EP1699107B1 - 3 dB coupler - Google Patents
3 dB coupler Download PDFInfo
- Publication number
- EP1699107B1 EP1699107B1 EP05004860.2A EP05004860A EP1699107B1 EP 1699107 B1 EP1699107 B1 EP 1699107B1 EP 05004860 A EP05004860 A EP 05004860A EP 1699107 B1 EP1699107 B1 EP 1699107B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- conductor
- coupler
- inductance
- coupler according
- coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 claims description 76
- 238000010168 coupling process Methods 0.000 claims description 42
- 230000008878 coupling Effects 0.000 claims description 41
- 238000005859 coupling reaction Methods 0.000 claims description 41
- 125000006850 spacer group Chemical group 0.000 claims description 16
- 230000001965 increasing effect Effects 0.000 claims description 15
- 238000004804 winding Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims 1
- 229910000859 α-Fe Inorganic materials 0.000 description 25
- 230000001939 inductive effect Effects 0.000 description 8
- 230000005291 magnetic effect Effects 0.000 description 8
- 230000005284 excitation Effects 0.000 description 6
- 239000012212 insulator Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000012876 carrier material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 230000005350 ferromagnetic resonance Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
Definitions
- the invention relates to a 3dB coupler having at least a first and a second electrical conductor which are spaced apart and which are capacitively and inductively coupled together, wherein the first conductor represents the primary side and the second conductor represents the secondary side of a transformer.
- high-frequency amplifiers with the usual industrial frequencies of 13.56 MHz and 27.12 MHz and output powers of 1 kW to 50 kW are known.
- the use of high frequency amplifiers of higher power and higher frequencies is desired, but can be difficult to realize for various reasons.
- Such load impedance changes occur, for example, when igniting the laser excitation or plasma processes or when arcing in the plasma process.
- high-frequency-driven laser excitations and, to an increasing extent, high-frequency excitations Plasma processes are operated pulsed, so the high-frequency amplifier with pulse frequencies of, for example, 100Hz to 300kHz on and off or be switched between two power ranges. With each switching process then arise short-term reflections, which are for the most part in the amplifiers in loss energy, ie heat development, implemented.
- Tubes are more robust to reflections and can dissipate the energy dissipation better than transistors, but are more expensive and subject to operational wear. Besides, they are relatively big. Together with control circuit and cooling, tube high-frequency amplifiers are offered in control cabinets in sizes of approx. 0.8m x 1m x 2m.
- a combiner commonly used in microwave technology or radio transmitter technology is the so-called 90 ° hybrid, which is also referred to as a 3dB coupler.
- the 3dB coupler is a four-port.
- a high-frequency power amplifier with the same internal resistance, the same output frequency and a 90 ° phase-shifted output signal is connected to two ports.
- a load with a load resistor is connected.
- a load balancing resistor is connected.
- Load resistance, load balancing resistance and internal resistance of the amplifiers are the same.
- the exclusively passive components of the 90 ° hybrid lines, capacitors, transformers or inductors) are designed so that the power of the two amplifiers is combined at the load, that no power is delivered at the load balancing resistor and that the two amplifiers are decoupled and mutually exclusive can not influence.
- the 90 ° hybrid itself is ideally lossless, that is, the power of the two high-frequency amplifiers is fully supplied to the load applied to the third port.
- the 3dB couplers known from microwave technology are constructed as Leltungskoppler with line lengths of ⁇ / 4. This line coupling technique is very unfavorable for 13 and 27 MHz, because the size would be a few meters with ⁇ / 4 lengths, which would mean a step backwards in view of the desired reduction of the generators.
- a 3dB coupler may be constructed of discrete components, with the 3dB coupler typically having at least one Capacitive coupling capacitance and a transformer with a coupling inductance for inductive magnetic coupling has.
- the coupling capacity by means of two spaced electrical conductors with a defined surface and a defined distance from each other can be realized easily, inexpensively and very precisely reproducible. In most cases, however, the required inductance is not achieved by means of two such conductors. It must therefore be increased appropriately.
- One possibility is to increase the inductance exclusively with inductance-increasing elements, eg ferrites. To come to the necessary inductance at high powers are Inductor elements with large dimensions and high costs necessary.
- the EP 0 456 212 A2 discloses a common mode choke for filtering common mode signals.
- common mode choke In the known common mode choke a purely inductive coupling is sought.
- the US 2004/0207482 A1 further discloses a microwave coupler.
- the coupling takes place for microwave signals with a frequency of more than 1 GHz.
- the US 2003/0218516 A1 shows a directional coupler, in which a part of a power to be determined is coupled out for measurement purposes. A capacitive coupling should be avoided.
- the known battery charging system is operated at a frequency of 75 kHz.
- the EP 0 964 525 A1 discloses an analog-to-digital converter with a coupler acting as an adder.
- the coupling in the coupler is made by inductive coupling with two magnetic cores.
- the Lelstungsdetektor is operated at frequencies of 800 MHz to 1 GHz.
- the object of the present invention is to further form a 3dB coupler in such a way that a good capacitive and inductive coupling of the primary and the secondary side of the transformer can be realized with a small overall size.
- the first and the second conductor each have a number of turns n> 1.
- the inductance can be increased in a simple manner.
- the inductance increases with the number of turns squared, with a doubling of the number of turns, the inductance therefore increases by a factor of four.
- the size of an inductance-increasing element can therefore be reduced by a factor of 4 when the number of turns is doubled.
- the size can be reduced by using more than one turn.
- At a sufficiently high number of turns can ideally be dispensed with further inductance-increasing measures.
- the phase offset between the input signal at one input port and a first output signal of a first output port should be + 45 ° and between the input signal and a second output signal of a second output port should be -45 °.
- a phase offset of e.g. + 40 ° at one exit gate compared to the entrance gate and -50 ° at the other exit gate For shorter conductor lengths deviations from the ideal phase are smaller.
- the inventive 3dB coupler can be used to couple RF power at a frequency in the range 1-80 MHz, in particular at about 1 MHz; about 2 MHz; 13.56 MHz; 27.12 MHz or about 60 MHz and be used at powers greater than 1kW. In this area, the use of 3dB couplers was previously unknown.
- the dimensions of the 3dB coupler for frequencies below 100 MHz can be significantly reduced. They can be smaller than ⁇ / 4, in particular smaller than ⁇ / 8 and preferably even smaller than ⁇ / 10. With these quantities, the influences of the line theory of high-frequency technology have no meaning.
- the 3dB coupler according to this invention is not a line coupler, as known from the prior art for higher frequencies, ie the character of the 3dB coupler is not (exclusively) by the Cable length determined. Rather, the coupling between the electrical conductors corresponds to a capacitive coupling with a fixed predetermined and set capacitance between the conductors at a given fundamental frequency f and predetermined characteristic impedance Z 0 .
- the capacity can be adjusted by the area and the distance of the conductors. Furthermore, the coupling of an inductive coupling with a fixed predetermined and set inductance of the transformer at a given fundamental frequency f and predetermined wave resistance Z 0 corresponds.
- the inductance is set, for example, depending on the length of the conductors, in particular the conductor sections.
- at least one inductance-increasing element is provided in the coupling region for increasing the inductance of the conductor. The values for the inductance and the capacitance are calculated from the formulas given above as a function of frequency and characteristic impedance.
- the inductance-increasing element may have any shape. Preferably, it surrounds the conductors in the coupling region at least partially. It can e.g. lying parallel to them. This allows a particularly simple and effective coupling can be achieved.
- the Indukttechnikserhöhüngselement the conductors in the coupling region is annularly surrounded.
- annular is meant that the conductor sections are surrounded in the coupling region by a largely closed geometery, they may be circular, ellipsoidal, rectangular or otherwise shaped. The advantage of an annular geometry is the reduction of stray fields.
- the heat that arises in the inductance-increasing element particularly good to a heat sink, especially a flat cooling plate, be dissipated.
- the inductance-increasing element may have a heat sink or be in heat exchange connection with such or may itself be embodied as a heat sink.
- the rectangular shape of the inductance-increasing element may be composed of several parts, for example, four cuboids or two U-shaped parts or a U-shaped part and a cuboid. In the assembled from several parts designs a simplified production is possible, also can be provided to adjust the inductance adjustable gaps between the parts.
- the at least one inductance-increasing element is formed of ferritic material.
- one or more conductors may be provided at least in sections, advantageously in the coupling region encompassing ferrite rings.
- ferrite rings with relatively high or low magnetic losses can be used. While ferrite rings with still relatively high magnetic losses can be used at comparatively low powers, ferrite material with extremely low magnetic losses must be used for high powers. With the same size ferrite body with low magnetic losses usually also lower A L values, which is why to achieve the same inductance correspondingly more ferrite must be used.
- ferrite rings with a high A L value of, for example, 200 nH can be used at comparatively low powers, and thus only a few ferrite rings are required to achieve the necessary inductance of, for example, 600 nH, for high powers (eg 5 kW) with correspondingly large currents
- Ferrite rings with a lower A L value can be used in the conductors because otherwise correspondingly high ferromagnetic losses occur in the ferrite cores.
- the magnetic or even gyromagnetic losses in the ferrite core increase depending on the material at certain frequencies up to a magnetic resonance frequency. If this ferromagnetic resonance frequency is too low and too close to the operating frequency, the losses heat the ferrite.
