EP1871571A2 - Dispositif de polissage de pierre precieuse et procede de polissage - Google Patents

Dispositif de polissage de pierre precieuse et procede de polissage

Info

Publication number
EP1871571A2
EP1871571A2 EP06711246A EP06711246A EP1871571A2 EP 1871571 A2 EP1871571 A2 EP 1871571A2 EP 06711246 A EP06711246 A EP 06711246A EP 06711246 A EP06711246 A EP 06711246A EP 1871571 A2 EP1871571 A2 EP 1871571A2
Authority
EP
European Patent Office
Prior art keywords
polishing
tang
axis
pedestal
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06711246A
Other languages
German (de)
English (en)
Inventor
Moshe Kelman
Menachem Moalem
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Israel Diamond Institute
Original Assignee
Israel Diamond Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Israel Diamond Institute filed Critical Israel Diamond Institute
Publication of EP1871571A2 publication Critical patent/EP1871571A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B24B9/161—Dops, dop holders

Definitions

  • the present device relates to the field of gemstones polishing devices, and particularly to the devices for polishing diamonds.
  • Diamonds are polished on a rotating polishing wheel. For polishing, they are held with the help of a dop and a tang.
  • Tang is an elongated device consisting of two main parts: the rear end or butt and the front part or clamp that extends forward from the butt. Usually two screws are inserted in the rear end of the tang. Rotation of the screws in the course of the leveling process changes the spatial position of the tang.
  • the front end of the tang is usually an assembly of a number of parts such as dop and dop holder that allows for dop rotation or facet switching.
  • Figure 1 is a schematic illustration of the tang and the polishing wheel
  • Figure 2 is a schematic cross sectional cut of front part of the tang of Figure 1 .
  • Figure 3 is a schematic illustration of the tang leveling sequence with a level placed on a pedestal.
  • Figure 4 is a schematic illustration of another embodiment of the tang
  • FIG. 1 is a schematic illustration of a device for polishing diamonds.
  • Device 100 which is a tang, includes an elongated body 102 having a rear part 104 and a front part 108.
  • Rear part 104 houses two spaced apart screws 112 and 114. Rotation of screws 112 and 114 changes the spatial position of tang 100. Change of spatial position may be performed in both pitch 118 and roll 120 direction.
  • Disposed in front part 108 are a removable linear level 124 and a conventional dop 128 for holding a gemstone or a diamond 122 in course of the polishing operation.
  • Dop 128 supports rotation of gemstone 122 from one facet to another facet as well as gemstone polishing angle adjustment.
  • Numeral 110 marks a polishing surface of a polishing wheel 116.
  • Figures 2 is cross sectional cut of front part 108 of tang 100.
  • Front part 108 further includes a fixed insert (bushing) 130.
  • Insert 130 is held in place by a fixing screw 134.
  • insert 130 may be a tight fit insert pressed in front part 108 of tang 100.
  • Insert 130 is substantially longer than the thickness t of front part 108 and it has its upper end face 138 and lower end face 136 machined.
  • An assembly 142 that includes a mushroom form pedestal 140 and dop holder 144 is located in front end 108.
  • Pedestal 140 or any other arrangement for holding level 124, has guiding means 146, which may be a protrusion or a recess or simply flat surface and a tubular cylindrical stem 148.
  • Guiding means 146 which are shown as a protrusion, serve as an axis for level 124 rotation.
  • the outer surface of stem 148 mechanically interfaces with the inner surface of insert 130 and actually resides within insert 130.
  • the inner surface of stem 148 couples with dop holder 144.
  • Holder 144 has a section 152 having external diameter larger that the external diameter of insert 130.
  • Surface 156 of section 152 that is in contact with surface 136 of insert 130 is machined.
  • the length of stem 148 is divided into two sections.
  • One of the sections 150 that extends from pedestal 140 has a diameter larger than the rest of stem 148.
  • Section 150 ends by a steep edge leaning on machined end face 138 of insert 130.
  • Screw 154 tensions and locks dop holder 144 with stem 148 and with insert 130.
  • Screw 154 locks extension 148 to machined end face 136 of insert 130 against a spring 158.
  • Dop holder 144 couples with stem 148 of pedestal 140 and subsequently with insert 130 along a common axis 160.
  • Pin 164 associated with dop holder 144 engages a slot in stem 148 and prevents rotation of dop holder 144 relative to pedestal 140.
  • Axis 160 defined by the assembly of pedestal 140 and dop holder 144 has a fixed spatial position with respect to elongated body 102 of tang 100.
  • Stem 148 further includes two O-rings 168 and 170.
  • O-rings 168 and 170 are hermetically closing the mechanical interface between stem 148 and insert 130.
  • O-rings 168 and 170 sit tight within insert 130, providing enough friction that prevents occasional rotation of assembly 142, of pedestal 140 and dop holder 144 relatively to elongated tang body 102 during the polishing.
  • O-rings 168 and 170 prevent dirt and abrasive dust that may be present in the course of the gemstone or diamond polishing process from entering into the interface area.
  • axis 160 maintains its spatial orientation in course of diamond polishing with respect to tang body 102.
  • the axial movement of axis 160 is restricted by the tension applied by spring 158 to machined end- faces 136 and 156 and pin 164 restricts rotational movement of pedestal 140 with respect to dop holder 144.
  • O-rings 168 and 170 prevent occasional free rotation of assembly 142 and accordingly of pedestal 140 relatively to elongated tang body 102.
  • the extended length of insert 130 and associated with it assembly 142 provides a more stable support for axis 160 and effectively reduces or eliminates any axis 160 wondering.
  • Level 124 provides visual feedback or control of the spatial position of axis 160 in the course of the leveling process.
  • Level 124 may be positioned on surface 174 of pedestal 140.
  • Level 124 has guiding means implemented as a circular depression coupled with guiding means (protrusion) 146 of pedestal 140.
  • Level 124 may have guiding means implemented as a protrusion if the pedestal guiding means are implemented as a recess.
  • Guiding means 146 serve as an axis and level 124 may be rotated on them 360 degrees or at least 90 degrees.
  • level 124 For control of the leveling accuracy of tang 100 and rigidly associated with it axis 160 level 124 as shown in Figures 3A and 3B, is oriented sequentially along two mutually orthogonal axes such as X-axis and Y-axis or vise versa. When oriented along X-axis level 124 indicates pitch 118 and when oriented along Y-axis level 124 indicates roll 120 of tang 100. In order to increase the measurement accuracy, level 124 readings are taken in two positions. The first position reading is taken when level 124 is oriented along X or Y axis, where for the second position reading pedestal 140 is rotated 180 degrees.
  • tang leveling level 124 may be removed from pedestal 140, dop 128 is released and rotated on a predefined angle and the next diamond 122 facet polishing process may begin.
  • the leveling process may be simplified by the use of a round or bubble level, although the accuracy of the commercially available levels is not sufficient for this purpose. Due to the rigidity of assembly of pedestal 140 and dop holder 144 axis 160 returns at the end of facet polishing to its orthogonal position to the polishing disk surface 110 making all of the facet angles equal.
  • tang 190 has an elongated body 192 having front end 198 and rear end 194. Front end 198 is substantially thicker than the rest of body 192 and it has a machined surface 200. This thickness is comparable with the length of insert 130 and is selected such as to provide the rigidity required to prevent axis 160 wondering.
  • the disclosed method of polishing diamonds 122 is characterized in that diamonds 122 to be polished are held by a tang 100 having a rigid axis 160 leveled once to be orthogonal to polishing surface 110. Axis 160 returns to its leveled spatial orientation at the completion of each facet polishing process. Axis 160 maintains its spatial orientation with respect to the body 102 of tang 100 in the course of diamond polishing and when diamond 122 position is switched (rotated) between the facets to be polished.

