EP1658148B1 - Method for shaping metal sheets - Google Patents

Description

The invention relates to a method for hot or hot forming of sheets, in particular circuit boards, in a forming tool, wherein applied to a motherboard for partial reinforcement one or more reinforcing boards, the motherboard and the at least one reinforcing board fixed to each other and / or aligned by suitable means and the motherboard and the at least one reinforcing board are formed together.

Such methods are known in the art, especially in the manufacture of molded parts for vehicles. Especially in the vehicle sector, there is the fundamental requirement to design parts as lightweight as possible in lightweight construction. As a result, the fuel consumption of the vehicle can be reduced and its handling and driving characteristics can be significantly improved. At the same time, however, a good stability of the vehicle parts should be ensured, especially a crash stability. For the partially heavily loaded in such a crash moldings, such as vehicle uprights, it is known to locally strengthen these more stressed areas. Such a local reinforcement can be achieved by a cross-sectional enlargement, for example by doubling sheets. Previously, the base plate and the reinforcing plate were each deep-drawn by itself and subsequently assembled into a complete structural part. Since in the rarest cases, a precise fit between the aufzufügenden shaped reinforcing sheet and the separately shaped base plate can be achieved, arise when joining such moldings usually at least in the edge region gaps. In this moisture can penetrate and lead to corrosion. However, this is particularly to be avoided since the doublings are provided precisely where a reinforcement of the sheet used is required. Occurring corrosion, however, leads to a weakening of such an area.

The DE 43 07 563 C2 suggests for the field of deep drawing of sheet metal, therefore, deep-draw base plate and reinforcing plate together or form-punching. The one or more reinforcing plates are attached to the base plate before the common deep-drawing or punching and connected inextricably after deep-drawing or punching with the base plate. In addition, this document discloses the provision of corrosion protection measures in the field of superimposed sheets. For this purpose, the provision of coated or galvanized steel sheets or the interposition of a plastic or metal foil or an adhesive layer (see also DE 101 20 121 A1 ) called.

Since deep drawing as Kaltverformvorgang the tools when doubling the deep-drawing sheets heavily loaded, is in the DE 100 49 660 A1 proposed to form a patched composite sheet of a base plate and reinforcing sheet (s) in the hot state at 800 - 850 ° C in a desired shape and to cool defined on the forming tool with mechanical maintenance of the forming state. To connect the base plate and the reinforcing plates, the contact surface of at least one of the plates is provided with a brazing blanket area before being applied to the base plate. After the soldering and before heating, a connection point between the reinforcement plate and the base plate is set to ensure a clear positioning of the sheets together. Before the joint forming the patched composite sheet is heated to a temperature above the forming temperature of the material of the sheets, formed in the hot state into the desired shape and then held under mechanical fixation in the forming state in the closed Forming tool and / or fixing and cutting tool defined chilled.

A similar procedure as the DE 100 49 660 A1 also reveals the DE 101 36 433 A1 , According to this publication, a local high reinforcement and rigidity increase with low additional weight in a sandwich construction of base plate and reinforcing plate is achieved in that between these two sheets, a molded body made of glass or a glass mat is inserted. Forming then takes place according to the DE 100 49 660 A1 by hot forming the entire patched composite sheet, initially again heating to temperatures above the forming temperature of the materials of the sheets, then the composite is placed in a hot state in a forming tool, formed into the desired shape and cooled with mechanical fixation of the desired forming state. To avoid leakage of the doughy glass from the gap between the base plate and the reinforcing plate, the edge of the reinforcing plate is connected to the base plate around the glass intermediate element, whereby a cavity is created for the intermediate glass element.

From the DE 101 35 647 C1 is a application of a non-metallic, inorganic sealant on a near-edge contact area of sheets, a stacking of the sheets, heating the patched composite sheet to a temperature above the forming temperature of the material, forming in the hot state and subsequent mechanical fixing of the forming state by cooling disclosed.

The sheet forming processes discussed above provide either no hot working and thus high and partially differential stress on the thermoforming tool, or hot working, which, however, is cumbersome when applied in paste form due to the use of blanket brazing application. precise metering and positioning when sprayed on, sprinkled or applied in the form of chips or applied in the form of a solder foil is, where in such a prior accurate blank is required. The provision of a pocket or a cavity for a glass intermediate element or a glass mat has the disadvantage that on the one hand such a cavity must be created, on the other hand, the glass mat, if it does not have the dimensions of the reinforcing plate, allows the penetration of moisture at their edges and thus corrosion of the sheets used.