- This number of turns represents a good compromise, in particular when using an inductance-increasing element at the same time.
- the design effort for the 3dB coupler is limited.
- the inductance and the capacitance can be reproduced well and ohmic losses can be kept low. Stray sufferers have no great influence.
- reproducibility is better when fewer ferrites are used, as the 10-20% tolerances used to make ferrites are less significant.
- the inductive transformer of the 3dB coupler To make the inductive transformer of the 3dB coupler, a close inductive coupling is necessary, ie at least sections of the primary and the secondary line must be as close to each other as possible.
- conductor sections of the primary and the secondary side may overlap or mesh with each other.
- the extend Conductor or sections thereof advantageously at least in sections, preferably in the coupling region, parallel to each other.
- At least one spacer in particular an insulator, can be provided, which holds portions of the at least one first and the at least one second conductor at a predetermined distance. It is particularly preferred if the conductors extend at least in sections, preferably in the coupling region, in parallel planes.
- areal spacers or insulators may be provided between adjacent conductor sections.
- the insulators are preferably made of an insulating material with an ⁇ r in the range 2 - 2.6, preferably from about 2.33, and a thickness of about 0.5mm to 3mm provided.
- the insulators may extend throughout the coupling region.
- PTFE polytetrafluoroethylene
- Teflon polytetrafluoroethylene
- a low loss factor tan ⁇ of the insulating material is advantageous.
- tan ⁇ should be less than 0.005 to minimize losses in the insulating material.
- RT / duorit 5870 from ROGERS Corp. has been found to be particularly suitable in the first experiments. exhibited a tan ⁇ of 0.0005 - 0.0012 and an ⁇ r of 2.3.
- a space-saving arrangement which at the same time allows easy to reproduce capacities, results when the conductors are formed at least in the coupling region as a flat conductor tracks.
- the at least one spacer is formed flat and a conductor portion of the first conductor on the one and a conductor portion of the second conductor mounted on the opposite side of the spacer, in particular the spacer with a conductor portion of the first and second Printed conductor, coated or laminated.
- the spacer serves as a carrier material for the conductors or conductor tracks and may be formed as a printed circuit board.
- first and second conductors can thereby be arranged in the coupling region in a conductor stack, wherein adjacent conductor segments are spaced apart, in particular, by an insulator.
- a plurality of spacers, in particular printed circuit boards, provided on both sides with conductor sections are stacked, wherein the conductor sections of opposing rare adjacent spacers are essentially congruent.
- the conductor tracks with a dielectric as a carrier layer can be easily realized by means of a board design and circuit board production.
- a first circuit board which has a recess which is surrounded by a respective conductor track on the top and bottom of the circuit board.
- At least two essentially T-shaped printed circuit boards are provided, each of which has a conductor track on the upper and lower sides, the printed conductors being connected to two separate windings.
- the recess can receive a ring-shaped ferrite, for example, where the tees can be inserted into the breakthrough of the ferrite.
- the operating frequency is not limited to the industry frequency of 13.56 MHz, but may be in the range 1 to 100MHz. the big advantage This arrangement is, however, that the principle is applicable to even much lower frequencies.
- the track sections do not work as a line coupler, but as coupling capacitances and coupling inductances. If the printed conductors or printed conductor sections were to work as line couplers, at least one line length of ⁇ ⁇ 4 would have to be used. However, such line lengths are longer, the lower the frequency. This would mean ever larger designs for line couplers. According to the concept of the invention, however, the design does not have to be lengthened with the reduction of the frequency, only the kapetity and inductance values, for example by influencing the number of turns, have to be adapted.
- FIGS. 1a, 1b show the top 1a and bottom 1b of a first circuit board 1.
- Die FIGS. 2a, 2b show the top 2a and bottom 2b of a second circuit board 2.
- Die FIGS. 3a, 3b show the top 3a and bottom 3b of a third circuit board 3.
- an inventive 3 dB coupler 100 can be formed, as shown in the Fig. 4 is shown.
- the terminals 11, 16, 21, 26 of the printed circuit board 1 are the inputs and outputs (gates) of the 3dB coupler.
- the terminals 12 and 12a are congruent when the printed circuit boards 1 and 2 are placed on each other, and are electrically connected to each other in composite 3dB coupler. Same glit for the terminals 13, 13a; 14, 14a; 15, 15a; 22, 22a; 23, 23a; 24, 24a and 25, 25a.
- the 3dB coupler has a transformer, wherein the inductance of the primary side (vertically shaded areas) has two turns that run through the inductance-increasing element 4 designed as ferrite. The course of the two turns is indicated by reference numerals and arrows in the Figures 1a - 3b explained.
- the first inductance runs from 11 to 12, further to 12a, further to 13, further to 13a, further to 14, further to 14a, further to 15, further to 15a and finally to the terminal 16.
- the inductance of the secondary side (diagonally hatched areas) also continues in two turns through the inductance-increasing element 4, namely from terminal 21 to 22, further to 22a, continuing to 23 after 23a continue to 24 continue to 24a continue to 25 continue to 25a and finally to connection 26.
- the trained 3dB coupler 100 ( Fig. 4 )
- the capacitance is so substantially only between the conductive surfaces of the top 1a, 2a, 3a and bottom 1b, 2b, 3b each of a printed circuit board 1, 2nd , 3 trained.
- the upper side 1a of the printed circuit board 1 and the lower side 2b of the printed circuit board 2 have printed conductors 27a, 28b of the same inductance, and the upper side 2a of the printed circuit board 2 and the lower side 3b of the printed circuit board 3 have printed conductors 28a, 29b of the other inductor.
- the circuit boards 1, 2, 3 Since a voltage is formed across the inductance, the circuit boards 1, 2, 3 must be spaced apart from each other, in particular by spacers, for example by Isoller plates or films, be isolated from each other separated. The whole arrangement of three circuit boards 1, 2, 3 can also be integrated into a multi-layered (in this case six-layered) multilayer board, which allows a more precise and cost-optimized production.
- the inductance-increasing elements 4 must then be inserted in the form of two half-shells.
- a discrete capacitor can be connected in parallel or the area can be increased on both sides, eg on the PCB 1
- the arrangement of the printed circuit boards 1, 2, 3 to the 3dB coupler 100 is shown. You can see the terminals 16, 26. Above the circuit board 1, the circuit boards 2, 3 are arranged, wherein the T-shaped circuit boards 2, 3 are inserted into the free space 4a of the formed as a ferrite Induktterrorismserhöhungselements 4. This means that the coupling region 101 is surrounded by the inductance-increasing element 4.
- the printed circuit boards 1, 2, 3 have printed conductors 27a, 27b, 28a, 28b, 29a, 29b on their upper side 1a, 2a, 3a and lower side 1b, 2b, 3b.
- the conductor tracks 27a, 27b, 28a, 28b, 29a, 29b on different sides of a printed circuit board 1, 2, 3 are spaced apart by the carrier material of the printed circuit board 1, 2, 3.
- the carrier material is an insulator and serves as a spacer.
- the opposing trace portions of adjacent circuit boards 1,2,3 are spaced by spacers.
- the inductance-increasing element 4 is placed on a heat sink 103, which in turn sits on a support plate 104. Between the heat sink 103 and the element 4, a heat conduction-improving layer 105 is arranged.
- the conductors 110, 111 designed as strip conductors are shaped as spirals.
- the spirals made of conductive material are applied to both sides of a circuit board, laminated example beispielse. It is largely congruent a conductor 110 mounted on the top and a conductor 111 on the underside of the circuit board.
- terminals 112-115 are desired as vias, they must be made offset, as in the Fig. 5 implied is. However, it is also conceivable to form the connections 112-115 respectively on the top and bottom side and to arrange the 3dB coupler, for example, between two amplifiers.
- an inductance-enhancing element e.g. a ferrite e.g. conceivable as a disk, pin or pot core.
- a recess e.g. a bore for a ferrite can be provided.
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
Die Erfindung betrifft einen 3dB-Koppler mit mindestens einem ersten und einem zweiten elektrischen Leiter, die voneinander beabstandet sind und die kapazitiv und Induktiv miteinander gekoppelt sind, wobei der erste Leiter die Primärseite und der zweite Leiter die Sekundärseite eines Übertragers darstellt.The invention relates to a 3dB coupler having at least a first and a second electrical conductor which are spaced apart and which are capacitively and inductively coupled together, wherein the first conductor represents the primary side and the second conductor represents the secondary side of a transformer.
Im Bereich der Laseranregungs- oder Plasmaprozesse sind Hochfrequenzverstärker mit den üblichen Industriefrequenzen 13,56MHz und 27,12MHz und Ausgangsleistungen von 1kW bis 50kW bekannt. Die Verwendung von Hochfrequenzverstärkern größerer Leistung und höherer Frequenzen wird angestrebt, lässt sich aber aus unterschiedlichen Gründen nur schwer realisieren.In the field of laser excitation or plasma processes, high-frequency amplifiers with the usual industrial frequencies of 13.56 MHz and 27.12 MHz and output powers of 1 kW to 50 kW are known. The use of high frequency amplifiers of higher power and higher frequencies is desired, but can be difficult to realize for various reasons.
