EP1854568B1 - Procédé de prise d'empreinte de surfaces de forme libre en trois dimensions dotées de surfaces microstructurées - Google Patents

Procédé de prise d'empreinte de surfaces de forme libre en trois dimensions dotées de surfaces microstructurées Download PDF

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Publication number
EP1854568B1
EP1854568B1 EP07008963A EP07008963A EP1854568B1 EP 1854568 B1 EP1854568 B1 EP 1854568B1 EP 07008963 A EP07008963 A EP 07008963A EP 07008963 A EP07008963 A EP 07008963A EP 1854568 B1 EP1854568 B1 EP 1854568B1
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layer
core
hard material
free
thickness
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German (de)
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EP1854568A1 (fr
Inventor
Kilian Saueressig
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K1 GmbH
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K1 GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C9/00—Moulds or cores; Moulding processes

Definitions

  • the invention relates to a method for molding microstructured three-dimensional freeform surfaces.
  • Microstructured means that the free-form surface contains structures with dimension differences smaller than 1 mm.
  • impression by means of a silicone casting or by means of a galvanic or chemical impression are known.
  • impressions of hard material layers, for example of tungsten carbide, with the aid of a sintering process are also in this process, the low dimensional stability and high residual stresses resulting from volume changes during sintering, disturbing.
  • a method of making molds and mold shells, foundry models, core bushings, and the like having a textured surface is known.
  • a layer of low-melting material is first applied to the master model, which has the desired surface structures.
  • the applied self-supporting layer is reinforced by non-metallic materials to an intermediate form.
  • the intermediate form is removed from the original model.
  • the present intermediate form thus has a metallic side, which is also structured on its surface.
  • a layer of a high-strength ceramic or another refractory material is then applied. If the layer of refractory material is not self-supporting, it can be reinforced.
  • the layer of low-melting metallic material is melted, for example in a water bath, in an oil bath, in an oven or even inductively. Once the low melting material has drained off, the layer of refractory forming the final form is separated from the remaining reinforcement of the intermediate form and the final shape can be removed.
  • a release agent which is an aqueous solution of polyvinylamide or the like is first applied to a sample-carrying master can. Then, a layer of low-melting metal is applied to this release agent layer to fill the original pattern. Subsequently, the metallic layer is reinforced with fiber-reinforced plastic. This construction forms the intermediate form which has mapped the prototype pattern on the layer of low-melting metal. In the next step, a release agent is again applied, then a high melting point metal such as nickel or the like is injected onto the release agent layer until the pattern of the intermediate form is covered. Finally, reinforced with glass fiber reinforced synthetic resins.
  • the object of the invention to provide a method for molding microstructured three-dimensional freeform surfaces, with which even very fine shapes can be precisely imaged, with a geometrically very dimensionally stable and wear-resistant and hard surface is to be generated.
  • the process should show a high variability with regard to the material properties of the surfaces.
  • a positive impression of the surface to be produced is produced by means of a negative impression on a polymer layer, on which the layers for the final molding shell are then built up. It works with very stable cores, such as low-stress steels, which can also be used several times. Throughout the manufacturing process, they ensure that the geometry of the core is transferred to the mold shell. Manufacturing deficiencies, such as shrinkage, high residual stresses, deformation due to residual stresses that regularly occur in silicone casts, sintered components, metal casings, etc., are thus avoided.
  • a barrier layer which is not chemically or galvanically attacked can be applied to the layers of metallic material.
  • the barrier layer may be omitted if a material is used for the hard material layer, which is not attacked galvanically or chemically, if later in the production of the final surface, the first and second layer are removed again.
  • the hard material layer can be galvanically or chemically reinforced.
  • Possible bonding techniques in step i) include bonding, wherein the adhesive has a higher decomposition temperature than the polymeric material of the layer, soldering under pressure, and sintering.
  • Another way to connect the exposed surface of the shell with the basic shape is to coat these and / or the basic form chemically, galvanically or physically and then under high pressure and a temperature which is lower than the melting temperature of the basic mold or shell to press.
  • the tray may be hot isostatically pressed prior to step i).
  • epoxy resin can be used, which more preferably contains a ceramic filler.
  • both the thermal decomposition temperature and the separation properties can be controlled. In particular, manufacturing inaccuracies in the steel core and the shell can be compensated by the polymeric layer.
  • Copper may be used as the metallic material for the first and second layers, silver as the material for the barrier layer.
  • the hard material layer may consist of nickel, preference is given to nitrides, carbides or carbonitrides of titanium and aluminum or mixtures thereof.
  • the first layer is preferably evaporated with a thickness of less than 10 .mu.m
  • the second layer can be applied with a thickness in the range between 50 .mu.m and 150 .mu.m.
  • the preferred range for the thickness is between 3 ⁇ m and 8 ⁇ m. The exact dimensions depend on the fineness of the microstructures that are to be imaged.
  • a thickness in the range between 100 .mu.m and 1000 .mu.m has proven to be expedient.
  • a silicone impression 10 is shown having the microstructured surface 12 removed from a master mold.
  • silicone another suitable material with release agent property can be selected.
  • a core 30 is then provided which has a contour which is milled to the contour of the three-dimensional freeform surface.
  • the silicone impression 10 is then coated with a thin layer 20 of polymeric material and placed on the core 30.
  • the layer 20 of polymeric material is then bonded to the core 30. Subsequently, the silicone impression 10 is removed.
  • FIG. 2 shows how then the remaining on the core 30 polymeric layer 20 has the microstructured surface 14 with the positive pattern of the original form. On the surface 14 of the polymeric layer 20, the final shape is now built.
  • the thickness of the second layer 44 is for example 100 microns, so that provided for a reinforcement of the thin first layer 42.
  • a barrier layer 46 for example made of silver, with a thickness of 5 microns is applied.
  • the barrier layer 46 is intended to protect the now following hard material layer 50 in the event of subsequent galvanic or chemical removal of the layers 42, 44.
  • the barrier layer 46 can be omitted.
  • the thickness of the hard material layer 50, which has been applied to the barrier layer 46, for example by means of high-speed flame spraying, plasma spraying, kerosene flame spraying or the like, has a layer thickness which is preferably 100 ⁇ m to 1000 ⁇ m.
  • the hard material layer 50 may be provided with a reinforcing layer 52 if necessary.
  • FIG. 4 shows the result.
  • the layer structure 42, 44, 46, 50, 52 forms a shell 60, which is constructed on the layer 20 of polymeric material. By machining, the exposed side of the shell 60 is provided with a defined contour. The result is in FIG. 5 shown.
  • FIG. 6 shows the process of joining the shell 60 with polymer layer 20 and core 30 with a basic shape 70, which preferably consists of steel.
  • the bonding is described by way of example with reference to a soldering process, other joining techniques are possible.
  • the soldering takes place at a temperature at which the layer 20 of polymeric material decomposes.
  • a suitable temperature is 400 ° C, so that, when pressure is applied in the direction of arrows F, warpage is eliminated and good contact is made between the shell 60 and the base mold 70.
  • the gap between shell 60 and basic shape 70 can thus be minimized, so that almost no solder between shell 60th and basic form 70 remains as an independent layer.
  • the solder diffuses almost completely into the shell 60 and the basic shape 70.
  • the decomposed layer 20 may be removed via a sandblasting process or other cleaning process.
  • the copper layers 42, 44 FIG. 3
  • the barrier layer 46 FIG. 3
  • This barrier layer 46 can now be removed in the production process, for example, by injection molding, by abrasion or by a gentle sand blasting process, so that the underlying hard material layer 50 comes to light.
  • FIG. 7 shows the finished end mold with basic shape 70, shell 60 and structured surface 12 of the hard material layer 50 and 52, respectively.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Claims (25)