The present invention is an object of the invention to provide a method for hot forming of sheets or boards, which does not have the disadvantages mentioned above and allows the production of moldings in lightweight construction with provided for a partial higher stress reinforcement, with respect to the above Technique for even more effective corrosion protection in conjunction with a secure connection of motherboard and reinforcement board (s) is to be made possible.

According to claim 1, the object of a method of the type mentioned is achieved in that the motherboard and the at least one reinforcing board singulated after forming, provided with at least one connecting layer and are joined together again. According to claim 5, the object is achieved in that on the at least one reinforcing plate before the warm forging or hot forming a surface coating is applied to form a or as a bonding layer, wherein the surface coating melts during the hot or hot forming and a connection between the motherboard and which forms at least one reinforcing board.

For a structural part according to the preamble of claim 15, the object is achieved in that a connecting layer between a molded motherboard and at least one reinforcing plate in the form of an adhesive and / or molten and solidified glass material is provided, which is the motherboard and the at least one reinforcing board or more Reinforcing reinforcing plates sealingly together, wherein the molded motherboard and the at least one molded reinforcing plate fit together to avoid gaps, and wherein the connecting layer of a sealing foam adhesive, a material film, in particular pressure-sensitive adhesive film, adhesive fiber composite mat, silicone, epoxy resin adhesive, polyurethane adhesive, hot melt adhesive, PUR Dispersion adhesive or sintered glass. Further developments of the invention are defined in the dependent claims.

This provides a process for hot or hot forging sheet metal, particularly blanks, which combines the advantages of co-forming blanks to be joined and hot or hot forging with those of optimum sealing and blending of the molded blanks. Due to the Using a common hot or hot forming of motherboard and reinforcing board (s) a very good manufacturing accuracy and avoidance of gaps between the formed blanks can be achieved in combination with the advantage of an arbitrarily high degree of deformation, due to the use of a hot or hot forging in contrast for example, to cold forming such as deep drawing. As a result, in particular the press tools used can be spared, even when using almost any material thicknesses of boards and their combination with each other. In warm forging, lower temperatures are used than in hot forming, which generally does not harden the material. However, for example, high-strength materials can be used which already have high-strength properties. In this case, only an increase in temperature in areas to facilitate the forming, especially at temperatures below 850 ° C, preferably between 500 and 730 ° C, more preferably between 500 and 700 ° C, in particular around 650 ° C.

By dicing the molded blanks according to the invention after hot or warm forming, it is possible to insert a suitable bonding layer between the molded parts and thus to ensure optimum bonding and sealing of molded motherboard and molded reinforcing board (s). Since the singulation can preferably take place after the forming process, the application of a hot-melt adhesive in particular also proves to be very advantageous, for example during the cooling phase of the shaped blanks within the forming tool. On the part of the molded blanks, the temperatures suitable for heat-bonding are present. Likewise, however, is also the separation of the molded boards after their cooling and the subsequent application of at least one connecting layer possible. In this case, the selection of the connection layer is arbitrary. For example, it is also possible to use a sealing and moisture-repellent foam adhesive layer, material film, in particular pressure-sensitive adhesive film, mat, in particular adhesive fiber composite mat, etc.

Preferably, the bonding layer is formed from a multicomponent adhesive whose components are applied to the surface of the motherboard and the at least one reinforcing board or surfaces of the reinforcing boards. As a result, advantageously a connection of the surfaces of the boards only after their firm assembly. In this case, the presence of heat for rapid curing usually proves to be advantageous, which is why the surfaces of the boards to be joined together can already be provided with the multi-component adhesive prior to complete cooling and joined together.

In a simpler, easily re-separable shaping of the blanks of the molded part to be created, the separation of the formed blanks proves to be advantageous. In the case of more complex shapes, in particular when providing undercuts which make subsequent separation of the shaped boards more difficult, it proves advantageous, however, not to have to separate the formed boards again. In order to make this possible, a surface coating for forming a connecting layer can be applied to the at least one reinforcing plate. Preferably, the surface coating is applied to the at least one reinforcing board prior to the hot or warm forming operation, whereby the surface coating melts during forming and forms a bond between the surface Motherboard and the at least one reinforcing board forms. As a result, it is advantageously possible that these are already connected to each other during the forming of the boards. By coating, in particular, the reinforcing plate (s) is an optimal and uniform connection with the motherboard up to the edge of the reinforcing board approaching and possibly of individual reinforcing boards to each other possible. In this way, a full-surface connection of the boards can be achieved up to the edge region of the reinforcing board (s) even with very complex shapes. An additional application of a sealant bead in the edge region of the at least one reinforcing plate is therefore no longer necessary, but may, if desired, nevertheless be provided.

