EP1738460A2 - Reseau de composants dielectriques a liaison de securite - Google Patents

Reseau de composants dielectriques a liaison de securite

Info

Publication number
EP1738460A2
EP1738460A2 EP05725382A EP05725382A EP1738460A2 EP 1738460 A2 EP1738460 A2 EP 1738460A2 EP 05725382 A EP05725382 A EP 05725382A EP 05725382 A EP05725382 A EP 05725382A EP 1738460 A2 EP1738460 A2 EP 1738460A2
Authority
EP
European Patent Office
Prior art keywords
filter
dielectric
feedthrough
conductor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05725382A
Other languages
German (de)
English (en)
Other versions
EP1738460A4 (fr
Inventor
Joseph V. Van Hoyweghen, Iii.
Edward G. Sveda, Jr.
Jeffrey D. Chereson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Spectrum Control Inc
Original Assignee
Spectrum Control Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Spectrum Control Inc filed Critical Spectrum Control Inc
Publication of EP1738460A2 publication Critical patent/EP1738460A2/fr
Publication of EP1738460A4 publication Critical patent/EP1738460A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/14—Protection against electric or thermal overload
    • H01G2/16—Protection against electric or thermal overload with fusing elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors

Definitions

  • the present invention relates to electromagnetic filters and methods of providing electromagnetic filters.
  • capacitors fail when a short develops in the capacitor.
  • a discoidal capacitor surrounds a feedthrough conductor and the capacitor shorts, the filtering previously provided by the capacitor is often lost or significantly degraded.
  • a short in the discoidal capacitor may result in an increase in the electric current being provided to the capacitor. The increased current will often result in an increase in temperature, which may result in a fire or damage to surrounding components.
  • the invention includes an electromagnetic filter for a feedthrough conductor.
  • the dielectric components may be capacitors.
  • the first side may be substantially planar.
  • the substrate may have a second side and a feedthrough surface.
  • the feedthrough surface may define an orifice extending from the first side to the second side.
  • a feedthrough conductor may extend through the orifice.
  • a failsafe device may be electrically connected between the feedthrough conductor and a first lead of at least one of the dielectric components.
  • a failsafe device may be electrically connected between a second lead of the dielectric component and a circuit to which the capacitor is electrically linked.
  • the failsafe device may be a fusible link or a dielectric link.
  • the invention also includes a method of providing an electromagnetic filter.
  • a substrate is provided.
  • the substrate may have a substantially planar first side, a second side and a feedthrough surface.
  • the feedthrough surface may define an orifice extending from the first side to the second side.
  • a feedthrough conductor may be provided so that the feedthrough conductor extends through the orifice.
  • a first dielectric component may be supported from the first side and proximate to the feedthrough conductor.
  • a second dielectric component may be supported from the first side and proximate to the feedthrough conductor.
  • a failsafe device may be provided for one or more of the dielectric components.
  • Such a failsafe device may be provided (a) electrically between the feedthrough conductor and a first lead of the dielectric component, and/or (b) electrically between a second lead of the dielectric component and a circuit, such as a noise handling circuit, to which the capacitor is electrically linked.
  • Figure 1 A is a plan view schematic of a device according to the invention
  • Figure IB is a cross-sectional view of the device depicted in Figure 1 A taken along the line IB-IB.
  • Figure IC is a variation of the device depicted in Figure 1 A and Figure IB;
  • Figure ID is a partially cross-sectioned side view of a fusible link according to the invention;
  • Figure IE is a partially cross-sectioned side view of a dielectric link according to the invention;
  • Figure 2 is a plan view schematic of a device according to the invention;
  • Figure 3 is a plan view schematic of a device according to the invention;
  • Figure 4 is a plan view schematic of a device according to the invention; and
  • Figure 5 depicts a method according to the invention.
  • FIG. 1 A and IB depict such a filter.
  • the left-side and right-side positions 5A, 5B are identical, except that the left-side position 5 A includes capacitors and a feedthrough conductor.
  • Feature numbers for the right-side position 5B have been limited for clarity.
  • the filter may include a substrate 7 having a substantially planar first side 10.
  • the substrate 7 may be a protective housing or a printed circuit board.
  • the substrate 7 may have a second side 13 and a feedthrough surface 16.
  • the feedthrough surface 16 may define an orifice 19 extending from the first side 10 to the second side 13.
  • a feedthrough conductor 22 may extend through the orifice 19.
  • FIGS 1A and IB show dielectric components 25 being supported from the first side 10 of the substrate 7.
  • Each dielectric component 25 may partially surround the conductor 22.
  • Each of the dielectric components 25 may be a capacitor positioned to filter a signal carried by the feedthrough conductor 22.
