EP1681527B1 - Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form - Google Patents

Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form Download PDF

Info

Publication number
EP1681527B1
EP1681527B1 EP05000861A EP05000861A EP1681527B1 EP 1681527 B1 EP1681527 B1 EP 1681527B1 EP 05000861 A EP05000861 A EP 05000861A EP 05000861 A EP05000861 A EP 05000861A EP 1681527 B1 EP1681527 B1 EP 1681527B1
Authority
EP
European Patent Office
Prior art keywords
plate
lower plate
upper plate
isothermal
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP05000861A
Other languages
English (en)
French (fr)
Other versions
EP1681527A1 (de
Inventor
Kuo-Len Lin
Hui-Min Tsui
Ken Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CpuMate Inc
Original Assignee
CpuMate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CpuMate Inc filed Critical CpuMate Inc
Priority to ES05000861T priority Critical patent/ES2287814T3/es
Priority to PL05000861T priority patent/PL1681527T3/pl
Priority to DK05000861T priority patent/DK1681527T3/da
Priority to EP05000861A priority patent/EP1681527B1/de
Priority to AT05000861T priority patent/ATE362604T1/de
Priority to DE602005001153T priority patent/DE602005001153T2/de
Publication of EP1681527A1 publication Critical patent/EP1681527A1/de
Application granted granted Critical
Publication of EP1681527B1 publication Critical patent/EP1681527B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Definitions

  • the present invention relates to a method for manufacturing an isothermal plate assembly with predetermined shape, and more particularly to a method for manufacturing an isothermal plate assembly with predetermined shape by low cost and high yield process.
  • the conventional isothermal plate for heat-dissipating device of electronic apparatus is manufactured by a high thermally conductive material.
  • the thermally conductive material is manufactured into a flat plate with a hollow accommodation space defined therein and containing a wicked structure.
  • the isothermal plate further comprises a wavy supporting unit arranged in the hollow accommodation space and used to support walls between an upper plate and a lower plate. The isothermal plate is then filled with working fluid and the accommodation space is sealed.
  • the isothermal plate described in above-mentioned process can only form plate-like structure because the conventional isothermal plate adopts non-vacuum structure.
  • the conventional isothermal plate has crack problem when it is bent from flat state or its shape is varied due to temperature change. The yield of the conventional isothermal plate is degraded.
  • the electronic apparatus are arranged on one side of the isothermal plate, and the heat-dissipating fins are arranged on another side of the isothermal plate. The heat-dissipating device is difficult to be made compact and the heat-dissipating effect is influenced.
  • DE 29 47 000 A1 describes an isothermal plate assembly with a predetermined shape including an isothermal plate, which is bent in a predetermined shape. The heat pipe is bent to the predetermined shape and placed on the isothermal plate.
  • JP 2001241869 A describes a heat pipe structure, which is composed of a container having a housing space inside and a plurality of capillaries arranged in parallel and including a hydraulic fluid.
  • the capillaries are arranged in a plurality of capillary groups, which are piled up in many stages so their direction may be different from each other.
  • the spaces between the container and the capillaries are filled up with a heat conductive material.
  • the present invention is to provide a method for manufacturing an isothermal plate assembly with predetermined shape by low cost and high yield process, thus the meeting requirements of various electronic apparatus.
  • the present invention provides a manufacturing method for an isothermal plate assembly.
  • An upper plate and a lower plate with predetermined shape are provided and an accommodation space is defined there between.
  • a flattened heat pipe is bent into the predetermined shape and placed into the accommodation space.
  • a binding agent is applied on the face between the heat pipe, the upper plate and the lower plate.
  • the upper plate and the lower plate are assembled and then a hot melting process is executed.
