DE19518521C2 - Housing of a control device, in particular for a motor vehicle - Google Patents
Housing of a control device, in particular for a motor vehicleInfo
- Publication number
- DE19518521C2 DE19518521C2 DE19518521A DE19518521A DE19518521C2 DE 19518521 C2 DE19518521 C2 DE 19518521C2 DE 19518521 A DE19518521 A DE 19518521A DE 19518521 A DE19518521 A DE 19518521A DE 19518521 C2 DE19518521 C2 DE 19518521C2
- Authority
- DE
- Germany
- Prior art keywords
- housing
- circuit board
- depression
- housing cover
- control device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Description
Die Erfindung betrifft ein Gehäuse eines Steuergeräts gemäß Oberbegriff von Patentanspruch 1. Solche Steuergeräte weisen ein Gehäuse auf, in dem eine Leiterplatte angeordnet ist. Falls auf der Leiterplatte Leistungsbauelemente, die während ihres Betriebs Wärme erzeugen, angeordnet sind, so muß diese Wärme nach außen abgeführt werden.The invention relates to a housing of a control device according to Preamble of claim 1. Such control devices have a housing in which a circuit board is arranged. If on the circuit board power components that during generate heat during their operation, must be arranged Heat can be dissipated to the outside.
Bei einem bekannten Steuergerät (US 5,109,318) liegen die Leistungsbauelemente flach auf der Leiterplatte auf. Gehäuse deckel und -boden klemmen die Leiterplatte derart zwischen sich ein, daß die Leistungsbauelemente in direktem thermi schen Kontakt mit den Gehäuseteilen stehen. Bei einem solchen Steuergerät ist es doch Voraussetzung, daß alle Leistungsbau elemente gleich hoch sind. Andere, höhere Bauelemente dürfen nicht auf der Leiterplatte angeordnet sein.In a known control device (US 5,109,318) are the Power components flat on the circuit board. Housing The lid and base clamp the PCB in this way agree that the power components in direct thermi contact with the housing parts. With such a Control unit it is a prerequisite that all power construction elements are the same height. Other, higher components are allowed not be placed on the circuit board.
Zudem muß der Gehäusedeckel mit einem festgelegten Druck ge gen die Leistungsbauelemente gepreßt werden, so daß ein guter thermischer Wärmeübergang gewährleistet ist. Leiterplatte, Leistungsbauelemente und bot weisen allerdings große Toleran zen auf, so daß die Gefahr besteht, daß der Druck zwischen Gehäusedeckel und Leistungsbauelement zu groß ist und die Leistungsbauelemente bzw. deren Kontaktierung zerstört wer den.In addition, the housing cover must be ge with a fixed pressure gene the power components are pressed, so that a good thermal heat transfer is guaranteed. PCB, Power components and bot, however, show great tolerance zen on, so that there is a risk that the pressure between Housing cover and power component is too large and the Power components or their contacting who destroyed the.
Gemäß der Druckschrift DE 36 37 372 A1 werden auf einer Lei terplatte angeordnete Leistungsbauelemente mittels eines Kühlkörpers gekühlt, der oberhalb des Leistungsbauelements angeordnet ist und einen Abschnitt aufweist, der auf die Oberfläche des Leistungsbauelements drückt.According to the document DE 36 37 372 A1 are on a lei terplatte arranged power components by means of a Cooled heat sink, the above the power device is arranged and has a section which on the Surface of the power component presses.
In den Druckschriften DE 39 27 755 A1 und DE 33 07 654 A1 werden identische Kühlkonzepte für Leistungsbauelemente vor geschlagen, wobei gemäß der DE 39 27 755 A1 der Kühlkörper über eine Stellschraube auf das Leistungsbauelement gedrückt wird und in der DE 33 07 654 A1 ein Rahmenteil eines Gehäuses eine in das Gehäuse inneren ragende Trägerplatte als Kühlkör per aufweist. Die Nachteile dieser Kühlkonzepte sind den Nachteilen des in der US 5 109 318 beschriebenen Kühlkonzep tes identisch.In the publications DE 39 27 755 A1 and DE 33 07 654 A1 are identical cooling concepts for power components beaten, the heat sink according to DE 39 27 755 A1 pressed onto the power component via a set screw is and in DE 33 07 654 A1 a frame part of a housing a support plate protruding into the housing as a heat sink per has. The disadvantages of these cooling concepts are Disadvantages of the cooling concept described in US 5 109 318 tes identical.
