EP1658148B2 - Method for shaping metal sheets - Google Patents

Method for shaping metal sheets Download PDF

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Publication number
EP1658148B2
EP1658148B2 EP04801928.5A EP04801928A EP1658148B2 EP 1658148 B2 EP1658148 B2 EP 1658148B2 EP 04801928 A EP04801928 A EP 04801928A EP 1658148 B2 EP1658148 B2 EP 1658148B2
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EP
European Patent Office
Prior art keywords
reinforcement
base plate
another
forming
plate
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Expired - Fee Related
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EP04801928.5A
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German (de)
French (fr)
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EP1658148A1 (en
EP1658148B1 (en
Inventor
Heiko Engels
Hubertus Steffens
Achim Braun
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Metalsa Automotive GmbH
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Metalsa Automotive GmbH
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Application filed by Metalsa Automotive GmbH filed Critical Metalsa Automotive GmbH
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/02Stamping using rigid devices or tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D35/00Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
    • B21D35/002Processes combined with methods covered by groups B21D1/00 - B21D31/00
    • B21D35/005Processes combined with methods covered by groups B21D1/00 - B21D31/00 characterized by the material of the blank or the workpiece
    • B21D35/007Layered blanks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D39/00Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
    • B21D39/03Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal otherwise than by folding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D49/00Sheathing or stiffening objects

Definitions

  • the invention relates to a method for hot forging of sheets, in particular circuit boards, in a forming tool, applied to a motherboard for partial reinforcement one or more reinforcing boards, the motherboard and the at least one reinforcing board fixed to each other and / or aligned by suitable means to each other and the motherboard and forming the at least one reinforcing board together, wherein a surface coating for forming a bonding layer is applied to the at least one reinforcing board prior to the hot forging operation, wherein the surface coating melts during the hot forging and forms a bond between the motherboard and the at least one reinforcing board.
  • the DE 43 07 563 C2 suggests for the field of deep drawing of sheet metal, therefore, deep-draw base plate and reinforcing plate together or form-punching.
  • the one or more reinforcing plates are attached to the base plate before the common deep-drawing or punching and connected inextricably after deep-drawing or punching with the base plate.
  • this document discloses the provision of corrosion protection measures in the field of superimposed sheets.
  • the provision of coated or galvanized steel sheets or the interposition of a plastic or metal foil or an adhesive layer see also DE 101 20 121 A1 ) called.
  • thermoforming As a thermoforming as Kaltverformvorgang the tools heavily loaded when doubling the deep-drawing sheets, is in the generic DE 100 49 660 A1 proposed to reform a patched composite sheet of a base plate and reinforcing sheet (s) in the hot state at 800 - 850 ° C in a desired shape and to cool defined on the forming tool with mechanical maintenance of the forming state.
  • the contact surface of at least one of the plates is provided with a brazing blanket area before being applied to the base plate. After the soldering and before heating, a connection point between the reinforcement plate and the base plate is set to ensure a clear positioning of the sheets together.
  • the patched composite sheet is heated to a temperature above the forming temperature of the material of the sheets, formed in the hot state into the desired shape and then cooled defined under mechanical fixation in the forming state in the closed held forming tool and / or fixing and cutting tool.
  • the DE 198 26 290 A1 discloses a method of manufacturing partial double sheet or multiple sheet metal structures formed from a base sheet and one or more reinforcing sheets which may be deep drawn, bent or die-stamped together. From the DE 199 57 910 A1 For example, a method is known for roll profiling two or more sheets that are brought together between oppositely rotating rolls. In the in the DE 199 19 783 A1 described method is a bonding of at least two sheets by a partial cross-linking of an adhesive before forming. A complete cross-linking of the adhesive takes place only after the forming.
  • the EP 0 857 526 A1 relates to a forming part with a partially formed multiple sheet metal structure, wherein the reinforcing plates are welded overlapping each other with the base sheet.
  • the sheet forming processes discussed above provide either no hot working and thus high and partially differential stress on the thermoforming tool, or hot working, which, however, is cumbersome when applied in paste form due to the use of blanket brazing application. precise metering and positioning when sprayed on, sprinkled or applied in the form of chips or applied in the form of a solder foil is, where in such a prior accurate blank is required.
  • the provision of a pocket or a cavity for a glass intermediate element or a glass mat has the disadvantage that on the one hand such a cavity must be created, on the other hand, the glass mat, if it does not have the dimensions of the reinforcing plate, the ingress of moisture at their edges allows and thus corrosion of the sheets used.
  • the present invention is an object of the invention to provide a method for hot forming of sheets or boards, which does not have the disadvantages mentioned above and allows the production of moldings in lightweight construction with provided for a partial higher stress reinforcement, with respect to the above Technique for even more effective corrosion protection in conjunction with a secure connection of motherboard and reinforcement board (s) is to be made possible.
  • the object is achieved for a method of the type mentioned above in that the connecting layer consists of a coating applied to the motherboard and / or the at least one reinforcing board adhesive and the warm forging at temperatures between 500 ° C and 730 ° C, in particular 500 ° C and 700 ° C, in particular 500 ° C and 650 ° C.
  • This provides a process for hot forging sheet metal, particularly blanks, which combines the advantages of co-forming blanks to be joined and hot forging with those of optimum sealing and bonding of the blanks. Due to the use of a common hot forging of motherboard and reinforcing board (s), very good manufacturing accuracy and avoidance of gaps between the reshaped boards can be achieved in combination with the advantage of an arbitrarily high degree of forming due to the use of hot forging as opposed to cold forming, for example like deep drawing. As a result, in particular the press tools used can be spared, even when using almost any material thicknesses of boards and their combination with each other. In warm forging, lower temperatures are used than in hot forming, which generally does not harden the material.
  • high-strength materials can be used which already have high-strength properties.
  • a surface coating for forming a connecting layer is applied to the at least one reinforcing plate, wherein the surface coating is applied to the at least one reinforcing plate before the hot forging process, wherein the surface coating melts during forming and forms a connection between the motherboard and the at least one reinforcing plate ,
  • the reinforcement board (s) By coating the reinforcement board (s), an optimal and uniform connection with the motherboard is possible up to the edge of the reinforcement board and, if necessary, of individual reinforcement boards. In this way, a full-surface connection of the boards can be achieved up to the edge region of the reinforcing board (s) even with very complex shapes.
  • An additional application of a sealant bead in the edge region of the at least one reinforcing plate is therefore no longer necessary, but may, if desired, nevertheless be provided.
  • a silicone in particular epoxy resin adhesive, polyurethane adhesive, hot melt adhesive, PUR dispersion adhesive, etc.
  • the coating can be done, for example, by rolling, dipping, printing, gumming, etc.
  • the tie layer may completely cover the surface of the reinforcing board (s). However, it can also be formed as a pattern or mask on the surface of the at least one reinforcing plate and / or the motherboard, in particular surrounding the edge region of the reinforcing board substantially gapless. In some cases, it is not absolutely necessary to provide the entire surface of the reinforcing board (s) with the respective bonding layer, since a connection of the molded boards is already supported by their shaping and sealing only in the edge region of the reinforcing board (s) for corrosion protection appropriate is. In the choice of the pattern or the mask, this (s) is advantageously matched to the forces acting on the finished molding during operation, so that unintentional release of the boards can be avoided from each other.
  • the connecting layer consists of a coating applied to the motherboard and / or the at least one reinforcing board adhesive, which melts during the forming process and forms a firm connection between motherboard and reinforcing board (s) during cooling.
  • the adhesive melts and forms an adhesive coating on the reinforcing sheet (s).
  • Corrosion protection is possible as well as a firm connection of the molded boards.
  • an adhesive will be used as the tie-layer. This can melt during the forming process, harden on cooling and form a firm connection between the motherboard and the at least one reinforcing board.
  • a bonding layer is provided between a molded motherboard and at least one reinforcing board in the form of an adhesive and / or molten and solidified glass material which interconnects the motherboard and the at least one reinforcing board and / or multiple reinforcing boards.
  • a reinforcing board is arranged on the motherboard and fixed and / or aligned by suitable means to this or several reinforcing boards next to and / or one above the other on the motherboard arranged and fixed and / or aligned by suitable means to each other and / or to the motherboard.
  • Particularly preferred is provided with the provision of only one gain board on the motherboard and fixed and / or aligned by suitable means to this or providing several reinforcing boards these are overlapping and / or abutting each other in a partial area and / or spaced from each other on the motherboard fixed and / or aligned with each other by suitable means.
  • stud bolts or the like may be particularly preferably provided in the forming tool or the forming press.
  • the reinforcing boards are connected to each other abutting each other before the forming process, in particular by attaching a weld or other connecting seam.
  • this butt seam can be leveled during forming, so that no uneven transition points remain.
  • the boards are fixed to each other before the warm forging and / or after the warm forging by additional compounds, in particular by welding, riveting, clinching or another connection method.
  • additional compounds in particular by welding, riveting, clinching or another connection method.
  • the unique position of the reinforcing plate (s) applied selectively at certain points on the surface of the motherboard is fixed, so that it does not substantially change during the forming, especially before forming.
  • a fixation proves to be advantageous in itself otherwise by shearing off possibly easily releasing connections between motherboard and reinforcement board (s), since especially an additional punctiform connection can counteract unwanted shearing.
  • the shaped reinforcing boards serve e.g. as internal reinforcement, the molded motherboard as external reinforcement of a vehicle B-pillar.
  • FIG. 1 shows the first processing step of an alternative method for hot forging of blanks.
  • the reinforcing boards 2, 3, 4 are initially provided with a surface coating 20, 30, 40.
  • This surface coating consists of an adhesive which melts under the influence of heat and at the latest on cooling of the molded blanks with these adhesively bonding adhesive.
  • the surface 10 of the motherboard and / or both the surface of the motherboard and the reinforcing boards can be provided with a surface coating which also allows connection to the reinforcing boards when heated, eg in the manner of a multi-component adhesive.
  • the reinforcing plates 2, 3, 4 are then placed on the motherboard 1 and fixed in the case shown in FIG. 7 at various points, for example by welding points 5.
  • This resulting unit of a composite board 60 is subsequently introduced into a furnace 7, such as FIG. 2 can be seen.
  • the composite board is heated to a suitable temperature for warm forging and forwarded to the forming press 8 ( FIG. 3 ). Therein, the warm forging takes place with corresponding temperatures.
  • the surface coating of the boards melts and bonds to the respective adjacent board surface. Therefore, a bonding layer 12 is formed directly during the forming, which allows a dense and firmly connected unit of the molded blanks.
  • the bonding layer 12 is cooled and thereby hardens. Any gaps between motherboard and reinforcing boards remaining or remaining during molding are filled by the bonding layer, thereby creating a dense corrosion prevention unit.
  • the joints already existing and remaining during hot forging in the form of e.g.
  • Welding points even more or these may be again provided for additional connection of the molded boards to each other. In principle, however, it is already possible to ensure a sufficiently firm hold of the molded blanks on one another by the combination of the fixing connecting points applied before forming and the connecting layer.
  • the forming press 8 as in FIG. 3 is shown, a finished molded part can be removed, which can be used as a structural part in vehicle construction after a customarily subsequent to the forming cutting.