  • the resultant product is then cooled to form a finished isothermal plate assembly with predetermined shape.
  • Fig. 1 shows the flowchart of method for manufacturing the isothermal plate assembly 1 according to a preferred embodiment of the present invention, which comprises following steps:
  • the heat pipe 2 can be firstly subjected to flatten process and then bent according to the shape of the upper plate 11 and the lower plate 12.
  • the isothermal plate assembly can be made with various shapes.
  • the isothermal plate assembly is formed by assembling the upper plate 11 and the lower plate 12.
  • the upper plate 11 and the lower plate 12 are preformed with predetermined bending shape.
  • the heat pipe 2 also has corresponding bending shape and is placed between the upper plate 11 and the lower plate 12 for providing heat conduction. Therefore, the isothermal plate with multiple and various shapes can be made with simple and low cost process.
  • the isothermal plate with multiple shapes can be easily adapted with various electronic devices.
  • the above-mentioned steps 102, 104 and 106 are interchangeable. That is, the heat pipe 2, the upper plate 11 and the lower plate 12 are bent before the heat pipe 2 is placed into the accommodation space 13 formed between the upper plate 11 and the lower plate 12. Alternatively, the heat pipe 2 is firstly placed into the accommodation space 13 formed between the upper plate 11 and the lower plate 12 and then bent together with the upper plate 11 and the lower plate 12. Moreover, a binding agent is selectively applied to contact faces between the heat pipe 2 and the upper plate 11 (and the lower plate 12). The binding agent fills the gap between the heat pipe 2 and the upper plate 11 (and the lower plate 12) by a following-up heating process.
  • step 106 the step of applying binding agent to contact faces between the heat pipe 2 and the upper plate 11 (and the lower plate 12) can be eliminated if the hermetic degree between the heat pipe 2 and the upper plate I (and the lower plate 12) is sufficient.
  • the step of applying binding agent to contact faces between the upper plate 11 and the lower plate 12 can also be eliminated.
  • the end product is manufactured in the step 108, wherein the upper plate 11 and the lower plate 12 are assembled. The high temperature heating process can be eliminated.
  • the isothermal plate assembly with multiple shapes comprises an upper plate 11, a lower plate 12 and flattened heat pipe 2 between the upper plate 11 and the lower plate 12.
  • the upper plate 11 and the lower plate 12 are used to form a closed isothermal plate assembly 1 and define an accommodation space 13 therein for receiving the flattened heat pipe 2.
  • at least one dent 14 is defined on either the upper plate 11 or the lower plate 12.
  • the upper plate 11 or the lower plate 12 with the dent 14 is assembled with the lower plate 12 or the upper plate 11 with smooth face to form an isothermal plate 1 with the accommodation space 13, as shown in Fig. 3.
  • both the upper plate 11 and the lower plate 12 are provided with dents 14, 14' to define the accommodation space 13 when the upper plate 11 and the lower plate 12 are assembled together.
  • the upper plate 11 and the lower plate 12 provided with dent 14, 14' are assembled by the help of outer coupling plates 111 and 121.
  • the accommodation space 13 is defined by the dents provided by the upper plate 11 and the lower plate 12.
  • the upper plate 11 and the lower plate 12 can be subjected to bending operation of other shape before assembling into the isothermal plate 1.
  • the shape is, for example, L shape in Fig. 2, U shape in Fig. 6 or S shape in Fig. 7.
  • the heat pipe 2 is placed in the accommodation space 13 defined by the dents provided by the upper plate 11 and the lower plate 12 and is functioned to provide heat conduction.
  • the heat pipe 2 is flattened to increase a contact surface between the upper plate 11 and the lower plate 12 and can be bent according to the shape of the upper plate 11 and the lower plate 12. Therefore, the heat pipe 2 has shape corresponding to the shape of the accommodation space 13 between the upper plate 11 and the lower plate 12.
  • the heat pipe 2 can be easily assembled into the accommodation space 13, as shown in Figs. 2 to 5.

