EP1799884B1 - Procede de preparation d'un substrat non conducteur pour electrodeposition - Google Patents

Procede de preparation d'un substrat non conducteur pour electrodeposition Download PDF

Info

Publication number
EP1799884B1
EP1799884B1 EP05758554.9A EP05758554A EP1799884B1 EP 1799884 B1 EP1799884 B1 EP 1799884B1 EP 05758554 A EP05758554 A EP 05758554A EP 1799884 B1 EP1799884 B1 EP 1799884B1
Authority
EP
European Patent Office
Prior art keywords
copper
carbon
solution
dispersion
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP05758554.9A
Other languages
German (de)
English (en)
Other versions
EP1799884A2 (fr
EP1799884A4 (fr
Inventor
Richard C. Retallick
Hyunjung Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of EP1799884A2 publication Critical patent/EP1799884A2/fr
Publication of EP1799884A4 publication Critical patent/EP1799884A4/fr
Application granted granted Critical
Publication of EP1799884B1 publication Critical patent/EP1799884B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Definitions

  • the present invention relates to a process for enhancing the electroplating of non-conductive surfaces, such as the through holes of a printed circuit board (PCB).
  • the invention comprises an improved process for plating non-conductive surfaces without the need for electroless plating.
  • the improved process is particularly suitable for plating surfaces, such as printed circuit boards, which comprise both non-conductive and conductive (metallic) surfaces.
  • Printed circuit boards are generally composed of a non-conductive layer, such as an epoxy resin/glass fiber mixture, which is positioned between copper or nickel plates or foils, or other conductive metal layers. There can also be a multiplicity of these alternating layers. Commonly, holes are drilled through the PCB to establish a connection between the conductive metal layers at specific points in the board. The holes are then metallized to form a connection between the conductive materials, usually by plating.
  • a non-conductive layer such as an epoxy resin/glass fiber mixture
  • the through holes are usually first provided with a layer of electroless copper in a process which requires several steps, including, desmear, pre-activation, activation with a palladium/tin activator, application of an accelerator, electroless copper deposition and one or more rinses, before electroplating could be effected.
  • the need for application of electroless copper can be avoided, it has been found, by the deposition of carbon on the through holes or other non-conductive surfaces which are to be electroplated. In this way, the long process time, complex chemistry requiring constant monitoring, and sensitivity of electroless baths can be avoided.
  • the expensive waste treatment often required with electroless copper and palladium/tin activators can be eliminated.
  • the use of a carbon deposition process may have several drawbacks. After carbon deposition, it takes several minutes before the non-conductive surface being plated is completely covered by the electroplated metal. This is especially significant where the surface to be plated is a through hole. Electroplating after treatment with carbon begins adjacent to the outer conductive surfaces (i.e., the copper foil) of the PCB and extends inward towards the center of the hole. This occurs from both sides of the through hole and the plating meets in the center and completes the connection.
  • the outer conductive surfaces i.e., the copper foil
  • This invention proposes a modification to one of the standard process steps in the copper plating cycle, namely the neutralization step in the desmear cycle.
  • the modified neutralization step proposed accomplishes both the required neutralization function as well as the application of a thin sacrificial coating to the copper surfaces prior to the application of carbon.
  • the sacrificial coating allows the subsequent removal of carbon from the copper surfaces to be achieved more reliably with less microetching. Thus, an improvement is provided without unwanted expansion of the process cycle.
  • This invention proposes a process for plating surfaces comprised of metallic areas and non-conductive areas, said process comprising contacting the surfaces to be plated with the following solutions:
  • Water rinses are interspersed after steps a, b, c, f and g.
  • a preferred embodiment of the present invention relates to the preparation of a PCB through hole for the deposition of an electroplated layer of copper or other conductive metal (such as nickel, gold, silver, etc.) so as to form a connection between conductive metal layers which are sandwiched with non-conductive layers.
  • an electroplated layer of copper or other conductive metal such as nickel, gold, silver, etc.
  • this description will be written in terms of electroplating (or metalizing) the through holes of printed circuit boards, it will be understood that such is for ease of description only, and that the disclosed process is equally applicable to the preparation of various non-conductive surfaces for deposition of an electroplated metal layer on plastics applications.
  • Printed circuit boards are generally comprised of two or more plates or foils of nickel or copper, which are separated from each other by a layer of non-conducting material.
  • the non-conducting layers are typically comprised of an organic material such as an epoxy resin which has been reinforced with glass fiber.
  • the non-conducting layer may also be comprised of thermosetting resins, thermoplastic resins, and mixtures thereof, with or without reinforcing materials such as fiberglass and fillers.
