EP1766106A4 - Pulse reverse electrolysis of acidic copper electroplating solutions - Google Patents

Pulse reverse electrolysis of acidic copper electroplating solutions

Info

Publication number
EP1766106A4
EP1766106A4 EP05725574A EP05725574A EP1766106A4 EP 1766106 A4 EP1766106 A4 EP 1766106A4 EP 05725574 A EP05725574 A EP 05725574A EP 05725574 A EP05725574 A EP 05725574A EP 1766106 A4 EP1766106 A4 EP 1766106A4
Authority
EP
European Patent Office
Prior art keywords
copper electroplating
acidic copper
reverse electrolysis
electroplating solutions
pulse reverse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05725574A
Other languages
German (de)
French (fr)
Other versions
EP1766106A2 (en
Inventor
Roderick D Herdman
Trevor Pearson
Ernest Long
Alan Gardner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of EP1766106A2 publication Critical patent/EP1766106A2/en
Publication of EP1766106A4 publication Critical patent/EP1766106A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP05725574A 2004-06-25 2005-03-15 Pulse reverse electrolysis of acidic copper electroplating solutions Withdrawn EP1766106A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/876,795 US20050284766A1 (en) 2004-06-25 2004-06-25 Pulse reverse electrolysis of acidic copper electroplating solutions
PCT/US2005/008502 WO2006011922A2 (en) 2004-06-25 2005-03-15 Pulse reverse electrolysis of acidic copper electroplating solutions

Publications (2)

Publication Number Publication Date
EP1766106A2 EP1766106A2 (en) 2007-03-28
EP1766106A4 true EP1766106A4 (en) 2007-09-05

Family

ID=35504436

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05725574A Withdrawn EP1766106A4 (en) 2004-06-25 2005-03-15 Pulse reverse electrolysis of acidic copper electroplating solutions

Country Status (5)

Country Link
US (2) US20050284766A1 (en)
EP (1) EP1766106A4 (en)
JP (1) JP2008504435A (en)
CN (1) CN101044269A (en)
WO (1) WO2006011922A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7153408B1 (en) * 2006-04-13 2006-12-26 Herdman Roderick D Copper electroplating of printing cylinders
JPWO2008126522A1 (en) * 2007-03-15 2010-07-22 日鉱金属株式会社 Copper electrolyte and two-layer flexible substrate obtained using the same
CN101768765B (en) * 2008-12-29 2013-03-13 财团法人工业技术研究院 Electrolyte and method for manufacturing copper foil by using same
WO2019038666A1 (en) 2017-08-22 2019-02-28 Behboudikhiavi Sepideh Synthesis of lithium manganese dioxide micro/nanostructures
JP2021530611A (en) * 2018-06-15 2021-11-11 トデスカン，アルベルト Electrolytic process for coating stainless steel objects

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3923610A (en) * 1974-08-27 1975-12-02 Intaglio Service Corp Method of copper plating gravure cylinders
DD264030A1 (en) * 1987-08-26 1989-01-18 Leipzig Galvanotechnik ELECTROLYTE FOR THE SEPARATION OF GLOSS-COPPER LAYERS WITH INCREASED MICROHAERTE

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
US74775A (en) * 1868-02-25 Improvement in cultivatoes
US79228A (en) * 1868-06-23 Improvement in hoese eay-foees
US2558090A (en) * 1947-12-11 1951-06-26 Westinghouse Electric Corp Periodic reverse current electroplating apparatus
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
US4101386A (en) * 1971-05-07 1978-07-18 Siemens Aktiengesellschaft Methods of coating and surface finishing articles made of metals and their alloys
US3703621A (en) * 1971-07-21 1972-11-21 Rapid Electric Co Inc Reciprocating frusto-conical plug switch contact and assembly
US3939056A (en) * 1973-10-19 1976-02-17 Sony Corporation Coated plating rack
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4301727A (en) * 1977-10-27 1981-11-24 Bardin Karl D Metal plated plastic base intaglio printing cylinders & plates and method of manufacture
US4176039A (en) * 1979-03-02 1979-11-27 Wismer Joseph C Electroplating rack
US4297197A (en) * 1980-11-13 1981-10-27 International Telephone And Telegraph Corp. Electroplating rack
US4781801A (en) * 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
DE69110208T2 (en) * 1990-08-03 1995-10-19 Rohco Inc Mcgean Copper plating of gravure cylinders.
US5849171A (en) * 1990-10-13 1998-12-15 Atotech Deutschland Gmbh Acid bath for copper plating and process with the use of this combination
DE4211881C2 (en) * 1992-04-09 1994-07-28 Wmv Ag Process for the electrochemical application of a structured surface coating
DE19545231A1 (en) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Process for the electrolytic deposition of metal layers
US6319384B1 (en) * 1998-10-14 2001-11-20 Faraday Technology Marketing Group, Llc Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
US6652727B2 (en) * 1999-10-15 2003-11-25 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
US20020079228A1 (en) * 2000-12-27 2002-06-27 Robert Smith Electroplating of gravure cylinders
US6723219B2 (en) * 2001-08-27 2004-04-20 Micron Technology, Inc. Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith
US20040074775A1 (en) * 2002-10-21 2004-04-22 Herdman Roderick Dennis Pulse reverse electrolysis of acidic copper electroplating solutions
US6904658B2 (en) * 2003-06-02 2005-06-14 Electroformed Stents, Inc. Process for forming a porous drug delivery layer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3923610A (en) * 1974-08-27 1975-12-02 Intaglio Service Corp Method of copper plating gravure cylinders
DD264030A1 (en) * 1987-08-26 1989-01-18 Leipzig Galvanotechnik ELECTROLYTE FOR THE SEPARATION OF GLOSS-COPPER LAYERS WITH INCREASED MICROHAERTE

Also Published As

Publication number Publication date
US20050284766A1 (en) 2005-12-29
WO2006011922A2 (en) 2006-02-02
WO2006011922A3 (en) 2007-02-22
CN101044269A (en) 2007-09-26
JP2008504435A (en) 2008-02-14
EP1766106A2 (en) 2007-03-28
US20090223827A1 (en) 2009-09-10

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Effective date: 20160122