The bonding layer in the form of a surface coating of the at least one reinforcing board may also prove to be advantageous as a surface coating applied to the singulated formed boards after hot or warm forming. In this case, any adhesive and / or sealant, for example an adhesive, such as a silicone, in particular epoxy resin adhesive, polyurethane adhesive, hot melt adhesive, PUR dispersion adhesive, etc., can be used as the coating material. The coating can be done, for example, by rolling, dipping, printing, gumming, etc.

The tie layer may completely cover the surface of the reinforcing board (s). However, it can also be formed as a pattern or mask on the surface of the at least one reinforcing plate and / or the motherboard, in particular surrounding the edge region of the reinforcing board substantially gapless. Sometimes it is not absolutely necessary to cover the entire surface of the Reinforcement board (s) to be provided with the respective connection layer, since a compound of the molded boards is already supported by the shaping and sealing only in the edge region of the reinforcing board (s) for corrosion protection is appropriate. In the choice of the pattern or the mask, this (s) is advantageously matched to the forces acting on the finished molding during operation, so that unintentional release of the boards can be avoided from each other.

The connecting layer preferably consists of a glass material applied as coating on the motherboard and / or the at least one reinforcing plate and / or adhesive, which melts during the forming process and forms a firm connection between the motherboard and the reinforcing plate (s) during cooling. By the hot forming of the particular thinly applied glass material melts and forms on the / the reinforcing sheet (s) an adhesive coating. Similar to an enamel layer, a firm connection between the adjacent board surfaces can occur during cooling. Corrosion protection is possible as well as a firm connection of the molded boards. In contrast to the provision of glass intermediate elements in cavities between a base plate and a reinforcing plate, as in DE 101 36 433 A1 discloses, it is possible to provide a very thin interconnecting layer which is much more resilient than the thick glass intermediate layer after DE 101 36 433 A1 , Cavities between motherboard and reinforcement board must also not be provided. Rather, it is advantageous to provide a coating, in particular of the reinforcement plate (s), with the glass material. More preferably, sintered glass is used as such a glass material. This can not only be applied easily, but also turns out to be very suitable for use with metals during hot forming as the melting temperatures ago.

In an advantageous provision of a warm forging of base plate provided with a connecting layer and at least one reinforcing plate together, in particular an adhesive can be used as the connecting layer. This can melt during the forming process, harden on cooling and form a firm connection between the motherboard and the at least one reinforcing board.

Preferably, in a structural part produced by the method according to the invention, a connecting layer is provided between a shaped motherboard and at least one reinforcing board in the form of an adhesive and / or molten and solidified glass material, which connects the motherboard and the at least one reinforcing board and / or several reinforcing boards.

Preferably, a reinforcing board is arranged on the motherboard and fixed and / or aligned by suitable means to this or several reinforcing boards next to and / or one above the other on the motherboard and fixed and / or aligned by suitable means to each other and / or to the motherboard. Particularly preferred is provided with the provision of only one gain board on the motherboard and fixed and / or aligned by suitable means to this or providing multiple reinforcing boards these are overlapping and / or abutting each other in a partial area and / or spaced from each other on the motherboard fixed and / or aligned with each other by suitable means. By providing multiple reinforcement boards Side by side with and without distance to each other stresses within a shaped workpiece or sheet metal structural part can be avoided or at least reduced, and stiffness increases are selectively carried out, especially when providing different material strengthen motherboard and reinforcement board (s). By providing a plurality of reinforcement boards one above the other, additional material reinforcements and thus greatly differing stiffnesses can be achieved over the surface of the structural part. By overlapping a plurality of reinforcement boards in their respective edge regions, stiffness differences can also be generated. However, in each case only one reinforcing plate can be provided, which if necessary was previously composed of several parts, in particular of different material thickness. Instead of providing a fixation or connection of the boards with each other before the forming process, it is also possible to position the boards only aligned with each other and without forming a connection with each other. To fix the position or to maintain the mutual positioning, stud bolts or the like may be particularly preferably provided in the forming tool or the forming press.

Preferably, the reinforcing boards are connected to each other abutting each other before the forming process, in particular by attaching a weld or other connecting seam. Depending on the forming temperature and forming mode, this butt seam can be leveled during forming, so that no uneven transition points remain.