Description

Die Erfindung betrifft ein Verfahren zum Halbwarmumformen von Blechen, insbesondere Platinen, in einem Umformwerkzeug, wobei auf eine Grundplatine zur partiellen Verstärkung ein oder mehrere Verstärkungsplatinen aufgebracht, die Grundplatine und die zumindest eine Verstärkungsplatine aufeinander fixiert und/oder durch geeignete Mittel zueinanderausgerichtet und die Grundplatine und die zumindest eine Verstärkungsplatine zusammen umgeformt werden, wobei auf die zumindest eine Verstärkungsplatine vor dem Halbwarmumformvorgang eine Oberflächenbeschichtung zum Bilden einer bzw. als Verbindungsschicht aufgebracht wird, wobei die Oberflächenbeschichtung während des Halbwarmumformens schmilzt und eine Verbindung zwischen der Grundplatine und der zumindest einen Verstärkungsplatine bildet.The invention relates to a method for hot forging of sheets, in particular circuit boards, in a forming tool, applied to a motherboard for partial reinforcement one or more reinforcing boards, the motherboard and the at least one reinforcing board fixed to each other and / or aligned by suitable means to each other and the motherboard and forming the at least one reinforcing board together, wherein a surface coating for forming a bonding layer is applied to the at least one reinforcing board prior to the hot forging operation, wherein the surface coating melts during the hot forging and forms a bond between the motherboard and the at least one reinforcing board.