Aus der DE 41 07 312 A1 ist eine ein Leistungsbauelement tra gende beiterplatte in ihrer gesamten Ausdehnung über eine wärmeleitende Schicht auf einer Metallplatte aufgebracht. Im Bereich der Auflagefläche des Bauelements weist die beiter platte Durchkontaktierungen zur wärmeleitenden Schicht auf.DE 41 07 312 A1 describes a power component tra the entire extension plate over its entire extent thermally conductive layer applied to a metal plate. in the The area of the support surface of the component has the beiter plated through-holes to the heat-conducting layer.
Der Erfindung liegt das Problem zugrunde, ein Gehäuse für ein Steuergerät zu schaffen, durch das die von Leistungsbauele menten erzeugte Wärme nach außen abgeführt wird und in dem genügend Platz für eine elektronische Schaltung ist.The invention is based on the problem of a housing for To create control unit by which of power components ment generated heat is dissipated to the outside and in the there is enough space for an electronic circuit.
Das Problem wird erfindungsgemäß durch die Merkmale von Pa tentanspruch 1 gelöst. Vorteilhafte Ausgestaltungen der Er findung sind in den Unteransprüchen gekennzeichnet.The problem is solved according to the invention by the features of Pa Claim 1 solved. Advantageous embodiments of the Er invention are characterized in the subclaims.
Ein Ausführungsbeispiel der Erfindung wird anhand der schema tischen Zeichnung näher erläutert. In der Figur ist ein Schnitt durch ein erfindungsgemäßes Gehäuse eines Steuerge räts dargestellt.An embodiment of the invention is based on the schematic table drawing explained. In the figure is a Section through an inventive housing of a Steuerge represented by riddles.
Ein Gehäuse eines Steuergeräts 10, insbesondere für ein Kraftfahrzeug, weist einen Gehäuseboden 11 und einen Gehäuse deckel 12 auf. Zwischen den beiden ist eine eine Schaltung tragende Leiterplatte 13 angeordnet.A housing of a control device 10 , in particular for a motor vehicle, has a housing base 11 and a housing cover 12 . A circuit board 13 carrying a circuit is arranged between the two.
Die Erfindung wird anhand des Ausführungsbeispiels eines ABS-Steuergeräts 10 dargestellt. Bei einem solchen Steuergerät 10 werden Ventile elektromagnetisch durch Spulen 14 gesteuert. Über einen Steckverbinder 15 wird die die Ventile steuernde Schaltung mit Energie und Steuersignalen versorgt. Die Erfin dung kann aber auch für andere Steuergeräte, wie beispiels weise Motorsteuergeräte oder Getriebesteuergeräte verwendet werden.The invention is illustrated on the basis of the exemplary embodiment of an ABS control device 10 . In such a control device 10 , valves are controlled electromagnetically by coils 14 . The circuit controlling the valves is supplied with energy and control signals via a plug connector 15 . The inven tion can also be used for other control units, such as engine control units or transmission control units.
Auf der die Schaltung tragenden Leiterplatte 13 sind unter anderem Leistungsbauelemente 16 angeordnet, die während ihres Betriebs eine hohe Wärme erzeugen, die nach außen abgeführt werden muß. Die Wärme wird erfindungsgemäß über den Gehäuse deckel 12 abgeführt. Hierzu weist der Gehäusedeckel 12 eine oder mehrere Senken 17 auf. Der Gehäusedeckel 12, der z. B. aus Blech hergestellt ist, hat also an bestimmten Stellen Vertiefungen.On the circuit board 13 carrying the circuit, power components 16 are arranged, among other things, which generate a high amount of heat during their operation, which must be dissipated to the outside. The heat is removed according to the invention via the housing cover 12 . For this purpose, the housing cover 12 has one or more depressions 17 . The housing cover 12 , the z. B. is made of sheet metal, so has recesses at certain points.
Die Senken 17 können - in der Zeichenebene - einen trapezför migen Querschnitt ihrer Wand 18 haben und in einer Ebene quer dazu einen kreisförmigen Querschnitt. Der Querschnitt ist je doch für die Erfindung unerheblich. Wesentlich ist nur, daß ein Boden 19 der Senke 17 auf der Leiterplatte 13 aufliegt und die Wand 18 der Senke 17 die Wärme an den gesamten Gehäusedeckel 12 wei tergibt.The depressions 17 can - in the plane of the drawing - have a trapezoidal cross section of their wall 18 and in a plane transverse to it a circular cross section. The cross section is irrelevant to the invention. It is only important that a bottom 19 of the depression 17 rests on the printed circuit board 13 and the wall 18 of the depression 17 transfers the heat to the entire housing cover 12 .