  1. Procédé pour la prise d'une empreinte de surfaces de forme libre en trois dimensions et microstructurées, comprenant les étapes suivantes consistant à:
    a) prendre l'empreinte de la surface de forme libre en trois dimensions et microstructurée à l'aide d'un matériau présentant une propriété d'agent de séparation pour du matériau polymère, afin d'obtenir une empreinte (10) de la surface microstructurée (12) de la surface de forme libre ;
    b) préparer un noyau (30) dont la surface est adaptée au contour de la surface de forme libre ;
    c) revêtir l'empreinte (10) avec une couche (20) d'un matériau polymère présentant une épaisseur qui correspond au moins à la profondeur des structures de la surface (12) microstructurée ;
    d) poser l'empreinte (10) revêtue sur le noyau (30) et pour former une liaison entre la couche (20) de matériau polymère et le noyau (30) sous une pression externe, de sorte que l'empreinte revêtue épouse la forme du noyau (30) ;
    e) enlever l'empreinte (10) du noyau (30), la couche (20) en matériau polymère restant sur le noyau (30) ;
    f) éventuellement appliquer une ou plusieurs couches (42, 44, 46) de matériau métallique ayant une épaisseur homogène sur la couche (20) dégagée à base de matériau polymère ;
    g) appliquer une couche d'une substance dure (50) sur la couche (20) de matériau polymère, en intercalant éventuellement une couche ou plusieurs autres couches (42, 44, 46) ;
    h) préparer une forme de base (70) dont le contour correspond sensiblement à celui de la surface (62) libérée de la couche de substance dure (50) et/ou d'un renfort (52) de la couche de substance dure (50) ;
    i) former une liaison de la surface (62) dégagée se trouvant sur le noyau avec la forme de base (70) à une température supérieure à la température de décomposition de la couche (20) à base de matériau polymère, avec décomposition simultanée de la couche (20) ;
    j) retirer la couche (20) décomposée ; et
    k) éventuellement enlever une ou plusieurs des autres couches (42, 44, 46) ;
    de sorte que la couche de substance dure (50) ayant une surface (12) microstructurée soit dégagée.
  2. Procédé selon la revendication 1, selon lequel, à l'étape g), la couche de substance dure (50) est précipitée par voie chimique ou galvanique directement sur la couche (20) en matériau polymère.
  3. Procédé selon la revendication 1, selon lequel, à l'étape g), la couche de substance dure (50) est déposée par voie physique sur la ou les couches (42, 44, 46) intercalées.
  4. Procédé selon la revendication 3, selon lequel la couche de substance dure (50) est déposée par projection à la flamme à vitesse élevée, projection au plasma, projection à la flamme de kérosène ou d'autres techniques de projection.
  5. Procédé selon la revendication 1, selon lequel, à l'étape g), la couche de substance dure (50) est déposée par voie physique directement sur la couche (20) à base de matériau polymère.
  6. Procédé selon la revendication 1, selon lequel, à l'étape g), la couche de substance dure (50) est appliquée sous une atmosphère protectrice ou sous vide.
  7. Procédé selon la revendication 1, selon lequel l'étape f) comprend :
    f1) la vaporisation d'une première couche (42) à base de matériau métallique avec une très faible épaisseur sur la couche (20) à base de matériau polymère ;
    f2) le renforcement de la première couche (42) par une seconde couche (44) ayant une épaisseur homogène.
  8. Procédé selon la revendication 7, caractérisé en ce que la seconde couche (44) est précipitée par voie chimique, galvanique ou physique.
  9. Procédé selon l'une quelconque des revendications 1 à 8, selon lequel, après l'étape f), une couche de barrage (46), qui n'est pas attaquée par voie chimique ou galvanique, est appliquée sur les couches (42, 44) à base de matériau métallique.
  10. Procédé selon la revendication 1, selon lequel la couche de substance dure (50) est renforcée après l'étape g) par voie galvanique ou chimique.
