EP1851177A2 - Method for increasing the laser damage threshold of diffraction grids - Google Patents
Method for increasing the laser damage threshold of diffraction gridsInfo
- Publication number
- EP1851177A2 EP1851177A2 EP06707011A EP06707011A EP1851177A2 EP 1851177 A2 EP1851177 A2 EP 1851177A2 EP 06707011 A EP06707011 A EP 06707011A EP 06707011 A EP06707011 A EP 06707011A EP 1851177 A2 EP1851177 A2 EP 1851177A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- laser
- diffraction grating
- treatment
- high energy
- damage threshold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- 230000006378 damage Effects 0.000 title claims abstract description 34
- 238000011282 treatment Methods 0.000 claims abstract description 44
- 238000005530 etching Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 description 16
- 239000000463 material Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/12—Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08004—Construction or shape of optical resonators or components thereof incorporating a dispersive element, e.g. a prism for wavelength selection
- H01S3/08009—Construction or shape of optical resonators or components thereof incorporating a dispersive element, e.g. a prism for wavelength selection using a diffraction grating
Definitions
- the invention relates to a method for increasing the laser damage threshold (LDT) of optical components, in particular of dielectric multilayer dielectric (MLD) diffraction gratings, and correspondingly improved optical components.
- LDT laser damage threshold
- MLD dielectric multilayer dielectric
- ultraintensive laser pulses For the investigation of nuclear fusion and fundamental processes, for example in plasma, astro and atomic physics, high-energy lasers in the tera- and petawatt range are used today to generate ultraintensive laser pulses.
- the achievable power of ultraintensive laser pulses is essentially limited by the properties of the optical components used and in particular by their laser damage threshold.
- CPA Complementary Pulse Amplification
- the stress on the optical components can be reduced in the generation of ultra-intense pulses.
- an optical pulse of high spectral bandwidth is first time stretched, amplified and compressed again after amplification.
- the intensity of a high energy laser during amplification can typically be reduced by several orders of magnitude.
- the risk of destruction of optical components at the output of the optical compressor can not be eliminated by the CPA method
- These critical optical components include, in particular, the diffraction gratings used in the compressor.
- Diffraction gratings with the highest laser damage thresholds are now fabricated by holographic imaging on photoresist and subsequent etching of the top layer of a multilayer dielectric (MLD) stack to obtain a highly efficient reflection grating.
- MLD multilayer dielectric
- the disclosure of the cited articles is incorporated by reference into the disclosure of this patent application.
- the diffraction gratings described in the cited articles can achieve a laser damage threshold for pulse durations of 10 ps, which are almost ten times that of conventional gold lattices. At pulse durations of 500 fs, a factor of 2 improvement over gold lattices with a maximum laser damage threshold of 0.6 J / cm 2 is achieved. Efforts are being made worldwide to further improve the laser damage threshold of MLD gratings as it is considered one of the largest technological
- HEPW high energy petawatt
- NIF National Ignition Facility
- the beam is typically expanded prior to compression.
- StrahlaufWeitung but disadvantageously increase the required
- US Pat. No. 6,620,333 discloses a method with which propagation through laser irradiation of destroyed surface regions of optical components by local material removal, for example by plasma treatment, can be prevented.
- US Pat. No. 6,518,539 B2 describes a method for treating quartz glass optical components, laser irradiation Destroy points are generated, whose propagation is limited by another laser irradiation.
- Laser irradiation known, wherein the laser irradiation takes place at the same wavelength for which the laser damage threshold is to be reduced.
- the invention is therefore based on the object to show a way how the quality and in particular the Laserzerstör threshold of diffraction gratings, in particular of MLD gratings, can be improved.
- a method of treating a diffraction grating for use in a high energy laser device including a first laser includes providing the diffraction grating, providing a second treatment laser, and irradiating the diffraction grating
- the laser damage threshold of a diffraction grating is increased by placing the grating with an intense laser beam of a treatment laser near and below the laser damage threshold, or by ramping up the output power of the laser
- irradiating the diffraction grating advantageously comprises ramping the output power of the second treatment laser beyond the laser damage threshold for the second treatment laser.
