EP1867224A2 - Cooling device for printed circuit boards and method for the production thereof - Google Patents

Cooling device for printed circuit boards and method for the production thereof

Info

Publication number
EP1867224A2
EP1867224A2 EP06705989A EP06705989A EP1867224A2 EP 1867224 A2 EP1867224 A2 EP 1867224A2 EP 06705989 A EP06705989 A EP 06705989A EP 06705989 A EP06705989 A EP 06705989A EP 1867224 A2 EP1867224 A2 EP 1867224A2
Authority
EP
European Patent Office
Prior art keywords
housing
cooling device
circuit board
printed circuit
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06705989A
Other languages
German (de)
French (fr)
Inventor
Josef Schmidt
Peter Weichselbaumer
Dirk Riese
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP1867224A2 publication Critical patent/EP1867224A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Definitions

  • the invention relates to a cooling device for a printed circuit board arranged in a housing and to a production method for such a cooling device.
  • a well-known in the art, effective way to produce a thermally conductive connection between the circuit board in the housing and the environment, is to glue the circuit board by means of a planteospray on a metal plate, preferably made of aluminum, and then to the housing screwed up.
  • the metal plate serves as a heat sink and at the same time as the lid of the housing. This construction technique is used by default in many control units in the automotive sector.
  • the invention has for its object to provide an improved cooling device of the type mentioned, which can be produced with little effort.
  • the object is achieved by a cooling device having the features specified in claim 1, and by a method having the features specified in claim 10.
  • the invention provides a cooling device in which the printed circuit board can be connected to a metal cooling body, which is designed as a cover of the housing and can be connected with it in a latching or snap-action manner. Through this screwless and detachable connection a complex screwing is avoided. This reduces both the number of parts used and the assembly effort.
  • the housing for latching or snap-fitting of the "metal heat sink on the housing at least one locking hook. This provides a simple means for screwless connection, in particular a simple locking or snap connection is.
  • At least one spring element is provided that allows a defined position of the metal heat sink relative to the circuit board and the housing. This is achieved by the spring element, that the metal heat sink is acted upon in the locked or snapped state with a compressive stress.
  • the compressive stress is directed against an undercut of the latching hook. A tension of the printed circuit board by different lines of force is thereby excluded. closed.
  • the spring element consists of a part of the housing.
  • the spring element as Gesimouselip- pen to the example formed of plastic housing formed. So no additional parts and no additional installation work is required.
  • a preferred embodiment provides that a heat-conducting body is arranged between the printed circuit board and the metal cooling body.
  • the circuit board may be spaced from the metal heat sink, so that, for example, structures such as electronic components on the circuit board are possible.
  • the heat-conducting body is formed from an initially flowable, hardened heat-conducting material, in particular from a heat-conducting compound.
  • a heat-conducting compound there are available from various manufacturers flowable heat conducting materials, such as thermal grease, which stick together after curing with the substrate and therefore do not require contact pressure.
  • flowable thermal mass allows the compensation of distance tolerances between the circuit board and the metal heat sink.
  • the housing consists of plastic. This allows a low weight and a simple. Production of the housing. In addition, electrical problems such as short circuits are avoided by the insulator effect of plastic.
  • a defined positioning of the printed circuit board in the housing is achieved by at least one support for the printed circuit board within the housing.
  • the support is designed in the manner of a support gage and can be molded onto the housing.
  • There may be provided a plurality of support domes for the positioning of the circuit board in the housing.
  • the housing may also be designed as a finished module, which is connected to the support men and formed as spring elements housing lips is produced in a pressing or forming process as a plastic module.
  • the method according to the invention for producing a cooling device provides that a printed circuit board arranged in a housing is provided with a flowable heat conducting body made of a heat conducting material and a metal cooling body is connected by contacting the heat conducting body with the housing in a frenzy or snap, before the heat conducting material has completely hardened ,
  • a heat-conducting compound with high viscosity is used as the heat-conducting material. In this way, the thermal mass is displaced by pressure without running out.
  • the essence of the invention is the mechanism for tolerance compensation.
  • the advantages achieved by the invention are, in particular, that the metal cover can be fixed without screws and still be achieved using a flowable michleitmaterials a permanent, 'thermally conductive connection between the circuit board and metal cover.
  • Fig. 1 shows a first variant of a cooling device
  • Fig. 2 shows a second variant of a cooling device.
  • Figure 1 shows a section of a cooling device 1 for a printed circuit board 2, which in a housing 3 made of plastic is arranged.
  • a metal heat sink 4 in plate form is provided as a cover for the housing 3.
  • the metal cooling body 4 is not screwed to the plastic housing, but fixed by a snap-locking hook 5.
  • a plurality of latching hooks 5 or a peripheral edge of the housing may be provided.
  • a latching hook 5 is exemplified.
  • the printed circuit board 2 is located in the housing 3 on a plane defined for example by a support 6, which is designed as a dome. There may be provided a plurality of supports 6 for positioning the printed circuit board 2 in the housing 3.
  • the space between the metal heat sink 4 and the circuit board 2 is filled with a flowable heat conducting material, which cures after assembly to a Weg1eitmaschine 7 and so causes a permanent thermally conductive connection.
  • a solid heat conduction body between the printed circuit board 2 and metal heat sink 4 can be used.
  • the length of the latching hooks 5 could be designed so that always the minimum possible distance between the printed circuit board 2 and the metal heat sink 4 is realized.
  • the minimum distance may, for example, be given by the size of solid fillers in the heat-conducting body 7 or by the thickness of a fixed heat-conducting body 7.
  • all components of the assembly are subject to production-related tolerances, in particular the length of the latching hooks 5, the thickness of the metal heat sink 4 and the thickness of the printed circuit board 2.
  • the latching hooks 5 are set so that with maximum thickness of the metal heat sink 4 and maximum thickness due to tolerances the circuit board 2, the distance between the circuit board 2 and metal heat sink 4 is minimal, as would be the reverse Case, that is, with a minimum thickness of the printed circuit board 2 and the metal heat sink 4, after mounting a game between latching hook 5 and metal heat sink 4.
  • the metal heat sink 4 would not be sufficiently fixed.
  • a defined position for the metal cooling body 4 is created by a combination of latching hook 5 and spring elements 8.
  • the circuit board 2 and the metal heat sink 4 is used in this.
  • the spring elements 8 are designed as housing lips in the interior of the housing 3 with this one piece made of plastic. They press the metal heat sink 4 against the undercuts 9 of the latching hooks 5. These form thereby defined contact surfaces for the metal heat sink 4.
  • the spring elements 8 can be used as separate parts in the housing 3.
  • the arrangement of the spring elements 8 causes both the circuit board 2 and the metal heat sink 4 always rest on a defined plane.
  • the manufacturing tolerances in the thicknesses of the printed circuit board 2 and the metal heat sink 4 and the length of the latching hook 5 thereby only lead to a variation of the distance between the printed circuit board 2 and metal cooling body 4, which is bridged by the flowable heat conducting material or the heat conducting body 7 formed therefrom , After snapping the metal heat sink 4, the distance remains constant, so that the thermosetting compound has a constant shape.
  • the amount of flowable choirleitmate- rials to be applied to the circuit board 2 before mounting the metal heat sink 4 is to be chosen so that the maximum distance between the circuit board 2 and metal heat sink 4 resulting from utilization of the manufacturing tolerances is still safely bridged. Since the material is flowable during assembly, the excess material is laterally displaced at less than the maximum distance.
  • the not to scale figure shows an example of a conceivable embodiment variant in which the housing lip is designed as a spring element 8 so that it is deflected when mounting the metal heat sink 4 as a cover in the entire tolerance range and thus always exerts a restoring force on the metal heat sink 4. It presses the metal heat sink 4 against the undercut 9 of the latching hooks 5. This defines the position of the metal heat sink 4.
  • the position of the printed circuit board 2 is defined by a support 6 formed on the plastic housing 3.
  • the resulting between the metal heat sink 4 and the circuit board 2 gap is bridged by the hardening after mounting flowable heat conducting material, whereby on the resulting heat conducting body 7, a thermally conductive connection is formed.
  • FIG. 2 shows a further embodiment of a cooling device 1 is shown in detail, in which the spring elements 8 are designed as housing outer lying on the housing housing 3 integral with the housing 3 made of plastic.
  • a locking hook 5 is located in the central region of the Metallkühlkör- pers • 4.
  • the latching hook 5 is in the region of a support 6 of the
  • housing 3 arranged and designed with the housing 3 in one piece made of plastic.
  • the latching hook 5 for example, be inserted as a separate part on the support 6 in the housing 3.
  • the printed circuit board 2 and the metal cooling body 4 have recesses through which the latching hook 5 can protrude.
  • the circuit board 2 is located around the latching hook 5 around on the support 6 and at an intermediate edge of the housing 3 in a defined position.