  • Suitable thermoplastic resins include the acetyl resins; acrylics, such as methyl acrylate; cellulosic resins, such as ethyl cellulose, cellulose acetate, cellulose propionate, cellulose acetate butyrate, cellulose nitrate, and the like; chlorinated polyethers; nylon, polyethylene; polypropylene, polystyrene, styrene blends, such as acrylonitrile styrene co-polymers; polycarbonates; polychlorotrifluorethylene; and vinyl polymers and co-polymers, such as vinyl acetate, vinyl alcohol, vinyl butyral, vinyl chloride, vinyl chloride-acetate co-polymer, vinylidene chloride and vinyl formal.
  • thermosetting resins include alkyl phthalate; furane; melamine-formaldehyde; phenol formaldehyde and phenol-furfural co-polymer, alone or compounded with butadiene acrylonitrile co-polymers; polyacrylic esters; silicones; urea formaldehydes; epoxy resins, polyimides, alkyl resins, glycerol phthalates; polyesters; and the like.
  • Through holes are formed in printed circuit boards in order to establish connection between the metal plates at certain points in the board to produce the desired electrical pattern. This is usually accomplished by drilling holes at the desired locations through the copper plates and the non-conducting layers, and then connecting the separate metal plates by metallizing the through holes (i.e., coating the inner surface of the through hole with a conductive metal).
  • the hole diameters of PCBs generally range from about 0.15 millimeters to about 10.0 millimeters, more typically from about 0.3 millimeters to about 1.0 millimeters.
  • a typical desmear solution comprises an alkaline solution of permanganate ions, usually provided by sodium or potassium permanganate at concentrations of from about 25 g/l to about 170 g/l.
  • a solvent or swellant can be used to soften or swell the resin of the non-conductive surfaces and thereby enhance the ability of the desmear solution to etch those surfaces.
  • the desmear solution is used at elevated temperatures of from about 100°F to about 180°F, and contact times ranging from 2 minutes to 30 minutes.
  • the neutralizer/sacrificial coating solution comprises an aqueous solution of (i) hydrogen peroxide, (ii) acid and (iii) corrosion inhibitor.
  • the concentration of hydrogen peroxide may range from about 2 g/l to about 60 g/l but is preferably from about 3 g/l to about 30 g/l.
  • the acid can be any acid which is stable in combination with the hydrogen peroxide but is preferably a mineral acid and is most preferably sulfuric acid. If sulfuric acid is used, concentration will preferably range from about 30 to about 200 g/l.
  • the corrosion inhibitor(s) are preferably selected from the group consisting of alkyl imidazoles, alkyl triazoles, aromatic imidazoles, aromatic triazoles and mixtures of the foregoing compounds. Most preferably the corrosion inhibitor(s) are selected from the group consisting of benzotriazole, hydroxy benzotriazole and mixtures of the foregoing compounds.
  • the concentration of corrosion inhibitor(s) should preferably range from about 0.5g/l to about 20 g/l.
  • the neutralizer/sacrificial coating solution may also comprise surfactants, water soluble polymers, halide ions and other additives known in the art. In this regard, reference is made to U.S. Patent No. 6,146,701 , the teachings of which are incorporated herein by reference in their entirety.
  • the part to be plated is neutralized and the sacrificial coating is applied by contacting the part with the neutralizer/sacrificial coating solution via immersion, spray or flood.
  • the contact time may vary from 0.5 to 10 minutes and the operating temperature may range from 70 to 150°F.
  • the part is then rinsed in water and proceeds through the typical carbon based plating cycle.
  • the printed circuit board is precleaned in order to place it in condition for receiving the liquid carbon black dispersion of this invention.
  • the PCB is placed in a cleaner/conditioner bath for several minutes at a temperature of about 130 degree F. to remove grease and other impurities from the hole wall surfaces.
  • One preferred Cleaner/Conditioner, Blackhole Conditioner is sold by MacDermid Incorporated of Waterbury, Conn.
  • the printed circuit board is rinsed to remove any residual cleaner/conditioner from the board.
  • the cleaner/conditioner should be alkaline so as not to remove the sacrificial layer. It should be recognized that none of the above-mentioned hole drilling or pre-cleaning operations is a critical feature of the present invention. Any and all conventional equivalents to these operations may be used instead.
  • the carbon deposition process involves the application of a liquid carbon dispersion to the cleaned printed circuit board.
  • This dispersion contains three principal ingredients, namely carbon, one or more surfactants capable of dispersing the carbon, and a liquid dispersing medium such as water.
  • the preferred methods of applying the dispersion to the PCB include immersion, spraying or other methods of applying chemicals used in the printed circuit board industry. A single working bath is sufficient for applying this carbon black dispersion; however, more than one bath may be used for rework or other purposes.
  • the three primary ingredients, and any other preferred ingredients are mixed together to form a stable dispersion. This may be accomplished by subjecting a concentrated form of the dispersion to ball milling, colloidal milling, high-shear milling, ultrasonic techniques or other like procedures to thoroughly mix the ingredients. The dispersion can then be later diluted with more water to the desired concentration for the working bath.
