EP1812961A1 - Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics - Google Patents
Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectricsInfo
- Publication number
- EP1812961A1 EP1812961A1 EP04796562A EP04796562A EP1812961A1 EP 1812961 A1 EP1812961 A1 EP 1812961A1 EP 04796562 A EP04796562 A EP 04796562A EP 04796562 A EP04796562 A EP 04796562A EP 1812961 A1 EP1812961 A1 EP 1812961A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- recited
- film
- silylating agent
- organosilicate
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003989 dielectric material Substances 0.000 title claims description 11
- 229910052751 metal Inorganic materials 0.000 title description 8
- 239000002184 metal Substances 0.000 title description 8
- 238000011084 recovery Methods 0.000 title description 3
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 119
- 238000000034 method Methods 0.000 claims abstract description 106
- 239000000463 material Substances 0.000 claims abstract description 45
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract description 38
- 125000003118 aryl group Chemical group 0.000 claims abstract description 34
- 150000004819 silanols Chemical class 0.000 claims abstract description 29
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 27
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000001257 hydrogen Substances 0.000 claims abstract description 20
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 15
- 239000011148 porous material Substances 0.000 claims abstract description 14
- 238000011282 treatment Methods 0.000 claims abstract description 13
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract description 10
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 18
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 18
- 230000009977 dual effect Effects 0.000 claims description 15
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 15
- 230000002209 hydrophobic effect Effects 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 13
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 12
- 239000001569 carbon dioxide Substances 0.000 claims description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 11
- 238000005229 chemical vapour deposition Methods 0.000 claims description 10
- -1 siloxanes Chemical class 0.000 claims description 10
- 239000012808 vapor phase Substances 0.000 claims description 10
- 125000003545 alkoxy group Chemical group 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 9
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 9
- 238000000137 annealing Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 229920000620 organic polymer Polymers 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 238000000231 atomic layer deposition Methods 0.000 claims description 5
- 150000002170 ethers Chemical class 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 4
- 150000001336 alkenes Chemical class 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 150000002576 ketones Chemical class 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000013019 agitation Methods 0.000 claims description 3
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims description 3
- 239000006184 cosolvent Substances 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- 239000003495 polar organic solvent Substances 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 229920002577 polybenzoxazole Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- JMBUOHCQHAPBFY-UHFFFAOYSA-N CN(C)C[SiH3] Chemical compound CN(C)C[SiH3] JMBUOHCQHAPBFY-UHFFFAOYSA-N 0.000 claims description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical class CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 claims description 2
- KZFNONVXCZVHRD-UHFFFAOYSA-N dimethylamino(dimethyl)silicon Chemical compound CN(C)[Si](C)C KZFNONVXCZVHRD-UHFFFAOYSA-N 0.000 claims description 2
- QULMGWCCKILBTO-UHFFFAOYSA-N n-[dimethylamino(dimethyl)silyl]-n-methylmethanamine Chemical group CN(C)[Si](C)(C)N(C)C QULMGWCCKILBTO-UHFFFAOYSA-N 0.000 claims description 2
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 5
- 239000012071 phase Substances 0.000 claims 1
- 229920000412 polyarylene Polymers 0.000 claims 1
- 238000006884 silylation reaction Methods 0.000 abstract description 50
- 210000002381 plasma Anatomy 0.000 abstract description 21
- 230000015572 biosynthetic process Effects 0.000 abstract description 10
- 125000004429 atom Chemical group 0.000 abstract description 2
- 210000004027 cell Anatomy 0.000 abstract 1
- 230000001010 compromised effect Effects 0.000 abstract 1
- 230000008569 process Effects 0.000 description 28
- 239000010410 layer Substances 0.000 description 11
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 11
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 6
- 230000010354 integration Effects 0.000 description 6
- XOJVVFBFDXDTEG-UHFFFAOYSA-N Norphytane Natural products CC(C)CCCC(C)CCCC(C)CCCC(C)C XOJVVFBFDXDTEG-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical class CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- GJWAPAVRQYYSTK-UHFFFAOYSA-N [(dimethyl-$l^{3}-silanyl)amino]-dimethylsilicon Chemical compound C[Si](C)N[Si](C)C GJWAPAVRQYYSTK-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical class CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical group C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- GKOZKEKDBJADSV-UHFFFAOYSA-N disilanol Chemical compound O[SiH2][SiH3] GKOZKEKDBJADSV-UHFFFAOYSA-N 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003738 xylenes Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31058—After-treatment of organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76814—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76822—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc.