Derartige Verfahren sind im Stand der Technik bekannt, insbesondere bei der Fertigung von Formteilen für Fahrzeuge. Gerade im Fahrzeugbereich besteht die grundsätzliche Anforderung, Teile möglichst gewichtsparend im Leichtbau auszugestalten. Hierdurch können der Kraftstoffverbrauch des Fahrzeugs gesenkt und dessen Handhabbarkeit sowie die Fahreigenschaften deutlich verbessert werden. Zugleich soll jedoch eine gute Stabilität der Fahrzeugteile sichergestellt werden, vorallem eine Crash-Stabilität. Für die partiell stark bei einem solchen Crash beanspruchten Formteile, wie beispielsweise Fahrzeugholme, ist es bekannt, diese stärker beanspruchten Stellen lokal verstärkt auszubilden. Eine solche lokale Verstärkung kann durch eine Querschnittsvergrößerung beispielsweise durch Aufdoppeln von Blechen erfolgen. Früher wurden das Grundblech und das Verstärkungsblech jeweils für sich allein tiefgezogen und nachfolgend zu einem vollständigen Strukturteil zusammengefügt. Da in den seltensten Fällen eine genaue Passform zwischen dem aufzufügenden geformten Verstärkungsblech und dem separat geformten Grundblech erzielt werden kann, entstehen beim Zusammenfügen solcher Formteile üblicherweise zumindest im Randbereich Spalte. In diese kann Feuchtigkeit eindringen und zu Korrosion führen. Dies ist jedoch besonders zu vermeiden, da die Aufdoppelungen gerade dort vorgesehen werden, wo eine Verstärkung des verwendeten Blechs erforderlich ist. Auftretende Korrosion führt jedoch zu einer Schwächung eines solchen Bereichs.Such methods are known in the art, especially in the manufacture of molded parts for vehicles. Especially in the vehicle sector, there is the fundamental requirement to design parts as lightweight as possible in lightweight construction. As a result, the fuel consumption of the vehicle can be reduced and its handling and driving characteristics can be significantly improved. At the same time, however, a good stability of the vehicle parts should be ensured, especially a crash stability. For the partially heavily loaded in such a crash moldings, such as vehicle uprights, it is known to locally strengthen these more stressed areas. Such a local reinforcement can be achieved by a cross-sectional enlargement, for example by doubling sheets. Previously, the base plate and the reinforcing plate were each deep-drawn by itself and subsequently assembled into a complete structural part. Since in the rarest cases, a precise fit between the aufzufügenden shaped reinforcing sheet and the separately shaped base plate can be achieved, arise when joining such moldings usually at least in the edge region gaps. In this moisture can penetrate and lead to corrosion. However, this is particularly to be avoided since the doublings are provided precisely where reinforcement of the sheet used is required. Occurring corrosion, however, leads to a weakening of such an area.

Die DE 43 07 563 C2 schlägt für den Bereich des Tiefziehens von Blechen daher vor, Grundblech und Verstärkungsblech gemeinsam tiefzuziehen oder formzustanzen. Das oder die Verstärkungsbleche werden an dem Grundblech vor dem gemeinsamen Tiefziehen oder Formstanzen befestigt und nach dem Tiefziehen oder Formstanzen unlösbar mit dem Grundblech verbunden. Außerdem offenbart diese Druckschrift das Vorsehen von Korrosionsschutzmaßnahmen im Bereich der aufeinanderliegenden Bleche. Hierzu werden das Vorsehen von beschichteten oder verzinkten Stahlblechen oder das Zwischenfügen einer Kunststoff- oder Metallfolie oder einer Kleberschicht (siehe auch DE 101 20 121 A1 ) genannt.The DE 43 07 563 C2 suggests for the field of deep drawing of sheet metal, therefore, deep-draw base plate and reinforcing plate together or form-punching. The one or more reinforcing plates are attached to the base plate before the common deep-drawing or punching and connected inextricably after deep-drawing or punching with the base plate. In addition, this document discloses the provision of corrosion protection measures in the field of superimposed sheets. For this purpose, the provision of coated or galvanized steel sheets or the interposition of a plastic or metal foil or an adhesive layer (see also DE 101 20 121 A1 ) called.

Da ein Tiefziehen als Kaltverformvorgang die Werkzeuge bei Aufdoppeln der tiefzuziehenden Bleche stark belastet, wird in der gattungsbildenden DE 100 49 660 A1 vorgeschlagen, ein gepatchtes Verbundblech aus einem Grundblech und Verstärkungsblech(en) im Warmzustand bei 800 - 850°C in eine gewünschte Form umzuformen und auf dem Umformwerkzeug unter mechanischer Aufrechterhaltung des Umformzustandes definiert abzukühlen. Zum Verbinden des Grundblechs und der Verstärkungsbleche wird vor deren Aufbringen auf das Grundblech die Kontaktfläche wenigstens eines der Bleche flächendeckend mit einem Hartlot versehen. Nach dem Lotauftrag und vor dem Erwärmen wird ein Verbindungspunkt zwischen Verstärkungsblech und Grundblech gesetzt, um eine eindeutige Positionierung der Bleche aneinander sicherzustellen. Vor dem gemeinsamen Umformen wird das gepatchte Verbundblech auf eine Temperatur oberhalb der Umformtemperatur des Werkstoffs der Bleche erwärmt, im Warmzustand in die gewünschte Form umgeformt und anschließend unter mechanischer Fixierung im Umformzustand in dem geschlossen gehaltenen Umformwerkzeug und/oder Fixier- und Beschneidungswerkzeug definiert abgekühlt.As a thermoforming as Kaltverformvorgang the tools heavily loaded when doubling the deep-drawing sheets, is in the generic DE 100 49 660 A1 proposed to reform a patched composite sheet of a base plate and reinforcing sheet (s) in the hot state at 800 - 850 ° C in a desired shape and to cool defined on the forming tool with mechanical maintenance of the forming state. To connect the base plate and the reinforcing plates, the contact surface of at least one of the plates is provided with a brazing blanket area before being applied to the base plate. After the soldering and before heating, a connection point between the reinforcement plate and the base plate is set to ensure a clear positioning of the sheets together. Before the common forming, the patched composite sheet is heated to a temperature above the forming temperature of the material of the sheets, formed in the hot state into the desired shape and then cooled defined under mechanical fixation in the forming state in the closed held forming tool and / or fixing and cutting tool.

Ein ähnliches Verfahren wie die DE 100 49 660 A1 offenbart auch die DE 101 36 433 A1 . Gemäß dieser Druckschrift wird eine lokale hohe Verstärkung und Steifigkeitserhöhung bei geringem zusätzlichen Gewicht bei einem Sandwichaufbau aus Grundblech und Verstärkungsblech dadurch erzielt, dass zwischen diese beiden Bleche ein Formkörper aus Glas oder eine Glasmatte eingefügt wird. Ein Umformen erfolgt dann entsprechend der DE 100 49 660 A1 durch Warmumformen des gesamten gepatchten Verbundblechs, wobei zunächst wiederum eine Erwärmung auf Temperaturen oberhalb der Umformtemperatur der Werkstoffe der Bleche erfolgt, nachfolgend der Verbund im Warmzustand in ein Umformwerkzeug eingelegt, in die gewünschte Form umgeformt und unter mechanischer Fixierung des gewünschten Umformzustandes abgekühlt wird. Um einen Austritt des teigigen Glases aus dem Spalt zwischen dem Grundblech und dem Verstärkungsblech zu vermeiden, wird der Rand des Verstärkungsblechs um das Glas-Zwischenelement herum mit dem Grundblech verbunden, wodurch für das Glas-Zwischenelement ein Hohlraum entsteht.A similar procedure as the DE 100 49 660 A1 also reveals the DE 101 36 433 A1 , According to this publication, a local high reinforcement and rigidity increase with low additional weight in a sandwich construction of base plate and reinforcing plate is achieved in that between these two sheets, a molded body made of glass or a glass mat is inserted. Forming then takes place according to the DE 100 49 660 A1 by hot forming the entire patched composite sheet, initially again heating to temperatures above the forming temperature of the materials of the sheets, then the composite is placed in a hot state in a forming tool, formed into the desired shape and cooled with mechanical fixation of the desired forming state. To avoid leakage of the doughy glass from the gap between the base plate and the reinforcing plate, the edge of the reinforcing plate is connected to the base plate around the glass intermediate element, whereby a cavity is created for the intermediate glass element.