Abstract

The invention relates to a cooling device (1) for a printed circuit board (2) which is disposed in a housing (3) and can be connected in a locking manner to a metal cooling element (4) that is embodied as a cover of said housing (3).

Description

B e s ehr e ibungHonest reminder
Kühlvorrichtung für Leiterplatten und Verfahren zur Herstellung derselbenCircuit board cooling apparatus and method of making the same
Die Erfindung betrifft eine Kühlvorrichtung für eine in einem Gehäuse angeordnete Leiterplatte sowie ein Herstellungsverfahren für eine solche Kühlvorrichtung.The invention relates to a cooling device for a printed circuit board arranged in a housing and to a production method for such a cooling device.
Bei elektronischen Steuergeräten, insbesondere im Automobilbereich, wird häufig eine mit elektronischen Komponenten bestückte Leiterplatte in ein Kunststoffgehäuse eingefasst. Die elektronischen Komponenten produzieren in der Regel eine Verlustleistung, die in Form von Abwärme zu einer Erwärmung der Baugruppe führt. Es besteht das Problem, diese Abwärme aus- dem Gehäuse heraus nach außen zu transportieren und an die Umgebung abzugeben, um eine Überhitzung der Baugruppe zu vermeiden.In electronic control devices, in particular in the automotive sector, often a printed circuit board equipped with electronic components is enclosed in a plastic housing. The electronic components usually produce a power loss, which leads to a warming of the module in the form of waste heat. There is the problem of transporting this waste heat out of the housing to the outside and to the environment to avoid overheating of the assembly.
Eine im Stand der Technik bekannte, effektive Möglichkeit, eine thermisch leitende Verbindung zwischen der Leiterplatte im Gehäuse und der Umgebung herzustellen, besteht darin, die Leiterplatte mit Hilfe einer Wärmeleitfolie auf einer Metallplatte, vorzugsweise aus Aluminium, zu verkleben und diese dann mit dem Gehäuse zu verschraüben . Bei diesem Konzept dient die Metallplatte als Kühlkörper und gleichzeitig als Deckel des Gehäuses . Diese Aufbautechnik wird standardmäßig bei vielen Steuergeräten im Automobilbereich verwendet.A well-known in the art, effective way to produce a thermally conductive connection between the circuit board in the housing and the environment, is to glue the circuit board by means of a Wärmeleitfolie on a metal plate, preferably made of aluminum, and then to the housing screwed up. In this concept, the metal plate serves as a heat sink and at the same time as the lid of the housing. This construction technique is used by default in many control units in the automotive sector.
Ein Nachteil dieser Aufbautechnik besteht darin, dass zurA disadvantage of this construction technique is that the
Aufrechterhaltung einer guten thermischen Verbindung zwischen Leiterplatte und Metallkühlkörper stets ein gewisser Anpressdruck vorhanden sein muss. Dies erfordert eine Verschraubung des Metallkühlkörpers mit dem Kunststoffgehäuse. Der Erfindung liegt die Aufgabe zugrunde, eine verbesserte Kühlvorrichtung der eingangs genannten Art anzugeben, die mit geringem Aufwand herstellbar ist.Maintaining a good thermal connection between circuit board and metal heat sink always a certain contact pressure must be present. This requires a screw connection of the metal heat sink with the plastic housing. The invention has for its object to provide an improved cooling device of the type mentioned, which can be produced with little effort.
Die Aufgabe wird erfindungsgemäß durch eine Kühlvorrichtung, welche die in Anspruch 1 angegebenen Merkmale aufweist, und durch ein Verfahren, welches die in Anspruch 10 angegebenen Merkmale aufweist, gelöst.The object is achieved by a cooling device having the features specified in claim 1, and by a method having the features specified in claim 10.
Vorteilhafte Ausgestaltungen sind Gegenstand der jeweiligen Unteransprüche .Advantageous embodiments are the subject of the respective subclaims.
Die Erfindung sieht eine Kühlvorrichtung vor, bei der die Leiterplatte mit einem Metallkühlkprper verbindbar ist, der als Deckel des Gehäuses ausgebildet und mit diesem rastend bzw. schnappend verbindbar ist. Durch diese schraubenlose und lösbare Verbindung ist eine aufwendige Verschraubung sicher vermieden. Dies reduziert sowohl die Anzahl der verwendeten Teile als auch den Montageaufwand.The invention provides a cooling device in which the printed circuit board can be connected to a metal cooling body, which is designed as a cover of the housing and can be connected with it in a latching or snap-action manner. Through this screwless and detachable connection a complex screwing is avoided. This reduces both the number of parts used and the assembly effort.