The blanks are preferably fixed to one another by means of additional connections prior to hot or warm forming and / or after semi-hot or hot forming, in particular by welding, riveting, clinching or another connection method. As a result, especially before the forming, the unique position of the reinforcing plate (s) applied selectively at certain locations on the surface of the motherboard is fixed so that it does not substantially change during the forming process. After reshaping, a fixation proves to be advantageous in itself otherwise by shearing off possibly easily releasing connections between motherboard and reinforcement board (s), since especially an additional punctiform connection can counteract unwanted shearing.

In contrast to the solder joints according to the DE 100 49 660 A1 proves the provision of an adhesive advantageous that the heating temperature does not need to be kept in a tolerable range for the area, but can be adjusted to a suitable in particular for warm-water, but also for hot forming suitable range. In addition, the problem of corrosion by flux, which is commonly used for a soldering, avoided.

Figur 1 bis 6

eine schematische Ansicht des Ablaufs eines erfindungsgemäßen Warmumformvorgangs unter Vereinzeln von drei auf einer Grundplatine aufgebrachten Verstärkungsplatinen, und

Figur 7 bis 10

eine schematische Ansicht des Ablaufs einer zweiten Ausführungsform eines erfindungsgemäßen Halbwarmumformvorgangs unter Vorsehen einer Oberflächenbeschichtung auf Verstärkungsplatinen.

For a more detailed explanation of the invention, two exemplary embodiments will be described in more detail below with reference to the drawings. These show in:

Figure 1 to 6

a schematic view of the sequence of a hot forming process according to the invention with separation of three mounted on a motherboard reinforcement boards, and

FIGS. 7 to 10

a schematic view of the sequence of a second embodiment of an inventive Warm forging process, providing a surface coating on reinforcing boards.

FIG. 1 shows a first step of a hot forming process, in which first a flat flat motherboard 1 is provided with three flat and flat reinforcing boards 2, 3, 4 of smaller dimensions than that of the motherboard. This is also indicated by the arrows P. The reinforcing boards 2, 3, 4 are fixed on the surface 10 of the motherboard by a number of joints, for example by six welds 5, whereby a composite board 6 is formed. Alternatively, a fixation can also be made by riveting, clinching or any other connection method. As a result, the boards are secured against displacement during subsequent forming. The number of joints depends on the sheet thickness of the boards as well as the extent of deformation. Again alternatively, the boards 1, 2, 3, 4 only aligned with each other without fixation by welding points or the like can be positioned on each other. The reinforcing boards are arranged side by side and adjacent to each other on the motherboard. Their position and dimensions depend on the desired local stiffness to be achieved. They reinforcing boards can therefore each, for example, have different thicknesses and / or different thicknesses of the reinforcing boards, possibly also by joining several reinforcing boards, achieved.

After fixing the boards to each other, the resulting composite board 6 is heated in an oven 7, as shown in FIG FIG. 2 outlined. Here, the composite board is heated to a suitable temperature for hot forming, in particular to a temperature in Range of 950 ° C. Alternatively, a half-warm forming can take place, for example, with temperatures in the range of less than 850 ° C, in particular 500 to 700 ° C, for example around 600 to 650 ° C. The heated composite board is then passed into a forming press 8, as in FIG. 3 outlined. In the forming press, the common hot or hot forming of the mutually fixed motherboard and reinforcing boards. Following the hot forming, the composite board is tempered by a corresponding temperature control.

The deformable composite plate in the form of a molded part which can be removed from the forming press 8 is shown in FIG FIG. 4 shown in perspective view. The three reinforcing boards are fixed on the now formed to an inside of the molding surface 10 of the motherboard 1. Their position to each other has not changed during the forming process.

Since no corrosion preventive and sealing bonding layer has been provided between the boards so far, the molded reinforcing boards and the motherboard will be formed in the next processing step, which is shown in FIG FIG. 5 sketched, again isolated. The separation can take place after the hot or warm forming still within the forming tool.

After separation of the molded blanks, they are provided on the mutually facing surfaces with a bonding layer 11, for example with an adhesive layer and / or a sealant, which preferably also allows bonding of the surfaces to one another. The three reinforcement boards may be applied either on a common interconnect layer or on separate interconnect layers. Subsequently, the molded reinforcing boards 2, 3, 4 are again molded onto the Motherboard 1 is fitted, wherein an at least adhesive connection between the surfaces of the boards is now achieved by the bonding layer. The connecting layer preferably has such a thickness that the accuracy of fit of the jointly deformed boards is not endangered. In particular, it lays between the boards in such a way that an optimal substantially gap-free fit is ensured. The attachment of the molded reinforcing boards 2, 3, 4 is in FIG. 6 indicated by arrows 9. The reinforcing boards can already be interconnected, in particular prior to forming, to allow easy singulation and reassembly.