Aus der DE 101 35 647 C1 ist ein Auftragen einer nichtmetallischen, anorganischen Abdichtmasse auf einem randnahen Kontaktbereich von Blechen, ein Aufeinanderlegen der Bleche, Erwärmen des gepatchten Verbundblechs auf eine oberhalb der Umformtemperatur des Werkstoffs liegende Temperatur, Umformen im Warmzustand und anschließendes mechanisches Fixieren des Umformzustandes durch Abkühlen offenbart.From the DE 101 35 647 C1 is a application of a non-metallic, inorganic sealant on a near-edge contact area of sheets, a stacking of the sheets, heating the patched composite sheet to a temperature above the forming temperature of the material, forming in the hot state and subsequent mechanical fixing of the forming state by cooling disclosed.

Die DE 198 26 290 A1 offenbart ein Verfahren zum Fertigen von partiellen Doppelblech- oder Mehrfachblechstrukturen, die aus einem Grundblech und einem oder mehreren Verstärkungsblechen gebildet sind, die gemeinsam tiefgezogen, gebogen oder formgestanzt werden können. Aus der DE 199 57 910 A1 ist ein Verfahren zur Rollprofilierung von zwei oder mehr Blechen bekannt, die zwischen entgegengesetzt rotierenden Rollen zusammengeführt werden. Bei dem in der DE 199 19 783 A1 beschriebenen Verfahren erfolgt eine Verklebung von wenigstens zwei Blechen durch eine Teilvernetzung eines Klebers vor der Umformung. Eine Vollvernetzung des Klebers erfolgt erst nach der Umformung. Die EP 0 857 526 A1 betrifft ein Umformteil mit einer bereichsweise ausgebildeten Mehrfachblechstruktur, wobei die Verstärkungsbleche miteinander überlappend mit dem Basisblech verschweißt sind.The DE 198 26 290 A1 discloses a method of manufacturing partial double sheet or multiple sheet metal structures formed from a base sheet and one or more reinforcing sheets which may be deep drawn, bent or die-stamped together. From the DE 199 57 910 A1 For example, a method is known for roll profiling two or more sheets that are brought together between oppositely rotating rolls. In the in the DE 199 19 783 A1 described method is a bonding of at least two sheets by a partial cross-linking of an adhesive before forming. A complete cross-linking of the adhesive takes place only after the forming. The EP 0 857 526 A1 relates to a forming part with a partially formed multiple sheet metal structure, wherein the reinforcing plates are welded overlapping each other with the base sheet.

Bei den vorstehend erörterten Verfahren zum Umformen von Blechen wird entweder kein Warmumformen und somit eine hohe und partiell unterschiedliche Belastung des Tiefziehwerkzeugs vorgesehen oder eine Warmumformung, die jedoch aufgrund der Verwendung eines flächendeckenden Aufbringens eines Hartlots sich als mühsam erweist, wenn es in Pastenform aufgebracht wird, einer genauen Dosierung und Positionierung bedarf, wenn es aufgesprüht, aufgestreut oder in Form von Spänen aufgelegt wird oder in Form einer Lötfolie aufgebracht wird, wobei bei einer solchen auch ein vorheriger genauer Zuschnitt erforderlich ist. Das Vorsehen einer Tasche bzw. eines Hohlraums für ein Glas-Zwischenelement oder eine Glasmatte weist den Nachteil auf, dass einerseits ein solcher Hohlraum geschaffen werden muss, andererseits die Glasmatte, wenn sie nicht die Abmessungen des Verstärkungsblechs aufweist, das Eindringen von Feuchtigkeit an ihren Rändern zulässt und somit eine Korrosion der verwendeten Bleche.The sheet forming processes discussed above provide either no hot working and thus high and partially differential stress on the thermoforming tool, or hot working, which, however, is cumbersome when applied in paste form due to the use of blanket brazing application. precise metering and positioning when sprayed on, sprinkled or applied in the form of chips or applied in the form of a solder foil is, where in such a prior accurate blank is required. The provision of a pocket or a cavity for a glass intermediate element or a glass mat has the disadvantage that on the one hand such a cavity must be created, on the other hand, the glass mat, if it does not have the dimensions of the reinforcing plate, the ingress of moisture at their edges allows and thus corrosion of the sheets used.

Der vorliegenden Erfindung liegt nun die Aufgabe zugrunde, ein Verfahren zum Warmumformen von Blechen bzw. Platinen vorzusehen, das die vorstehend genannten Nachteile nicht aufweist und die Herstellung von Formteilen in Leichtbauweise mit für eine partielle höhere Beanspruchung vorgesehener Verstärkung ermöglicht, wobei gegenüber dem vorstehenden Stand der Technik ein noch effektiverer Korrosionsschutz in Verbindung mit einem sicheren Verbinden von Grundplatine und Verstärkungsplatine(n) ermöglicht werden soll.The present invention is an object of the invention to provide a method for hot forming of sheets or boards, which does not have the disadvantages mentioned above and allows the production of moldings in lightweight construction with provided for a partial higher stress reinforcement, with respect to the above Technique for even more effective corrosion protection in conjunction with a secure connection of motherboard and reinforcement board (s) is to be made possible.

Gemäß Anspruch 1 wird die Aufgabe für ein Verfahren der eingangs genannten Art dadurch gelöst, dass die Verbindungsschicht aus einem als Beschichtung auf der Grundplatine und/oder der zumindest einen Verstärkungsplatine aufgetragenen Klebstoff besteht und das Halbwarmumformen bei Temperaturen zwischen 500° C und 730° C, insbesondere 500° C und 700° C, insbesondere 500° C und 650° C erfolgt.According to claim 1, the object is achieved for a method of the type mentioned above in that the connecting layer consists of a coating applied to the motherboard and / or the at least one reinforcing board adhesive and the warm forging at temperatures between 500 ° C and 730 ° C, in particular 500 ° C and 700 ° C, in particular 500 ° C and 650 ° C.