In einer bevorzugten Ausgestaltung weist das Gehäuse zum Einrasten bzw. Verschnappen des" Metallkühlkörpers am Gehäuse mindestens einen Rasthaken auf. Dieser stellt ein einfaches Mittel zur schraubenlosen Verbindung, insbesondere eine ein- fache Rast- oder, Schnappverbindung, dar.In a preferred embodiment, the housing for latching or snap-fitting of the "metal heat sink on the housing at least one locking hook. This provides a simple means for screwless connection, in particular a simple locking or snap connection is.
Zum Ausgleich von Fertigungstoleranzen, z. B. der Dicke der Leitplatte oder des Deckels, ist mindestens ein Federelement vorgesehen, dass eine definierte Lage des Metallkühlkörpers gegenüber der Leiterplatte und dem Gehäuse ermöglicht. Hierbei wird durch das Federelement erreicht, dass der Metallkühlkörper im eingerasteten bzw. verschnappten Zustand mit einer Druckspannung beaufschlagt wird. In einer besonderen Ausgestaltung ist die Druckspannung gegen eine Hinterschnei- düng des Rasthakens gerichtet. Eine Verspannung der Leiterplatte durch unterschiedliche Kraftlinien ist dadurch ausge- schlössen .To compensate for manufacturing tolerances, eg. As the thickness of the baffle or the lid, at least one spring element is provided that allows a defined position of the metal heat sink relative to the circuit board and the housing. This is achieved by the spring element, that the metal heat sink is acted upon in the locked or snapped state with a compressive stress. In a particular embodiment, the compressive stress is directed against an undercut of the latching hook. A tension of the printed circuit board by different lines of force is thereby excluded. closed.
Vorzugsweise besteht das Federelement aus einem Teil des Gehäuses. Beispielsweise sind die Federelement als Gehäuselip- pen an das beispielsweise aus Kunststoff gebildete Gehäuse angeformt. So sind keine zusätzlichen Teile und kein zusätzlicher Montageaufwand erforderlich.Preferably, the spring element consists of a part of the housing. For example, the spring element as Gehäuselip- pen to the example formed of plastic housing formed. So no additional parts and no additional installation work is required.
Eine bevorzugte Ausführungsform sieht vor, dass zwischen der Leiterplatte und dem Metallkühlkörper ein Wärmeleitkörper angeordnet ist. Auf diese Weise kann die Leiterplatte von dem Metallkühlkörper beabstandet sein, so dass beispielsweise Aufbauten wie elektronische Bauelemente auf der Leiterplatte möglich sind.A preferred embodiment provides that a heat-conducting body is arranged between the printed circuit board and the metal cooling body. In this way, the circuit board may be spaced from the metal heat sink, so that, for example, structures such as electronic components on the circuit board are possible.
Vorteilhafterweise ist der Wärmeleitkörper aus einem ursprünglich fließfähigen, ausgehärteten Wärmeleitmaterial, insbesondere aus einer Wärmeleitmasse gebildet. Es sind von verschiedenen Herstellern fließfähige Wärmeleitmaterialien, beispielsweise Wärmeleitpasten, erhältlich, die nach dem Aushärten mit dem Substrat verkleben und daher keinen Anpress- druck erfordern. Eine solche fließfähige Wärmeleitmasse ermöglicht den Ausgleich von Abstandstoleranzen zwischen der Leiterplatte und dem Metallkühlkörper.Advantageously, the heat-conducting body is formed from an initially flowable, hardened heat-conducting material, in particular from a heat-conducting compound. There are available from various manufacturers flowable heat conducting materials, such as thermal grease, which stick together after curing with the substrate and therefore do not require contact pressure. Such a flowable thermal mass allows the compensation of distance tolerances between the circuit board and the metal heat sink.
Zweckmäßigerweise besteht das Gehäuse aus Kunststoff. Dies ermöglicht ein geringes Gewicht und eine einfache. Herstellung des Gehäuses. Zudem werden elektrische Probleme wie Kurzschlüsse durch die Isolatorwirkung von Kunststoff vermieden.Appropriately, the housing consists of plastic. This allows a low weight and a simple. Production of the housing. In addition, electrical problems such as short circuits are avoided by the insulator effect of plastic.
Ein definiertes Positionieren der Leiterplatte im Gehäuse gelingt durch mindestens eine Auflage für die Leiterplatte innerhalb des Gehäuses . Die Auflage ist in Art eines Auflagedomes ausgebildet und kann an das Gehäuse angeformt sein. Es können mehrere Auflagedome für die Positionierung der Leiterplatte in dem Gehäuse vorgesehen sein. Auch kann das Gehäuse als Fertigmodul ausgebildet sein, welches mit den Auflagedo- men und den als Federelementen ausgebildeten Gehäuselippen in einem Press- oder Umformvorgang als Kunststoffmodul hergestellt wird.A defined positioning of the printed circuit board in the housing is achieved by at least one support for the printed circuit board within the housing. The support is designed in the manner of a support gage and can be molded onto the housing. There may be provided a plurality of support domes for the positioning of the circuit board in the housing. The housing may also be designed as a finished module, which is connected to the support men and formed as spring elements housing lips is produced in a pressing or forming process as a plastic module.
