EP1579034A4 - Appareil, systeme et procede anti-corrosion et anti-encrassement a base de semi-conducteur - Google Patents

Appareil, systeme et procede anti-corrosion et anti-encrassement a base de semi-conducteur

Info

Publication number
EP1579034A4
EP1579034A4 EP03808972A EP03808972A EP1579034A4 EP 1579034 A4 EP1579034 A4 EP 1579034A4 EP 03808972 A EP03808972 A EP 03808972A EP 03808972 A EP03808972 A EP 03808972A EP 1579034 A4 EP1579034 A4 EP 1579034A4
Authority
EP
European Patent Office
Prior art keywords
semiconductive
corrosion
control apparatus
fouling control
fouling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03808972A
Other languages
German (de)
English (en)
Other versions
EP1579034A1 (fr
Inventor
Farshad Khorrami
David B Dowling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Semiconductor International Ltd
Original Assignee
Applied Semiconductor International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/291,770 external-priority patent/US6811681B2/en
Application filed by Applied Semiconductor International Ltd filed Critical Applied Semiconductor International Ltd
Publication of EP1579034A1 publication Critical patent/EP1579034A1/fr
Publication of EP1579034A4 publication Critical patent/EP1579034A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
    • C23F13/02—Inhibiting corrosion of metals by anodic or cathodic protection cathodic; Selection of conditions, parameters or procedures for cathodic protection, e.g. of electrical conditions
    • C23F13/04—Controlling or regulating desired parameters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Prevention Of Electric Corrosion (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
EP03808972A 2002-10-17 2003-10-17 Appareil, systeme et procede anti-corrosion et anti-encrassement a base de semi-conducteur Withdrawn EP1579034A4 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US291770 1988-12-29
US27173402A 2002-10-17 2002-10-17
US271734 2002-10-17
US10/291,770 US6811681B2 (en) 2002-11-12 2002-11-12 Semiconductive corrosion and fouling control apparatus, system, and method
PCT/US2003/029133 WO2004035865A1 (fr) 2002-10-17 2003-10-17 Appareil, systeme et procede anti-corrosion et anti-encrassement a base de semi-conducteur

Publications (2)

Publication Number Publication Date
EP1579034A1 EP1579034A1 (fr) 2005-09-28
EP1579034A4 true EP1579034A4 (fr) 2008-07-02

Family

ID=32109814

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03808972A Withdrawn EP1579034A4 (fr) 2002-10-17 2003-10-17 Appareil, systeme et procede anti-corrosion et anti-encrassement a base de semi-conducteur

Country Status (6)

Country Link
EP (1) EP1579034A4 (fr)
JP (1) JP5009502B2 (fr)
AU (1) AU2003276888B2 (fr)
CA (1) CA2502465C (fr)
EA (1) EA007147B1 (fr)
WO (1) WO2004035865A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7318889B2 (en) * 2005-06-02 2008-01-15 Applied Semiconductor International, Ltd. Apparatus, system and method for extending the life of sacrificial anodes on cathodic protection systems
WO2007120087A1 (fr) * 2006-04-19 2007-10-25 Volvo Technology Corporation Procédé permettant de prévoir l'effet d'un comportement de vieillissement d'un élément électrique et modèle de simulation permettant de simuler un tel comportement
RU2486288C2 (ru) * 2011-08-11 2013-06-27 Анатолий Александрович Анашкин Устройство для импульсной катодной защиты
ES2910413T3 (es) 2012-10-11 2022-05-12 Sembcorp Marine Repairs & Upgrades Pte Ltd Sistema y método para proporcionar protección contra la corrosión de estructuras metálicas utilizando ondas electromagnéticas que varían con el tiempo
RU2618968C1 (ru) * 2015-10-13 2017-05-11 Александр Петрович Молодцов Устройство для питания и автоматического регулирования выходного тока системы катодной защиты от коррозии металлоконструкций
RU170510U1 (ru) * 2016-07-28 2017-04-26 Федеральное государственное бюджетное образовательное учреждение высшего образования "Омский государственный университет путей сообщения" Автоматическая дренажная установка
RU2735223C1 (ru) * 2020-03-25 2020-10-28 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л.Духова"(ФГУП "ВНИИА") Устройство для защиты объекта от воздействия космоса
RU2735162C1 (ru) * 2020-03-25 2020-10-28 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л.Духова"(ФГУП "ВНИИА") Устройство для защиты объекта от воздействия космоса

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002006563A1 (fr) * 2000-07-18 2002-01-24 Applied Semiconductor, Inc. Procede et systeme permettant de prevenir l'encrassement et la corrosion de dispositifs biomedicaux et de structures
US6402933B1 (en) * 2001-06-08 2002-06-11 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
WO2002101117A1 (fr) * 2001-06-08 2002-12-19 Applied Semiconductor, Inc. Systeme polymere a semi-conducteur, dispositifs equipes d'un tel systeme, et ses utilisations dans la lutte contre la corrosion

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551491B2 (en) * 2000-06-02 2003-04-22 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002006563A1 (fr) * 2000-07-18 2002-01-24 Applied Semiconductor, Inc. Procede et systeme permettant de prevenir l'encrassement et la corrosion de dispositifs biomedicaux et de structures
US6402933B1 (en) * 2001-06-08 2002-06-11 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
WO2002101117A1 (fr) * 2001-06-08 2002-12-19 Applied Semiconductor, Inc. Systeme polymere a semi-conducteur, dispositifs equipes d'un tel systeme, et ses utilisations dans la lutte contre la corrosion
US6562201B2 (en) * 2001-06-08 2003-05-13 Applied Semiconductor, Inc. Semiconductive polymeric system, devices incorporating the same, and its use in controlling corrosion

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2004035865A1 *

Also Published As

Publication number Publication date
JP5009502B2 (ja) 2012-08-22
CA2502465C (fr) 2011-09-27
WO2004035865A1 (fr) 2004-04-29
CA2502465A1 (fr) 2004-04-29
EA007147B1 (ru) 2006-08-25
WO2004035865A9 (fr) 2004-06-17
JP2006503184A (ja) 2006-01-26
AU2003276888A1 (en) 2004-05-04
EA200500665A1 (ru) 2005-10-27
AU2003276888B2 (en) 2008-04-17
EP1579034A1 (fr) 2005-09-28

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