Damit die Wärme besser nach außen abgeführt werden kann, wird der Gehäusedeckel 12 im Bereich der Senke 17 mit einer mecha nischen Spannung versehen. Hierzu ist der Gehäusedeckel 12 an seinem Rande durch eine nachgiebige Vergußmasse 20 elastisch gelagert und in den Gehäuseboden 11 mit Hilfe von Rasthaken 21 eingerastet oder eingeschnappt. Wenn der Boden 19 der Senke 17 tiefer ausgebildet ist, d. h. tiefer liegt als die Lagerung des Gehäusedeckels 12 in der Vergußmasse 20, so liegt der Boden 19 im montierten Zustand des Steuergeräts 10 abhängig davon mit einem gewissen Druck auf der Leiterplatte 13 auf. Der Boden 19 der Senke 17 wird also auf die Leiterplatte 13 gepreßt. Somit weist der Gehäusedeckel 12 eine mechanische Vorspannung auf.So that the heat can be better dissipated to the outside, the housing cover 12 is provided with a mechanical tension in the region of the depression 17 . For this purpose, the housing cover 12 is elastically supported on its edge by a resilient potting compound 20 and snapped or snapped into the housing base 11 with the aid of locking hooks 21 . If the bottom 19 of the depression 17 is formed deeper, that is to say deeper than the mounting of the housing cover 12 in the sealing compound 20 , the bottom 19 lies in the assembled state of the control device 10 on the printed circuit board 13 with a certain pressure depending on it. The bottom 19 of the depression 17 is thus pressed onto the printed circuit board 13 . The housing cover 12 thus has a mechanical pretension.
Damit die Leiterplatte 13 nicht durch den durch die Senke 17 verursachten Druck bricht, sind Abstützelemente 22 vorgese hen, die die Leiterplatte 13 im Bereich um die Senke 17 un terstützen. Die Abstützelemente 22 können einstückig mit dem Gehäuseboden 11 hergestellt sein. Es können aber ebensogut separate Abstandhalter dafür verwendet werden. Zwischen dem Boden 19 der Senke 17 und der Leiterplatte 13 kann eine Isolierfolie 23 angeordnet sein, damit keine elektrische Verbindung zwischen dem Gehäuse und der Leiterplatte 13 entsteht. Somit wird die Gefahr eines Kurzschlusses verringert.So that the circuit board 13 does not break through the pressure caused by the depression 17 , support elements 22 are hen vorgese that support the printed circuit board 13 in the area around the depression 17 un. The support elements 22 can be made in one piece with the housing base 11 . However, separate spacers can also be used for this. An insulating film 23 can be arranged between the bottom 19 of the depression 17 and the printed circuit board 13 , so that no electrical connection is produced between the housing and the printed circuit board 13 . This reduces the risk of a short circuit.
Der Gehäusedeckel 12 kann auch mehrere Senken 17 aufweisen. Ebenso kann eine einzige Senke 17 die Wärme von mehreren Lei stungsbauelementen 16, die im Bereich des Bodens 19 der Senke angeordnet sind, abführen.The housing cover 12 can also have a plurality of depressions 17 . Likewise, a single depression 17 can dissipate the heat from a plurality of performance components 16 which are arranged in the region of the bottom 19 of the depression.