Ein Grund ist die Nichtlinearität und die dynamische, oftmals unvorhersehbare Änderung der Lastimpedanzen von Laseranregungs- oder Plasmaprozessen. Diese dynamischen Änderungen der Impedanz erzeugen Reflektionen, die im Verstärker zu Verlusten führen. Hohe Blindenergien, die in den Blindelementen von den Verstärkern, In den Zuleitungen und in Blindelementen von Anpassungsnetzwerken gespeichert sind, können sich dabei entladen und zu hohen Spannungen oder Strömen aufbauen und den Verstärker zu Oszillationen anregen oder Bauteile zerstören.One reason is the nonlinearity and dynamic, often unpredictable, change in the load impedances of laser excitation or plasma processes. These dynamic changes in impedance create reflections that cause losses in the amplifier. High reactive energies, which are stored in the dummy elements of the amplifiers, in the leads and in dummy elements of matching networks, can thereby discharge and build up to high voltages or currents and excite the amplifier to oscillate or destroy components.
Solche Lastimpedanzänderungen treten beispielsweise beim Zünden der Laseranregungs- oder Plasmaprozesse oder beim Arcen im Plasmaprozess auf. Zusätzlich muss berücksichtigt werden, dass hochfrequenzbetriebene Laseranregungen und im zunehmenden Maße auch hochfrequenzangeregte Plasmaprozesse gepulst betrieben werden, also die Hochfrequenzverstärker mit Pulsfrequenzen von beispielsweise 100Hz bis 300kHz ein- und ausgeschaltet werden oder zwischen zwei Leistungsbereichen geschaltet werden. Bei jedem Schaltvorgang entstehen dann kurzzeitige Reflektionen, die zum größten Teil in den Verstärkern in Verlustenergie, also Wärmeentwicklung, umgesetzt werden.Such load impedance changes occur, for example, when igniting the laser excitation or plasma processes or when arcing in the plasma process. In addition, it must be taken into account that high-frequency-driven laser excitations and, to an increasing extent, high-frequency excitations Plasma processes are operated pulsed, so the high-frequency amplifier with pulse frequencies of, for example, 100Hz to 300kHz on and off or be switched between two power ranges. With each switching process then arise short-term reflections, which are for the most part in the amplifiers in loss energy, ie heat development, implemented.
Ausgangsstufen solcher Hochfrequenzverstärker werden für kleine Leistungen (1-6kW) bereits mit Transistoren realisiert, für größere Leistungen werden üblicherweise Röhren eingesetzt. Röhren sind robuster gegenüber Reflektionen und können die Verlustenergie besser abführen als Transistoren, sie sind aber teurer und unterliegen einem betriebsbedingten Verschleiß. Außerdem sind sie relativ groß. Zusammen mit Ansteuerschaltung und Kühlung werden Röhren-Hochfrequenzverstärker in Schaltschränken in Baugrößen von ca. 0,8m x 1m x 2m angeboten.Output stages of such high-frequency amplifiers are already realized with transistors for small powers (1-6kW), tubes are usually used for larger powers. Tubes are more robust to reflections and can dissipate the energy dissipation better than transistors, but are more expensive and subject to operational wear. Besides, they are relatively big. Together with control circuit and cooling, tube high-frequency amplifiers are offered in control cabinets in sizes of approx. 0.8m x 1m x 2m.
Daher wird zunehmend versucht auch Hochfrequenzverstärker größerer Leistung mit Transistorausgangsstufen auszurüsten. Mit dem Einsatz von transistorisierten Verstärkern hat der Einsatz von geschalteten Verstärkern, die im Resonanzbetrieb arbeiten, stark zugenommen. Dabei werden die Transistoren so geschaltet, dass nur eine sehr geringe Verlustenergie produziert wird. Damit lassen sich Verstärker mit sehr geringen Abmessungen und vergleichsweise hoher Leistung aufbauen. 13,56MHz 3kW Verstärker mit Baugrößen von ca. 0,3m x 0,2m x 0,2m sind realisierbar. Solche Verstärker können auf Grund Ihrer Baugröße besser in Plasmaanlagen oder Laseranregungsanordnungen integriert werden.Therefore, it is increasingly trying to equip high-frequency amplifier of greater power with transistor output stages. The use of transistorized amplifiers has greatly increased the use of switched amplifiers operating in resonant mode. The transistors are switched so that only a very low energy loss is produced. This makes it possible to build amplifiers with very small dimensions and comparatively high power. 13.56MHz 3kW amplifiers with sizes of approx. 0.3m x 0.2m x 0.2m can be realized. Such amplifiers can be better integrated into plasma systems or laser excitation arrangements due to their size.
Große Leistung mit transistorisierten Ausgangsstufen lässt sich mit der Zusammenschaltung mehrerer synchron laufender Hochfrequenzverstärker erzielen. Die Zusammenschaltung erfolgt durch sogenannte Combiner. Es gibt unterschiedliche Bauarten solcher Combiner.Great performance with transistorized output stages can be achieved with the interconnection of several synchronously running high-frequency amplifiers. The interconnection is done by so-called combiners. There are different types of such combiners.
Ein in der Mikrowellentechnik oder Radiosendertechnik häufig verwendeter Combiner ist der sogenannte 90° Hybrid, der auch als 3dB-Koppler biszeichnet wird. Bei dem 3dB Koppler handelt es sich um ein Viertor.A combiner commonly used in microwave technology or radio transmitter technology is the so-called 90 ° hybrid, which is also referred to as a 3dB coupler. The 3dB coupler is a four-port.
Bei der Verwendung des 3dB Kopplers als Combiner werden an zwei Tore jeweils ein Hochfrequenz-Leistungsverstärker mit jeweils gleichem Innenwiderstand, gleicher Ausgangsfrequenz und einem um 90° phasenverschobenen Ausgangssignal angeschlossen. An einem dritten Tor wird eine Last mit einem Lastwiderstand angeschlossen. An dem vierten Tor wird ein Lastausgleichswiderstand angeschlossen. Lastwiderstand, Lastausgleichswiderstand und Innenwiderstände der Verstärker sind gleich. Die ausschließlich passiven Bauelemente des 90° Hybriden (Leitungen, Kapazitäten, Übertrager oder Induktivitäten) werden so ausgelegt, dass an der Last die Leistung der beiden Verstärker zusammengeführt wird, dass am Lastausgleichswiderstand keine Leistung abgegeben wird und dass die beiden Verstärker entkoppelt sind und sich gegenseitig nicht beeinflussen können. Der 90° Hybrid ist selbst idealerweise verlustfrei, das heißt, die Leistung der beiden Hochfrequenzverstärker wird vollständig der am dritten Tor anliegenden Last zugeführt.When using the 3dB coupler as a combiner, a high-frequency power amplifier with the same internal resistance, the same output frequency and a 90 ° phase-shifted output signal is connected to two ports. At a third gate, a load with a load resistor is connected. At the fourth gate a load balancing resistor is connected. Load resistance, load balancing resistance and internal resistance of the amplifiers are the same. The exclusively passive components of the 90 ° hybrid (lines, capacitors, transformers or inductors) are designed so that the power of the two amplifiers is combined at the load, that no power is delivered at the load balancing resistor and that the two amplifiers are decoupled and mutually exclusive can not influence. The 90 ° hybrid itself is ideally lossless, that is, the power of the two high-frequency amplifiers is fully supplied to the load applied to the third port.
Die aus der Mikrowellentechnik bekannten 3dB Koppler sind als Leltungskoppler mit Leitungslängen von λ/4 aufgebaut. Diese Leitungskopplertechnik ist für 13 und 27 MHz nur sehr unvorteilhaft einsetzbar, weil die Baugröße mit λ/4-Längen einige Meter betragen würde, was im Hinblick auf die gewünschte Verkleinerung der Generatoren einen Rückschritt bedeuten würde.The 3dB couplers known from microwave technology are constructed as Leltungskoppler with line lengths of λ / 4. This line coupling technique is very unfavorable for 13 and 27 MHz, because the size would be a few meters with λ / 4 lengths, which would mean a step backwards in view of the desired reduction of the generators.
Alternativ dazu kann ein 3dB Koppler auch aus diskreten Bauteilen aufgebaut werden, wobei der 3dB Koppler in der Regel mindestens eine Kapazität zur kapazitiven Kopplung und einen Übertrager mit einer Koppelinduktivität zur induktiven magnetischen Kopplung aufweist.Alternatively, a 3dB coupler may be constructed of discrete components, with the 3dB coupler typically having at least one Capacitive coupling capacitance and a transformer with a coupling inductance for inductive magnetic coupling has.
Damit sich das gewünscht Verhalten des 3dB Kopplers einstellt, sollten die Koppelinduktivität und die Koppelkapazität die folgenden Bedingungen erfüllen:
- Lk = Koppelinduktivität
- Ck = Koppelkapazität
- Z0 = Wellenwiderstand
- f = Frequenz
- L k = coupling inductance
- C k = coupling capacity
- Z 0 = characteristic impedance
- f = frequency
Bei 13MHz und Z0 = 50Ω ergibt sich dann eine Koppelinduktivität Lk von ca. 600nH und eine Koppelkapazität Ck von ca. 200pF.At 13 MHz and Z 0 = 50Ω, a coupling inductance L k of approximately 600 nH and a coupling capacitance C k of approximately 200 pF are obtained.