  11. Procédé selon l'une quelconque des revendications 1 à 10, selon lequel la couche de substance dure (50) et/ou son renfort (52) sont usinés par enlèvement de copeaux sur la surface (62) dégagée, opposée à la surface (12) microstructurée, afin de générer une coquille (60) dont la surface (62) a un contour défini.
  12. Procédé selon l'une quelconque des revendications 1 à 11, selon lequel, à l'étape i), la surface (62) dégagée est collée à la forme de base (70), le moyen adhésif ayant une température de décomposition plus élevée que le matériau polymère de la couche (20).
  13. Procédé selon l'une quelconque des revendications 1 à 11, selon lequel, à l'étape i), la surface (62) dégagée est brasée sous pression avec la forme de base (70).
  14. Procédé selon l'une quelconque des revendications 1 à 11, selon lequel, à l'étape i), la surface (62) dégagée est frittée avec la forme de base (70).
  15. Procédé selon l'une quelconque des revendications 1 à 11, selon lequel, à l'étape i), pour relier la surface (62) dégagée à la forme de base (70),
    - la forme de base (70) est immergée complètement dans un bain à base de métal fondant à basse température ;
    - le noyau (30) ayant la surface (62) dégagée est enfoncé dans la forme ;
    - le métal fondu est enlevé du bain ; et
    - la forme de base (70) et le noyau (30) sont maintenus sous pression élevée pendant quelques heures à une température qui est inférieure à la température de fusion de la forme de base (70) et de la coquille (60).
  16. Procédé selon l'une quelconque des revendications 1 à 11, selon lequel, à l'étape i), pour relier la surface (62) dégagée avec la forme de base (70),
    - la surface (62) dégagée et/ou la forme de base (70) sont revêtues par voie chimique, galvanique ou physique ; et
    - la coquille (60) et la forme de base (70) sont comprimées sous pression à une température qui est inférieure à la température de fusion de la forme de base (70) et de la coquille (60).
  17. Procédé selon l'une quelconque des revendications 1 à 16, selon lequel la coquille (60) est comprimée de façon isostatique à température élevée avant l'étape i) pour la réduction des tensions.
  18. Procédé selon l'une quelconque des revendications 1 à 17, selon lequel on utilise comme matériau polymère de la résine époxy qui contient de préférence une charge céramique.
  19. Procédé selon l'une quelconque des revendications 1 à 18, selon lequel on utilise du cuivre comme matériau métallique pour la première et la seconde couches (42, 44).
  20. Procédé selon l'une quelconque des revendications 1 à 19, selon lequel on utilise de l'argent comme matériau pour la couche de barrage (46).
  21. Procédé selon l'une quelconque des revendications 1 à 20, selon lequel on utilise comme matériau pour la couche de substance dure (50) du nickel, un nitrure, un carbure, un carbonitrure de titane, de l'aluminium ou des mélanges de ces produits.
  22. Procédé selon l'une quelconque des revendications 1 à 21, selon lequel la première couche (42) est vaporisée avec une épaisseur inférieure à 10 µm.
  23. Procédé selon l'une quelconque des revendications 1 à 22, selon lequel la seconde couche (44) est appliquée avec une épaisseur comprise entre 50 µm et 150 µm.
  24. Procédé selon l'une quelconque des revendications 1 à 23, selon lequel la couche de barrage (46) est appliquée avec une épaisseur comprise entre 3 µm et 8 µm.
  25. Procédé selon l'une quelconque des revendications 1 à 24, selon lequel la couche de substance dure (50) est appliquée avec une épaisseur comprise entre 100 µm et 1.000 µm.
EP07008963A 2006-05-09 2007-05-03 Procédé de prise d'empreinte de surfaces de forme libre en trois dimensions dotées de surfaces microstructurées Active EP1854568B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006021477A DE102006021477A1 (de) 2006-05-09 2006-05-09 Verfahren zum Abformen mikrostrukturierter dreidimensionaler Freiformflächen