Dadurch wird ein Verfahren zum Halbwarmumformen von Blechen, insbesondere Platinen, geschaffen, bei dem die Vorteile eines gemeinsamen Umformens zu verbindender Platinen und des Halbwarmumformens mit denen einer optimalen Abdichtung und eines optimalen Verbindens der geformten Platinen kombiniert werden. Aufgrund der Verwendung eines gemeinsamen Halbwarmumformens von Grundplatine und Verstärkungsplatine(n) kann eine sehr gute Fertigungsgenauigkeit und Vermeidung von Spalten zwischen den umgeformten Platinen erzielt werden in Kombination mit dem Vorteil eines beliebig hohen Umformgrades, bedingt durch die Verwendung eines Halbwarmumformens im Gegensatz beispielsweise zu einem Kaltumformen wie dem Tiefziehen. Hierdurch können insbesondere die verwendeten Pressen-Werkzeuge geschont werden, sogar bei Verwendung nahezu beliebiger Materialstärken von Platinen und deren Kombination miteinander. Beim Halbwarmumformen werden niedrigere Temperaturen verwendet als beim Warmumformen, wodurch i.a. keine Materialhärtung erfolgt. Es können beispielsweise jedoch Hochfestmaterialien verwendet werden, die bereits hochfeste Eigenschaften aufweisen. In diesem Falle braucht lediglich eine Temperaturerhöhung in Bereiche zwischen 500 und 730°C, besonders bevorzugt zwischen 500 und 700°C, insbesondere um die 650°C zuerfolgen.This provides a process for hot forging sheet metal, particularly blanks, which combines the advantages of co-forming blanks to be joined and hot forging with those of optimum sealing and bonding of the blanks. Due to the use of a common hot forging of motherboard and reinforcing board (s), very good manufacturing accuracy and avoidance of gaps between the reshaped boards can be achieved in combination with the advantage of an arbitrarily high degree of forming due to the use of hot forging as opposed to cold forming, for example like deep drawing. As a result, in particular the press tools used can be spared, even when using almost any material thicknesses of boards and their combination with each other. In warm forging, lower temperatures are used than in hot forming, which generally does not harden the material. However, for example, high-strength materials can be used which already have high-strength properties. In this case, only a temperature increase in ranges between 500 and 730 ° C, more preferably between 500 and 700 ° C, in particular to 650 ° C to succeed.

Erfindungsgemäß ist auf die zumindest eine Verstärkungsplatine eine Oberflächenbeschichtung zum Bilden einer bzw. als Verbindungsschicht aufgebracht wobei die Oberflächenbeschichtung vor dem Halbwarmumformvorgang auf die zumindest eine Verstärkungsplatine aufgetragen wird, wobei die Oberflächenbeschichtung während des Umformens schmilzt und eine Verbindung zwischen der Grundplatine und der zumindest einen Verstärkungsplatine bildet. Hierdurch ist es möglich, dass bereits während des Umformens der Platinen diese miteinander verbunden werden. Durch das Beschichten der Verstärkungsplatine(n) ist eine optimale und gleichmäßige Verbindung mit der Grundplatine bis an den Rand der Verstärkungsplatine heran und ggf. von einzelnen Verstärkungsplatinen aufeinander möglich. Hierdurch kann ein vollflächiges Verbinden der Platinen bis in den Randbereich der Verstärkungsplatine(n) sogar bei sehr komplexen Formgebungen erzielt werden. Ein zusätzliches Aufbringen einer Dichtmittelwulst im Randbereich der zumindest einen Verstärkungsplatine ist daher nicht mehr erforderlich, kann jedoch, falls dies gewünscht wird, dennoch vorgesehen werden.According to the invention, a surface coating for forming a connecting layer is applied to the at least one reinforcing plate, wherein the surface coating is applied to the at least one reinforcing plate before the hot forging process, wherein the surface coating melts during forming and forms a connection between the motherboard and the at least one reinforcing plate , This makes it possible that already during the forming of the boards these are interconnected. By coating the reinforcement board (s), an optimal and uniform connection with the motherboard is possible up to the edge of the reinforcement board and, if necessary, of individual reinforcement boards. In this way, a full-surface connection of the boards can be achieved up to the edge region of the reinforcing board (s) even with very complex shapes. An additional application of a sealant bead in the edge region of the at least one reinforcing plate is therefore no longer necessary, but may, if desired, nevertheless be provided.

Als Klebstoff kann ein Silicon, insbesondere Epoxidharzklebstoff, Polyurethanklebstoff, Schmelzklebstoff, PUR-Dispersionsklebstoff, etc., verwendet werden. Die Beschichtung kann beispielsweise durch Aufrollen, Tauchen, Drucken, Gummieren etc. erfolgen.As the adhesive, a silicone, in particular epoxy resin adhesive, polyurethane adhesive, hot melt adhesive, PUR dispersion adhesive, etc., can be used. The coating can be done, for example, by rolling, dipping, printing, gumming, etc.

Die Verbindungsschicht kann die Oberfläche der Verstärkungsplatine(n) vollständig bedecken. Sie kann aber auch als Muster oder Maske auf der Oberfläche der zumindest einen Verstärkungsplatine und/oder der Grundplatine ausgebildet sein, insbesondere den Randbereich der Verstärkungsplatine im Wesentlichen lückenlos umgebend. Teilweise ist es nicht unbedingt erforderlich, die gesamte Oberfläche des/der Verstärkungsplatine(n) mit der jeweiligen Verbindungsschicht zu versehen, da eine Verbindung der geformten Platinen schon durch deren Formgebung unterstützt wird und ein Abdichten lediglich im Randbereich der Verstärkungsplatine(n) zum Korrosionsschutz zweckmäßig ist. Bei der Wahl des Musters oder der Maske wird diese(s) vorteilhaft an die auf das fertige Formteil im Betrieb einwirkenden Kräfte abgestimmt, so dass ein ungewolltes Lösen der Platinen voneinander vermieden werden kann.The tie layer may completely cover the surface of the reinforcing board (s). However, it can also be formed as a pattern or mask on the surface of the at least one reinforcing plate and / or the motherboard, in particular surrounding the edge region of the reinforcing board substantially gapless. In some cases, it is not absolutely necessary to provide the entire surface of the reinforcing board (s) with the respective bonding layer, since a connection of the molded boards is already supported by their shaping and sealing only in the edge region of the reinforcing board (s) for corrosion protection appropriate is. In the choice of the pattern or the mask, this (s) is advantageously matched to the forces acting on the finished molding during operation, so that unintentional release of the boards can be avoided from each other.