Der Aufbau eines 3dB Kopplers aus diskreten Bauteilen erfordert immer einen hohen Aufwand an präzisen Bauteilen, die unter Umständen auch noch abgeglichen werden müssen. Insbesondere für größere Leistungen (größer 1kW) ist dies immer sehr kostspielig.The construction of a 3dB coupler from discrete components always requires a high expenditure of precise components, which under certain circumstances also have to be adjusted. This is always very expensive, especially for larger outputs (more than 1kW).
Die Koppelkapazität mittels zweier beabstandeter elektrischer Leiter mit einer definierten Fläche und einem definierten Abstand zueinander kann einfach, kostengünstig und sehr präzise reproduzierbar realisiert werden. Zumeist wird aber die erforderliche Induktivität mittels zweier solcher Leiter nicht erreicht. Sie muss daher geeignet erhöht werden. Eine Möglichkeit besteht darin, die Induktivität ausschließlich mit Induktivitätserhöhungselementen, z.B. Ferriten zu erhöhen. Um auf die notwendige Induktivität bei großen Leistungen zu kommen, sind Induktivitätserhöhungselemente mit großen Abmessungen und hohen Kosten notwendig.The coupling capacity by means of two spaced electrical conductors with a defined surface and a defined distance from each other can be realized easily, inexpensively and very precisely reproducible. In most cases, however, the required inductance is not achieved by means of two such conductors. It must therefore be increased appropriately. One possibility is to increase the inductance exclusively with inductance-increasing elements, eg ferrites. To come to the necessary inductance at high powers are Inductor elements with large dimensions and high costs necessary.
Aus der
Die
Die
Die
Aus der
Die
Aus der
Aus der Druckschrift "
Weiterhin ist es aus der
Schließlich offenbart die
Aufgabe der vorllegenden Erfindung ist es demgegenüber, einen 3dB-Koppler derart weiter zu bilden, dass eine gute kapazitive und induktive Kopplung der Primär- und der Sekundärseite des Übertragers bei geringer Baugröße realisierbar ist.In contrast, the object of the present invention is to further form a 3dB coupler in such a way that a good capacitive and inductive coupling of the primary and the secondary side of the transformer can be realized with a small overall size.
Diese Aufgabe wird erfindungsgemäß mit einem 3dB-Koppler der eingangs genannten Art mit den Merkmalen des Patentanspruchs 1 gelöst. Die Unteransprüche geben bevorzugte Weiterbildungen an. Die Aufgabe wird weiterhin gelöst durch die Verwendung eines solchen 3dB-Kopplers zur Kopplung von HF-Leistung bei einer Frequenz im Bereich 1 MHz - 80 MHz und bei Leistungen größer 1 kW.This object is achieved with a 3dB coupler of the type mentioned with the features of claim 1. The dependent claims indicate preferred developments. The object is further achieved by the use of such a 3dB coupler for coupling RF power at a frequency in the range 1 MHz - 80 MHz and at powers greater than 1 kW.
Dabei weisen der erste und der zweite Leiter jeweils eine Windungszahl n > 1 auf. Durch diese einfache Maßnahme kann die Induktivität auf einfache Art und Weise erhöht werden. Die Induktivität steigt mit der Anzahl der Windungen im Quadrat, mit einer Verdopplung der Windungszahl erhöht sich die Induktivität demnach um den Faktor vier. Die Größe eines Induktivitätserhöhungselements kann sich demnach bei der Verdopplung der Windungszahl um den Faktor 4 verkleinern. Damit kann die Baugröße durch Verwendung von mehr als einer Windung reduziert werden. Bei einer ausreichend hohen Windungszahl kann im Idealfall auf weitere induktivitätserhöhende Maßnahmen verzichtet werden.In this case, the first and the second conductor each have a number of turns n> 1. By this simple measure, the inductance can be increased in a simple manner. The inductance increases with the number of turns squared, with a doubling of the number of turns, the inductance therefore increases by a factor of four. The size of an inductance-increasing element can therefore be reduced by a factor of 4 when the number of turns is doubled. Thus, the size can be reduced by using more than one turn. At a sufficiently high number of turns can ideally be dispensed with further inductance-increasing measures.
Durch eine erhöhte Windungszahl kann aber auch die Länge der die Induktivität erzeugenden Leiter reduziert werden. Das bewirkt vorteilhafterweise auch eine symmetrischere Phasenauftellung. Idealerweise sollte der Phasenversatz zwischen dem Eingangssignal an einem Eingangstor und einem ersten Ausgangssignal eines ersten Ausgangstors +45° und zwischen dem Eingangssignal und einem zweiten Ausgangssignal eines zweiten Ausgangstors -45° betragen. Bei nur einer Windung ergibt sich aber häufig ein Phasenversatz von z.B. +40° an einem Ausgangstor im Vergleich zum Eingangstor und -50° am anderen Ausgangstor. Bei kürzeren Leiterlängen sind Abweichungen von der idealen Phasenauftellung geringer.By an increased number of turns but also the length of the inductance generating conductor can be reduced. This advantageously also causes a more symmetrical phase Aufaufstellung. Ideally, the phase offset between the input signal at one input port and a first output signal of a first output port should be + 45 ° and between the input signal and a second output signal of a second output port should be -45 °. However, with only one turn, a phase offset of e.g. + 40 ° at one exit gate compared to the entrance gate and -50 ° at the other exit gate. For shorter conductor lengths deviations from the ideal phase are smaller.
Der erfindungsgemäße 3dB-Koppler kann zur Kopplung von HF-Leistung bei einer Frequenz im Bereich 1 - 80 MHz, insbesondere bei etwa 1 MHz; etwa 2 MHz; 13,56 MHz; 27,12 MHz oder etwa 60 MHz und bei Leistungen größer 1kW verwendet werden. In diesem Bereich war der Einsatz von 3dB Kopplern bislang nicht bekannt.The inventive 3dB coupler can be used to couple RF power at a frequency in the range 1-80 MHz, in particular at about 1 MHz; about 2 MHz; 13.56 MHz; 27.12 MHz or about 60 MHz and be used at powers greater than 1kW. In this area, the use of 3dB couplers was previously unknown.
Die Abmessungen des 3dB Kopplers für Frequenzen unter 100 MHz können deutlich reduziert werden. Sie können kleiner als λ/4, insbesondere kleiner als λ/8 und vorzugsweise sogar kleiner als λ/10 betragen. Bei diesen Größen haben die Einflüsse der Leitungstheorie der Hochfrequenztechnik keine Bedeutung mehr. Ausdrücklich sei hier noch einmal erwähnt, dass es sich bei dem 3dB Koppler nach dieser Erfindung nicht um einen Leitungskoppler handelt, wie er aus dem Stand der Technik für höhere Frequenzen bekannt ist, d.h. die Charakterisitk des 3dB-Kopplers wird nicht (ausschließlich) durch die Leitungslänge bestimmt. Vielmehr entspricht die Kopplung zwischen den elektrischen Leitern einer kapazitiven Kopplung mit einer fest vorgegebenen und eingestellten Kapazität zwischen den Leitern bei vorgegebener Grundfrequenz f und vorgegebenem Wellenwiderstand Z0. Die Kapazität kann über die Fläche und den Abstand der Leiter eingestellt werden. Weiterhin entspricht die Kopplung einer induktiven Kopplung mit einer fest vorgegebenen und eingestellten Induktivität des Übertragers bei vorgegebener Grundfrequenz f und vorgegebenem Wellenwiderstand Z0. Die Induktivität wird beispielsweise abhängig von der Länge der Leiter, insbesondere der Leiterabschnitte eingestellt. Bei einer Ausgestaltung der Erfindung ist im Kopplungsbereich zur Erhöhung der Induktivität der Leiter zumindest ein Induktivitätserhöhungselement vorgesehen. Die Werte für die Induktivität und die Kapazität berechnen sich aus den oben angegebenen Formeln in Abhängigkeit von Frequenz und Wellenwiderstand.The dimensions of the 3dB coupler for frequencies below 100 MHz can be significantly reduced. They can be smaller than λ / 4, in particular smaller than λ / 8 and preferably even smaller than λ / 10. With these quantities, the influences of the line theory of high-frequency technology have no meaning. It should be expressly mentioned here again that the 3dB coupler according to this invention is not a line coupler, as known from the prior art for higher frequencies, ie the character of the 3dB coupler is not (exclusively) by the Cable length determined. Rather, the coupling between the electrical conductors corresponds to a capacitive coupling with a fixed predetermined and set capacitance between the conductors at a given fundamental frequency f and predetermined characteristic impedance Z 0 . The capacity can be adjusted by the area and the distance of the conductors. Furthermore, the coupling of an inductive coupling with a fixed predetermined and set inductance of the transformer at a given fundamental frequency f and predetermined wave resistance Z 0 corresponds. The inductance is set, for example, depending on the length of the conductors, in particular the conductor sections. In one embodiment of the invention, at least one inductance-increasing element is provided in the coupling region for increasing the inductance of the conductor. The values for the inductance and the capacitance are calculated from the formulas given above as a function of frequency and characteristic impedance.