- H01L21/76826—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc. by contacting the layer with gases, liquids or plasmas
Definitions
- This invention pertains to interconnect wiring networks on very high performance microelectronic chips used in computers, microprocessors, microcontrollers, sensors, communication devices and the like.
- inventive structures described tterein pertain to significantly reducing the signal propagation delay associated with these wires.
- inventive methods detailed and claimed provide the chemistry and processing required to recover- the dielectric properties of low dielectric constant dielectrics after they have been rendered hydrophilic by required plasma exposures and to the chemistry and method required to increase the mechanical strength, and maintain the low dielectric constant of poroi ⁇ s organosilicate dielectrics after they have been deposited and during the process of building an interconnect structure comprising these films.
- This invention further pertains to methods which enable the successful integration of these materials into such chips.
- High performance microprocessor, microcontroller and communication chips require -very high speed interconnects between the active transistor devices which are used to perform the various functions such as logical operations, storing and retrieving data, providing control signals, and the like.
- the signal propagation delay in the interconnects is dependent on the RC product wherein, R denotes the resistance of the interconnect wires and C represents the overall capacitance of the interconnect scheme in which the wires are embedded.
- Use of copper instead of aluminum as the interconnect wiring material has allowed the reduction of the resistance contribution to the RC product.
- the current focus in the microelectronics industry is to reduce interconnect capacitance by the use of lower dielectric constant (k) insulators in building the multilayered interconnect structures on chips.
- DD dual damascene
- IMD inter metal dielectric
- the via level dielectric 1110 and the line level dielectric 1120 are shown separately for clarity of the process flow description. In general, these two layers can be made of the same or different; insulating films and in the former case applied as a single monolithic layer.
- a hard mask layer or a layered stack 1130 is optionally employed to facilitate etch selectivity and to serve as a polish stop.
- the wiring interconnect network consists of two types of features: line features that traverse a distance across the chip, and the via features which connect lines in different levels of interconnects in a multilevel stack together.
- both layers are made from an inorganic glass such as silicon dioxide (SiO 2 ) or a fluorinated silica glass (FSG) film deposited by plasma enhanced chemical vapor deposition
- PECVD PECVD
- the position of the lines 1150 and the vias 1170 are defined lithographically in photoresist layers 1500 and 1510 respectively, and transferred into the hard mask and IMD layers using reactive ion etching processes.
- the process sequence shown in Figs Ia through Id is called a "line-first" approach.
- lithography is used to define a via pattern 1170 in the photoresist layer 1510 and the pattern is transferred into the dielectric material to generate a via opening 1180, as illustrated in Fig. Id.
- the dual damascene trench and via structure 1190 is shown in Fig. Ie after the photoresist has been stripped. As shown in Fig.
- the recessed structure 1190 is then coated with a conducting liner material or material stack 1200 that serves to protect the conductor metal lines and vias and serve as an adhesion layer between the conductor and the IMD.
- This recess is then filled with a conducting fill material 1210 over the surface of the patterned substrate.
- the fill is most commonly accomplished by electroplating of copper although other methods such as chemical vapor deposition (CVD) and other materials such as aluminum or gold can also be used.
- the fill and liner materials are then chemical-mechanical polished (CMP) to be coplanar with the surface of the hard mask and the structure at this stage is shown in Fig. If.
- a capping material 1220 is deposited as a blanket film, as is depicted in Fig.