Erfindungsgemäß besteht die Verbindungsschicht aus einem als Beschichtung auf der Grundplatine und/oder der zumindest einen Verstärkungsplatine aufgetragenen Klebstoff, der während des Umformvorgangs aufschmilzt und beim Abkühlen eine feste Verbindung zwischen Grundplatine und Verstärkungsplatine(n) bildet. Durch das Halbwarmumformen schmilzt der Klebstoff und bildet auf dem/den Verstärkungsblech(en) einen klebenden Überzug. Beim Abkühlenentsteht eine feste Verbindung zwischen den aneinander liegenden Platinenoberflächen entstehen. Ein Korrosionsschutz wird dabei ebenso ermöglicht wie eine feste Verbindung der geformten Platinen. Im Gegensatz zu dem Vorsehen von Glas-Zwischenelementen in Hohlräumen zwischen einem Grundblech und einem Verstärkungsblech, wie in der DE 101 36 433 A1 offenbart, ist es möglich, eine sehr dünne verbindende Schicht vorzusehen, die sehr viel belastbarer ist als die dicke Glas-Zwischenschicht nach DE 101 36 433 A1 . Hohlräume zwischen Grundplatine und Verstärkungsplatine müssen ebenfalls nicht vorgesehen werden.According to the invention, the connecting layer consists of a coating applied to the motherboard and / or the at least one reinforcing board adhesive, which melts during the forming process and forms a firm connection between motherboard and reinforcing board (s) during cooling. As a result of the warm forging, the adhesive melts and forms an adhesive coating on the reinforcing sheet (s). Upon cooling, a strong bond will form between the adjacent board surfaces. Corrosion protection is possible as well as a firm connection of the molded boards. In contrast to the provision of glass intermediate elements in cavities between a base plate and a reinforcing plate, as in DE 101 36 433 A1 discloses, it is possible to provide a very thin interconnecting layer which is much more resilient than the thick glass intermediate layer after DE 101 36 433 A1 , Cavities between motherboard and reinforcement board must also not be provided.

Beim Halbwarmumformens von mit einer Verbindungsschicht versehenen Grundplatine und zumindest einer Verstärkungsplatine zusammen wird als Verbindungsschicht ein Klebstoff verwendet werden. Dieser kann während des Umformvorgangs aufschmelzen, beim Abkühlen erhärten und eine feste Verbindung zwischen Grundplatine und der zumindest einen Verstärkungsplatine bilden.In the case of semi-hot forming of a tie-layer base board and at least one reinforcing board together, an adhesive will be used as the tie-layer. This can melt during the forming process, harden on cooling and form a firm connection between the motherboard and the at least one reinforcing board.

Bei einem nach dem erfindungsgemäßen Verfahren hergestellten Strukturtest ist eine Verbindungsschicht zwischen einer geformten Grundplatine und zumindest einer Verstärkungsplatine in Form eines Klebstoffs und/oder geschmolzenen und erstarrten Glaswerkstoffs vorgesehen, der die Grundplatine und die zumindest eine Verstärkungsplatine und/oder mehrere Verstärkungsplatinen miteinander verbindet.In a structural test made by the method of the invention, a bonding layer is provided between a molded motherboard and at least one reinforcing board in the form of an adhesive and / or molten and solidified glass material which interconnects the motherboard and the at least one reinforcing board and / or multiple reinforcing boards.

Bevorzugt wird eine Verstärkungsplatine auf der Grundplatine angeordnet und fixiert und/oder durch geeignete Mittel zu dieser ausgerichtet oder werden mehrere Verstärkungsplatinen neben- und/oder übereinander auf der Grundplatine angeordnet und fixiert und/oder durch geeignete Mittel zueinander und/oder zu der Grundplatine ausgerichtet. Besonders bevorzugt wird bei Vorsehen nur einer Verstärkungsplatine diese auf der Grundplatine angeordnet und fixiert und/oder durch geeignete Mittel zu dieser ausgerichtet oder bei Vorsehen mehrerer Verstärkungsplatinen werden diese einander in einem Teilbereich überlappend und/oder aneinander anstoßend und/oder mit Abstand zueinander auf der Grundplatine fixiert und/oder durch geeignete Mittel zueinander ausgerichtet. Durch das Vorsehen mehrerer Verstärkungsplatinen nebeneinander mit und ohne Abstand zueinander können Spannungen innerhalb eines geformten Werkstücks bzw. Blechstrukturteils vermieden bzw. zumindest reduziert, und Steifigkeitserhöhungen gezielt durchgeführt werden, insbesondere bei Vorsehen unterschiedlicher Material stärken bei Grundplatine und Verstärkungsplatine(n). Durch Vorsehen mehrerer Verstärkungsplatinen übereinander können zusätzlich weitere Materialverstärkungen und somit stark unterschiedliche Steifigkeiten über die Oberfläche des Strukturteils hinweg erzielt werden. Durch das Überlappen mehrerer Verstärkungsplatinen in ihren jeweiligen Randbereichen können ebenfalls Steifigkeitsunterschiede erzeugt werden. Es kann jeweils jedoch auch nur eine Verstärkungsplatine vorgesehen werden, die ggf. zuvor aus mehreren Teilen insbesondere unterschiedlicher Materialstärke zusammengesetzt wurde. Anstelle des Vorsehens einer Fixierung bzw. Verbindung der Platinen untereinander vor dem Umformvorgang ist es ebenso möglich, die Platinen lediglich zueinander ausgerichtet aufeinander zu positionieren und ohne eine Verbindung miteinander umzuformen. Zur Lagefixierung bzw. zum Aufrechterhalten der gegenseitigen Positionierung können insbesondere Stehbolzen oder dergleichen Einrichtungen besonders bevorzugt in dem Umformwerkzeug bzw. der Umformpresse vorgesehen werden.Preferably, a reinforcing board is arranged on the motherboard and fixed and / or aligned by suitable means to this or several reinforcing boards next to and / or one above the other on the motherboard arranged and fixed and / or aligned by suitable means to each other and / or to the motherboard. Particularly preferred is provided with the provision of only one gain board on the motherboard and fixed and / or aligned by suitable means to this or providing several reinforcing boards these are overlapping and / or abutting each other in a partial area and / or spaced from each other on the motherboard fixed and / or aligned with each other by suitable means. By providing multiple reinforcement boards Side by side with and without distance to each other stresses within a shaped workpiece or sheet metal structural part can be avoided or at least reduced, and stiffness increases are selectively carried out, especially when providing different material strengthen motherboard and reinforcement board (s). By providing a plurality of reinforcement boards one above the other, additional material reinforcements and thus greatly differing stiffnesses can be achieved over the surface of the structural part. By overlapping a plurality of reinforcement boards in their respective edge regions, stiffness differences can also be generated. However, in each case only one reinforcing plate can be provided, which if necessary was previously composed of several parts, in particular of different material thickness. Instead of providing a fixation or connection of the boards with each other before the forming process, it is also possible to position the boards only aligned with each other and without forming a connection with each other. To fix the position or to maintain the mutual positioning, stud bolts or the like may be particularly preferably provided in the forming tool or the forming press.

