EP1711803A1 - Detecteur et procede de production correspondant - Google Patents
Detecteur et procede de production correspondantInfo
- Publication number
- EP1711803A1 EP1711803A1 EP05707905A EP05707905A EP1711803A1 EP 1711803 A1 EP1711803 A1 EP 1711803A1 EP 05707905 A EP05707905 A EP 05707905A EP 05707905 A EP05707905 A EP 05707905A EP 1711803 A1 EP1711803 A1 EP 1711803A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- silicon
- sensor
- containing components
- silanization
- fet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 7
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 20
- 239000010703 silicon Substances 0.000 claims abstract description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000011896 sensitive detection Methods 0.000 claims abstract 2
- 238000002444 silanisation Methods 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 9
- 230000001133 acceleration Effects 0.000 claims description 3
- 230000005669 field effect Effects 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- PYJJCSYBSYXGQQ-UHFFFAOYSA-N trichloro(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](Cl)(Cl)Cl PYJJCSYBSYXGQQ-UHFFFAOYSA-N 0.000 claims description 2
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims description 2
- 239000005052 trichlorosilane Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 239000012491 analyte Substances 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 10
- 238000007667 floating Methods 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000003570 air Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
- G01N27/4141—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS specially adapted for gases
- G01N27/4143—Air gap between gate and channel, i.e. suspended gate [SG] FETs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
- G01N33/0036—General constructional details of gas analysers, e.g. portable test equipment concerning the detector specially adapted to detect a particular component
- G01N33/005—H2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a sensor, for example gas sensor, acceleration sensor or pressure sensor with silicon-containing components, by means of which electrical signals can be read out in the presence of analyte or in the event of mechanical deformation, and a manufacturing method.
- the moisture contained in the air forms a thin film of water on the surface of silicon-containing material, which leads to increased surface conductivity.
- the leakage currents caused by this increase represent a problem with regard to stability and signal behavior for many sensors that are in contact with air.
- the invention has for its object to provide a sensor with a semiconductor body, the sensitivity to moisture or whose leakage currents is / are significantly reduced. A manufacturing process must also be specified.
- the invention is based on the knowledge that the method of silanization known from glass coating also can be transferred to semiconductor technology. This creates a monolayer of the common, hydrophobic molecular chains on the silicon-containing surface, which prevent the adsorption of water molecules. All hydrophobic molecular chains that form a stable connection with the surface are suitable for this. Thus, up to high air humidity, almost 100%, no closed water film can arise, which favors the undesirable surface conductivity.
- silicon-containing components can be operated unheated and unencapsulated in ambient air without any disturbing influences from surface currents induced by moisture.
- the semiconductor body used as the basis in this silicon technology is silanized. Both pure silicon and superficial silicon compounds can be treated.
- silicon-based semiconductor sensors which are insensitive to moisture are, for example, gas sensors, pressure sensors or generally all sensors which come into contact with essentially atmospheric moisture during operation. Therefore, analytes such as target gases are detected in gas sensors and mechanical shape changes in pressure or acceleration sensors.
- FIG. 1 shows a comparison between a silanized hydrogen sensor and one without a hydrophobic cover layer
- FIG. 2 shows a representation with different moisture values and additional gases
- Figure 3 shows the prior art in the form of a floating gate FET.
- FGFET floating gate field effect transistor
- Other types of FETs can also be used, such as suspended gate FETs.
- 3 shows the schematic structure of the FGFET used.
- the potential change at the sensitive layer, caused by the application of gas, is conducted to the MOSFET via the voltage control spanned by the floating gate and capacitive well (electrode) and leads there to a
- the strong drift and "deformation" of the hydrogen signals is effectively prevented by the silanization.
- the remaining small moisture levels in the silanized signal are caused by the dipole signal of the water on the sensitive platinum layer and are no longer a problem.
- the above FGFET with surfaces without a hybrid gate was both silanized and unsilanized.
- the sensitivity of the floating gate was used.
- the guard ring was controlled with a rectangular generator and the moisture-dependent coupling to the transistors was measured.
- the frequency was chosen to be very low (0.1 Hz) in order to exclude frequency-dependent effects in the RC elements.
- the representation corresponding to FIG. 2 contains a comparison of these measurements with different humidities and additional gases.
- the current in the transistors is kept constant via feedback electronics. The resulting signals originate from the feedback control loop and thus reflect the potential present at the floating gate.