Das erfindungsgemäße Verfahren zur Herstellung einer Kühlvorrichtung sieht vor, dass eine in einem Gehäuse angeordnete Leiterplatte mit einem fließfähigen Wärmeleitkörper aus einem Wärmeleitmaterial versehen wird und ein Metallkühlkörper durch Kontaktierung des Wärmeleitkörpers mit dem Gehäuse ras- tend oder schnappend verbunden wird, bevor das Wärmeleitmaterial vollständig ausgehärtet ist.The method according to the invention for producing a cooling device provides that a printed circuit board arranged in a housing is provided with a flowable heat conducting body made of a heat conducting material and a metal cooling body is connected by contacting the heat conducting body with the housing in a frenzy or snap, before the heat conducting material has completely hardened ,
In einer bevorzugten Ausführungsform wird dabei als Wärmeleitmaterial eine Wärmeleitmasse mit hoher Viskosität verwen- det . Auf diese Weise ist die Wärmeleitmasse durch Druck verdrängbar ohne zu zerlaufen.In a preferred embodiment, a heat-conducting compound with high viscosity is used as the heat-conducting material. In this way, the thermal mass is displaced by pressure without running out.
Das Wesentliche an der Erfindung ist der Mechanismus zum Toleranzausgleich. Die mit der Erfindung erzielten Vorteile be- stehen insbesondere darin, dass der Metalldeckel schraubenlos fixiert werden kann und unter Verwendung eines fließfähigen Wärmeleitmaterials dennoch eine dauerhafte, 'thermisch leitende Verbindung zwischen Leiterplatte und Metalldeckel erzielbar ist.The essence of the invention is the mechanism for tolerance compensation. The advantages achieved by the invention are, in particular, that the metal cover can be fixed without screws and still be achieved using a flowable Wärmeleitmaterials a permanent, 'thermally conductive connection between the circuit board and metal cover.
Ausführungsbeispiele der Erfindung werden anhand einer Zeichnung näher erläutert. Darin zeigen:Embodiments of the invention will be explained in more detail with reference to a drawing. Show:
Fig. 1 eine erste Variante einer Kühlvorrichtung undFig. 1 shows a first variant of a cooling device and
Fig. 2 eine zweite Variante einer Kühlvorrichtung.Fig. 2 shows a second variant of a cooling device.
Einander entsprechende Teile sind in allen Figuren mit den gleichen Bezugszeichen versehen.Corresponding parts are provided in all figures with the same reference numerals.
Figur 1 zeigt einen Ausschnitt einer Kühlvorrichtung 1 für eine Leiterplatte 2, die in einem Gehäuse 3 aus Kunststoff angeordnet ist. Ein Metallkühlkörper 4 in Plattenform ist als Deckel für das Gehäuse 3 vorgesehen. Erfindungsgemäß ist der Metallkühlkörper 4 mit dem Kunststoffgehäuse nicht verschraubt, sondern durch einen schnappenden Rasthaken 5 fi- xiert. Je nach Größe und Form der Leiterplatte 2 können mehrere Rasthaken 5 oder ein am Gehäuserand umlaufender Rastrand vorgesehen sein. In der Figur 1 ist beispielhaft ein Rasthaken 5 dargestellt.Figure 1 shows a section of a cooling device 1 for a printed circuit board 2, which in a housing 3 made of plastic is arranged. A metal heat sink 4 in plate form is provided as a cover for the housing 3. According to the invention, the metal cooling body 4 is not screwed to the plastic housing, but fixed by a snap-locking hook 5. Depending on the size and shape of the circuit board 2, a plurality of latching hooks 5 or a peripheral edge of the housing may be provided. In the figure 1 a latching hook 5 is exemplified.
Die Leiterplatte 2 liegt im Gehäuse 3 auf einer beispielsweise durch eine Auflage 6, die als Dom ausgeführt ist, definierten Ebene auf. Es können mehrere Auflagen 6 zur Positionierung der Leiterplatte 2 im Gehäuse 3 vorgesehen sein.The printed circuit board 2 is located in the housing 3 on a plane defined for example by a support 6, which is designed as a dome. There may be provided a plurality of supports 6 for positioning the printed circuit board 2 in the housing 3.
Der Zwischenraum zwischen Metallkühlkörper 4 und der Leiterplatte 2 wird mit einem fließfähigen Wärmeleitmaterial ausgefüllt, das nach der Montage zu einem Wärme1eitkörper 7 aushärtet und so eine dauerhafte thermisch leitfähige Verbindung bewirkt. In einer alternativen Ausführung kann beispielsweise ein fester Wärmeleitkörper zwischen Leiterplatte 2 und Metallkühlkörper 4 eingesetzt werden.The space between the metal heat sink 4 and the circuit board 2 is filled with a flowable heat conducting material, which cures after assembly to a Wärme1eitkörper 7 and so causes a permanent thermally conductive connection. In an alternative embodiment, for example, a solid heat conduction body between the printed circuit board 2 and metal heat sink 4 can be used.