Bevorzugt werden die Verstärkungsplatinen aneinander anstoßend vor dem Umformvorgang miteinander verbunden, insbesondere durch Anbringen einer Schweißnaht oder anderen Verbindungsnaht. Je nach Umformtemperatur und Umformmodus kann diese Stoßnaht beim Umformen egalisiert werden, so dass keine unebenen Übergangsstellen verbleiben.Preferably, the reinforcing boards are connected to each other abutting each other before the forming process, in particular by attaching a weld or other connecting seam. Depending on the forming temperature and forming mode, this butt seam can be leveled during forming, so that no uneven transition points remain.

Vorzugsweise werden die Platinen vor dem Halbwarmumformen und/oder nach dem Halbwarmumformen durch Zusatzverbindungen aneinander fixiert, insbesondere durch Schweißen, Nieten, Durchsetzfügen oder ein anderes Verbindungsverfahren. Hierdurch wird besonders vor dem Umformen die eindeutige Position der gezielt an bestimmten Stellen auf der Oberfläche der Grundplatine aufgebrachten Verstärkungsplatine(n) fixiert, so dass sich diese während des Umformens im Wesentlichen nicht ändert. Nach dem Umformen erweist sich eine Fixierung gerade bei sich ansonsten durch Abscheren ggf. leicht lösenden Verbindungen zwischen Grundplatine und Verstärkungsplatine(n) als vorteilhaft, da besonders eine zusätzliche punktförmige Verbindung einem ungewollten Abscheren entgegenwirken kann.Preferably, the boards are fixed to each other before the warm forging and / or after the warm forging by additional compounds, in particular by welding, riveting, clinching or another connection method. As a result, the unique position of the reinforcing plate (s) applied selectively at certain points on the surface of the motherboard is fixed, so that it does not substantially change during the forming, especially before forming. After reshaping, a fixation proves to be advantageous in itself otherwise by shearing off possibly easily releasing connections between motherboard and reinforcement board (s), since especially an additional punctiform connection can counteract unwanted shearing.

Im Unterschied zu den Lötverbindungen gemäß der DE 100 49 660 A1 erweist sich das Vorsehen von einem Klebstoff als vorteilhaft, die Erwärmungstemperatur nicht in einem für das Lot verträglichen Bereich gehalten zu werden braucht, sondern in einen insbesondere für das Halbwarmumformen geeigneten Bereich eingestellt werden kann. Außerdem wird die Problematik einer Korrosion durch Flussmittel, das für einen Lötvorgang üblicherweise verwendet wird, vermieden.In contrast to the solder joints according to the DE 100 49 660 A1 proves the provision of an adhesive advantageous that the heating temperature does not need to be kept in a tolerable range for the area, but can be adjusted to a suitable in particular for warm forging range. In addition, the problem of corrosion by flux, which is commonly used for a soldering, avoided.

Zur näheren Erläuterung der Erfindung wird im Folgenden ein Ausführungsbeispiel anhand der Zeichnungen näher beschrieben. Diese zeigen in:

Figur 1 bis 4
eine schematische Ansicht des Ablaufs einer zweiten Ausführungsform eines erfindungsgemäßen Halbwarmumformvorgangs unter Vorsehen einer Oberflächenbeschichtung auf Verstärkungsplatinen.
For a more detailed explanation of the invention, an embodiment will be described below with reference to the drawings. These show in:
Figure 1 to 4
a schematic view of the process of a second embodiment of a warm forging process according to the invention under provision of a surface coating on reinforcing boards.

Die geformten Verstärkungsplatinen dienen z.B. als Innenverstärkung, die geformte Grundplatine als Außenverstärkung einer Fahrzeug-B-Säule.The shaped reinforcing boards serve e.g. as internal reinforcement, the molded motherboard as external reinforcement of a vehicle B-pillar.

Figur 1 zeigt den ersten Bearbeitungsschritt eines alternativen Verfahrens zum Halbwarmumformen von Platinen. Hierbei werden die Verstärkungsplatinen 2, 3, 4 zunächst mit einer Oberflächenbeschichtung 20, 30, 40 versehen. Diese Oberflächenbeschichtung besteht aus einem unter Einfluss von Hitze schmelzenden und sich spätestens beim Abkühlen der geformten Platinen mit diesen klebend verbindenden klebstoff. Alternativ zu dem Vorsehen der Oberflächenbeschichtung nur auf den Oberflächen der Verstärkungsplatinen kann auch die Oberfläche 10 der Grundplatine und/oder können sowohl die Oberfläche der Grundplatine als auch die der Verstärkungsplatinen mit einer Oberflächenbeschichtung versehen werden, die beim Erhitzen ebenfalls eine Verbindung mit den Verstärkungsplatinen ermöglicht, z.B. nach Art eines Mehrkomponentenklebers. FIG. 1 shows the first processing step of an alternative method for hot forging of blanks. Here, the reinforcing boards 2, 3, 4 are initially provided with a surface coating 20, 30, 40. This surface coating consists of an adhesive which melts under the influence of heat and at the latest on cooling of the molded blanks with these adhesively bonding adhesive. As an alternative to providing the surface coating only on the surfaces of the reinforcing boards, the surface 10 of the motherboard and / or both the surface of the motherboard and the reinforcing boards can be provided with a surface coating which also allows connection to the reinforcing boards when heated, eg in the manner of a multi-component adhesive.

Mit ihren beschichteten Oberflächen 21, 31, 41 werden die Verstärkungsplatinen 2, 3, 4, anschließend auf die Grundplatine 1 aufgefügt und in dem in Figur 7 dargestellten Fall an verschiedenen Stellen fixiert, beispielsweise durch Schweißpunkte 5.With their coated surfaces 21, 31, 41, the reinforcing plates 2, 3, 4 are then placed on the motherboard 1 and fixed in the case shown in FIG. 7 at various points, for example by welding points 5.