  • the conductor 22 may be positioned to extend through the substrate 7 so that a high potential terminal 23 surrounds the conductor 22.
  • the capacitors 25 may be positioned around the conductor 22, and may be electrically connected so as to filter a signal traveling through the conductor 22.
  • no capacitor 25 or conductor 22 is shown on the right-side position 5B, but it should be understood that capacitors 25 may be associated with either positions 5A, 5B, or both.
  • Figure IB shows a device according to the invention, which has been partially cross- sectioned to show certain features.
  • the capacitors 25 may have plates 28, 31 oriented in a plane that is substantially perpendicular to an axis 34 of the feedthrough conductor 22 and separated by a dielectric material 37.
  • the dielectric material 37 may be barium-titanate, magnesium titanate, alumina, polyester, polyamide or a metal-oxide.
  • the electromagnetic characteristics approach that of a discoidal capacitor. If the discrete dielectric components are chip capacitors supported from the same surface of the substrate 7, a reduction in cost may be realized since chip capacitors tend to be much less expensive than discoidal capacitors.
  • Figure IC is a device according to the invention in which the arrangement shown in Figure IB is made on both sides 10, 13 of the substrate 7.
  • One or more of the dielectric components 25 may be electrically connected to a first conductive contact 40, which may be associated with circuitry on the first side 10.
  • the first conductive contact 40 may be a trace on the substrate 7.
  • the first conductive contact 40 may be electrically connected to one of the plates 28.
  • the first conductive contact 40 may be used to fix the dielectric component 25 relative to the substrate 7, the first conductive contact 40 need not be used for that purpose.
  • Each dielectric component 25 may be packaged in such a way that the dielectric component 25 has a side joined to the substrate 7 by a conductive or non-conductive material.
  • an adhesive may be used to mechanically join the dielectric component 25 to the first side 10 so as to fix the dielectric component 25 to the substrate 7.
  • one or more of the dielectric components 25 may be electrically connected via a second conductive contact 43 to the feedthrough conductor 22.
  • the second conductive contact 43 may be electrically connected to the other of the plates 31 and to the feedthrough conductor 22.
  • the second conductive contact 43 may be connected to the feedthrough conductor 22 at a location that is not within the orifice 19.
  • the first conductive contact 40 may be at a first electric potential and the conductor 22 may be at a second electric potential.
  • a failsafe link 46 may be positioned electrically between the capacitor 25 and a low potential terminal 49.
  • the failsafe link 46 may electrically join the low potential terminal 49 to the first conductive contact 40.
  • the failsafe link 46, the low potential terminal 49 and the first conductive contact 40 may be at substantially the same electric potential.
  • the failsafe link 46 may be positioned so that electric current traveling between the first conductive contact 40 and the low potential terminal 49 also passes through the failsafe link 46.
  • the low potential terminal 49 may be part of, or electrically connected to, a noise handling circuit.
  • the noise handling circuit may be on the substrate 7.
  • the low potential terminal 49 may be electrically associated with a via 52 that extends through the substrate 7.
  • the via 52 may be an electrically conductive pathway that extends from one side of the substrate 7 to the other side of the substrate 7. In this fashion, the low potential terminal 49 may be located on one side of the substrate 7 (for example, the first side 10), while the noise handling circuit may be located on another side of the substrate 7 (for example, the second side 13).
  • Figure ID depicts an example of a failsafe link 46 in the form of a fusible link 46 A.
  • the fusible link 46 A may be formed on the substrate 7 by fixing a conductive precursor 55, such as a copper trace to the substrate 7. A portion of the conductive precursor 55 may then be removed, for example by milling or die cutting, in order form a gap 58 and therefore provide the conductive precursor 55 in two distinct parts with no conductive path between them. Alternatively, the precursor 55 may be formed on the substrate 7 as two distinct parts having the gap 58 between the parts. At this stage of forming the fusible link 46A, electric current will not flow from the first conductive contact 40 to the low potential terminal 49 due to the gap 58.
  • a fusible bridge 61 may be placed so as to electrically connect the two parts of the precursor 55.
  • the fusible bridge 61 may be a material that is known to fuse open at a desired current more readily than the precursor 55.
  • the fusible bridge 61 maybe made from a material having characteristics that cause the bridge 61 to fuse open quicker, or with greater certainty, or both, or (b) the dimensions of the fusible bridge 61 may more tightly controlled than those of the precursor 55, or both (a) and (b).
  • the fusible bridge 61 may be made from a solder, an ultra fine wire, or other resistive material.
  • Figure IE depicts an example of a failsafe link 46 in the form of a dielectric link 46B.