- the output power of the second treatment laser is ramped from less than 80% up to at least 120% of the Laserzerstörschwelle increased.
- the method according to the invention is particularly advantageous for increasing the laser damage threshold for femtosecond and picosecond laser pulses of MLD diffraction gratings, as used in terawatt (TW) and petawatt (PW) pulse compressors.
- a laser irradiation by the second treatment laser with a Repeat rate between 1 and 1000 Hz and for a period of at least 10 seconds proved.
- the diffraction grating is designed for use in a terawatt or petawatt high-energy laser device.
- the high energy laser device in which the diffraction grating is used is preferably suitable for generating laser light in the visible or infrared frequency range.
- the diffraction grating is preferably for use in a
- High energy laser device formed with a laser wavelength of 1054 nm +/- 30%. Furthermore, the high-energy laser device is preferably suitable for generating ultrashort laser pulses, in particular with a pulse duration below 20 ps.
- the preferred wavelength of the second treatment laser which differs from the high energy laser device typically designed as a terawatt or petawatt laser, in the UV range, preferably at 355nm, 308nm, 248nm, 193nm or 157 nm.
- Suitable wavelengths of the second treatment laser further include wavelengths of 1064 nm, 557 nm and 532 nm, and other wavelengths below 550 nm.
- An example of a suitable treatment laser is an excimer laser, but other laser embodiments are also within the scope of the invention ,
- Invention selected as the material of the multilayer stack and the substrate of the MLD diffraction grating a material with low absorption at the wavelength of the treatment laser, for example quartz glass as Substrate material when using a treatment laser in the UV range.
- a material with low absorption at the wavelength of the treatment laser for example quartz glass as Substrate material when using a treatment laser in the UV range.
- UV light is suitable for changing the material properties of different materials.
- the laser irradiation with the second treatment laser is carried out with a fluence which is below 90% of the UV Zerstörfluez the diffraction grating.
- the second treatment laser has a different wavelength than the laser radiation generated by the high-energy laser device.
- a diffraction grating may also be irradiated with laser radiation of a wavelength other than the output wavelength of the high energy laser device when, for example, frequency multipliers are provided in the high energy laser device.
- the second treatment laser advantageously also has a different wavelength than the laser radiation with which the diffraction grating is irradiated in use. Since the method according to the invention is sensitive to environmental contaminants, the irradiation of the diffraction grating is advantageously carried out in vacuo.
- the diffraction grating is preferably a multilayer dielectric (MLD) diffraction grating (MLD).
- MLD multilayer dielectric
- a particularly preferred embodiment of the method according to the invention provides for such a diffraction grating to irradiate a mirror of the diffraction grating with the treatment laser in a first step before the diffraction grating is etched and etch the grating of the diffraction grating in a second step.
- the MLD diffraction grating may be provided in a third step, a re-irradiation with the second treatment laser.
- the diffraction grating is arranged in the beam path of a laser system which comprises the high-energy laser device, wherein the high-energy laser device is arranged in a position such that laser pulses generated by it are steerable onto the diffraction grating to move from the diffraction grating into another direction for further use to be reflected.
- the invention further includes a diffraction grating treated by the described method.
- a diffraction grating according to the invention preferably has a laser damage threshold for a 500 fs laser pulse of at least 0.7 J / cm 2 .
- a diffraction grating according to the invention is also particularly advantageously designed as an etched MLD diffraction grating.
- the grid of the Diffraction grating advantageously has 1740 lines / mm +/- 50%.
- a laser system according to the invention comprises a high-energy laser device, a beam guide
- FIG. 2 is a schematic representation of a
- Fig. 1 schematically shows a high energy laser device for generating a high energy laser pulse based on the CPA method.
- the pulse of one Laser oscillator 210 with a pulse duration of, for example, 100 fs and with energies of a few nanojoules and sufficiently large spectral bandwidth is initially stretched in time by means of an optical delay path.
- the optical delay path has two anti-parallel MLD diffraction gratings 10. The beam guidance takes place with the aid of mirrors 230 and 240.