Dabei kann das Induktivitätserhöhungselement eine beliebige Form haben. Vorzugsweise umgibt es die Leiter im Kopplungsbereich zumindest teilweise. Es kann z.B. parallel zu ihnen liegen. Dadurch kann eine besonders einfache und effektive Kopplung erreicht werden. Bevorzugt wird das Induktivitätserhöhüngselement die Leiter im Kopplungsbereich ringförmig umgeben. Dabei ist mit ringförmig gemeint, dass die Leiterabschnitte im Kopplungsbereich von einer weitestgehend geschlossenen Geometerie umgeben sind, sie kann kreisförmig, ellipsoid, rechteckig oder anders geformt sein. Der Vorteil einer ringförmigen Geometrie ist die Reduzierung von Streufeldem. Bei einer rechteckigen Bauweise der Ringform kann die Wärme, die im Induktivitätserhöhungselement entsteht, besonders gut an einen Kühlkörper, insbesondere eine plane Kühlplatte, abgeführt werden. Allgemein kann das Induktivitätserhöhungselement einen Kühlkörper aufweisen oder mit einem solchen in Wärmeaustauschverbindung stehen oder selbst als Kühlkörper ausgebildet sein.In this case, the inductance-increasing element may have any shape. Preferably, it surrounds the conductors in the coupling region at least partially. It can e.g. lying parallel to them. This allows a particularly simple and effective coupling can be achieved. Preferably, the Induktivitätserhöhüngselement the conductors in the coupling region is annularly surrounded. In this case, by annular is meant that the conductor sections are surrounded in the coupling region by a largely closed geometery, they may be circular, ellipsoidal, rectangular or otherwise shaped. The advantage of an annular geometry is the reduction of stray fields. In a rectangular construction of the ring shape, the heat that arises in the inductance-increasing element, particularly good to a heat sink, especially a flat cooling plate, be dissipated. In general, the inductance-increasing element may have a heat sink or be in heat exchange connection with such or may itself be embodied as a heat sink.
Die rechteckige Bauform des Induktivitätserhöhungselements kann aus mehreren Teilen zusammengesetzt sein, z.B. aus vier Quadern oder aus zwei U-förmigen Teilen oder aus einem U-förmigen Teil und einem Quader. Bei den aus mehreren Teilen zusammengesetzten Bauformen ist eine vereinfachte Fertigung möglich, außerdem können zur Einstellung der Induktivität einstellbare Spalte zwischen den Teilen vorgesehen werden.The rectangular shape of the inductance-increasing element may be composed of several parts, for example, four cuboids or two U-shaped parts or a U-shaped part and a cuboid. In the assembled from several parts designs a simplified production is possible, also can be provided to adjust the inductance adjustable gaps between the parts.
Vorzugsweise ist das zumindest eine Induktivitätserhöhungselement aus ferritischem Material ausgebildet. Insbesondere können ein oder mehrere die Leiter zumindest abschnittsweise, vorteilhafterweise im Kopplungsbereich umgreifende Ferritringe vorgesehen sein.Preferably, the at least one inductance-increasing element is formed of ferritic material. In particular, one or more conductors may be provided at least in sections, advantageously in the coupling region encompassing ferrite rings.
Je nach den zu koppelnden Leistungen können Ferritringe mit relativ hohen oder niedrigen magnetischen Verlusten eingesetzt werden. Während bei vergleichsweise kleinen Leistungen Ferritringe mit noch relativ hohen magnetischen Verlusten eingesetzt werden können, muss für hohe Leistungen Ferritmaterial mit extrem niedrigen magnetischen Verlusten eingesetzt werden. Bei gleicher Baugröße weisen Ferritkörper mit niedrigen magnetischen Verlusten in der Regel auch niedrigere AL Werte auf, weshalb zur Erzielung der gleichen Induktivität entsprechend mehr Ferritkörper eingesetzt werden müssen.Depending on the power to be coupled, ferrite rings with relatively high or low magnetic losses can be used. While ferrite rings with still relatively high magnetic losses can be used at comparatively low powers, ferrite material with extremely low magnetic losses must be used for high powers. With the same size ferrite body with low magnetic losses usually also lower A L values, which is why to achieve the same inductance correspondingly more ferrite must be used.
Während also bei vergleichsweise kleinen Leistungen Ferritringe mit großem AL-Wert von zum Beispiel 200nH einsetzbar sind und damit nur wenige Ferritringe erforderlich sind, um die notwendige Induktivität von zum Beispiel 600nH zu erreichen, müssen für hohe Leistungen (z.B. 5kW) mit entsprechend großen Strömen in den Leitern Ferritringe mit geringerem AL-Wert verwendet werden, weil sonst entsprechend hohe ferromagnetische Verluste in den Ferritkernen auftreten. Bekanntermaßen steigen die magnetischen oder auch gyromagnetischen Verluste im Ferritkern materialabhängig bei bestimmten Frequenzen bis zu einer magnetischen Resonanzfrequenz an. Liegt diese ferromagnetische Resonanzfrequenz zu niedrig und zu nah an der Betriebsfrequenz, so erwärmen die Verluste den Ferrit.Thus, while ferrite rings with a high A L value of, for example, 200 nH can be used at comparatively low powers, and thus only a few ferrite rings are required to achieve the necessary inductance of, for example, 600 nH, for high powers (eg 5 kW) with correspondingly large currents Ferrite rings with a lower A L value can be used in the conductors because otherwise correspondingly high ferromagnetic losses occur in the ferrite cores. As is known, the magnetic or even gyromagnetic losses in the ferrite core increase depending on the material at certain frequencies up to a magnetic resonance frequency. If this ferromagnetic resonance frequency is too low and too close to the operating frequency, the losses heat the ferrite.
Es werden deshalb bei hohen Leistungen bevorzugt Ferritringe mit geringerem AL Wert verwendet und dafür eine entsprechend höhere Anzahl. Damit sind bei einer Leistung von bis zu 10kW und einer Betriebsfrequenz von 13,56MHz 90° Hybride mit einer Grundfläche von 5cm X 10cm oder kleiner realisierbar. Dabei ist die Höhe in beiden Fällen kleiner oder ungefähr gleich 5cm. Je höher jedoch die Windungszahl ist, desto weniger Induktivitätserhöhungselemente werden benötigt. Dies ist wünschenswert für einen besonders platzsparenden und preisgünstigen Aufbau, da die Induktivitätserhöhungselemente die Reproduzierbarkeit der Induktivität erschwert.Therefore, at high powers, preference is given to using ferrite rings with a lower A L value and, correspondingly, a correspondingly higher number. Thus, with a power of up to 10kW and an operating frequency of 13.56MHz, 90 ° hybrids with a footprint of 5cm X 10cm or smaller can be realized. The height in both cases is less than or equal to 5cm. However, the higher the number of turns, the less inductance-increasing elements are needed. This is desirable for a particularly space-saving and inexpensive construction, since the inductance-increasing elements makes the reproducibility of the inductance more difficult.
Bei einer besonders bevorzugten Ausführungsform weisen der erste und der zweite Leiter jeweils eine Windungszahl n = 2 auf. Diese Windungszahl stellt insbesondere bei der gleichzeitigen Verwendung eines Induktivitätserhöhungselements einen guten Kompromiss dar. Der konstruktive Aufwand für den 3dB-Koppler hält sich in Grenzen. Die Induktivität und die Kapazität können gut reproduziert werden und ohmsche Verluste können gering gehalten werden. Streufeider haben keinen großen Einfluss. Werden Ferrite als Induktivitätserhöhungselemente verwendet, kann deren Anzahl oder Erstreckung auf 25% dessen reduziert werden, was bei einer Windungszahl von n=1 benötigt wird. Dadurch können teure Ferrite eingespart werden. Außerdem ist die Reproduzierbarkeit besser, wenn weniger Ferrite verwendet werden, da die Toleranzen von 10-20%, mit denen Ferrite gefertigt werden, weniger ins Gewicht fallen.In a particularly preferred embodiment, the first and the second conductor each have a number of turns n = 2. This number of turns represents a good compromise, in particular when using an inductance-increasing element at the same time. The design effort for the 3dB coupler is limited. The inductance and the capacitance can be reproduced well and ohmic losses can be kept low. Stray sufferers have no great influence. When ferrites are used as inductance enhancement elements, their number or extent can be reduced to 25% of what is needed with a turn number of n = 1. This can save expensive ferrites. In addition, reproducibility is better when fewer ferrites are used, as the 10-20% tolerances used to make ferrites are less significant.
Um den induktiven Übertrager des 3dB-Kopplers herzustellen, ist eine enge induktive Kopplung notwendig, d.h. zumindest Abschnitte der Primär- und der Sekundärleitung müssen so nah wie möglich beieinander liegen. Insbesondere können Leiterabschnitte der Primär- und der Sekundärseite sich überlappen oder miteinander kämmen. Weiterhin erstrecken sich die Leiter bzw. Abschnitte davon vorteilhafterweise zumindest abschnittsweise, vorzugsweise im Kopplungsbereich, parallel zueinander.To make the inductive transformer of the 3dB coupler, a close inductive coupling is necessary, ie at least sections of the primary and the secondary line must be as close to each other as possible. In particular, conductor sections of the primary and the secondary side may overlap or mesh with each other. Furthermore, the extend Conductor or sections thereof advantageously at least in sections, preferably in the coupling region, parallel to each other.