Diese so entstandene Einheit einer Verbundplatine 60 wird nachfolgend in einen Ofen 7 eingebracht, wie Figur 2 zu entnehmen ist. In diesem wird die Verbundplatine auf eine für das Halbwarmumformen geeignete Temperatur erhitzt und in die Umformpresse 8 weitergeleitet (Figur 3). Darin erfolgt die Halbwarmumformung mit entsprechenden Temperaturen. Während des Umformvorgangs schmilzt die Oberflächenbeschichtung der Platinen und verbindet sich mit der jeweiligen angrenzenden Platinenoberfläche. Es entsteht daher direkt während des Umformens eine Verbindungsschicht 12, die eine dichte und zugleich fest verbundene Einheit der geformten Platinen ermöglicht.This resulting unit of a composite board 60 is subsequently introduced into a furnace 7, such as FIG. 2 can be seen. In this, the composite board is heated to a suitable temperature for warm forging and forwarded to the forming press 8 ( FIG. 3 ). Therein, the warm forging takes place with corresponding temperatures. During the forming process, the surface coating of the boards melts and bonds to the respective adjacent board surface. Therefore, a bonding layer 12 is formed directly during the forming, which allows a dense and firmly connected unit of the molded blanks.

Während des Vergütens des Platinenmaterials wird die Verbindungsschicht 12 abgekühlt und härtet dabei aus. Eventuell bei der Formgebung verbleibende oder entstehende Spalte zwischen Grundplatine und Verstärkungsplatinen werden durch die Verbindungsschicht ausgefüllt, wodurch eine dichte Einheit zum Schutz vor Korrosion geschaffen werden kann. Zusätzlich zu den bereits bestehenden und während des Halbwarmumformens verbliebenen Verbindungsstellen in Form von z.B.During annealing of the board material, the bonding layer 12 is cooled and thereby hardens. Any gaps between motherboard and reinforcing boards remaining or remaining during molding are filled by the bonding layer, thereby creating a dense corrosion prevention unit. In addition to the joints already existing and remaining during hot forging in the form of e.g.

Schweißpunkten, können noch weitere oder diese ggf. erneut zum zusätzlichen Verbinden der geformten Platinen aufeinander vorgesehen werden. Grundsätzlich kann jedoch bereits durch die Kombination aus den vor dem Umformen aufgebrachten fixierenden Verbindungsstellen und der Verbindungsschicht ein ausreichend fester Halt der geformten Platinen aufeinander sichergestellt werden.Welding points, even more or these may be again provided for additional connection of the molded boards to each other. In principle, however, it is already possible to ensure a sufficiently firm hold of the molded blanks on one another by the combination of the fixing connecting points applied before forming and the connecting layer.

Der Umformpresse 8, wie sie in Figur 3 gezeigt ist, kann ein fertiges Formteil entnommen werden, das nach einem üblicherweise sich an das Umformen anschließenden Zuschneiden als Strukturteil im Fahrzeugbau etc. verwendet werden kann.The forming press 8, as in FIG. 3 is shown, a finished molded part can be removed, which can be used as a structural part in vehicle construction after a customarily subsequent to the forming cutting.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
Grundplatinemotherboard
22
Verstärkungsplatinereinforcing plate
33
Verstärkungsplatinenreinforcing boards
44
Verstärkungsplatinenreinforcing boards
55
SchweißpunktWeldingSpot
66
Verbundplatinecomposite board
77
Ofenoven
88th
Umformpresseforming press
99
Pfeilearrows
1010
Oberfläche der GrundplatineSurface of the motherboard
1111
Verbindungsschichtlink layer
1212
Verbindungsschichtlink layer
2020
Oberflächenbeschichtungsurface coating
2121
beschichtete Oberflächecoated surface
3030
Oberflächenbeschichtungsurface coating
3131
beschichtete Oberflächecoated surface
4040
Oberflächenbeschichtungsurface coating
4141
beschichtete Oberflächecoated surface
6060
Verbundplatinecomposite board
PP
Pfeilearrows

Claims (8)

  1. A method for the warm forming of sheet metal, in particular plates (1, 2, 3, 4), in a forming die (8), wherein one or a plurality of reinforcement plates (2, 3, 4) are applied to a base plate (1) for the purposes of partial reinforcement, the base plate (1) and the at least one reinforcement plate (2, 3, 4) are fixed on top of one another and/or, by suitable means, are aligned with one another, and the base plate (1) and the at least one reinforcement plate (2, 3, 4) are formed together,
    wherein, before the warm forming process, a surface coating (20, 30, 40) is applied to the at least one reinforcement plate (2, 3, 4) for the formation of a bonding layer, or as a bonding layer,
    and wherein the surface coating melts during the warm forming and forms a bond between the base plate (1) and the at least one reinforcement plate (2, 3, 4),
    characterised in that
    the bonding layer consists of an adhesive applied as a coating on the base plate (1) and/or on the at least one reinforcement plate (2, 3, 4), and the warm forming takes place at temperatures between 500 and 730°C, in particular 500 and 700°C, in particular 500 and 650°C.
  2. The method according to Claim 1,
    characterised in that
    the adhesive is an adhesive that is suitable for high or very high temperatures.
  3. The method according to Claim 1 or 2,
    characterised in that
    the bonding layer is designed as a pattern or mask on the surface of the at least one reinforcement plate (2, 3, 4) and/or the base plate (1), in particular surrounding the edge region of the reinforcement plate.
  4. The method according to one of the preceding claims,
    characterised in that
    a reinforcement plate is arranged and fixed on the base plate (1) and/or, by suitable means, is aligned with the latter, or in that a plurality of reinforcement plates (2, 3, 4) are arranged and fixed on the base plate (1) alongside one another and/or on top of one another and/or, by suitable means, are aligned with one another and/or with the base plate (1).
  5. The method according to one of the preceding claims,
    characterised in that
    a reinforcement plate is arranged and fixed on the base plate (1) and/or, by suitable means, is aligned with the latter, or in that a plurality of reinforcement plates (2, 3, 4) are fixed on the base plate (1) overlapping one another in a sub-region, and/or abutting one another, and/or with a distance apart from one another, and/or, by suitable means, are aligned with one another.
  6. The method according to Claim 5,
    characterised in that
    a plurality of reinforcement plates are bonded to one another in an abutting manner before the forming process, in particular by the application of a weld seam or another bonding seam.
  7. The method according to one of the preceding claims,
    characterised in that
    the base plate (1) and the reinforcement plate(s) (2, 3, 4) have different material thicknesses.
  8. The method according to one of the preceding claims,
    characterised in that
    the plates (1, 2, 3, 4), before the warm forming and/or after the warm forming, are fixed to one another by means of additional bonds, in particular by welding, riveting, clinching or another bonding method.
EP04801928.5A 2003-08-25 2004-08-23 Method for shaping metal sheets Expired - Fee Related EP1658148B2 (en)

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DE10339350A DE10339350B4 (en) 2003-08-25 2003-08-25 Process for hot or hot forging sheet metal
PCT/EP2004/009389 WO2005021177A1 (en) 2003-08-25 2004-08-23 Method for shaping metal sheets

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EP1658148A1 EP1658148A1 (en) 2006-05-24
EP1658148B1 EP1658148B1 (en) 2008-09-10
EP1658148B2 true EP1658148B2 (en) 2015-10-28

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