  • the preferred method of mixing is ball milling a concentrated form of the dispersion in a container having glass mineral or plastic beads therein for at least about 1 hour. The mixing can continue for up to about 24 hours. This thorough mixing allows for the carbon particles to be intimately coated or wetted with the surfactant.
  • the mixed concentrate is then mixed with water or some other liquid dispersing medium to the desired concentration.
  • the working bath is preferably kept agitated during both the diluting and applying steps to aid in maintaining dispersion stability.
  • the particle diameter of the carbon particles should average no more than about 3 microns while in the dispersion. It is desirable to have this average particle diameter of carbon as small as possible to obtain desired plating characteristics, such as substantially even plating and no plating pullaways.
  • the average particle diameter of the carbon particles is preferably from about 0.05 microns to about 3.0 microns, more preferably between about 0.08 microns and about 1.0 microns when in the dispersion.
  • the term "average particle diameter" as used herein refers to the average mean diameter of the particles (the average by number).
  • the average mean diameter in the dispersion may be determined through the use of either a NiComp Model 370 submicron particle sizer (Version 3.0) or a HIAC PA-720 automatic particle size analyzer (both available from the HIAC/ROYCO Instrument Division of Pacific Scientific of Menlo Park, Calif.). It is also important to maintain the size distribution of the carbon particles to a relatively narrow distribution.
  • carbon blacks which are initially acidic or neutral, i.e. those which have a pH of between about 1 and about 7.5 and more preferably between about 2 and about 4 when slurried with water.
  • the carbon black particles which are preferred are also very porous and generally have as their surface area from about 45 to about 1100, and preferably about 300 to about 600, square meters per gram, as measured by the BET method (method of Brunauer-Emmert-Teller).
  • carbon blacks suitable for use in this invention are Cabot XC-72R Conductive, Cabot Monarch 800, Cabot Monarch 1300, all available from Cabot Corporation of Boston, Mass.
  • Other suitable carbon blacks include Columbian T-10189, Columbian Conductiex 975 Conductive, Columbian CC-40,220, and Columbian Raven 3500, all available from Columbian Carbon Company of New York, N.Y.
  • Cabot Monarch 1300 and Columbian Raven 3500 are the two most preferred carbon blacks because of their ease of dispersion and low pH.
  • Suitable graphites include Showa-Denko UFG available from Showa-Denko K.K., 13-9 Shiba Daimon 1-Chrome, Minato-Ku, Tokyo, 105 Japan, Nippon Graphite AUP available from Nippon Graphite Industries, Ishiyama, Japan, and Asbury Micro 850, available from Asbury Graphite Mills of Asbury, N.J.
  • a surfactant capable of dispersing the carbon in the liquid dispersing medium is employed in the dispersion.
  • One or more surfactants is added to the dispersion to enhance the wetting ability and stability of the carbon and to permit maximum penetration by the carbon within the pores and fibers of the non-conducting layer of the PCB.
  • Suitable surfactants include anionic, nonionic and cationic surfactants (or combinations thereof such as amphoteric surfactants).
  • the surfactant should be soluble, stable and preferably non-foaming in the liquid carbon dispersion. In general, for a polar continuous phase as in water, the surfactant should preferably have a high HLB number (8-18).
  • the preferred type of surfactant will depend mainly on the pH of the dispersion.
  • the total dispersion is alkaline (i.e. has an overall pH in the basic range) so as not to disturb the sacrificial layer.
  • an anionic or nonionic surfactant include sodium or potassium salts of naphthalene sulfonic acid such as DARVAN No. 1, commercially available from Eastern Color and Chemical, PETRO AA and PETRO ULF, commercially available from Petro Chemical Co., Inc., and AEROSOL OT, commercially available from American Cyanamid.
  • Preferred anionic surfactants include neutralized phosphate ester-type surfactants such as MAPHOS 55,56,8135, 60A and L6, commercially available from BASF Chemical Co.
  • the most preferable anionic surfactant for a liquid carbon black dispersion is MAPHOS 56.
  • Suitable nonionic surfactants include ethoxylated nonyl phenols such as the POLY-TERGENT B-series from Olin Corporation or alkozylated linear alcohol's such as the POLY-TERGENT SL-series, also from Olin Corporation.
  • carbon is present in the dispersion in an mount of less than about 15% by weight of the dispersion, preferably less than about 5% by weight, most preferably weight, most preferably less than 2% by weight, particularly when the form of carbon is carbon black. It has been found that the use of higher concentrations of carbon blacks may provide undesirable plating characteristics.
  • the solids content i.e. all of the ingredients other than the liquid dispersing medium
  • the liquid dispersion of carbon is typically placed in a vessel and the printed circuit board is immersed in, sprayed with or otherwise contacted with the liquid dispersion.
  • the temperature of the liquid dispersion in an immersion bath should be maintained at between about 15 degree C. and about 35 degree C. and preferably between about 20 degree C. and about 30 degree C. during immersion.