Abstract

L'invention concerne un procédé de polissage de diamants retenus par une pince de taille (100) présentant un axe prédéfini (160) perpendiculaire à la surface de polissage (110). Ledit axe (160) revient dans son orientation spatiale originale par rapport à la surface de polissage (110) au niveau de l'extrémité de chaque facette du diamant (122) en cours de polissage.
EP06711246A 2005-03-14 2006-02-28 Dispositif de polissage de pierre precieuse et procede de polissage Withdrawn EP1871571A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL16742305 2005-03-14
PCT/IL2006/000264 WO2006097915A2 (fr) 2005-03-14 2006-02-28 Dispositif de polissage de pierre precieuse et procede de polissage

Publications (1)

Publication Number Publication Date
EP1871571A2 true EP1871571A2 (fr) 2008-01-02

Family

ID=36992118

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06711246A Withdrawn EP1871571A2 (fr) 2005-03-14 2006-02-28 Dispositif de polissage de pierre precieuse et procede de polissage

Country Status (6)

Country Link
US (1) US20080113588A1 (fr)
EP (1) EP1871571A2 (fr)
CN (1) CN101137462A (fr)
RU (1) RU2007138041A (fr)
WO (1) WO2006097915A2 (fr)
ZA (1) ZA200708626B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7987608B2 (en) * 2009-07-16 2011-08-02 Frederick Rowe Grinding angle bubble level jig
CN102309097A (zh) * 2011-08-12 2012-01-11 深圳市星光达珠宝首饰实业有限公司 湿式离心滚桶机
WO2013031772A1 (fr) * 2011-08-31 2013-03-07 高知Ｆｅｌ株式会社 Dispositif de polissage de diamants
RU2548335C1 (ru) * 2013-11-06 2015-04-20 Владимир Юрьевич Карасев Способ изготовления изделий из алмазов
BE1025522B1 (nl) 2017-09-01 2019-04-04 Octonus Finland Oy Verbeterde werkwijze voor het controleren van het slijpen van edelstenen

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US558909A (en) * 1896-04-21 Diamond-polishing tool
US1103698A (en) * 1913-06-12 1914-07-14 Edgard Soetens Mechanical dop for polishing (cutting) diamonds.
US2530421A (en) * 1942-02-21 1950-11-21 Thomas P N Burness Appliance for use in cutting and polishing diamonds and other substances
US2534384A (en) * 1942-03-31 1950-12-19 Spira Josef Hillel Apparatus for polishing or forming facets on gems, diamonds, or the like
JPS4835597B1 (fr) * 1968-01-25 1973-10-29
GB2249743B (en) * 1987-11-20 1992-09-16 Diamond Trading Co Ltd Working a multi-grain facet of a gemstone
US5435774A (en) * 1994-02-04 1995-07-25 Naujok; Robert Apparatus for holding gemstones to be polished

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2006097915A2 *

Also Published As

Publication number Publication date
ZA200708626B (en) 2008-10-29
CN101137462A (zh) 2008-03-05
US20080113588A1 (en) 2008-05-15
WO2006097915A2 (fr) 2006-09-21
RU2007138041A (ru) 2009-04-20
WO2006097915A3 (fr) 2006-12-07

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