Wäre es möglich, Gehäuse 3, Leiterplatte 2 und Metallkühlkörper 4 ohne Toleranzen zu fertigen, so könnte die Länge der Rasthaken 5 so ausgelegt werden, dass stets der minimal mögliche Abstand zwischen Leiterplatte 2 und dem Metallkühlkörper 4 realisiert ist. Der minimale Abstand kann beispielsweise durch die Größe von in dem Wärme1eitkörper 7 befindlichen, festen Füllstoffen beziehungsweise durch die Dicke eines fes- ' ten Wärmeleitkörpers 7 gegeben sein. Es unterliegen jedoch alle Komponenten der Baugruppe fertigungsbedingten Toleranzen, insbesondere die Länge der Rasthaken 5, die Dicke des Metallkühlkörpers 4 und die Dicke der Leiterplatte 2. Legt man die Rasthaken 5 so aus, dass bei toleranzbedingt maxima- ler Dicke des Metallkühlkörpers 4 und maximaler Dicke der Leiterplatte 2 der Abstand zwischen Leiterplatte 2 und Me- tallkühlkörper 4 minimal wird, so ergäbe sich im umgekehrten Fall, das heißt bei minimaler Dicke der Leiterplatte 2 und des Metallkühlkörpers 4, nach der Montage ein Spiel zwischen Rasthaken 5 und Metallkühlkörper 4. Der Metallkühlkörper 4 wäre also nicht ausreichend fixiert.If it were possible to produce housing 3, printed circuit board 2 and metal heat sink 4 without tolerances, then the length of the latching hooks 5 could be designed so that always the minimum possible distance between the printed circuit board 2 and the metal heat sink 4 is realized. The minimum distance may, for example, be given by the size of solid fillers in the heat-conducting body 7 or by the thickness of a fixed heat-conducting body 7. However, all components of the assembly are subject to production-related tolerances, in particular the length of the latching hooks 5, the thickness of the metal heat sink 4 and the thickness of the printed circuit board 2. If the latching hooks 5 are set so that with maximum thickness of the metal heat sink 4 and maximum thickness due to tolerances the circuit board 2, the distance between the circuit board 2 and metal heat sink 4 is minimal, as would be the reverse Case, that is, with a minimum thickness of the printed circuit board 2 and the metal heat sink 4, after mounting a game between latching hook 5 and metal heat sink 4. The metal heat sink 4 would not be sufficiently fixed.
Um das beschriebene Problem zu vermeiden, das sich als Folge der kaum • zu vermeidenden Fertigungstoleranzen der Teile der Baugruppe ergibt, wird durch eine Kombination von Rasthaken 5 und Federelementen 8 eine definierte Lage für den Metallkühl- körper 4 geschaffen. Zum Ausgleich von Fertigungstoleranzen des Gehäuses 3, der Leiterplatte 2 und des Metallkühlkörpers 4 dient in diesem. Beispiel eine besondere Gestaltung des Gehäuses 3. Die Federelemente 8 sind als Gehäuselippen im Inneren des Gehäuses 3 mit diesem einstückig aus Kunststoff ausgeführt. Sie drücken den Metallkühlkörper 4 gegen die Hin- terschneidungen 9 der Rasthaken 5. Diese bilden dadurch definierte Auflageflächen für den Metallkühlkörper 4. In einer alternativen Anordnung können die Federelemente 8 als separate Teile in das Gehäuse 3 eingesetzt werden.In order to avoid the described problem, which results as a result of the hardly • avoidable manufacturing tolerances of the parts of the assembly, a defined position for the metal cooling body 4 is created by a combination of latching hook 5 and spring elements 8. To compensate for manufacturing tolerances of the housing 3, the circuit board 2 and the metal heat sink 4 is used in this. Example, a special design of the housing 3. The spring elements 8 are designed as housing lips in the interior of the housing 3 with this one piece made of plastic. They press the metal heat sink 4 against the undercuts 9 of the latching hooks 5. These form thereby defined contact surfaces for the metal heat sink 4. In an alternative arrangement, the spring elements 8 can be used as separate parts in the housing 3.
Die Anordnung der Federelemente 8 führt dazu, dass sowohl die Leiterplatte 2 als auch der Metallkühlkörper 4 stets auf einer definierten Ebene aufliegen. Die Fertigungstoleranzen in den Dicken der Leiterplatte 2 und des Metallkühlkörpers 4 so- wie der Länge der Rasthaken 5 führen dadurch lediglich zu einer Variation des Abstandes zwischen Leiterplatte 2 und Me- tallkühlkörper 4, der durch das fließfähige Wärmeleitmaterial beziehungsweise den daraus gebildeten Wärmeleitkörper 7 überbrückt wird. Nach dem Verschnappen des Metallkühlkörpers 4 bleibt der Abstand konstant, so dass die aushärtende Wärmeleitmasse eine konstante Form aufweist.The arrangement of the spring elements 8 causes both the circuit board 2 and the metal heat sink 4 always rest on a defined plane. The manufacturing tolerances in the thicknesses of the printed circuit board 2 and the metal heat sink 4 and the length of the latching hook 5 thereby only lead to a variation of the distance between the printed circuit board 2 and metal cooling body 4, which is bridged by the flowable heat conducting material or the heat conducting body 7 formed therefrom , After snapping the metal heat sink 4, the distance remains constant, so that the thermosetting compound has a constant shape.