  • the period of immersion advantageously ranges from about 15 seconds to about 10 minutes, more preferably from about 30 seconds to 5 minutes.
  • the immersed board is then removed from the bath of the liquid carbon-containing dispersion and is preferably contacted with compressed air to unplug any through holes that may still retain plugs of the dispersion.
  • excess basic liquid carbon-containing dispersion is removed from the face of the copper plates.
  • substantially all (i.e. over about 90% by weight) of the water (or other liquid dispersing medium) in the applied dispersion is removed and a dried deposit containing carbon is left on the surfaces of the non-conducting material.
  • This may be accomplished by several methods such as by evaporation at room temperature, by a vacuum, or by heating the board for a short time at an elevated temperature. Heating at an elevated temperature is the preferred method. Heating is generally carried out for between about 5 and about 45 minutes at a temperature of from about 75 degree C. to about 120 degree C., more preferably from about 80 degree to 98 degree C. To insure complete coverage of the hole walls, the procedure of immersing the board in the liquid carbon dispersion and then drying may be repeated one or more times.
  • the resulting PCB is often completely coated with the carbon dispersion.
  • the dispersion is not only coated on the drilled hole surfaces, as desired, but also coats the copper plate or foil surfaces, which is disadvantageous. Thus prior to any further processing, the carbon should be removed from the copper plate or foil surface.
  • the part is dipped in a mild acid microetch solution in order to remove the unwanted carbon from the metallic (copper) surfaces.
  • a mild acid microetch solution A variety of acids including hydrochloric acid, sulfuric acid, acetic acid, citric acid, tartaric acid and the like may be used.
  • the concentration of the acid may range from 0.5% to 50% by weight, preferably from 1% to 10% by weight, with water and the chosen oxidizer essentially making up the remainder.
  • the oxidizer is either hydrogen peroxide or a persulfate.
  • Application of the acid microetch solution can be by any conventional means such as by immersion or spray.
  • the parts are ready for the standard electroplating process as subsequently indicated.
  • a standard soak cleaner as is typically used in electroplating processes, may be employed at this point prior to electroplating.
  • the thusly treated printed wiring board is then immersed in a suitable electroplating bath for applying a copper coating on the hole walls of the non-conducting layer.
  • a suitable electroplating bath for applying a copper coating on the hole walls of the non-conducting layer.
  • the present invention contemplates the use of any and all electroplating operations conventionally employed in applying a metal layer to the through hole walls of a PCB. Therefore this claimed invention is not limited to any particular electroplating bath parameters.
  • a typical copper electroplating bath is comprised of copper, copper sulfate, sulfuric acid and chloride ion in aqueous solution.
  • the electroplating bath is normally agitated and preferably maintained at a temperature of between about 20 degree C. and about 25 degree C.
  • the electroplating bath is provided with anodes, generally constructed of copper, and the printed circuit board to the plated is connected as a cathode to the electroplating circuit.
  • a current is then impressed across the electroplating circuit for a period of between about 60 and about 90 minutes in order to effect copper plating on the hole walls of the non-conducting layer positioned between the two plates of copper. This copper plating of the hole wall provides a current path between the copper layers of the printed circuit board.
  • Other suitable electroplating conditions may be employed, if desired.
  • Other electroplating bath compositions containing other copper salts or other metal salts such as salts of nickel, gold, silver and the like may be employed, if desired.
  • the printed circuit board is removed from the copper electroplating bath and then washed and dried to provide a board which is further processed by applying photoresist compounds and the like, as is known in the art for the preparation of printed circuit boards.
  • the invention is further illustrated with reference to the following examples.
  • Double-sided boards (copper foil is laminated to opposite sides of an epoxy resin/fiberglass composite) were mechanically scrubbed and processed through the following sequence for the indicated time. All procedures were performed by immersion in a beaker without any special impingement.
  • Example 1 demonstrates that application of sacrificial layer improves carbon removal in the direct metallization process. Copper removal by microetch can be decreased by 50 % or more while maintaining a clean surface.
  • Double-sided printed circuit boards with through holes are processed according to the sequences in the example 1. All boards were laminated, exposed and developed followed by Cu-Sn plating. All panels were carefully inspected to observe any blisters, halos or dry film lifting caused by poor dry film adhesion.
  • Four kinds of dry films, AQUA MER® DI 200, AQUA MER® DI 300, AQUA MER® MP 420 and AQUA MER® PR 100 were used for the test. The dry film adhesion evaluation is described in table 3. Table 3.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Claims (5)