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004005927 | 2004-02-06 | ||
DE102004035551A DE102004035551A1 (de) | 2004-02-06 | 2004-07-22 | Sensor und Verfahren zu dessen Herstellung |
PCT/EP2005/050418 WO2005075969A1 (fr) | 2004-02-06 | 2005-02-01 | Detecteur et procede de production correspondant |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1711803A1 true EP1711803A1 (fr) | 2006-10-18 |
Family
ID=34839585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05707905A Withdrawn EP1711803A1 (fr) | 2004-02-06 | 2005-02-01 | Detecteur et procede de production correspondant |
Country Status (3)
Country | Link |
---|---|
US (1) | US7719004B2 (fr) |
EP (1) | EP1711803A1 (fr) |
WO (1) | WO2005075969A1 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005046944A1 (de) * | 2005-09-30 | 2007-04-05 | Micronas Gmbh | Gassensitiver Feldeffekttransistor zur Detektion von Chlor |
EP2006668B1 (fr) | 2007-06-22 | 2014-05-07 | Micronas GmbH | Capteur de gaz |
US8878257B2 (en) * | 2010-06-04 | 2014-11-04 | Freescale Semiconductor, Inc. | Methods and apparatus for an ISFET |
GB2540904B (en) | 2010-10-08 | 2017-05-24 | Dnae Group Holdings Ltd | Electrostatic discharge protection |
US20170089941A1 (en) * | 2014-04-08 | 2017-03-30 | Panasonic Intellectual Property Management Co., Ltd. | Sensor |
DE102014226816A1 (de) | 2014-12-22 | 2016-06-23 | Robert Bosch Gmbh | Halbleiterbasierte Gassensoranordnung zum Detektieren eines Gases und entsprechendes Herstellungsverfahren |
DE102017215310A1 (de) * | 2017-09-01 | 2019-03-07 | Robert Bosch Gmbh | Gassensorvorrichtung und Verfahren zum Herstellen einer Gassensorvorrichtung |
JP2022048545A (ja) * | 2020-09-15 | 2022-03-28 | セイコーエプソン株式会社 | 物理量センサー、慣性計測ユニット及び物理量センサーの製造方法 |
CN113447534B (zh) * | 2021-07-06 | 2023-01-06 | 重庆大学 | 一种氨气传感器及其制备方法 |
TWI808541B (zh) * | 2021-11-22 | 2023-07-11 | 財團法人工業技術研究院 | 晶片封裝結構的透氣封裝蓋及其製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4020830A (en) * | 1975-03-12 | 1977-05-03 | The University Of Utah | Selective chemical sensitive FET transducers |
JPS5825221B2 (ja) | 1977-12-12 | 1983-05-26 | 株式会社クラレ | Fet比較電極 |
JPS56100350A (en) | 1980-01-11 | 1981-08-12 | Kuraray Co Ltd | Fet comparison electrode |
NL8400916A (nl) | 1984-03-22 | 1985-10-16 | Stichting Ct Voor Micro Elektr | Werkwijze voor het vervaardigen van een isfet en een aldus vervaardigde isfet. |
JPS63171355A (ja) * | 1987-01-09 | 1988-07-15 | Seitai Kinou Riyou Kagakuhin Shinseizou Gijutsu Kenkyu Kumiai | 半導体化学センサ |
US5182005A (en) * | 1990-06-01 | 1993-01-26 | Basf Aktiengesellschaft | Reference electrode for chemical sensors |
DE4017905A1 (de) * | 1990-06-02 | 1991-12-05 | Basf Ag | Referenzelektrode fuer chemische sensoren |
JP3384900B2 (ja) * | 1995-01-09 | 2003-03-10 | 長野計器株式会社 | 圧力センサ |
DE19621997C1 (de) * | 1996-05-31 | 1997-07-31 | Siemens Ag | Elektrochemischer Sensor |
DE19814855C1 (de) * | 1998-04-02 | 1999-11-04 | Siemens Ag | Gassensor nach dem Prinzip der Messung der Austrittsarbeit bzw. des Kontaktpotentiales |
DE10163567A1 (de) * | 2001-12-21 | 2003-07-17 | Endress & Hauser Gmbh & Co Kg | Drucksensor mit hydrophober Beschichtung |
DE10246283B3 (de) * | 2002-10-02 | 2004-03-25 | Infineon Technologies Ag | Verfahren zur Herstellung von Kanälen und Kavitäten in Halbleitergehäusen und elektronisches Bauteil mit derartigen Kanälen und Kavitäten |
DE10335163B3 (de) * | 2003-07-30 | 2005-03-03 | Micronas Gmbh | Gassensor |
-
2005
- 2005-02-01 EP EP05707905A patent/EP1711803A1/fr not_active Withdrawn
- 2005-02-01 US US10/588,559 patent/US7719004B2/en not_active Expired - Fee Related
- 2005-02-01 WO PCT/EP2005/050418 patent/WO2005075969A1/fr active Application Filing
Non-Patent Citations (1)
Title |
---|
See references of WO2005075969A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20070262358A1 (en) | 2007-11-15 |
US7719004B2 (en) | 2010-05-18 |
WO2005075969A1 (fr) | 2005-08-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20060828 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): CH DE FR GB IT LI NL |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: BURGMAIR, MARKUS Inventor name: EISELE, IGNAZ Inventor name: KNITTEL, THORSTEN |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): CH DE FR GB IT LI NL |
|
17Q | First examination report despatched |
Effective date: 20080925 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20110901 |