- Ig to passivate the exposed metal surface and to serve as a diffusion barrier between the metal and any additional IMD layers to be deposited over them.
- Silicon nitride, silicon carbide, and silicon carbonitride films deposited by PECVD are typically used as the capping material 1220. This process sequence is repeated for each level of the interconnects on the device. Since two interconnect features are simultaneously defined to form a conductor inlaid within an insulator by a single polish step, this process is designated a dual damascene process.
- organosili-cates have a silica like backbone with hydrogen and/or organic groups such as alkyl or aryl groups attached directly to the Si atoms in the network.
- Their elemental compositions generally consist of Si, C, O, and H in various ratios. The C and H are most often present in the form of methyl groups (-CH 3 ) . The primary function of these methyl groups is to add hydrophobic!ty to the materials.
- a secondary function is to create free volume in these films and rreduce their polarizability.
- the k value can be further reduced to 2.2 (ultra low k) and even below 2.0 (extremely low k) by introduction of porosity in these insulators.
- these ultzra low k and extreme low k materials will be referred to collectively as very low k materials in this document.
- silanol (Si-OH) groups in the film through a potential reaction with moisture in the ambient enviro-nment.
- Silanols absorb water and hence Increase the dielectric constant and the dielectric loss factor of the film significantly, thus negating the performance benefits expected from the very low k films. They also increase the electrical leakage in the film and thus create a potentially unreliable interconnect structure. Since reactive ion etch and plasma etch are key steps required in the formation of the dual damascene trench and via structure as described above, and in the removal of photoresists used in patterning the very low k materials, it is very difficult, if not impossible, to avoid plasma damage of this class of films during a prior art dual damascene integration.
- Another method to prevent the low k material from losing its hydrophobicity and its dielectric properties is the use of fluorinated or non-fluorinated organic polymer based low k materials such as Dow Chemical' s SiMf* 4 dielectric, Honeywell' s Flare 1 * 4 and other polyimides, benzocyclobutene, polybenzoxazoles, aromatic thermoset polymers based on polyphenylene ethers; and chemical vapor deposited polymers such as poly paraxylylene which are not susceptible to damage during traditional process plasma exposures associated with the dual damascene processing.
- these materials do not possess the other properties required of a lO ⁇ * k dielectric film such as a low thermal expansion and small pore sizes.
- organosilicate-based porous materials are very fragile mechanically due to their low elastic modulus, fracture toughness and hardness which often lead to failures in CMP, dicing and packaging operations.
- the mechanical strength of these resins depends on both the void volume as well as their chemical structure. Their mechanical strength decreases with increasing porosity as well as increasing cage-like structure of the siloxane backbone. Since it is imperative that a low dielectric constant be maintained, it is very difficult to decrease the void volume While maintaining the same mechanical strength.
- TMCS is not completely effective at recovering the dielectric properties either.
- HMDS and TMCS are monofunctional siIyIating agents with the ability to attack only a single isolated siXanol group per molecule on the surface and pore wall off the low k material.
- organosilicate based low Is materials have two distinct types of silanols which are classified as follows (Gun'ko et. al., J.
- the firrst type of silanol is the non-hydrogen bonded silanoX which in itself consists of, (1) completely non-interacting single silanols (also called isolated silamols) which do not have any neighboring silanols nearby, (2) very weakly interacting silanols, and (3) weakly and non-interacting geminal silanols (also called disilanol) .
- the second type of silanol is tine hydrogen bonded silanol. Most monofunctional silylafcion agents attack and replace the isolated silanols readily, but generally do not attack the other two types of non-hydrogen bonded silanols as readily.
- the method by which the cage-network ratio is altered in this invention is also by silyla ⁇ tion which introduces new network forming siloxane bortds into the film and hence improves mechanical properties without a significant increase in dielectric constant.
- silyla ⁇ tion introduces new network forming siloxane bortds into the film and hence improves mechanical properties without a significant increase in dielectric constant.