In order to further strengthen the connection between the motherboard and the reinforcing boards, in turn, joints in the form of e.g. Welding points, rivets, etc. are provided. Depending on the choice of the connection layer used, however, in principle this additional connection can also be omitted.

The shaped reinforcing boards serve e.g. as internal reinforcement, the molded motherboard as external reinforcement of a vehicle B-pillar.

FIG. 7 shows the first processing step of an alternative method for hot or hot forging of blanks. Here, the reinforcing boards 2, 3, 4 are initially provided with a surface coating 20, 30, 40. This surface coating consists of a material which melts under the influence of heat and, at the latest when cooling the shaped blanks, adheres or adhesively bonds these with the molded blanks, in particular an adhesive. When using a hot forming, a glass material, such as a sintered glass, can be advantageously used. Alternatively to providing the surface coating only on the surfaces of the reinforcing boards Also, the surface 10 of the motherboard and / or both the surface of the motherboard and the reinforcing boards can be provided with a surface coating, which also allows a connection with the reinforcing boards when heated, for example in the manner of a multi-component adhesive.

With their coated surfaces 21, 31, 41, the reinforcing boards 2, 3, 4, then placed on the motherboard 1 and in the in FIG. 7 Case fixed at different locations, for example, by welding points. 5

This resulting unit of a composite board 60 is subsequently introduced into a furnace 7, such as FIG. 8 can be seen. In this, the composite board is heated to a suitable for warm forging (or possibly hot forming) suitable temperature and forwarded to the forming press 8 ( FIG. 9 ). This is the warm forging or possibly hot forming with appropriate temperatures. During the forming process, the surface coating of the boards melts and bonds to the respective adjacent board surface. Therefore, a bonding layer 12 is formed directly during the forming, which allows a dense and firmly connected unit of the molded blanks.

During annealing of the board material, the bonding layer 12 is cooled and thereby hardens. Any gaps between motherboard and reinforcing boards remaining or remaining during molding are filled by the bonding layer, thereby creating a dense corrosion prevention unit. In addition to the existing and remaining during the warm forging or hot forming joints in the form of eg

Welding points, even more or these may be again provided for additional connection of the molded boards to each other. In principle, however, it is already possible to ensure a sufficiently firm hold of the molded blanks on one another by the combination of the fixing connecting points applied before forming and the connecting layer.

The forming press 8, as in FIG. 9 is shown, a finished molded part can be removed, which can be used as a structural part in vehicle construction after a customarily subsequent to the forming cutting.

In addition to the embodiments described in the foregoing and illustrated in the figures, numerous others can be formed, in each of which a separation of half-hot or hot-formed blanks or sheets is provided following the forming and before applying a bonding layer or the boards or sheets, without being singulated after hot or hot forging, directly therealong by melting a coating provided on at least one board of a pair of superposed boards.

LIST OF REFERENCE NUMBERS

1

motherboard

2

reinforcing plate

3

reinforcing boards

4

reinforcing boards

5

WeldingSpot

6

composite board

7

oven

8th

forming press

9

arrows

10

Surface of the motherboard

11

link layer

12

link layer

20

surface coating

21

coated surface

30

surface coating

31

coated surface

40

surface coating

41

coated surface

60

composite board

P

arrows

Claims (16)