Die Menge des auf die Leiterplatte 2 vor der Montage des Metallkühlkörpers 4 aufzutragenden fließfähigen Wärmeleitmate- rials ist so zu wählen, dass der bei Ausnutzung der Fertigungstoleranzen entstehende maximale Abstand zwischen Leiterplatte 2 und Metallkühlkörper 4 noch sicher überbrückt wird. Da das Material bei der Montage fließfähig ist, wird der Ma- terialüberschuss bei geringerem als dem maximalen Abstand seitlich verdrängt.The amount of flowable Wärmeleitmate- rials to be applied to the circuit board 2 before mounting the metal heat sink 4 is to be chosen so that the maximum distance between the circuit board 2 and metal heat sink 4 resulting from utilization of the manufacturing tolerances is still safely bridged. Since the material is flowable during assembly, the excess material is laterally displaced at less than the maximum distance.
Die nicht maßstäbliche Abbildung zeigt beispielhaft eine denkbare Ausgestaltungsvariante, bei der die Gehäuselippe als Federelement 8 so ausgelegt ist, dass sie bei Montage des Me- tallkühlkörpers 4 als Deckel im gesamten Toleranzbereich ausgelenkt wird und so stets eine Rückstellkraft auf den Metall- kühlkörper 4 ausübt. Sie drückt den Metallkühlkörper 4 gegen die Hinterschneidung 9 der Rasthaken 5. Dadurch wird die Lage des Metallkühlkörpers 4 definiert. Die Lage der Leiterplatte 2 wird durch eine am Kunststoff-Gehäuse 3 ausgeformte Auflage 6 definiert. Der zwischen dem Metallkühlkörper 4 und der Leiterplatte 2 entstehende Zwischenraum wird durch das nach der Montage aushärtende fließfähige Wärmeleitmaterial überbrückt, wodurch über den so entstehenden Wärmeleitkörper 7 eine thermisch leitende Verbindung entsteht.The not to scale figure shows an example of a conceivable embodiment variant in which the housing lip is designed as a spring element 8 so that it is deflected when mounting the metal heat sink 4 as a cover in the entire tolerance range and thus always exerts a restoring force on the metal heat sink 4. It presses the metal heat sink 4 against the undercut 9 of the latching hooks 5. This defines the position of the metal heat sink 4. The position of the printed circuit board 2 is defined by a support 6 formed on the plastic housing 3. The resulting between the metal heat sink 4 and the circuit board 2 gap is bridged by the hardening after mounting flowable heat conducting material, whereby on the resulting heat conducting body 7, a thermally conductive connection is formed.
In Figur 2 ist eine weitere Ausführungsform einer Kühlvorrichtung 1 im Ausschnitt dargestellt, bei der die Federelemente 8 als außen am Gehäuse 3 liegende Gehäuselippen einstückig mit dem Gehäuse 3 aus Kunststoff ausgeführt sind. Ein Rasthaken 5 sitzt im mittleren Bereich des Metallkühlkör- pers 4. Der • Rasthaken 5 ist im Bereich einer Auflage 6 des2 shows a further embodiment of a cooling device 1 is shown in detail, in which the spring elements 8 are designed as housing outer lying on the housing housing 3 integral with the housing 3 made of plastic. A locking hook 5 is located in the central region of the Metallkühlkör- pers • 4. The latching hook 5 is in the region of a support 6 of the
Gehäuses 3 angeordnet und mit dem Gehäuse 3 einstückig aus Kunststoff ausgeführt. Alternativ kann der Rasthaken 5 beispielsweise auch als ein separates Teil auf der Auflage 6 in das Gehäuse 3 eingefügt sein. Die Leiterplatte 2 und der Me- tallkühlkörper 4 weisen in diesem Fall Ausnehmungen auf, durch die der Rasthaken 5 hindurchragen kann. Die Leiterplatte 2 liegt um den Rasthaken 5 herum auf der Auflage 6 und an einem Zwischenrand des Gehäuses 3 in einer definierten Lage auf . Bezugs zeichenlisteHousing 3 arranged and designed with the housing 3 in one piece made of plastic. Alternatively, the latching hook 5, for example, be inserted as a separate part on the support 6 in the housing 3. In this case, the printed circuit board 2 and the metal cooling body 4 have recesses through which the latching hook 5 can protrude. The circuit board 2 is located around the latching hook 5 around on the support 6 and at an intermediate edge of the housing 3 in a defined position. Reference sign list
1 Kühlvorrichtung1 cooling device
2 Leiterplatte2 circuit board
3 Gehäuse3 housing
4 Metallkühlkörper4 metal heat sinks
5 Rasthaken5 snap hooks
6 Auflage6 edition
7 Wärmeleitkörper7 heat-conducting body
8 Federelement8 spring element
9 Hinterschneidung 9 undercut