- organosilicate film it is necessary for the organosilicate film to have an aZbundance of silanols. Providing these silanols prior to silylation and ensuring that the silylation reaction occurs to a sufficient extent to strengthen this film is also an object of this invention.
- An advantage of this invention is that fclie material choice for ultra low k intermetal dielectri-cs need not be constrained by a consideration of the effects of plasma and wet cleaning damage to these materials because they can be restored to thei_r original properties after they have been damaged b>y employing the silylation methods taught in the present: invention.
- this invention provides a method to increase the* mechanical robustness of the porous organosilicate films to be used as IMD f s.
- the invention is directed to a method for restoring properties of a low k or very low k dielectric constant organosilicate film havi-ng hydrogen atoms or alkyl or aryl groups attached to silicon atoms, and used in a low very low dielectric constant as an insulating layer in a semiconductor ciaip, or chip carrier, or a semiconductor wafer whearein the organosilicate film has undergone processing/ tending to degrade its the properties.
- the method comprises applying to the film a silylating agent comprising an aminosilane, so as to render the film hydrophobic.
- the aminosilane may have the general formula (R 2 N) x SiR ⁇ where X and Y are integers from 1 to 2 and 2 to 1 respectively, and where R and R x are selected from the group consisting of hydrogen, alkyl, aaryl, allyl, phenyl and a vinyl moiety.
- the aminosilane is bis(dimethylamino)dimethylsilane.
- the aminosilane may have the general formula where X, Y and Z are integers from 1 to 3, 3 to 1 and 1 to 3 respectively, and where R, R v , and R NX are any hydrogen, alkyl, or aryl, allyJ., phenyl or vinyl moiety.
- the invention is also directed to the same general method comprising applying to the film a. silylating agent, so as to render the film hydrophobic, said silylating agent having the form R x HySi-A where X and Y are integers from 0 to 2 and 3 to 1, respectively and where R, is any hydrogen, alkyl, or aryl, allyl, phenyl or vinyl moiety and where A is a silazane, chloro, amino or alkoxy moiety.
- the silylating agent may comprise amino, chloro and alkoxy terminated monofunctional terminated silylating agent, wherein methyl moieties on the silylating agent are at least partially replaced by hydrogen analogrues.
- the silylating agent may also comprise a polymeric siloxane with amino, alkoxy, chloro or silazane terminated end groups.
- the end groups of the polymeric s ⁇ iloxanes may comprise mono or di alkyl, aryl, vinyl or hydrogen moieties.
- the siloxane may comprise amiixo terminated polydimethylsiloxane.
- the silylating agent also may have the general formula R x H 7 Si 2 A where X, and Y, are integers from 0 to 5, and 6 to 1 respectively and Z is equal to, 1 to 2 and where R is a hydrogen, alkyl, aryl, allyl, phenyl or vinyl moiety, and A is a silazane, chlojro, amino or alkoxy moiety.
- the processing may include etching of the film, and removing a. photresist material from the film, wherein the silylating agent is applied after the etching and the removing. The etching and removing may be performed by exposing the film -to a plasma.
- Single damascene or a dual damascene processing may be used, and the applying of the silylating agent may be performed after definition of at least one of an interconnect line and a via, and prior to deposition of an electrical conductor. Applying of the silylating agent is performed prior to deposition of a conductive liner.
- the silylating agent may be applied by one of spin coating a liquid, immersing the substrate in a liquid, spray coating the substrate with the liquid,, in a vapor phase, or dissolved in super critical carbon dioxide, preferably with a co-solvent selected frc * m the group comprising at least one of alkanes, alkenes, ketones, ethers, and esters.
- the> silylating agent is applied in an absence of moisture.
- the film may be annealed, preferably at a temperature of at least 350° C, or as high as 450° C for a period in excess of one minute. The annealing may £>e performed before or after applying the silylating agent.
- the silylating agent is preferably applied at at temperature of at least 25° C.