Um eine reproduzierbare Kapazität zu erzielen, kann zumindest ein Abstandshalter, insbesondere ein Isolator vorgesehen sein, der Abschnitte des zumindest einen ersten und des zumindest einen zweiten Leiters in einem vorgegebenen Abstand hält. Besonders bevorzugt ist es, wenn die Leiter sich zumindest abschnittsweise, vorzugsweise im Kopplungsbereich, In parallelen Ebenen erstrecken.In order to achieve a reproducible capacity, at least one spacer, in particular an insulator, can be provided, which holds portions of the at least one first and the at least one second conductor at a predetermined distance. It is particularly preferred if the conductors extend at least in sections, preferably in the coupling region, in parallel planes.
Nach einer bevorzugten Ausführungsform können zwischen benachbarten Leiterabschnitten flächige Abstandhalter bzw. Isolatoren vorgesehen sein. Die Isolatoren sind vorzugsweise aus einem Isoliermaterial mit einem εr im Bereich 2 - 2,6, bevorzugt von etwa 2,33, und einer Dicke von etwa 0,5mm bis 3mm vorgesehen. Die Isolatoren können sich im gesamten Kopplungsbereich erstrecken.According to a preferred embodiment, areal spacers or insulators may be provided between adjacent conductor sections. The insulators are preferably made of an insulating material with an ε r in the range 2 - 2.6, preferably from about 2.33, and a thickness of about 0.5mm to 3mm provided. The insulators may extend throughout the coupling region.
Für eine hohe Güte und eine hohe Durchschlagfestigkeit kann als Isoliermaterial bevorzugt Polytetrafluoräthylen (PTFE), wie es unter der Handelsbezeichnung "Teflon" bekannt ist, verwendet werden. Vorteilhaft ist ein niedriger Verlustfaktor tan δ des Isoliermaterials. tan δ sollte kleiner als 0,005 sein, damit die Verluste im Isoliermaterial gering gehalten werden. Als besonders geeignet hat sich in ersten Versuchen RT/duorit 5870 von ROGERS Corp. herausgestellt mit einem tan δ von 0,0005 - 0,0012 und einem εr von 2,3.For high quality and high dielectric strength, polytetrafluoroethylene (PTFE), as known under the trade name "Teflon", may be used as the insulating material. A low loss factor tan δ of the insulating material is advantageous. tan δ should be less than 0.005 to minimize losses in the insulating material. RT / duorit 5870 from ROGERS Corp. has been found to be particularly suitable in the first experiments. exhibited a tan δ of 0.0005 - 0.0012 and an ε r of 2.3.
Eine raumsparende Anordnung, die zugleich einfach zu reproduzierende Kapazitäten ermöglicht, ergibt sich, wenn die Leiter zumindest im Kopplungsbereich als ebene Leiterbahnen ausgebildet sind.A space-saving arrangement, which at the same time allows easy to reproduce capacities, results when the conductors are formed at least in the coupling region as a flat conductor tracks.
In diesem Zusammenhang ist es besonders vorteilhaft, wenn der zumindest eine Abstandshalter flächig ausgebildet ist und ein Leiterabschnitt des ersten Leiters auf der einen und ein Leiterabschnitt des zweiten Leiters auf der gegenüber liegenden Seite des Abstandhalters angebracht, insbesondere der Abstandshalter mit einem Leiterabschnitt des ersten und zweiten Leiters bedruckt, beschichtet oder kaschiert ist. Der Abstandshalter dient dabei als Trägermaterial für die Leiter bzw. Leiterbahnen und kann als Leiterplatte ausgebildet sein.In this context, it is particularly advantageous when the at least one spacer is formed flat and a conductor portion of the first conductor on the one and a conductor portion of the second conductor mounted on the opposite side of the spacer, in particular the spacer with a conductor portion of the first and second Printed conductor, coated or laminated. The spacer serves as a carrier material for the conductors or conductor tracks and may be formed as a printed circuit board.
Mehrere dieser Anordnungen können übereinander gestapelt sein. Wie bereits vorerwähnt, kann damit ein definierter, konstanter Abstand zwischen den Leitern bzw. Leiterbahnen sichergestellt werden. Insbesondere können dadurch Abschnitte des ersten und zweiten Leiters im Kopplungsbereich in einem Leiterstapel angeordnet sein, wobei benachbarte Leiterabschnitte Insbesondere durch einen Isolator voneinander beabstandet sind.Several of these arrangements may be stacked on top of each other. As already mentioned above, it is thus possible to ensure a defined, constant distance between the conductors or interconnects. In particular, portions of the first and second conductors can thereby be arranged in the coupling region in a conductor stack, wherein adjacent conductor segments are spaced apart, in particular, by an insulator.
Bei einer vorteilhaften Ausführungsform sind mehrere, vorzugsweise beidseitig mit Leiterabschnitten versehene Abstandshalter, insbesondere Leiterplatten, gestapelt, wobei die Leiterabschnitte von sich gegenüberliegenden Selten benachbarter Abstandshalter im Wesentlichen deckungsgleich sind. Die Leiterbahnen mit einem Dielektrikum als Trägerschicht können mittels eines Platinenentwurfs und Leiterplattenfertigung einfach realisiert werden.In an advantageous embodiment, a plurality of spacers, in particular printed circuit boards, provided on both sides with conductor sections are stacked, wherein the conductor sections of opposing rare adjacent spacers are essentially congruent. The conductor tracks with a dielectric as a carrier layer can be easily realized by means of a board design and circuit board production.
In einer bevorzugten Ausgestaltung der Erfindung ist eine erste Leiterplatte vorgesehen, die eine Ausnehmung aufweist, die von jeweils einer Leiterbahn auf der Ober- und Unterseite der Leiterplatte umgeben ist. Es sind zumindest zwei im Wesentlichen T-förmige Leiterplatten vorgesehen, die auf der Ober- und Unterseite jeweils eine Leiterbahn aufweisen, wobei die Leiterbahnen zu zwei getrennten Wicklungen verbunden sind. Die Ausnehmung kann einen beispielsweise ringförmigen Ferrit aufnehmen, wobei die T-Stücke in den Durchbruch des Ferrits eingesteckt werden können.In a preferred embodiment of the invention, a first circuit board is provided which has a recess which is surrounded by a respective conductor track on the top and bottom of the circuit board. At least two essentially T-shaped printed circuit boards are provided, each of which has a conductor track on the upper and lower sides, the printed conductors being connected to two separate windings. The recess can receive a ring-shaped ferrite, for example, where the tees can be inserted into the breakthrough of the ferrite.
Die Betriebsfrequenz ist nicht auf die Industriefrequenz von 13,56 MHz beschränkt, sondern kann im Bereich 1 bis 100MHz liegen. Der große Vorteil dieser Anordnung ist aber, dass das Prinzip auch für noch deutlich niedrigere Frequenzen anwendbar ist. Well die Leiterbahnabschnitte nicht als Leitungskoppler funktionieren, sondern als Koppelkapazitäten und Koppelinduktivitäten. Würden die Leiterbahnen bzw. Leiterbahnabschnitte als Leitungskoppler arbeiten, müsste mindestens eine Leitungslänge von λ\4 verwendet werden. Solche Leitungslängen sind aber umso länger, je niedriger die Frequenz ist. Das würde bei Leitungskopplern immer größere Bauformen bedeuten. Nach dem erfindungsgemäßen Konzept muss aber die Bauform mit dem Verringern der Frequenz nicht verlängert werden, es müssen nur die Kapezitäts- und Induktivitätswerte, beispielsweise durch Beeinflussung der Windungszahl, angepasst werden.The operating frequency is not limited to the industry frequency of 13.56 MHz, but may be in the range 1 to 100MHz. the big advantage This arrangement is, however, that the principle is applicable to even much lower frequencies. Well the track sections do not work as a line coupler, but as coupling capacitances and coupling inductances. If the printed conductors or printed conductor sections were to work as line couplers, at least one line length of λ \ 4 would have to be used. However, such line lengths are longer, the lower the frequency. This would mean ever larger designs for line couplers. According to the concept of the invention, however, the design does not have to be lengthened with the reduction of the frequency, only the kapetity and inductance values, for example by influencing the number of turns, have to be adapted.
Bevorzugte Ausführungsbeispiele der Erfindung sind in der Zeichnung schematisch dargestellt und werden nachfolgend mit Bezug zu den Figuren der Zeichnung näher erläutert. Es zeigt:
- Fig. 1a
- die Oberseite einer ersten Leiterplatte, die Teil eines 3dB-Kopplers ist;
- Fig. 1b
- die Unterseite der Leiterplatte der
Fig. 1a ; - Fig. 2a
- die Oberseite einer zweiten Leiterplatte, die Ober der ersten Leiterplatte anzuordnen ist;
- Fig. 2b
- die Unterseite der zweiten Leiterplatte;
- Fig. 3a
- die Oberseite einer dritten Leiterplatte, die Ober der zweiten Leiterplatte anzuordnen ist;
- Fig. 3b
- die Unterseite der dritten Leiterplatte
- Fig. 4
- eine Frontalansicht einer ersten Ausführungsform eines 3dB-Kopplers;
- Fig. 5
- eine weitere Ausführungsform eines 3dB-Kopplers.