Claims

Patentansprüche claims
1. Kühlvorrichtung (1) für eine in einem Gehäuse (3) angeordnete Leiterplatte (2), die mit einem Metallkühlkörper (4), der als Deckel des Gehäuses (3) ausgebildet ist, rastend verbindbar ist.1. Cooling device (1) for a in a housing (3) arranged printed circuit board (2) which with a metal cooling body (4), which is designed as a cover of the housing (3), is latchably connectable.
2. Kühlvorrichtung (1) nach Anspruch 1, dadurch gekennzeichnet, dass das Gehäuse (3) des Metallkühlkörpers (4) mindes- tens einen Rasthaken (5) aufweist.2. Cooling device (1) according to claim 1, characterized in that the housing (3) of the metal cooling body (4) at least one latching hook (5).
3. Kühlvorrichtung (1) nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass mindestens ein Federelement (8) vorgesehen ist, das den Metallkühlkörper (4) im eingerasteten (ver- schnappten Zustand) mit einer Druckspannung beaufschlagt.3. Cooling device (1) according to claim 1 or 2, characterized in that at least one spring element (8) is provided which acts on the metal heat sink (4) in the locked (snap-in state) with a compressive stress.
4. Kühlvorrichtung (1) nach Anspruch 3, dadurch gekennzeichnet, dass das Federelement (8) aus einem Teil des Gehäuses (3) gebildet ist.4. Cooling device (1) according to claim 3, characterized in that the spring element (8) is formed from a part of the housing (3).
5. Kühlvorrichtung (1) nach Anspruch 3 oder 4, dadurch gekennzeichnet, dass die Druckspannung gegen eine Hinterschnei- dung (9) des Rasthakens ' (5) gerichtet ist.5. Cooling device (1) according to claim 3 or 4, characterized in that the compressive stress against an undercut (9) of the latching hook ' (5) is directed.
6. Kühlvorrichtung (1) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass zwischen der Leiterplatte (2) und dem Metallkühlkörper (4) ein Wärmeleitkörper (7) angeordnet ist.6. Cooling device (1) according to one of the preceding claims, characterized in that between the printed circuit board (2) and the metal cooling body (4), a heat-conducting body (7) is arranged.
7. Kühlvorrichtung (1) nach Anspruch 6, dadurch gekennzeichnet, dass der Wärmeleitkörper (7) aus einem ursprünglich fließfähigen, ausgehärteten Wärmeleitmaterial gebildet ist.7. Cooling device (1) according to claim 6, characterized in that the heat-conducting body (7) is formed from an initially flowable, cured heat conducting material.
8. Kühlvorrichtung (1) nach einem der vorhergehenden Ansprü- che, dadurch gekennzeichnet, dass das Gehäuse (3) aus Kunststoff besteht. 8. Cooling device (1) according to one of the preceding claims, characterized in that the housing (3) consists of plastic.
9. Kühlvorrichtung (1) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Gehäuse (3) mindestens eine Auflage (6) für die Leiterplatte (2) aufweist.9. Cooling device (1) according to one of the preceding claims, characterized in that the housing (3) has at least one support (6) for the printed circuit board (2).
10. Verfahren zur Herstellung einer Kühlvorrichtung (1), insbesondere nach einem der vorhergehenden Ansprüche, wobei eine in einem Gehäuse (3) angeordnete Leiterplatte (2) mit einem Wärmeleitkörper (7) aus einem fließfähigen Wärmeleitmaterial versehen wird und ein Metallkühlkörper (4) durch Kontaktie- rung des Wärmeleitkörpers (7) mit dem Gehäuse (3) rastend verbunden wird, bevor die Wärmeleitmasse vollständig ausgehärtet ist.10. A method for producing a cooling device (1), in particular according to one of the preceding claims, wherein in a housing (3) arranged printed circuit board (2) with a heat conducting body (7) is provided from a flowable heat conducting material and a metal heat sink (4) Contacting tion of the heat conducting body (7) with the housing (3) is connected in a locking manner, before the heat conducting compound is completely cured.
11. Verfahren nach Anspruch 10, gekennzeichnet durch Verwen- düng einer Wärmeleitmasse hoher Viskosität. 11. The method according to claim 10, characterized by use düng a thermal mass of high viscosity.
EP06705989A 2005-04-06 2006-02-18 Cooling device for printed circuit boards and method for the production thereof Withdrawn EP1867224A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005015749A DE102005015749A1 (en) 2005-04-06 2005-04-06 Circuit board cooling apparatus and method of making the same
PCT/DE2006/000305 WO2006105746A2 (en) 2005-04-06 2006-02-18 Cooling device for printed circuit boards and method for the production thereof