Landscapes

  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Adornments (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Tunnel Furnaces (AREA)

Claims (8)

  1. Verfahren zum Herstellen einer isothermischen Plattenanordnung (1), das die folgenden Schritte umfasst:
    - Vorsehen einer oberen Platte (11) und einer unteren Platte (12) mit einem dazwischen definierten Aufnahmeraum (13);
    - Biegen der oberen Platte (11) und der unteren Platte (12) in eine vorgegebene Form;
    - Vorsehen eines abgeflachten Wärmerohrs (2) und Biegen des Wärmerohrs (2) in die vorgegebene Form; und
    - Anordnen des gebogenen Wärmerohrs (2) in dem Aufnahmeraum (13) und Zusammenfügen der oberen Platte (11) und der unteren Platte (12).
  2. Verfahren zum Herstellen einer isothermischen Plattenanordnung (1) nach Anspruch 1, bei dem das abgeflachte Wärmerohr (2) in dem Aufnahmeraum (13) angeordnet wird, anschließend die obere Platte (11) und die untere Platte (12) gemeinsam mit dem Wärmerohr gebogen werden und dann die obere Platte (11) und die untere Platte (12) zusammengefügt werden.
  3. Verfahren zum Herstellen einer isothermischen Plattenanordnung (1) nach Anspruch 1, das ferner umfasst:
    - Ausführen eines Heißschmelzprozesses, um die obere Platte (11) und die untere Platte (12) abzudichten, und anschließend Kühlen der oberen Platte (11) und der unteren Platte (12), um eine isothermische Plattenanordnung (1) mit vorgegebener Form zu bilden.
  4. Verfahren zum Herstellen einer isothermischen Plattenanordnung (1) nach Anspruch 3, bei dem die vorgegebene Form eine L-Form, eine U-Form oder eine S-Form ist.
  5. Verfahren zum Herstellen einer isothermischen Plattenanordnung (1) nach Anspruch 3, bei der das abgeflachte Wärmerohr (2) in dem Aufnahmeraum angeordnet wird, anschließend die obere Platte (11) und die untere Platte (12) gemeinsam mit dem Wärmerohr gebogen werden und dann die obere Platte (11) und die untere Platte (12) zusammengefügt werden.
  6. Verfahren zum Herstellen einer isothermischen Plattenanordnung (1) nach Anspruch 3, das ferner den folgenden Schritt umfasst:
    - Aufbringen eines Bindemittels auf eine Kontaktfläche zwischen dem Wärmerohr (2) und der oberen Platte (11) bzw. der unteren Platte (12), wobei das Bindemittel in dem Heißschmelzprozess geschmolzen wird, um einen Spalt zwischen dem Wärmerohr (2) und der oberen Platte (11) bzw. der unteren Platte (12) abzudichten.
  7. Verfahren zum Herstellen einer isothermischen Plattenanordnung (1) nach Anspruch 3, das ferner den folgenden Schritt umfasst:
    - Zusammenfügen der oberen Platte (11) und der unteren Platte (12) durch einen Niet-, Einrastverriegelungs-, Einbettungs-, Punktschweiß-, Verschraubungs- oder Klebeschritt und wahlweises Aufbringen eines Bindemittels auf eine Kontaktfläche zwischen der oberen Platte (11) und der unteren Platte (12).
  8. Verfahren zum Herstellen einer isothermischen Plattenanordnung (1) nach Anspruch 3, das ferner die folgenden Schritte umfasst:
    - nach dem Zusammenfügen der oberen Platte (11) und der unteren Platte (12)
    - Schicken der mit der oberen Platte (11) zusammengefügten unteren Platte (12) zu einem Hochtemperaturofen oder einem Schmelzofen für einen Heißschmelzprozess; und
    - Kühlen der mit der oberen Platte (11) zusammengefügten unteren Platte (12).
EP05000861A 2005-01-17 2005-01-17 Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form Not-in-force EP1681527B1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ES05000861T ES2287814T3 (es) 2005-01-17 2005-01-17 Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada.
PL05000861T PL1681527T3 (pl) 2005-01-17 2005-01-17 Sposób wytwarzania zespołu płytki izotermicznej o określonym kształcie
DK05000861T DK1681527T3 (da) 2005-01-17 2005-01-17 Fremgangsmåde til fremstilling af et isotermisk pladeaggregat med forudbestemt form
EP05000861A EP1681527B1 (de) 2005-01-17 2005-01-17 Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form
AT05000861T ATE362604T1 (de) 2005-01-17 2005-01-17 Herstellungsverfahren für eine isotherme plattenanordnung mit vorbestimmter form
DE602005001153T DE602005001153T2 (de) 2005-01-17 2005-01-17 Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05000861A EP1681527B1 (de) 2005-01-17 2005-01-17 Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form

Publications (2)

Publication Number Publication Date
EP1681527A1 EP1681527A1 (de) 2006-07-19
EP1681527B1 true EP1681527B1 (de) 2007-05-16

Family

ID=34933339

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05000861A Not-in-force EP1681527B1 (de) 2005-01-17 2005-01-17 Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form

Country Status (6)

Country Link
EP (1) EP1681527B1 (de)
AT (1) ATE362604T1 (de)
DE (1) DE602005001153T2 (de)
DK (1) DK1681527T3 (de)
ES (1) ES2287814T3 (de)
PL (1) PL1681527T3 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2657338B2 (es) * 2016-09-02 2019-01-29 Eidopia S L Sistema opto-térmico basado en pletinas térmicas bidimensionales
EP4165358A1 (de) * 2020-06-11 2023-04-19 Signify Holding B.V. Dampfkammeranordnung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2947000C2 (de) * 1978-11-22 1985-04-18 Pioneer Electronic Corp., Tokio/Tokyo Gehäuse für elektronische Vorrichtungen
US4461343A (en) * 1982-01-28 1984-07-24 Mcdonnell Douglas Corporation Plated heat pipe
DE3543673A1 (de) * 1985-12-11 1987-06-19 Sueddeutsche Kuehler Behr Einrichtung zum heizen
US4880052A (en) * 1989-02-27 1989-11-14 Thermacore, Inc. Heat pipe cooling plate
JPH04366394A (ja) * 1991-06-11 1992-12-18 Akutoronikusu Kk ハイブリッド型ヒートパイプ平板構造体
US6133631A (en) * 1997-05-30 2000-10-17 Hewlett-Packard Company Semiconductor package lid with internal heat pipe
JP2981505B2 (ja) * 1998-04-10 1999-11-22 ダイヤモンド電機株式会社 ヒートパイプの加工方法
JP2001165584A (ja) * 1999-12-02 2001-06-22 Tokai Rubber Ind Ltd シート状ヒートパイプ
JP2001241869A (ja) * 2000-02-24 2001-09-07 Toshiba Corp ヒートパイプ構造
US6679318B2 (en) * 2002-01-19 2004-01-20 Allan P Bakke Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
EP1681527A1 (de) 2006-07-19
DE602005001153D1 (de) 2007-06-28
ATE362604T1 (de) 2007-06-15
DK1681527T3 (da) 2007-09-10
DE602005001153T2 (de) 2008-01-24
PL1681527T3 (pl) 2007-10-31
ES2287814T3 (es) 2007-12-16

