EP1684316A1 - Dispositif encapsulé en résine et procédé de fabrication - Google Patents

Dispositif encapsulé en résine et procédé de fabrication Download PDF

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Publication number
EP1684316A1
EP1684316A1 EP05250267A EP05250267A EP1684316A1 EP 1684316 A1 EP1684316 A1 EP 1684316A1 EP 05250267 A EP05250267 A EP 05250267A EP 05250267 A EP05250267 A EP 05250267A EP 1684316 A1 EP1684316 A1 EP 1684316A1
Authority
EP
European Patent Office
Prior art keywords
component
buffer element
housing
rigid buffer
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05250267A
Other languages
German (de)
English (en)
Inventor
Frederic Baron
Eric Schoeber
John Truong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Priority to EP05250267A priority Critical patent/EP1684316A1/fr
Publication of EP1684316A1 publication Critical patent/EP1684316A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/005—Impregnating or encapsulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306—Fastening or mounting coils or windings on core, casing or other support

Definitions

  • the present invention relates to resin encapsulated devices and in particular to a resin encapsulated device including means for preventing cracks from originating and/or propagating within the resin from damaging sensitive components embedded therein.
  • Epoxy resin is widely used in a number of products, in particular in electronic devices such as ignition coils and other ignition components, to insulate parts under high tension and to encapsulate sensitive components to protect them from damage.
  • One of the disadvantages of epoxy resin is that the material is relatively brittle and cracks can develop and propagate through the resin under conditions of mechanical stress and temperature gradients. If the cracks propagate as far as the components embedded therein severe damage can be caused to the very components the resin was intended to protect.
  • a known method of protecting sensitive electronic components against damage caused by the cracking of an encapsulating epoxy resin material is the use of a buffer made of a synthetic rubber material placed against the sensitive component.
  • the buffer compensates for different expansions between the epoxy and the components and if a crack reaches the buffer the buffer will deform so that the crack stops at the edge of the epoxy.
  • Such soft buffers can be used for protecting smaller components (e.g. pencil coils) wherein a small amount of epoxy resin is used, they are not effective for larger components (e.g. cassettes) wherein the mass of the components and the mass of the epoxy resin become much more substantial. In such larger components, the packaging of the component limits the size of the buffer that may be used.
  • a resin encapsulated device comprising a housing defining a hollow body, at least one sensitive component at least partly located within the housing, a resin material provided within the housing to at least partially encapsulate the component, characterised by a rigid buffer element embedded within the resin material adjacent the at least one component to prevent the origination of cracks within the resin material and/or to prevent cracks which might propagate within the resin material from reaching the component.
  • the rigid buffer element is interposed between a likely initiation site for cracks within the resin material and the at least one component.
  • the component may be mounted on the rigid buffer element.
  • the rigid buffer element may include locating means for locating the component against and/or on the rigid buffer element.
  • the component may be an electronic component, such as a printed circuit board.
  • the device comprises an ignition coil.
  • the rigid buffer element may extend from an electrical connector for connecting the device to other components.
  • the rigid buffer element is integrally formed with another component, such as the electrical connector.
  • a process for forming a resin encapsulated device comprising the steps of providing a housing defining a hollow body, locating a component and a rigid buffer element within the housing, the rigid buffer element being located adjacent the component, pouring a settable resin material into the housing to at least partially encapsulate the component and rigid buffer element.
  • the process further includes the steps of mounting the component on the rigid buffer element before locating both the component and the rigid buffer element within the housing.
  • the resin encapsulated device in this case an ignition coil, comprises a housing 2 defining a hollow chamber in which is located a coil 3 and associated sensitive electronic components including a printed circuit board 4.
  • the coil 3 and other electronic components 4 are encapsulated in epoxy resin (not shown) to seal and protect the components from damage.
  • the device 1 incorporates a known synthetic rubber buffer element 5 to compensate for different expansions between the epoxy and the components. If a crack in the epoxy resin reaches the buffer the buffer will deform so that the crack stops at the edge of the epoxy. However, the soft buffer element 5 does not provide sufficient support for the adjacent component and thus requires additional components to provide sufficient support and protection for the sensitive encapsulated components.
  • Figs. 2,3 and 4 show an encapsulated ignition coil according to the present invention, wherein the known synthetic rubber buffer element is replaced by a rigid plastic component 5.
  • the buffer element 5 can be provided with holes 8 for wires and/or locating pins 7 for locating an electronic component 4 on the buffer element 5 to assist the process of assembling the device 1.
  • the holes 8 can also provide guidance to wires.
  • the rigidity of the hard plastic buffer element of the present invention means that that, when mounted, it will not deform e.g. during the filling with epoxy, so that the assembly does not require an additional component to hold the electronic component 4 in place. It also means that the buffer can be formed integrally as part of an existing component, such as an electrical connector. Consequently, there is no need for a dedicated retaining component for the encapsulated electronic component.
  • the process of encapsulating the component involves one less process assembly operation. Consequently, the process of encapsulating a component is reduced compared with traditional encapsulation processes.
  • the buffer element of the present invention requires less material and utilises less expensive materials than is used in the conventional synthetic rubber buffer.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
EP05250267A 2005-01-20 2005-01-20 Dispositif encapsulé en résine et procédé de fabrication Withdrawn EP1684316A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05250267A EP1684316A1 (fr) 2005-01-20 2005-01-20 Dispositif encapsulé en résine et procédé de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05250267A EP1684316A1 (fr) 2005-01-20 2005-01-20 Dispositif encapsulé en résine et procédé de fabrication

Publications (1)

Publication Number Publication Date
EP1684316A1 true EP1684316A1 (fr) 2006-07-26

Family

ID=34940373

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05250267A Withdrawn EP1684316A1 (fr) 2005-01-20 2005-01-20 Dispositif encapsulé en résine et procédé de fabrication

Country Status (1)

Country Link
EP (1) EP1684316A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174510A (en) * 1977-12-28 1979-11-13 The United States Of America As Represented By The United States Department Of Energy RF transformer
US4866409A (en) * 1987-12-03 1989-09-12 Mitsubishi Denki Kabushiki Kaisha Resin-crack prevented high-voltage transformer
US5662091A (en) * 1995-04-24 1997-09-02 Mitsubishi Denki Kabushiki Kaisha Ignition apparatus for internal combustion engine
GB2345799A (en) * 1997-08-19 2000-07-19 Taiyo Yuden Kk Filler material for a wire wound electronic component
US6525636B1 (en) * 1997-02-14 2003-02-25 Denso Corporation Stick-type ignition coil having improved structure against crack or dielectric discharge
US20030189476A1 (en) * 2001-05-31 2003-10-09 Takashi Nagata Internal combustion engine ignition coil, and method of producing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174510A (en) * 1977-12-28 1979-11-13 The United States Of America As Represented By The United States Department Of Energy RF transformer
US4866409A (en) * 1987-12-03 1989-09-12 Mitsubishi Denki Kabushiki Kaisha Resin-crack prevented high-voltage transformer
US5662091A (en) * 1995-04-24 1997-09-02 Mitsubishi Denki Kabushiki Kaisha Ignition apparatus for internal combustion engine
US6525636B1 (en) * 1997-02-14 2003-02-25 Denso Corporation Stick-type ignition coil having improved structure against crack or dielectric discharge
GB2345799A (en) * 1997-08-19 2000-07-19 Taiyo Yuden Kk Filler material for a wire wound electronic component
US20030189476A1 (en) * 2001-05-31 2003-10-09 Takashi Nagata Internal combustion engine ignition coil, and method of producing the same

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