- Fig. 1a
- the top of a first circuit board that is part of a 3dB coupler;
- Fig. 1b
- the underside of the PCB
Fig. 1a ; - Fig. 2a
- the top of a second circuit board to be placed above the first circuit board;
- Fig. 2b
- the bottom of the second circuit board;
- Fig. 3a
- the top of a third circuit board to be placed above the second circuit board;
- Fig. 3b
- the underside of the third circuit board
- Fig. 4
- a frontal view of a first embodiment of a 3dB coupler;
- Fig. 5
- another embodiment of a 3dB coupler.
Die
Die Anschlüsse 11, 16, 21, 26 der Leiterplatte 1 sind die Ein- bzw. Ausgänge (Tore) des 3dB-Kopplers. Die Anschlüsse 12 und 12a sind deckungsgleich, wenn die Leiterplatten 1 und 2 aufeinander gelegt werden, und sind bei zusammengesetztem 3dB-Koppler miteinander elektrisch leitend verbunden. Gleiches glit für die Anschlüsse 13, 13a; 14, 14a; 15, 15a; 22, 22a; 23, 23a; 24, 24a und 25, 25a. Der 3dB-Koppler weist einen Übertrager auf, wobei die Induktivität der Primärseite (senkrecht schraffierte Flächen) zwei Windungen aufweist, die durch das als Ferrit ausgebildete Induktivitätserhöhungselement 4 verlaufen. Der Verlauf der zwei Windungen wird anhand von Bezugszeichen und Pfeilen in den
Die Induktivität der Sekundärseite (schräg schraffierte Flächen) läuft ebenfalls in zwei Windungen durch das Induktivitätserhöhungselement 4, nämlich vom Anschluss 21 nach 22 weiter nach 22a weiter nach 23 weiter nach 23a weiter nach 24 weiter nach 24a weiter nach 25 weiter nach 25a und schließlich zum Anschluss 26.The inductance of the secondary side (diagonally hatched areas) also continues in two turns through the inductance-increasing element 4, namely from terminal 21 to 22, further to 22a, continuing to 23 after 23a continue to 24 continue to 24a continue to 25 continue to 25a and finally to
Beim ausgebildeten 3dB-Koppler 100 (
Mit den Abmessungen von 10 cm Länge und 5 cm Breite (Leiterplatte 1) und 4cm Höhe (bestimmt durch das als Ferritring ausgebildete Induktivitätserhöhungselement 4) kann so ein 3dB-Koppler für die Zusammenführung von zweimal 2,5kW HF-Leistung bei 13,56MHz zu 5kW erreicht werden.With the dimensions of 10 cm in length and 5 cm in width (printed circuit board 1) and 4cm in height (determined by the designed as a ferrite ring inductance increasing element 4) so a 3dB coupler for the merger of twice 2.5kW RF power at 13.56MHz to 5kW can be achieved.
Wenn die Kapazität abgeglichen werden muss oder erhöht werden muss, kann eine diskreter Kondensator parallel geschaltet werden oder die Fläche z.B. auf der Leiterplatte 1 beidseitig erhöht werdenIf the capacitance needs to be adjusted or increased, a discrete capacitor can be connected in parallel or the area can be increased on both sides, eg on the PCB 1
In der
Eine Ausführungsform ohne Induktivitätserhöhungselement ist in der
Wenn die Anschlüsse 112 - 115 als Durchkontaktierungen gewünscht sind, müssen diese versetzt ausgeführt werden, wie das in der
Auch hier ist ein induktivitätserhöhendes Element, z.B. ein Ferrit z.B. als Scheibe, Stift oder Schalenkern denkbar. Ggf. müsste in der Mitte der Spirale eine Aussparung, z.B. eine Bohrung für einen Ferrit, vorgesehen werden.Again, an inductance-enhancing element, e.g. a ferrite e.g. conceivable as a disk, pin or pot core. Possibly. in the middle of the spiral, a recess, e.g. a bore for a ferrite can be provided.
Claims (12)
- Coupler (100) in the form of a 3dB coupler which couples two input signals, which are phase-shifted by 90°, to an output signal, comprising at least one first and one second electrical conductor (110, 111) which are spaced apart from each other and are capacitively and inductively coupled to each other, wherein the first conductor (110) represents the primary side and the second conductor (111) represents the secondary side of a transformer, and wherein the first and the second conductor (110, 111) each have a winding number n > 1 and the coupler (100) is designed as a four-port device, wherein the coupler is designed to have a predetermined coupling capacitance CK and coupling inductance LK, wherein CK=1/(2πf Z0), LK= Z0/(2πf), Z0 is a predetermined wave impedance and f is a predetermined basic frequency, wherein the coupler is designed to couple RF power at a frequency in the range between 1 and 80 MHz and at powers > 1 kW.
- 3dB coupler according to claim 1, characterized in that the first and second conductors each have a winding number of n=2.
- 3dB coupler according to any one of the preceding claims, characterized in that at least one inductance increasing element (4) is provided in a coupling region (101) to increase the inductance of the conductors.
- 3dB coupler according to claim 3, characterized in that the at least one inductance increasing element (4) surrounds the conductors (110, 111) in the coupling region (101) at least partially.
- 3dB coupler according to claim 3 or 4, characterized in that the at least one inductance increasing element (4) has an annular shape.
- 3dB coupler according to any one of the claims 3 to 5, characterized in that the at least one inductance increasing element (4) comprises at least one adjustable gap.
- 3dB coupler according to any one of the claims 3 to 6, characterized in that the at least one inductance increasing element (4) is formed from ferritic material.
- 3dB coupler according to any one of the preceding claims, characterized in that the length of the at least one first and/or second conductor (110, 111) is < λ/4, preferably < λ/8, with particular preference <λ/10.
- 3dB coupler according to any one of the preceding claims, characterized in that at least one spacer is provided which keeps sections of the at least one first and the at least one second conductor at a predetermined separation, wherein the at least one spacer has a laminar configuration and one conductor section of the first conductor is disposed on one side of the spacer and one conductor section of the second conductor is disposed on the opposite side of the spacer, in particular, that a conductor section of the first and second conductor is printed, coated or laminated on the spacer.
- 3dB coupler according to any one of the claims 3 to 9, characterized in that the inductance increasing element (4) comprises a cooling body (103) or is in contact therewith, thereby exchanging heat, or is itself designed as cooling body (103).
- 3dB coupler according to any one of the preceding claims, characterized in that a first circuit board (1) is provided comprising a recess which is surrounded by one strip conductor (27a, 27b) each on the upper and lower sides (1a, 1b) of the circuit board (1), at least two substantially T-shaped circuit boards (2, 3) are provided which comprise one strip conductor (28a, 28b, 29a, 29b) each on the upper and lower sides (2a, 3a, 2b, 3b), wherein the strip conductors (27a, 27b, 28a, 28b, 29a, 29b) are connected to form two separate windings.