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EP1854568A1 EP1854568A1 (fr) 2007-11-14
EP1854568B1 true EP1854568B1 (fr) 2010-09-15

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007030307B4 (de) 2007-06-29 2011-04-28 Kilian Saueressig Verfahren zum Herstellen von farbigen, dreidimensional strukturierten Bauteilen mit Freiformflächen
EP2243618B1 (fr) 2009-04-22 2012-10-31 Nordenia Deutschland Gronau GmbH Procédé de fabrication d'un film thermoplastique doté d'une surface structurée tridimensionnelle
DE102014017721A1 (de) * 2014-12-02 2016-06-02 Mahle International Gmbh Verfahren zum Herstellen eines verlorenen Gießkerns, Gießkern sowie unter Verwendung eines derartigen Gießkerns hergestellter Kühlkanalkolben
CN110480800B (zh) * 2019-07-22 2021-04-16 广东新秀新材料股份有限公司 3d陶瓷薄壁件及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3605855A (en) * 1968-02-26 1971-09-20 Nagano Ken Japan Process for the making of metal moulds for a casting
FR2572673B1 (fr) * 1984-11-07 1987-01-09 Rhone Poulenc Spec Chim Procede de fabrication de moules en metal a haut point de fusion par pulverisation dudit metal sur une forme en elastomere silicone charge
DE3831192A1 (de) * 1988-09-14 1990-03-22 Hek Gmbh Verfahren zum herstellen von formen und formschalen, giessereimodellen, kernbuchsen und dergleichen, mit strukturierter oberflaeche
JPH05171398A (ja) * 1991-12-25 1993-07-09 Chugoku Kako Kk 溶射金属層を有する複合体製品およびその製造方法、ならびに、その製造方法に用いる離型剤
US6155330A (en) * 1998-11-04 2000-12-05 Visteon Global Technologies, Inc. Method of spray forming metal deposits using a metallic spray forming pattern
CA2414798A1 (fr) * 2002-12-20 2004-06-20 Thomas A. Goodwin Composition de sable de surface et methode pour son incorporation dans un moule

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DE502007005018D1 (de) 2010-10-28
DE102006021477A1 (de) 2007-11-15
EP1854568A1 (fr) 2007-11-14
ATE481191T1 (de) 2010-10-15

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