- the first grating is imaged in reverse behind the second grating, so that the individual wavelengths, from which the short pulse is composed, travel different distances between the grids and thus pass the pulse stretcher in times of different lengths.
- the time-stretched pulse is then amplified by a power amplifier 220 by several orders of magnitude before it is recompressed by means of a grid consisting of two parallel grating 10 grid pair.
- the diffraction gratings 10 used in the optical compressor are exposed to a particularly high laser power.
- the Laserzerstörschwelle particular such diffraction grating is increased by the method according to the invention.
- FIG. 2 shows a schematic representation of such a diffraction grating 10, which comprises a substrate 140 on which a dielectric multilayer system 100 having layers 120 and 130 with different refractive indices is arranged.
- a grid is etched in the uppermost layer 110.
- the lattice parameters, exemplified by a, b, and h, can be used for maximum efficiency optimal Laserzerstörschwelle be adjusted.
- the shape of the grid, in particular the grooves and elevations, according to the invention may also differ from the illustrated rectangular shape.
- the invention provides to increase the laser damage threshold of such MLD diffraction gratings by irradiating the grating surface and the multilayer stack with a laser beam.
- the inventors assume that laser-irradiation removes, inter alia, residues originating from the production process of the grid, as well as dust and other, destruction-causing, absorbing defects. It is also believed that sharp edges with lower laser damage threshold are also removed.
- the wavelength of the treatment laser is chosen so that a minimum absorption in the multi-layer system and the underlying substrate of the diffraction grating is achieved.
- FIG. 3 a shows a first preferred embodiment of the invention, in which the diffraction grating 10 is irradiated with a treatment laser 300, for example formed as a UV laser.
- a treatment laser 300 for example formed as a UV laser.
- a further preferred embodiment of the method according to the invention envisages, in a first step, irradiating the MLD diffraction grating 10 'with the treatment laser 300 before etching the grid, as shown in FIG. 3b, and then the grating in the uppermost layer of the MLD Etching grating.
- a further irradiation with the treatment laser can advantageously take place after the etching process.
- 4 shows results of measurements of the laser damage threshold of a diffraction grating treated according to the invention.
- a KrF excimer laser with a wavelength of 248 nm at 70% of its UV-destroying fluence was used to estimate the laser-breakdown threshold of a 1740 MLD diffraction grating
- the aim was to increase the laser collapse threshold of the laser pulse diffraction grating with a pulse duration of 500 fs at a wavelength of 1054 nm.
- the maximum measured laser damage threshold without laser treatment according to the invention was about 0.4 J / cm 2 .
- the laser damage threshold was measured at 500 fs with a 300 ⁇ m diameter test beam.
- the results for the irradiated areas 1, 2, 3 and 4 within the area 410 of the diffraction grating 400 are shown in FIG. 4.
- the beam of the KrF excimer laser used as the treatment laser was homogenized by means of a beam homogenizer and irradiation was preferably carried out at a repetition rate of 50 Hz for about one minute.
- the value in the first line indicates the "non-destructive" flux on the grating surface in J / cm 2 at which a "beam imprint" on the grating surface can be seen after a few laser shots with this fluence in the third row, the maximum destructive fluence on the grating surface is given in J / cm 2 , and the value in the second row indicates the number of laser shots from which destruction occurs with the fluence indicated in the corresponding third row , From Fig.