- The use of a 3dB coupler according to any one of the preceding claims for coupling RF power at a frequency in the range between 1 and 80MHz, in particular at 1MHz; 2MHz; 13.56MHz; 27.12MHz or 60MHz and at powers of more than 1kW.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05004860.2A EP1699107B1 (en) | 2005-03-05 | 2005-03-05 | 3 dB coupler |
US11/368,314 US7477114B2 (en) | 2005-03-05 | 2006-03-03 | 3DB coupler |
JP2006059327A JP2006245591A (en) | 2005-03-05 | 2006-03-06 | 3dB COUPLER |
US11/371,628 US7452443B2 (en) | 2005-03-05 | 2006-03-09 | Vacuum plasma generator |
US12/257,643 US8133347B2 (en) | 2005-03-05 | 2008-10-24 | Vacuum plasma generator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05004860.2A EP1699107B1 (en) | 2005-03-05 | 2005-03-05 | 3 dB coupler |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15000604 Division-Into | 2015-03-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1699107A1 EP1699107A1 (en) | 2006-09-06 |
EP1699107B1 true EP1699107B1 (en) | 2017-05-31 |
Family
ID=34934080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05004860.2A Active EP1699107B1 (en) | 2005-03-05 | 2005-03-05 | 3 dB coupler |
Country Status (3)
Country | Link |
---|---|
US (1) | US7477114B2 (en) |
EP (1) | EP1699107B1 (en) |
JP (1) | JP2006245591A (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7792403B1 (en) | 2005-09-08 | 2010-09-07 | Infinera Corporation | Adiabatic polarization converter |
US8436618B2 (en) * | 2007-02-19 | 2013-05-07 | Schlumberger Technology Corporation | Magnetic field deflector in an induction resistivity tool |
US8299795B2 (en) * | 2007-02-19 | 2012-10-30 | Schlumberger Technology Corporation | Independently excitable resistivity units |
US8395388B2 (en) * | 2007-02-19 | 2013-03-12 | Schlumberger Technology Corporation | Circumferentially spaced magnetic field generating devices |
US7598742B2 (en) * | 2007-04-27 | 2009-10-06 | Snyder Jr Harold L | Externally guided and directed field induction resistivity tool |
US7265649B1 (en) | 2007-02-19 | 2007-09-04 | Hall David R | Flexible inductive resistivity device |
US8198898B2 (en) * | 2007-02-19 | 2012-06-12 | Schlumberger Technology Corporation | Downhole removable cage with circumferentially disposed instruments |
US7565041B2 (en) * | 2007-10-26 | 2009-07-21 | Infinera Corporation | Symmetric optical circuit with integrated polarization rotator |
US8354894B2 (en) * | 2009-04-30 | 2013-01-15 | Harris Corporation | RF signal combiner/splitter and related methods |
DE202010016850U1 (en) | 2010-12-22 | 2011-04-14 | Hüttinger Elektronik Gmbh + Co. Kg | RF power coupler |
DE102011075312A1 (en) * | 2011-05-05 | 2012-11-08 | Rohde & Schwarz Gmbh & Co. Kg | Quasi-broadband Doherty amplifier and related capacitor circuit |
US8704611B2 (en) * | 2012-06-28 | 2014-04-22 | Werlatone, Inc. | Planar constant-resistance hybrid filter |
DE102015212233A1 (en) | 2015-06-30 | 2017-01-05 | TRUMPF Hüttinger GmbH + Co. KG | Power combiner with symmetrically arranged heat sink and power combiner arrangement |
EP3605115A1 (en) | 2018-08-02 | 2020-02-05 | TRUMPF Huettinger Sp. Z o. o. | Arc detector for detecting arcs, plasma system and method of detecting arcs |
EP3605582A1 (en) | 2018-08-02 | 2020-02-05 | TRUMPF Huettinger Sp. Z o. o. | Power converter and power supply system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0506091A1 (en) * | 1991-03-29 | 1992-09-30 | Kokusai Electric Co., Ltd. | CM type directional coupler destined for use as power detector in portable telephone |
EP0964525A2 (en) * | 1998-06-12 | 1999-12-15 | Lockheed Martin Corporation | Low-noise sigma-delta analog-to-digital converter |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1440304A (en) * | 1974-11-29 | 1976-06-23 | Mullard Ltd | Transmission line pulse transformers |
US4499441A (en) * | 1982-10-14 | 1985-02-12 | Massachusetts Institute Of Technology | Superconducting signal processing circuits |
US5138287A (en) * | 1990-05-11 | 1992-08-11 | Hewlett-Packard Company | High frequency common mode choke |
US5600222A (en) | 1993-10-25 | 1997-02-04 | Delco Electronics Corporation | Thermal management using a hybrid spiral/helical winding geometry |
JP3125691B2 (en) * | 1995-11-16 | 2001-01-22 | 株式会社村田製作所 | Coupled line element |
US5801602A (en) * | 1996-04-30 | 1998-09-01 | 3Com Corporation | Isolation and signal filter transformer |
DE19724473A1 (en) * | 1996-06-10 | 1997-12-11 | Fuji Electric Co Ltd | Suppression filter for reducing switching interference signals in static converter |
JP3680627B2 (en) * | 1999-04-27 | 2005-08-10 | 富士電機機器制御株式会社 | Noise filter |
JP3520411B2 (en) * | 1999-11-10 | 2004-04-19 | 株式会社村田製作所 | High frequency components using coupled lines |
US6765455B1 (en) * | 2000-11-09 | 2004-07-20 | Merrimac Industries, Inc. | Multi-layered spiral couplers on a fluropolymer composite substrate |
US6522222B1 (en) * | 2001-06-26 | 2003-02-18 | Yuriy Nikitich Pchelnikov | Electromagnetic delay line with improved impedance conductor configuration |
US6806789B2 (en) | 2002-01-22 | 2004-10-19 | M/A-Com Corporation | Quadrature hybrid and improved vector modulator in a chip scale package using same |
US6809623B2 (en) * | 2002-03-01 | 2004-10-26 | Broadcom Corp. | High Q on-chip inductor |
JP3734455B2 (en) | 2002-05-21 | 2006-01-11 | アルプス電気株式会社 | Non-reciprocal circuit element |
-
2005
- 2005-03-05 EP EP05004860.2A patent/EP1699107B1/en active Active
-
2006
- 2006-03-03 US US11/368,314 patent/US7477114B2/en active Active
- 2006-03-06 JP JP2006059327A patent/JP2006245591A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0506091A1 (en) * | 1991-03-29 | 1992-09-30 | Kokusai Electric Co., Ltd. | CM type directional coupler destined for use as power detector in portable telephone |
EP0964525A2 (en) * | 1998-06-12 | 1999-12-15 | Lockheed Martin Corporation | Low-noise sigma-delta analog-to-digital converter |
Non-Patent Citations (1)
Title |
---|
STEVE MAAS: "Designing VHF Lumped-Element Couplers with MW Office", pages 1 - 8, Retrieved from the Internet <URL:https://www.google.nl/url?sa=t&rct=j&q=&esrc=s&source=web&cd=1&ved=0ahUKEwjL8uHhmcvQAhWInRoKHX3CCggQFggaMAA&url=https%3A%2F%2Fawrcorp.com%2Fdownload%2Fkb.aspx%3Ffile%3Dappnotes%2FVHF_Lump_Coupler.pdf&usg=AFQjCNHnzFzZx24iOapTZw5-G1F0faPnwA&sig2=HeiCGu07hgzwonIpBHwmJg&bvm=bv.139782543,d.d2s> [retrieved on 19990101] * |
Also Published As
Publication number | Publication date |
---|---|
US7477114B2 (en) | 2009-01-13 |
JP2006245591A (en) | 2006-09-14 |
US20060197629A1 (en) | 2006-09-07 |
EP1699107A1 (en) | 2006-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1699107B1 (en) | 3 dB coupler | |
EP1701376B1 (en) | Vacuum plasma generator | |
EP3317966B1 (en) | High-frequency amplifier arrangement | |
DE69724469T2 (en) | NARROW-BAND COUPLED DIRECTIONAL COUPLER IN A MULTILAYER PACK | |
DE112008000120B4 (en) | Plasma supply device | |
DE60308599T2 (en) | Highly efficient interdigital filters | |
EP3317915B1 (en) | Power combiner for coupling high-frequency signals and power combiner arrangement comprising a power combiner of this type | |
DE102006035204A1 (en) | Monolithic integrated circuit e.g. e.g. hybrid circuit, arrangement, for processing high frequency signals in e.g. voltage controlled oscillator, has metallic connection unit connecting plate with loop in electrically conductive manner | |
DE112010001533T5 (en) | RANGE RESONANT POWER CONVERTERS, INCLUDING A LINKED INDUCTOR / CONDENSER | |
DE112004001614B4 (en) | 90 ° hybrid | |
DE69931729T2 (en) | Radio with a dielectric filter | |
DE10202699B4 (en) | Non-reciprocal circuit device and communication device including the same | |
DE202010016850U1 (en) | RF power coupler | |
DE831418C (en) | Arrangement for amplifying, generating and modulating or demodulating electromagnetic waves of ultra-high frequencies | |
DE60307730T2 (en) | Highly efficient low-pass filter | |
EP3631980B1 (en) | High frequency amplifier arrangement and method for designing a high frequency amplifier arrangement | |
EP1739716A1 (en) | HF plasma process system | |
DE102009049609B4 (en) | Stripline balun | |
DE102011086557B4 (en) | coupler | |
DE60317266T2 (en) | Highly efficient three-port circuit | |
EP1495513A1 (en) | Electric matching network with a transformation line | |
DE102012200634B4 (en) | Power coupler and control cabinet with power coupler | |
WO2005038976A1 (en) | Electrical adaptation network comprising a transformation line | |
EP2885837B1 (en) | Device for coupling hf-power into a waveguide | |
EP0490903B1 (en) | Microwave filter |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR LV MK YU |
|
17P | Request for examination filed |
Effective date: 20060811 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: HUETTINGER ELEKTRONIK GMBH + CO. KG |
|
AKX | Designation fees paid |
Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR |
|
17Q | First examination report despatched |
Effective date: 20071130 |
|
R17C | First examination report despatched (corrected) |
Effective date: 20070801 |
|
APBK | Appeal reference recorded |
Free format text: ORIGINAL CODE: EPIDOSNREFNE |
|
APBN | Date of receipt of notice of appeal recorded |
Free format text: ORIGINAL CODE: EPIDOSNNOA2E |
|
APBR | Date of receipt of statement of grounds of appeal recorded |
Free format text: ORIGINAL CODE: EPIDOSNNOA3E |
|
APAF | Appeal reference modified |
Free format text: ORIGINAL CODE: EPIDOSCREFNE |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: TRUMPF HUETTINGER GMBH + CO. KG |
|
APBT | Appeal procedure closed |
Free format text: ORIGINAL CODE: EPIDOSNNOA9E |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
INTG | Intention to grant announced |
Effective date: 20170109 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 898208 Country of ref document: AT Kind code of ref document: T Effective date: 20170615 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: GERMAN |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 502005015601 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: FP |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170901 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170930 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170831 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 502005015601 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 14 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20180301 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20180305 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20050305 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20170531 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20230322 Year of fee payment: 19 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 20230321 Year of fee payment: 19 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20230328 Year of fee payment: 19 Ref country code: CH Payment date: 20230401 Year of fee payment: 19 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IE Payment date: 20240321 Year of fee payment: 20 Ref country code: NL Payment date: 20240320 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: AT Payment date: 20240321 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20240320 Year of fee payment: 20 Ref country code: GB Payment date: 20240320 Year of fee payment: 20 |