  1. Procédé de placage d'objets comprenant des zones métalliques et des zones non conductrices, ledit procédé comprenant la mise en contact de l'objet avec :
    a. une solution d'ébeurrage comprenant des ions de permanganate ;
    b. une solution de neutralisation comprenant (i) un acide, (ii) un peroxyde d'hydrogène, et (iii) un inhibiteur de corrosion ;
    c. une solution de conditionnement comprenant un matériau sélectionné dans le groupe constitué d'agents tensio-actifs et de polymères solubles dans l'eau ;
    d. une dispersion aqueuse de particules de carbone comprenant (i) un matériau sélectionné dans le groupe constitué d'agents tensio-actifs et de polymères solubles dans l'eau et de (ii) particules de carbone ;
    e. un processus de séchage ;
    f. une solution de microdécapant ;
    g. une solution d'électrodéposition de cuivre avec un potentiel électrique appliqué.
  2. Procédé selon la revendication 1, dans lequel l'inhibiteur de corrosion est sélectionné dans le groupe constitué d'imidazoles d'alkyle, de triazoles d'alkyle, d'imidazoles aromatiques, de triazoles aromatiques et une combinaison des composés précités.
  3. Procédé selon la revendication 1, dans lequel l'objet est une carte de circuits imprimés.
  4. Procédé selon la revendication 1, dans lequel les zones métalliques comprennent du cuivre et dans lequel les zones non conductrices comprennent un matériau résineux ou polymérique.
  5. Procédé selon la revendication 2, dans lequel l'objet est une carte de circuits imprimés.
EP05758554.9A 2004-10-13 2005-06-10 Procede de preparation d'un substrat non conducteur pour electrodeposition Active EP1799884B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/964,212 US7214304B2 (en) 2004-10-13 2004-10-13 Process for preparing a non-conductive substrate for electroplating
PCT/US2005/020635 WO2006043994A2 (fr) 2004-10-13 2005-06-10 Procede de preparation d'un substrat non conducteur pour electrodeposition