1. A method for the warm forming or hot forming of sheet metal, in particular plates (1, 2, 3, 4), in a forming die (8), wherein
   one or a plurality of reinforcement plates (2, 3, 4) are applied to a base plate (1) for purposes of partial reinforcement, the base plate (1) and the at least one reinforcement plate (2, 3, 4) are fixed on top of one another and/or by suitable means are aligned with one another, and the base plate (1) and the at least one reinforcement plate (2, 3, 4) are formed together, characterised in that the base plate (1) and the at least one reinforcement plate (2, 3, 4) are separated after the forming, provided with at least one bonding layer (11) and are joined together again.
2. The method according to Claim 1,
   characterised in that before, during, or after the warm forming or hot forming process an adhesive, in particular a hot melt adhesive, is applied to the base plate and/or to the at least one reinforcement plate, in particular during the cooling phase of the formed plates (1, 2, 3, 4), in particular within the forming die.
3. The method according to one of the preceding claims,
   characterised in that the bonding layer is formed from a multi-component adhesive, whose components are applied to the surface (10) of the base plate (1) and of the at least one reinforcement plate (2, 3, 4), or to the surfaces of the reinforcement plates (2, 3, 4).
4. The method according to one of the preceding claims,
   characterised in that the bonding layer, in the form of a surface coating (20, 30, 40) of the at least one reinforcement plate (2, 3, 4), is applied to the latter.
5. A method for the warm forming or hot forming of sheet metal, in particular plates (1, 2, 3, 4), in a forming die (8), wherein
   one or a plurality of reinforcement plates (2, 3, 4) are applied to a base plate (1) for the purposes of partial reinforcement, the base plate (1) and the at least one reinforcement plate (2, 3, 4) are fixed on top of one another and/or by suitable means are aligned with one another, and the base plate (1) and the at least one reinforcement plate (2, 3, 4) are formed together, characterised in that before the warm forming or hot forming process a surface coating (20, 30, 40) is applied to the at least one reinforcement plate (2, 3, 4) for the formation of a coating layer, or as a coating layer, wherein the surface coating melts during the warm forming or hot forming process and forms a bond between the base plate (1) and the at least one reinforcement plate (2, 3, 4).
6. The method according to Claim 4 or 5,
   characterised in that the bonding layer consists of an adhesive and/or glass material applied as a coating on the base plate (1) and/or on the at least one reinforcement plate (2,3,4).
7. The method according to Claim 6,
   characterised in that the glass material is sintered glass, and/or the adhesive is an adhesive that is suitable for high or very high temperatures.
8. The method according to one of the preceding claims,
   characterised in that the bonding layer is designed as a pattern or mask on the surface of the at least one reinforcement plate (2,3,4) and/or the base plate (1), in particular surrounding the edge region of the reinforcement plate.
9. The method according to one of the preceding claims,
   characterised in that a reinforcement plate is arranged and fixed on the base plate (1) and/or by suitable means is aligned with the latter, or
   in that a plurality of reinforcement plates (2, 3, 4) are arranged and fixed on the base plate (1) alongside one another and/or on top of one another, and/or by suitable means are aligned with one another and/or with the base plate (1).
10. The method according to one of the preceding claims,
    characterised in that a reinforcement plate is arranged and fixed on the base plate (1) and/or by suitable means is aligned with the latter, or
    in that a plurality of reinforcement plates (2, 3, 4) are fixed on the base plate (1) overlapping one another in a sub-region, and/or abutting one another, and/or with a distance apart from one another, and/or by suitable means are aligned with one another.
11. The method according to Claim 10,
    characterised in that a plurality of reinforcement plates are bonded to one another in an abutting manner before the forming process, in particular by the application of a weld seam or another bonding seam.
12. The method according to one of the preceding claims,
    characterised in that the base plate (1) and the reinforcement plates (2, 3, 4) have different material thicknesses.
13. The method according to one of the preceding claims,
    characterised in that the plates (1, 2, 3, 4) before the warm forming or hot forming and/or after the warm forming or hot forming are fixed to one another by means of additional bonds, in particular by means of welding, riveting, clinching, or another bonding method.
14. The method according to one of the preceding claims,
    characterised in that warm forming takes place at temperatures below 850°C, in particular the plates are formed at temperatures between 500 and 730°C, in particular between 500 and 700°C, in particular between 500 and 650°C.
15. A structural part, manufactured according to a method according to one of the preceding claims, wherein
    a bonding layer (12) is provided between a formed base plate (1) and at least one reinforcement plate (2, 3, 4) in the form of an adhesive and/or melted and solidified glass material, which bonds the at least one reinforcement plate (2, 3, 4) or a plurality of reinforcement plates (2, 3, 4) with one another in a sealing manner, wherein
    the formed base plate and the at least one formed reinforcement plate match up to one another accurately, avoiding gaps, and wherein
    the bonding layer consists of a sealing foam adhesive, a material film, in particular a pressure sensitive film, an adhering composite fibre mat, a silicone, an epoxy resin adhesive, a polyurethane adhesive, a hot melt adhesive, a PUR dispersion adhesive, or sintered glass.
16. The structural part according to Claim 15,
    characterised in that the reinforcement plates. or the at least one reinforcement plate (2, 3, 4), and the base plate (1) have different material thicknesses.

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