- the annealing is performed to facilitate at least one of condensing unsilylated silanols in the film, and forming additional siloxane bonds.
- the silylating agent may be dissolved in a solvent, including a non-polar organic solvent with low surface tension selected from the group comprising alkanes, alkenes, ketones, ethers, esters, or any combinations thereof.
- the solvent has a low enough surface tension so as to penetrate pores in the film.
- the silylating agent may preferably have a concentration of between two per cent and ten per cent by weight in the solvent, but may also have a concentration of as low as one half per cent or greater by weight in the solvent.
- the silylating agent may be applied for a period of time between one minute and one hour, at room temperature or higher. Agitation or ultrasonification may be utilized when the silylating agent is applied.
- the film may be rinsed to remove excess silylating agent.
- the film may be baked, preferably at a temperature of up to 450° C.
- the silylating agent may be applied in a vapor phase, at temperatures between room temperature and 450° C, for a duration of thirty seconds to one hour, or of substantially 250° C, for a duration of five minutes.
- the silylating agent may be applied in super critical carbon dioxide, at temperatures between 25° C and 450° C, at a pressure between 1000 and 10,000 psi, for a duration of thirty seconds to one hour.
- Xt may also be applied in super critical carbon dioxide or vapor media at temperature in excess of 75° C for -times in excess of 30 seconds.
- the silylating agent is preferably diffunctional. It may comprise comprises (Bis)dimethylamiriodimethylsilane or (Bis)dimethylaroinomethylsilane.
- the step of applying the silylating agent follows treatment of the film with one of ultraviolet radiation, exposure to ozone, or exposure to a mildly oxidizing plasma or combinations thereof that introduces silanols into the film.
- the method may be carried out in a chemical vapor deposition chamber, or an atomic layer deposition chamber.
- the properties that are restored by the method in accordance with the invention include at least one of hydrophobic!ty, elastic modulus, -Low dielectric constant, fracture toughness and hardness, dielectric breakdown strength, low dielectric leakage and dielectric reliability.
- the interconnect structure in which such a restored film is integrated may additionally include one or more intermetal dielectrics selected from the group consisting of silicon dioxide, fluorinated tetraethyl orthosilicate, fluorinated silica glass, fluorinated or non-fluo ⁇ rinated organic polymers, the ⁇ noset polymers, and chemical vapor deposited polymers.
- the thermoset polymers may be based on polyphenylene ethers.
- the chemical vapor deposited polymer may be poly parajcylylene.
- the additional intermetal dielectrics may be an organic polymers selected from the group of polyimides, benzocyclobutene, polybenzoxazoles, aromatic.
- the invention is also directed to an article of manufacture comprising an insulating mate-crial having a plurality of electrical conductors formed therein; and an intermetal dielectric including an oarganosilicate film having hydrogen atoms or alkyl or aryl groups attached to silicon atoms; a surface of the organosilicate film comprising a product of the reaction between one of the silylating agents mentioned in the methods set forth above, and the O-cganosilicate film.
- the article may be configured as a semiconductor chip, a semiconductor chip carrier or a semiconductor wafer.
- the surface may be an external surface of the film or that of pores within the film.
- Fig. Ia to Fig. Ig illustrate process flow for a standard dual damascene integration scheme
- Fig. 2 Is a schematic diagram illustrating the effect of plasma exposure and silylation on the chemistry of the very low fc material
- Fig. 3a is a schematic diagram showing how mono functional silylating agents capture only one isolated silanol and block the neighboring silanol;
- Fig. 3b is a schematic showing htow the di functional analog of the agent used in 3a is successful at capturing two neighboring silanols simultaneously.
- Fig. 4a shows a series of FTIR sp&ctra illustrating the effect of mono, di and tri ffunctional silylation agents
- Fig. 4b is an enlarged potion of Fig. 4a.
- Fig. 5 provides comparisons of FTXR spectra and contact angle data of pristine, plasma damaged, BDMADMS treated and BDMADMS treated and annealed XMD.