- laser arc damage threshold measurements are approximately 0.8 J / cm 2 (reference numeral 440), about 0.7 J / cm 2 (reference numeral 430) and about 0, 6 J / cm 2 (reference numeral 420). 4 shows the clear effect of increasing the laser damage threshold for the method according to the invention. Shown are the results of initial measurements, which can be further optimized in terms of statistical significance and homogeneity.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Lasers (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06707011A EP1851177A2 (en) | 2005-02-22 | 2006-02-16 | Method for increasing the laser damage threshold of diffraction grids |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05003757 | 2005-02-22 | ||
EP06707011A EP1851177A2 (en) | 2005-02-22 | 2006-02-16 | Method for increasing the laser damage threshold of diffraction grids |
PCT/EP2006/001410 WO2006089681A2 (en) | 2005-02-22 | 2006-02-16 | Method for increasing the laser damage threshold of diffraction grids |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1851177A2 true EP1851177A2 (en) | 2007-11-07 |
Family
ID=36282907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06707011A Withdrawn EP1851177A2 (en) | 2005-02-22 | 2006-02-16 | Method for increasing the laser damage threshold of diffraction grids |
Country Status (5)
Country | Link |
---|---|
US (1) | US8349226B2 (en) |
EP (1) | EP1851177A2 (en) |
JP (1) | JP4901762B2 (en) |
KR (1) | KR101004425B1 (en) |
WO (1) | WO2006089681A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5050594B2 (en) * | 2007-03-20 | 2012-10-17 | 旭硝子株式会社 | Spectrometer |
FR2921498B1 (en) * | 2007-09-25 | 2010-08-13 | Commissariat Energie Atomique | DISPERSIVE OPTICAL DEVICE WITH THREE DIMENSIONAL PHOTONIC CRYSTAL. |
CN102870293A (en) * | 2010-03-26 | 2013-01-09 | 劳伦斯·利弗莫尔国家安全有限责任公司 | Multi-pass amplifier architecture for high power laser systems |
US20130048600A1 (en) * | 2011-08-22 | 2013-02-28 | Cybernetic Industrial Corporation Of Georgia | Volumetric optically variable devices and methods for making same |
JP5962317B2 (en) * | 2012-08-07 | 2016-08-03 | 株式会社島津製作所 | Diffraction grating and optical pulse compressor |
CA3010979C (en) * | 2015-12-18 | 2023-08-29 | Infinite Potential Laboratories Lp | Pulse compression in chirped pulse laser systems |
CN106094084A (en) * | 2016-06-02 | 2016-11-09 | 中国科学院微电子研究所 | extreme ultraviolet multilayer film reflection type single-stage diffraction grating |
US11890051B2 (en) * | 2017-02-06 | 2024-02-06 | Sensor, LLC | Apparatus with filter to treat macular degeneration and method of treating macular degeneration |
WO2018222504A2 (en) | 2017-06-02 | 2018-12-06 | Lawrence Livermore National Security, Llc | Innovative solutions for improving laser damage performance of multi-layer dielectric gratings |
US11835743B2 (en) | 2017-06-02 | 2023-12-05 | Lawrence Livermore National Security, Llc | Innovative solutions to improve laser damage thresholds of optical structures |
US10594106B2 (en) * | 2017-09-07 | 2020-03-17 | Lawrence Livermore National Security, Llc | Symmetric out-of-plane configurations of diffractive gratings and method |
CN108445567B (en) * | 2018-03-30 | 2020-09-18 | 苏州沛斯仁光电科技有限公司 | High-reflectivity film with high damage threshold and preparation method thereof |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01102503A (en) * | 1987-10-16 | 1989-04-20 | Canon Inc | Cleaning method for optical substrate |
US5472748A (en) | 1990-10-15 | 1995-12-05 | The United States Of America As Represented By The United States Department Of Energy | Permanent laser conditioning of thin film optical materials |
US5395362A (en) | 1992-01-14 | 1995-03-07 | Summit Technology | Methods and apparatus for distributing laser radiation |
US5907436A (en) * | 1995-09-29 | 1999-05-25 | The Regents Of The University Of California | Multilayer dielectric diffraction gratings |
JP2001269789A (en) | 2000-01-20 | 2001-10-02 | Komatsu Ltd | Laser beam machining device |
US6705125B2 (en) | 2000-10-23 | 2004-03-16 | The Regents Of The University Of California | Reduction of damage initiation density in fused silica optics via UV laser conditioning |
JP4374774B2 (en) * | 2000-12-06 | 2009-12-02 | コニカミノルタホールディングス株式会社 | Polarization conversion optical system and polarization conversion element |