  • the dielectric link 46B may be formed on the substrate 7 by fixing a conductive precursor 55, such as a copper trace to the substrate 7. A portion of the conductive precursor 55 may then be removed, for example by milling or die cutting, in order form a gap 58 and therefore provide the conductive precursor 55 in two distinct parts with no conductive path between them. Alternatively, the precursor 55 may be formed on the substrate 7 as two distinct parts having the gap 58 between the parts. At this stage of forming the dielectric link 46B, electric current will not flow from the first conductive contact 40 to the low potential terminal 49 due to the gap 58.
  • a dielectric bridge 62 may be placed so as to electrically connect the two parts of the precursor 55.
  • the dielectric bridge 62 may be a dielectric component, such as a chip capacitor, which may include a dielectric material 37 similar to that used in the dielectric component 25. Further, the dielectric bridge 62 may be a dielectric paste.
  • Figure 2 depicts an embodiment of the invention in which the substrate 7 is made from a conductive material.
  • the left-side and right-side positions 5 A, 5B are identical in order to better illustrate how the invention might be embodied.
  • the left-side position 5 A has capacitors 25.
  • a conductor (not shown) may be positioned to extend through the conductive substrate 7 so that the high potential terminal 23 surrounds the conductor.
  • the capacitors 25 may be positioned around the conductor, and may be electrically connected so as to conduct a noise current traveling through the conductor to ground.
  • no capacitor 25 is shown on the right-side position 5B, but it should be understood that capacitors 25 may be associated with either positions 5A, 5B, or both.
  • Features similar to those depicted in prior figures have the same feature number in Figure 2.
  • Figure 3 depicts an embodiment of the invention in which the left-side and right-side positions 5 A, 5B are identical in order to better illustrate how the invention might be embodied.
  • the failsafe links 46 are positioned between the second conductive contact 43 and the high potential terminal 23.
  • the right-side position 5B has capacitors 25.
  • a feedthrough conductor (not shown) maybe positioned to extend through the substrate 7 so that the high potential terminal 23 surrounds the conductor.
  • the capacitors 25 would be positioned around the conductor, and may be electrically connected so as to filter a signal traveling through the conductor.
  • no capacitor 25 is shown on the left-side position 5 A, but it should be understood that capacitors 25 may be associated with either positions 5A, 5B, or both.
  • the left-side and right-side positions 5A, 5B are identical in order to better illustrate how the invention might be embodied.
  • the failsafe links 46 are positioned between the second conductive contact 43 and the high potential terminal 23.
  • the right-side position 5B has capacitors 25.
  • a conductor (not shown) may be positioned to extend through the substrate so that the high potential terminal 23 surrounds the conductor.
  • the capacitors 25 would be positioned around the conductor, and may be electrically connected so as to filter a signal traveling through the conductor.
  • no capacitor 25 is shown on the left-side position 5 A, but it should be understood that capacitors 25 may be associated with position 5A, position 5B, or both.
  • FIG. 5 is a flow chart of a method according to the invention.
  • a substrate is provided 100.
  • the substrate may have a substantially planar first side, a second side and a feedthrough surface.
  • the feedthrough surface may define an orifice extending from the first side to the second side, and a feedthrough conductor may be provided 103 to extend through the orifice.
  • a first dielectric component may be supported 106 from the first side and proximate to the feedthrough conductor, and the first dielectric component may be joined to the substrate, for example by soldering at least a portion of the first side to a conductive contact of the dielectric component.
  • a second dielectric component maybe supported 109 from the first side and joined to the substrate in a fashion similar to that used for the first dielectric component.
  • Each of the dielectric components may be electrically connected 112 to the feedthrough conductor, for example by soldering a conductive contact of each dielectric component to the feedthrough conductor.
  • Each of the dielectric components may be associated 115 with a respective failsafe link.
  • the failsafe link may be electrically positioned between the feed through conductor and the dielectric component, or electrically between the dielectric component and a circuit, or both.
  • the failsafe link may be a fusible link or a dielectric link.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Filters And Equalizers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Cette invention concerne un filtre électromagnétique pour conducteur de traversée ainsi qu'un procédé de fabrication d'un tel filtre. Au moins deux composants diélectriques reposent sur un premier côté d'un substrat, tel qu'un boîtier ou une carte de circuits imprimés. Au moins un des composants diélectriques est associé à une liaison de sécurité.
EP05725382A 2004-03-19 2005-03-11 Reseau de composants dielectriques a liaison de securite Withdrawn EP1738460A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55449104P 2004-03-19 2004-03-19
PCT/US2005/008178 WO2005091976A2 (fr) 2004-03-19 2005-03-11 Reseau de composants dielectriques a liaison de securite