- Fig. 6 is a graph of infrared absorbence as a function of wave number for pristine, plasma damaged, BDMADMS treated and BDMADMS treated -and annealed porous organosilicate IMD. DESCRIPTION OF THE INVENTION
- invention 1 The primary embodiment of this invention (hereinafter “embodiment 1”) pertains to the use of a novel cla.ss of silylating agents which are very effective silyl_ating agents for recovery of dielectric properties.
- embodiment 1 of this invention also pertains to a method by which these silylation agents are introduced into the process to ensure that the external surrface, as well as the bulk (including all the interior- pore walls) , of the porous low k material are rendered hydrophobic.
- a second embodiment of this invention discloses specific molecular variations on moieties such as silazanes used in the prior art to render them more effective as silylating agents.
- the silyHating agents of this invention are introduced into the single or dual damascene process for building an interconnect structure after the definition of the interconnect line and via and prior to the deposition of the conductive liner and fill materials which comprise the interconnect metal.
- the silylatincj agents are introduced after the resist is stripped following the reactive ion etch (RIE) of the low k material.
- RIE reactive ion etch
- a dual damascene scheme such as the one depicted in Fig. 1 is used, the silylating agent of the present invention is introduced between process steps of Fig. Ie and Fig. If.
- the silylating agents detailed in this invention can be used in interconnect structures which have dense or porous organosilicates at either "the line or the via level or both. Further, they can be used in structures when porous organosilicates are iased in combination with other organosilicates oar with materials such as SiO 2 , FSG, fluorinated tefcraethyl orthosilicate (FTEOS) , or fluorinated or non-fluorinated organic polymers. While the other materials listed may be part of the structure, they are generally not prone to damage of the kind described herein during processing and are thus not amenable to the silylation treatment, as such.
- the schematic in Fig. 2 demonstrates how the silylating agents used in this invention succeed in restoring the methyl moieties in the low k organosilicate films following their removal during typical process plasma exposures.
- the group of the silylating agent which leaves the reaction site (the "leaving group") is the group that reacts with and deprotonates the silanol forming a new siloxane bond.
- the reactivity of the leaving group determines the efficacy of the silylation reaction.
- a class of silylating agents which go by the general formula where X and Y are integers from 1 to 2 and 2 to 1 respectively, are introduced after the definition of line and via that will subsequently hold the interconnect metal.
- R and R 1 could be any hydrogen, alkyl, aryl, phenyl, allyl or vinyl moiety that could render the film hydrophobic.
- These silylating agents are generally called aminosilanes and they will be referred to as such in the remainder of this document. They are termed monofunctional or difunctional depending upon the value of x being 1 or 2 respectively.
- the aminosilanes are introduced by a spin-on process, in liquid phase, in the vapor phase (in a furnace or in a CVD chamber) , or supercritical carbon dioxide media, but in all cases, it is very important to handle the silylating agent in the total absence of ambient moisture, since any moisture that might be present could reduce the efficacy of the silylation reaction. Further, a combination of a silylation followed by an anneal or an anneal followed by a silylation or high temperature
- silylation is preferred to silylation by itself, as this results in the greatest decrease of silanol content in the film.
- the anneal step also condenses any remaining unsilylated silanols in the film and enables the formation of additional siloxaite bonds which strengthen the film.
- the aminosilaaies When used in a liquid medium, they should preferably ⁇ >e dissolved in any non-polar organic solvent that: has a low surface tension so that the pores can be penetrated effectively.
- solvents include but are not limited to, hexanes, heptanes, xylenes, and the like. It is desirable but not necessary for -the solvent to have a low volatility as measured by its flash point and boiling point.
- concentration of the aminosilanes necessary for effective silylation can be as low as 0.5% by weight of the solution or the aroinosilane can be used as such in its undiluted liqtiid form.
- the desired range for the most effective siLylation is typically 2% to 10% in solution.
