EP1799402A4 - METHOD AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION - Google Patents

METHOD AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION

Info

Publication number
EP1799402A4
EP1799402A4 EP05808056A EP05808056A EP1799402A4 EP 1799402 A4 EP1799402 A4 EP 1799402A4 EP 05808056 A EP05808056 A EP 05808056A EP 05808056 A EP05808056 A EP 05808056A EP 1799402 A4 EP1799402 A4 EP 1799402A4
Authority
EP
European Patent Office
Prior art keywords
chemical mechanical
mechanical planarization
improved chemical
improved
planarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05808056A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1799402A1 (en
Inventor
Rajeev Bajaj
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP1799402A1 publication Critical patent/EP1799402A1/en
Publication of EP1799402A4 publication Critical patent/EP1799402A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP05808056A 2004-10-06 2005-10-05 METHOD AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION Withdrawn EP1799402A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US61694404P 2004-10-06 2004-10-06
US63925704P 2004-12-27 2004-12-27
PCT/US2005/035979 WO2006042010A1 (en) 2004-10-06 2005-10-05 Method and apparatus for improved chemical mechanical planarization

Publications (2)

Publication Number Publication Date
EP1799402A1 EP1799402A1 (en) 2007-06-27
EP1799402A4 true EP1799402A4 (en) 2009-12-16

Family

ID=36148660

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05808056A Withdrawn EP1799402A4 (en) 2004-10-06 2005-10-05 METHOD AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION

Country Status (5)

Country Link
EP (1) EP1799402A4 (ja)
JP (1) JP5025478B2 (ja)
KR (1) KR101165114B1 (ja)
TW (1) TWI270438B (ja)
WO (1) WO2006042010A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110019442A (ko) * 2008-06-26 2011-02-25 쓰리엠 이노베이티브 프로퍼티즈 캄파니 다공성 요소를 구비한 연마 패드 및 이 연마 패드의 제작 방법 및 이용 방법
TWI415711B (zh) * 2008-07-18 2013-11-21 3M Innovative Properties Co 具有浮動元件之研磨墊，及其製造與使用方法
JP5551479B2 (ja) * 2010-03-19 2014-07-16 ニッタ・ハース株式会社 研磨装置、研磨パッドおよび研磨情報管理システム
US9751189B2 (en) * 2014-07-03 2017-09-05 Applied Materials, Inc. Compliant polishing pad and polishing module
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
JP7010166B2 (ja) * 2018-07-24 2022-01-26 株式会社Sumco ワークの両面研磨装置および両面研磨方法
CN109616412A (zh) * 2018-12-14 2019-04-12 大连理工大学 一种光化学与机械抛光相结合的半导体晶片加工方法
JP7317440B2 (ja) * 2019-04-15 2023-07-31 株式会社ディスコ ドレッシング工具
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치
CN115365922B (zh) * 2022-10-24 2023-02-28 西安奕斯伟材料科技有限公司 研磨轮、研磨设备及硅片
CN116276337B (zh) * 2023-04-23 2023-11-07 南京茂莱光学科技股份有限公司 一种高平整度平面玻璃加工方法及加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9309972D0 (en) * 1993-05-14 1993-06-30 De Beers Ind Diamond Tool insert
US5795218A (en) * 1996-09-30 1998-08-18 Micron Technology, Inc. Polishing pad with elongated microcolumns
JPH10225864A (ja) * 1997-02-17 1998-08-25 Sony Corp 研磨パッドとその製造方法並びにその研磨パッドを用いたウエハの研磨方法
JP2000158327A (ja) 1998-12-02 2000-06-13 Rohm Co Ltd 化学的機械的研磨用研磨布およびそれを用いた化学的機械的研磨装置
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6612916B2 (en) * 2001-01-08 2003-09-02 3M Innovative Properties Company Article suitable for chemical mechanical planarization processes
JP2003103470A (ja) * 2001-09-28 2003-04-08 Dainippon Printing Co Ltd 研磨層に凹部を有する研磨シート
JP4165118B2 (ja) 2002-05-14 2008-10-15 ソニー株式会社 研磨装置、研磨部材厚さ検出方法および研磨部材厚さ検出装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
KR101165114B1 (ko) 2012-07-12
JP2008516452A (ja) 2008-05-15
TWI270438B (en) 2007-01-11
WO2006042010A1 (en) 2006-04-20
JP5025478B2 (ja) 2012-09-12
KR20070057271A (ko) 2007-06-04
TW200626291A (en) 2006-08-01
EP1799402A1 (en) 2007-06-27

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Effective date: 20091116

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