Publications (3)

Publication Number Publication Date
EP1799884A2 EP1799884A2 (fr) 2007-06-27
EP1799884A4 EP1799884A4 (fr) 2007-10-03
EP1799884B1 true EP1799884B1 (fr) 2017-01-18

Family

ID=36144169

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05758554.9A Active EP1799884B1 (fr) 2004-10-13 2005-06-10 Procede de preparation d'un substrat non conducteur pour electrodeposition

Country Status (6)

Country Link
US (1) US7214304B2 (fr)
EP (1) EP1799884B1 (fr)
JP (1) JP2008516088A (fr)
CN (1) CN101040065B (fr)
ES (1) ES2612210T3 (fr)
WO (1) WO2006043994A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006114130A1 (fr) * 2005-04-26 2006-11-02 Agilent Technologies, Inc. Enzymes comprenant des acides aminés modifiés
US8771804B2 (en) * 2005-08-31 2014-07-08 Lam Research Corporation Processes and systems for engineering a copper surface for selective metal deposition
US20100034965A1 (en) 2008-08-06 2010-02-11 Retallick Richard C Direct Metallization Process
CN102036489B (zh) * 2010-11-26 2012-10-03 深南电路有限公司 高精度非金属加金属化边pcb板的加工方法
US20130186764A1 (en) * 2012-01-19 2013-07-25 Kesheng Feng Low Etch Process for Direct Metallization
ES2925233T3 (es) * 2013-05-14 2022-10-14 Prc Desoto Int Inc Composiciones de recubrimiento de conversión a base de permanganato
CN104519664B (zh) * 2013-09-27 2018-04-17 北大方正集团有限公司 印制电路板的清洗方法和印制电路板
JP2015078443A (ja) * 2015-01-14 2015-04-23 上村工業株式会社 電気銅めっき用前処理剤、電気銅めっきの前処理方法及び電気銅めっき方法
CN106319603A (zh) * 2016-08-29 2017-01-11 苏州铱诺化学材料有限公司 一种黑孔整孔剂配方
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process
CN110856348A (zh) * 2019-10-09 2020-02-28 广东利尔化学有限公司 一种用于pcb除胶后处理中和还原剂
CN111041535A (zh) * 2019-12-25 2020-04-21 浙江振有电子股份有限公司 一种连续移动式电镀通孔双面板的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724005A (en) * 1985-11-29 1988-02-09 Olin Hunt Specialty Products Inc. Liquid carbon black dispersion
US4964959A (en) * 1990-04-12 1990-10-23 Olin Hunt Specialty Products Inc. Process for preparing a nonconductive substrate for electroplating
US5139642A (en) * 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
US5626736A (en) * 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
US5674372A (en) * 1996-09-24 1997-10-07 Mac Dermid, Incorporated Process for preparing a non-conductive substrate for electroplating
US6565731B1 (en) * 1997-06-03 2003-05-20 Shipley Company, L.L.C. Electroplating process
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
GB0105718D0 (en) * 2001-03-08 2001-04-25 Shipley Co Llc Compositions containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
EP1799884A2 (fr) 2007-06-27
WO2006043994A2 (fr) 2006-04-27
CN101040065A (zh) 2007-09-19
US20060076245A1 (en) 2006-04-13
WO2006043994A3 (fr) 2006-09-28
US7214304B2 (en) 2007-05-08
CN101040065B (zh) 2010-08-18
ES2612210T3 (es) 2017-05-12
JP2008516088A (ja) 2008-05-15
EP1799884A4 (fr) 2007-10-03

Similar Documents

Publication Publication Date Title
EP1799884B1 (fr) Procede de preparation d'un substrat non conducteur pour electrodeposition
USRE37765E1 (en) Process for preparing a nonconductive substrate for electroplating
US5015339A (en) Process for preparing nonconductive substrates
EP0244535B1 (fr) Procédé de dépôt chimique
US4622108A (en) Process for preparing the through hole walls of a printed wiring board for electroplating
US4897164A (en) Process for preparing the through hole walls of a printed wiring board for electroplating
US4874477A (en) Process for preparing the through hole walls of a printed wiring board for electroplating
US5143592A (en) Process for preparing nonconductive substrates
US5536386A (en) Process for preparing a non-conductive substrate for electroplating
US5110355A (en) Process for preparing nonconductive substrates
JP7161597B2 (ja) 炭素系ダイレクトめっきプロセス
US4994153A (en) Process for preparing nonconductive substrates
US5759378A (en) Process for preparing a non-conductive substrate for electroplating
US5674372A (en) Process for preparing a non-conductive substrate for electroplating
US20100034965A1 (en) Direct Metallization Process

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20070302

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE ES FR GB IT

A4 Supplementary search report drawn up and despatched

Effective date: 20070905

DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20160811

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE ES FR GB IT

RBV Designated contracting states (corrected)

Designated state(s): DE ES FR GB IT

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602005051190

Country of ref document: DE

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2612210

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20170512

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 13

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602005051190

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20171019

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 14

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 602005051190

Country of ref document: DE

Representative=s name: PAGE, WHITE & FARRER GERMANY LLP, DE

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230524

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20230703

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20240521

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240521

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20240522

Year of fee payment: 20

Ref country code: FR

Payment date: 20240521

Year of fee payment: 20