- the solution can either be spin coated on to the porous low k fi_lm or used in a wet chemical tank in which the wafers wi.th the interconnect features defined in the porous low k film are immersed for a period ranging from 1 minute to 1 hour or more.
- the temperature for tbe silylation can either be room temperature or higlier. Agitation or ultrasonification during the immersion is not necessary to facilitate the reaction but in sor ⁇ e applications may help enhance the rate of the reactdLon.
- the wafers can be rinsed off in the pure solvent and then baked on a hot plate or in a furnace to a temperature up to 450 C. Liquid phase silylation can also be carried out by using the solution defined in the paragraph above and spin coating or spray coating this solution.
- a vapor phase silylation is carried out with the aminosilanes, it is important for the carrier gas to be inert and non-oxidizing and for the chamber to be moisture free. In case the chamber is not free of moisture, the di and tri functional amino sxlanes will tend to oligomerize and form either monolayers or films respectively. The formation of monolayers and films is not desirable because the reactivity of the silylating agents with the film in general will be slowed down; further the treatment will also be limited to the top surface and the pores in the bulk of the film will not be rendered hydrophobic. Vapor phase silylation can be carried out at temperatures ranging from room temperature to 450° C for a duration ranging from 30 seconds to an hour or more.
- a preferable time and temperature for the vapor phase silylation is 5 minutes at 250° C.
- an optional hot plate bake or a furnace cure up to a temperature of 450° C can be employed.
- the vapor phase treatment of dielectric films can be performed in free standing furnaces, flow through chambers or in processing chambers used in semiconductor industry for chemical vapor deposition (CVD) or atomic layer deposition (ALD) .
- CVD chemical vapor deposition
- ALD atomic layer deposition
- SC carbon dioxide
- CO 2 carbon dioxide
- the temperature, pressure and time ranges for the SC CO 2 based silylation can be as follows: Temperature: 25° C to 450° C, Pressure: 1,000 to 10,000 psi, Time: 30 seconds to 1 hour or more.
- Difunctional silylating agents are generally more effective than their monofunctional counterparts since they have a capacity to capture two neighboring non-hydrogen bonded silanols, especially geminal silanols simultaneously as shown in Fig. 3b (Fig. 3b shows two neighboring isolated silanols) .
- Monofunctional silylating agents are generally unable to capture two neighboring silanols due to the three methyl moieties sterically hindering another monofunctional silylating agent from reacting readily with the neighboring silanol as shown.
- Trifunctional silylating agents have a tendency to cross-link and form films that do not penetrate the pores of a low k film. Additionally, due to the fact that it is not possible for trifunctional silylating agents to capture three silanols simultaneously, there is a possibility for additional silanol formation on the unreacted ends of the silylating agent.
- Fig. 4 shows the comparison between mono, di and trifunctional chlorine terminated silylating agents where the silylation is performed in a moisture free environment in the liquid phase. From the FTIR spectra in Fig. 4, it can be seen that the difunctional agent shows the optimum combination of an increase in the methyl content of the film and a decrease in silanol content. A similar effect can be achieved with amino terminated silylation agents with the added benefit that the byproduct of the reaction is not corrosive.
- liquid phase silylation by BDMADMS followed by an anneal at 400° C recovers the hydrophobicity and the methyl content of a porous low k film.
- Tables IA and IB show a comparison of contact angles achieved by the preferred agent of this invention, BDMADMS, and that of the silylation agent HMDS used in the prior art. As can be seen from table Ia, BDMADMS is more effective in recovering the contact angle. Table Ib shows that fche effect of BDMM)MS is not diminished after 4 weeks of exposure to the ambient whilst the contact angle of the HMDS silylated low k material decreases showing a progressive deterioration in dielectric properties. Table 2 shows that BDMM)MS recovers the Ic of the porous low k film after it increases post exposure to a typical process plasma. Similarly, the dielectric loss as well as the dielectric brea ⁇ kdown strength recover back to their original values for films treated with BDMADMS.
