist composition
JP2015197509A (en) * 2014-03-31 2015-11-09 富士フイルム株式会社 Method for producing active ray-sensitive or radiation-sensitive resin composition and active ray-sensitive or radiation-sensitive resin composition
JP6481334B2 (en) * 2014-11-06 2019-03-13 三菱ケミカル株式会社 Purification method and manufacturing method of polymer for semiconductor lithography, manufacturing method of resist composition, and manufacturing method of substrate on which pattern is formed
US10421867B2 (en) * 2015-03-16 2019-09-24 Taiwan Semiconductor Manufacturing Company, Ltd. Priming material for substrate coating
EP3435158A1 (en) * 2016-03-24 2019-01-30 Fujifilm Corporation Active ray-sensitive or radiation-sensitive composition, method for purifying active ray-sensitive or radiation-sensitive composition, pattern-forming method, and method for producing electronic device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004057422A1 (en) * 2002-12-19 2004-07-08 Tokyo Ohka Kogyo Co., Ltd. Process for producing photoresist composition, filter, coater and photoresist composition
US20040224254A1 (en) * 2003-02-11 2004-11-11 Carey Richard J. Photoresist and organic antireflective coating compositions

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4082833B2 (en) * 1999-10-28 2008-04-30 富士フイルム株式会社 Method for preparing chemically amplified resist composition
JP3766245B2 (en) * 1999-12-16 2006-04-12 株式会社ルネサステクノロジ Pattern forming method and semiconductor device manufacturing method
JP2001350266A (en) 2000-06-09 2001-12-21 Sumitomo Chem Co Ltd Method for producing resist composition
JP2002062667A (en) * 2000-08-23 2002-02-28 Sumitomo Chem Co Ltd Method of manufacturing photoresist composition decreased in amount of particulate
JP3832269B2 (en) 2001-04-13 2006-10-11 住友化学株式会社 Photoresist liquid product manufacturing method
US7264912B2 (en) 2001-04-13 2007-09-04 Sumitomo Chemical Company, Limited Method of producing photoresist
JP3832267B2 (en) 2001-04-13 2006-10-11 住友化学株式会社 Method for producing photoresist liquid product with reduced number of fine particles
JP2003311601A (en) 2002-04-22 2003-11-05 Kanekita Kk Polishing device
JP2003330202A (en) * 2002-05-09 2003-11-19 Fuji Photo Film Co Ltd Method for manufacturing positive resist composition
JP4165138B2 (en) 2002-07-19 2008-10-15 住友化学株式会社 Chemical amplification resist solution manufacturing apparatus and chemical amplification resist solution manufacturing method using the apparatus
JP2004195427A (en) 2002-12-20 2004-07-15 Tokyo Ohka Kogyo Co Ltd Filtration method of material for electronic component production
KR100702376B1 (en) 2003-02-06 2007-04-02 도오꾜오까고오교 가부시끼가이샤 Process for refining crude resin for resist
JP4393910B2 (en) 2004-04-08 2010-01-06 東京応化工業株式会社 Photoresist composition manufacturing method, filtration apparatus, coating apparatus, and photoresist composition
JP5192120B2 (en) 2004-09-14 2013-05-08 丸善石油化学株式会社 Method for preventing increase of particles in copolymer for semiconductor resist
JP5030474B2 (en) * 2006-05-18 2012-09-19 丸善石油化学株式会社 Resin composition for semiconductor lithography

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004057422A1 (en) * 2002-12-19 2004-07-08 Tokyo Ohka Kogyo Co., Ltd. Process for producing photoresist composition, filter, coater and photoresist composition
EP1574901A1 (en) * 2002-12-19 2005-09-14 Tokyo Ohka Kogyo Co., Ltd. Process for producing photoresist composition, filter, coater and photoresist composition
US20040224254A1 (en) * 2003-02-11 2004-11-11 Carey Richard J. Photoresist and organic antireflective coating compositions

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
GOTLINSKY B ET AL: "THE EFFECT OF SUB-0.1MUM FILTRATION ON 248NM PHOTORESIST PERFORMANCE", SOLID STATE TECHNOLOGY, PENNWELL CORPORATION, TULSA, OK, US, vol. 43, no. 7, 1 July 2000 (2000-07-01), pages 202 - 204,206, XP000936451, ISSN: 0038-111X *
See also references of WO2006121162A1 *

Also Published As

Publication number Publication date
KR101109808B1 (en) 2012-02-15
JPWO2006121162A1 (en) 2008-12-18
US7705115B2 (en) 2010-04-27
KR20080014967A (en) 2008-02-15
WO2006121162A1 (en) 2006-11-16
JP5071107B2 (en) 2012-11-14
EP1881371A1 (en) 2008-01-23
US20090081586A1 (en) 2009-03-26

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