US7256938B2 (en) * | 2004-03-17 | 2007-08-14 | General Atomics | Method for making large scale multilayer dielectric diffraction gratings on thick substrates using reactive ion etching |
-
2006
- 2006-02-16 US US11/883,435 patent/US8349226B2/en not_active Expired - Fee Related
- 2006-02-16 KR KR1020077019228A patent/KR101004425B1/en not_active IP Right Cessation
- 2006-02-16 WO PCT/EP2006/001410 patent/WO2006089681A2/en active Application Filing
- 2006-02-16 EP EP06707011A patent/EP1851177A2/en not_active Withdrawn
- 2006-02-16 JP JP2007556534A patent/JP4901762B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO2006089681A2 * |
Also Published As
Publication number | Publication date |
---|---|
WO2006089681A3 (en) | 2006-12-07 |
KR20070120491A (en) | 2007-12-24 |
KR101004425B1 (en) | 2010-12-28 |
JP4901762B2 (en) | 2012-03-21 |
US8349226B2 (en) | 2013-01-08 |
JP2008532070A (en) | 2008-08-14 |
WO2006089681A2 (en) | 2006-08-31 |
US20090028206A1 (en) | 2009-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1851177A2 (en) | Method for increasing the laser damage threshold of diffraction grids | |
DE69500997T2 (en) | METHOD FOR CONFIGURATION CONTROLLING LASER-INDUCED DESTRUCTION AND REMOVAL | |
DE69016051T2 (en) | Surface cleaning with a laser. | |
DE19912879C2 (en) | Process for removing a transparent solid with laser beams | |
EP2931467B1 (en) | Method for producing aligned linear breaking points by ultra-short focussed, pulsed laser radiation; method and device for separating a workpiece by means of ultra-short focussed laser radiation using a protective gas atmosphere | |
DE3721940C2 (en) | ||
EP1537841B1 (en) | Device for treating opaqueness and/or hardening of a closed eye | |
DE68919328T2 (en) | Ultraviolet laser ablation and etching of organic solids. | |
EP0134469B1 (en) | Method of marking semiconductor surfaces using laser radiation | |
WO2000060668A1 (en) | Device and method for removing thin layers on a support material | |
EP2944413A1 (en) | Device for mask projection of femtosecond and picosecond laser beams with a blade, a mask and lenses' systems | |
EP3169475A1 (en) | Method and device for the laser-based working of two-dimensional, crystalline substrates, in particular semiconductor substrates | |
EP2394774A2 (en) | Method and device for producing nanostructured surfaces | |
DE112006001230B4 (en) | Machining method and processing apparatus using interfering laser beams, and diffraction grating and microstructure manufactured by the beating method | |
WO2015027997A1 (en) | Method for laser-structuring thin layers on a substrate in order to produce monolithically connected thin-layer solar cells, and method for producing a thin-layer solar module | |
DE19715702A1 (en) | Process for the selective removal of one or more layers | |
WO2022233711A1 (en) | Method for writing polarization-influencing nanostructures into a transparent material | |
EP1260838B1 (en) | Process for direct microstructuring of materials | |
DE69906599T2 (en) | Method and device for laser processing | |
WO2021191218A1 (en) | Method, system and workpiece, with large-scale removal of material from the workpiece using laser-supported etching | |
DE102019219462A1 (en) | Method for cutting a glass element and cutting system | |
DE4219809A1 (en) | Material surface layers removal for precision and less complicated system - by successive radiation of parts of surface with optical element system in electromagnetic beam path for constant area cross=section maintenance | |
DE102007058103A1 (en) | High energy ion beam precision modifies the profile or surface micro-roughness of an optical lens or mirror used in micro-lithography | |
DE19801013A1 (en) | Process for the removal of surface layers by means of laser-induced shock waves reinforced with outer layers | |
EP0662803B1 (en) | Process and device for correcting the shape of a lens |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20070716 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: BORNEIS, STEFAN Inventor name: JAVORKOVA, DASA Inventor name: ONKELS, ECKENHARD Inventor name: NEUMAYER, PAUL |
|
DAX | Request for extension of the european patent (deleted) | ||
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: GSI HELMHOLTZZENTRUM FUER SCHWERIONENFORSCHUNG GMB |
|
17Q | First examination report despatched |
Effective date: 20100203 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20140902 |