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EP1867224A2 true EP1867224A2 (en) 2007-12-19

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EP (1) EP1867224A2 (en)
DE (2) DE102005015749A1 (en)
WO (1) WO2006105746A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5738679B2 (en) * 2011-06-01 2015-06-24 トヨタ自動車株式会社 Heat dissipation structure
JP5956948B2 (en) * 2013-03-21 2016-07-27 日立オートモティブシステムズ株式会社 Electronic control unit
JP6435145B2 (en) * 2014-09-19 2018-12-05 日立オートモティブシステムズ株式会社 Electronic control unit
KR102415119B1 (en) * 2015-08-21 2022-06-30 삼성에스디아이 주식회사 Device having circuit board
US10206295B2 (en) 2016-08-19 2019-02-12 Flextronics Ap, Llc Securing a PCB in a plastic and metal housing
US11683911B2 (en) * 2018-10-26 2023-06-20 Magna Electronics Inc. Vehicular sensing device with cooling feature

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278311A (en) * 1979-04-06 1981-07-14 Amp Incorporated Surface to surface connector
DE8427885U1 (en) * 1984-09-21 1985-01-03 Siemens AG, 1000 Berlin und 8000 München Device for fastening a heat sink on several integrated modules arranged next to one another
DE8427872U1 (en) * 1984-09-21 1985-01-03 Siemens AG, 1000 Berlin und 8000 München Device for fastening a heat sink on several integrated modules arranged next to one another
US5402313A (en) * 1993-05-21 1995-03-28 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
DE4416460C2 (en) * 1994-05-10 1996-04-11 Hella Kg Hueck & Co Circuit arrangement, in particular for fan control for motor vehicles
DE19518521C2 (en) * 1995-05-19 1997-08-28 Siemens Ag Housing of a control device, in particular for a motor vehicle
DE19533298A1 (en) * 1995-09-08 1997-03-13 Siemens Ag Electronic module with power components
DE19600619A1 (en) * 1996-01-10 1997-07-17 Bosch Gmbh Robert Control unit consisting of at least two housing parts
DE19701731A1 (en) * 1997-01-20 1998-07-23 Bosch Gmbh Robert Control unit consisting of at least two housing parts
DE19722602C2 (en) * 1997-05-30 2001-03-29 Lenze Gmbh & Co Kg Aerzen Heat-dissipating housing for holding electrical or electronic components
DE19836887A1 (en) * 1998-08-14 2000-02-17 Krone Ag Electrically and mechanically sealed casing for electronic circuit board module; has one casing shell pressed into contact with circuit component, to form waste heat or heat sink region of circuit board
US6088228A (en) * 1998-12-16 2000-07-11 3M Innovative Properties Company Protective enclosure for a multi-chip module
US6111760A (en) * 1998-12-30 2000-08-29 Ericsson, Inc. Simple enclosure for electronic components
US6301096B1 (en) * 2000-03-18 2001-10-09 Philips Electronics North America Corporation Tamper-proof ballast enclosure
DE10109083B4 (en) * 2001-02-24 2006-07-13 Conti Temic Microelectronic Gmbh Electronic module
US6462954B1 (en) * 2001-06-26 2002-10-08 Inventec Corporation Modular machine board structure capable of automatically correcting the contact travel for an electronic device
DE10249436A1 (en) * 2001-11-08 2003-05-22 Tyco Electronics Amp Gmbh Heat sink for cooling power component on circuit board, has recess which receives power component, while establishing thermal contact between planar surfaces of heat sink and circuit board
JP3712982B2 (en) * 2002-02-06 2005-11-02 株式会社ケーヒン Electronic circuit board housing case
US6881077B2 (en) * 2002-07-22 2005-04-19 Siemens Vdo Automotive Corporation Automotive control module housing
DE10300175B4 (en) * 2003-01-08 2016-12-29 Hella Kgaa Hueck & Co. Electronic assembly with heat-dissipating housing part
US7336491B2 (en) * 2005-09-06 2008-02-26 Lear Corporation Heat sink

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2006105746A2 *

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US20090122494A1 (en) 2009-05-14
WO2006105746A3 (en) 2007-04-26
DE112006000163A5 (en) 2007-10-11
DE102005015749A1 (en) 2006-10-12

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