Mit dem erfindungsgemäßen Gehäuse werden separate Kühlkörper zum Abführen von Wärme eingespart. Außerdem wird die Wärme sofort nach außen an die Umgebung abgeführt.With the housing according to the invention separate heat sinks saved for dissipating heat. In addition, the heat immediately dissipated to the outside world.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19518521A DE19518521C2 (en) | 1995-05-19 | 1995-05-19 | Housing of a control device, in particular for a motor vehicle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19518521A DE19518521C2 (en) | 1995-05-19 | 1995-05-19 | Housing of a control device, in particular for a motor vehicle |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19518521A1 DE19518521A1 (en) | 1996-11-21 |
DE19518521C2 true DE19518521C2 (en) | 1997-08-28 |
Family
ID=7762414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19518521A Expired - Lifetime DE19518521C2 (en) | 1995-05-19 | 1995-05-19 | Housing of a control device, in particular for a motor vehicle |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE19518521C2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10123198A1 (en) * | 2001-05-12 | 2002-12-19 | Hella Kg Hueck & Co | Housing with circuit-board arrangement, has part of heat-sink extending through opening in circuit-board |
DE10129511A1 (en) * | 2001-06-19 | 2003-01-16 | Hella Kg Hueck & Co | Device for cooling electronic circuit, especially for motor vehicles, has cooling arrangement with cooling plate connected to circuit board to carry heat away protruding into hollow volume |
DE10315299A1 (en) * | 2003-04-04 | 2004-10-14 | Hella Kg Hueck & Co. | Housing for circuit board and power components, has deformable thermally-conductive medium arranged between circuit board and base of other half of housing |
DE10334147A1 (en) * | 2003-07-26 | 2005-02-17 | Hella Kgaa Hueck & Co. | Infra-red imaging system for automobile using headlamp with lamp and filter for blocking visible light together with IR sensor coupled to display device |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19701731A1 (en) * | 1997-01-20 | 1998-07-23 | Bosch Gmbh Robert | Control unit consisting of at least two housing parts |
DE10011807B4 (en) * | 2000-03-10 | 2013-08-01 | Continental Teves Ag & Co. Ohg | Electronic control unit for electrohydraulic pressure control devices |
DE10206271A1 (en) * | 2002-02-15 | 2003-08-28 | Conti Temic Microelectronic | Thermal conductor connecting heat sink to substrate carrying electronic components used for engine valve control, has wavy profile and resilience |
DE10300175B4 (en) * | 2003-01-08 | 2016-12-29 | Hella Kgaa Hueck & Co. | Electronic assembly with heat-dissipating housing part |
DE102004040596A1 (en) * | 2004-08-21 | 2006-02-23 | Robert Bosch Gmbh | Electrical device with a housing and a heat sink |
DE102005015749A1 (en) * | 2005-04-06 | 2006-10-12 | Conti Temic Microelectronic Gmbh | Circuit board cooling apparatus and method of making the same |
JP6023524B2 (en) | 2012-09-14 | 2016-11-09 | 日立オートモティブシステムズ株式会社 | Electronic control unit |
DE102013001645A1 (en) * | 2013-01-31 | 2014-07-31 | Connaught Electronics Ltd. | Electronic device for camera system of motor car, has cooling component whose rib-shaped cooling elements are projected from bottom wall out of recess so that cooling component limits side walls in inner space of housing |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3307654A1 (en) * | 1983-03-04 | 1984-09-06 | Robert Bosch Gmbh, 7000 Stuttgart | Electric switchgear in vehicular engine compartment - has cooling intermediate bottom with notch for electric component to be cooled |
DE3627372C3 (en) * | 1986-08-12 | 1994-04-14 | Loewe Opta Gmbh | Arrangement consisting of a printed circuit board, a heat sink and electronic components to be cooled |
DE3927755C2 (en) * | 1989-08-23 | 1997-09-11 | Sel Alcatel Ag | Heat dissipation device for electrical components |
US5109318A (en) * | 1990-05-07 | 1992-04-28 | International Business Machines Corporation | Pluggable electronic circuit package assembly with snap together heat sink housing |
DE4107312A1 (en) * | 1991-03-07 | 1992-09-10 | Telefunken Electronic Gmbh | Mounting system for power semiconductor device - has heat conductive coupling between heat conductive layer beneath semiconductor device and insulating layer supporting circuit board |
-
1995
- 1995-05-19 DE DE19518521A patent/DE19518521C2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10123198A1 (en) * | 2001-05-12 | 2002-12-19 | Hella Kg Hueck & Co | Housing with circuit-board arrangement, has part of heat-sink extending through opening in circuit-board |
DE10129511A1 (en) * | 2001-06-19 | 2003-01-16 | Hella Kg Hueck & Co | Device for cooling electronic circuit, especially for motor vehicles, has cooling arrangement with cooling plate connected to circuit board to carry heat away protruding into hollow volume |
DE10315299A1 (en) * | 2003-04-04 | 2004-10-14 | Hella Kg Hueck & Co. | Housing for circuit board and power components, has deformable thermally-conductive medium arranged between circuit board and base of other half of housing |
DE10334147A1 (en) * | 2003-07-26 | 2005-02-17 | Hella Kgaa Hueck & Co. | Infra-red imaging system for automobile using headlamp with lamp and filter for blocking visible light together with IR sensor coupled to display device |
Also Published As
Publication number | Publication date |
---|---|
DE19518521A1 (en) | 1996-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: CONTINENTAL AUTOMOTIVE GMBH, 30165 HANNOVER, DE |
|
R071 | Expiry of right | ||
R071 | Expiry of right |