Similar Documents

Publication Publication Date Title
US7322102B2 (en) Isothermal plate assembly with predetermined shape and method for manufacturing the same
JP3170757U (ja) 放熱装置
US7593228B2 (en) Technique for forming a thermally conductive interface with patterned metal foil
US6637109B2 (en) Method for manufacturing a heat sink
US20100294200A1 (en) Vapor chamber and method for manufacturing the same
US20070047209A1 (en) Heat transfer plate
JPH1038484A (ja) 平面型ヒートパイプ
US7237338B2 (en) Method for manufacturing heat-dissipating device with isothermal plate assembly of predetermined shape
US20110240264A1 (en) Plate-type heat pipe and method for manufacturing the same
GB2420223A (en) A bendable heat spreader with wire mesh microstructure
US6817097B2 (en) Flat plate fuel cell cooler
US9103605B2 (en) Heat exchange device
US20110048341A1 (en) Vapor chamber and method for manufacturing the same
US7096926B2 (en) Thermal pouch interface
US8322403B2 (en) Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having the same
EP1681527B1 (de) Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form
US20120049314A1 (en) Thermoelectric module and method for fabricating the same
CN112218486B (zh) 基于热管及热电制冷器的ltcc集成制冷系统及其制作方法
EP1681911B1 (de) Wärmeableitvorrichtung mit isothermischer Plattenanordnung von gewünschter Form und Herstellungsverfahren
JP5546280B2 (ja) ヒートパイプ受熱部の接続部およびヒートパイプ受熱部の接続方法
CN101522010A (zh) 散热装置及其制造方法
EP2299229B1 (de) Wärmerohren und Befestigungseinheit dafür und Wärmesenke
JP3972878B2 (ja) 冷却プレート及びその製造方法
EP2325592B1 (de) Verfahren und Befestigung zum Herstellen von koplanaren Verdampfern aus Wärmrohren sowie dadurch hergestellter Verdampfer
CN114390869A (zh) 一种y形导流台吸液芯单向传热热管及其加工方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20060124

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR LV MK YU

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RTI1 Title (correction)

Free format text: METHOD FOR MANUFACTURING AN ISOTHERMAL PLATE ASSEMBLY WITH PREDETEMINED SHAPE

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

Ref country code: LI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 602005001153

Country of ref document: DE

Date of ref document: 20070628

Kind code of ref document: P

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070816

REG Reference to a national code

Ref country code: GR

Ref legal event code: EP

Ref document number: 20070402359

Country of ref document: GR

REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070916

REG Reference to a national code

Ref country code: PL

Ref legal event code: T3

ET Fr: translation filed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2287814

Country of ref document: ES

Kind code of ref document: T3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070816

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071016

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20080219

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080117

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080117

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071117

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070516

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DK

Payment date: 20130124

Year of fee payment: 9

Ref country code: ES

Payment date: 20130225

Year of fee payment: 9

Ref country code: CZ

Payment date: 20130111

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20130124

Year of fee payment: 9

Ref country code: GR

Payment date: 20130129

Year of fee payment: 9

Ref country code: PL

Payment date: 20130103

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 20130301

Year of fee payment: 9

BERE Be: lapsed

Owner name: CPUMATE INC.

Effective date: 20140131

REG Reference to a national code

Ref country code: NL

Ref legal event code: V1

Effective date: 20140801

REG Reference to a national code

Ref country code: DK

Ref legal event code: EBP

Effective date: 20140131

REG Reference to a national code

Ref country code: GR

Ref legal event code: ML

Ref document number: 20070402359

Country of ref document: GR

Effective date: 20140801

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140801

Ref country code: CZ

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140117

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140801

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140131

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140131

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20150408

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140118

REG Reference to a national code

Ref country code: PL

Ref legal event code: LAPE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140117

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20150114

Year of fee payment: 11

Ref country code: FR

Payment date: 20150108

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20160112

Year of fee payment: 12

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20160117

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20160930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160117

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160201

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602005001153

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170801