- silylation changes the structural morphology of the organosilicate and renders the backbone more netnoxk like rather than cage like, with the result that the mechanical properties are enhanced. This is due to the fact that the silylation reaction forms new network forming siloxane bonds which enhance the mechanical strength of the films.
- the infrared peak at a ware number (of about 1067 (I/cm) which signifies the extent of the network structure in the film shows a marked, increase in height with the silylation treatment as seen in the FTIR spectra in Fig. 6. Reference is matde to Table 3.
- the silylation reaction is followed by a furnace anneal to condense any remaining silanols and form new siloxane bonds that further enhance the mechanical strength.
- Embodiment 1 shows the efficacy of rii-Ftmotional silylation agents in general and BDMADMS in parrticular.
- Embodiment 1 also shows that monofunctional si-lylating agents such as HMDS and TMCS are not as effective as their difunctional counterparts due to the* steric hindrance presented by the three methyl moieties on the silylating agent.
- monofunctional si-lylating agents such as HMDS and TMCS are not as effective as their difunctional counterparts due to the* steric hindrance presented by the three methyl moieties on the silylating agent.
- TMDS tetramethyldisilazane
- si-lylating agents with the general formula R x HySi-A where X and Y are integers from 0 to 2 and 3 to 1 respectively can be used as effective silylating agents.
- the silylation reaction is followed by a furnace anneal to condense any rremaining silanols and form new siloxane bonds that further enhance the mechanical strength.
- polymeric siloxanes with amino, alkoxy, chloro or silazanes terminated end groups with mono or di alkyl, aryl, vinyl or hydrogen moieties on them can be used to form monolayers on the top surface of the low k film and recover surface hydrophobicity.
- a siloxane is amino terminated polydimethylsiloxane.
- Xt is important to ensure that the molecular weight is low enough so that the silylating agent flows into the gaps created by the etch process to form trench and via in the organosilicate for the formation of the interconnect structure.
- the silylation reaction is followed by a furnace anneal to condense any remaining silanols and form new siloxane bonds that further enhance the mechanical strength.
- the silylating agent can also be introduced Iimmediately after the film is deposited.
- the efficacy in this case depends on how many silanols are present in the film after deposition.
- the silylation agent can also be introduced following a treatment such as UV/Ozone, or a mildly oxidizing plasma exposure that introduces silanols into the film.
- the silylation is followed by a thermal anneal.
- Silylating agents described in any of the above three embodiments can be employed in this manner.
- the silylation agent can be either co-deposited or introduced into the chamber along with the precursor for the CVD dielectric.
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- 2004-10-27 WO PCT/US2004/035685 patent/WO2006049595A1/en active Search and Examination
- 2004-10-27 KR KR1020097021355A patent/KR100985613B1/en not_active IP Right Cessation
- 2004-10-27 EP EP04796562A patent/EP1812961A1/en not_active Withdrawn
- 2004-10-27 KR KR1020097021356A patent/KR100974042B1/en not_active IP Right Cessation
- 2004-10-27 KR KR1020107016122A patent/KR101063591B1/en not_active IP Right Cessation
- 2004-10-27 CN CN2004800442976A patent/CN101048857B/en not_active Expired - Fee Related
- 2004-10-27 JP JP2007538874A patent/JP4594988B2/en not_active Expired - Fee Related
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KR101063591B1 (en) | 2011-09-07 |
KR100985613B1 (en) | 2010-10-05 |
KR100974042B1 (en) | 2010-08-05 |
CN101048857A (en) | 2007-10-03 |
KR20100088166A (en) | 2010-08-06 |
CN101048857B (en) | 2010-10-13 |
WO2006049595A1 (en) | 2006-05-11 |
JP2008518460A (en) | 2008-05-29 |
KR20090113389A (en) | 2009-10-30 |
JP4594988B2 (en) | 2010-12-08 |
KR20090111883A (en) | 2009-10-27 |
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