Publications (2)

Publication Number Publication Date
EP1738460A2 true EP1738460A2 (fr) 2007-01-03
EP1738460A4 EP1738460A4 (fr) 2009-11-04

Family

ID=35056710

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05725382A Withdrawn EP1738460A4 (fr) 2004-03-19 2005-03-11 Reseau de composants dielectriques a liaison de securite

Country Status (2)

Country Link
EP (1) EP1738460A4 (fr)
WO (1) WO2005091976A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2470999A (en) * 2009-06-02 2010-12-15 Astec Int Ltd A feedthrough Capacitor assembly with a plurality of capacitors

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015103613A1 (fr) * 2014-01-06 2015-07-09 Neocis, Inc. Dispositif d'attelle pour former un marqueur fiable pour un système de guidage de robot chirurgical, et procédé associé

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0865115A1 (fr) * 1997-01-29 1998-09-16 Johnson Chuang Dispositif blindé contre les interférences pour des connecteurs électriques
EP0870517A1 (fr) * 1997-04-10 1998-10-14 Hittman Materials and Medical Components, Inc. Traversée munie de filtres pour appareils médicaux implantables et méthode de fabrication correspondante
US20040012462A1 (en) * 2001-05-29 2004-01-22 Sung-Youl Kim Feed-through filter having improved shielding and mounting functions

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4148003A (en) * 1977-07-08 1979-04-03 Globe-Union Inc. Series feed-through capacitor
US4193106A (en) * 1978-01-24 1980-03-11 Sprague Electric Company Monolithic ceramic capacitor with fuse link
JP3447443B2 (ja) * 1995-10-02 2003-09-16 ローム株式会社 安全ヒューズ付き面実装型固体電解コンデンサの構造
US5861809A (en) * 1997-09-22 1999-01-19 Checkpoint Systems, Inc. Deactivateable resonant circuit
US5959829A (en) * 1998-02-18 1999-09-28 Maxwell Energy Products, Inc. Chip capacitor electromagnetic interference filter
US6456554B1 (en) * 1999-10-19 2002-09-24 Texas Instruments Incorporated Chip identifier and method of fabrication

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0865115A1 (fr) * 1997-01-29 1998-09-16 Johnson Chuang Dispositif blindé contre les interférences pour des connecteurs électriques
EP0870517A1 (fr) * 1997-04-10 1998-10-14 Hittman Materials and Medical Components, Inc. Traversée munie de filtres pour appareils médicaux implantables et méthode de fabrication correspondante
US20040012462A1 (en) * 2001-05-29 2004-01-22 Sung-Youl Kim Feed-through filter having improved shielding and mounting functions

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005091976A2 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2470999A (en) * 2009-06-02 2010-12-15 Astec Int Ltd A feedthrough Capacitor assembly with a plurality of capacitors
US8154846B2 (en) 2009-06-02 2012-04-10 Astec International Limited Feedthrough capacitor assemblies
GB2470999B (en) * 2009-06-02 2014-02-12 Astec Int Ltd Feedthrough capacitor assemblies

Also Published As

Publication number Publication date
EP1738460A4 (fr) 2009-11-04
WO2005091976A2 (fr) 2005-10-06
WO2005091976A3 (fr) 2006-11-30

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