EP1573825A4 - Anbring- und verbindungsvorrichtung für optische komponenten - Google Patents

Anbring- und verbindungsvorrichtung für optische komponenten

Info

Publication number
EP1573825A4
EP1573825A4 EP03786840A EP03786840A EP1573825A4 EP 1573825 A4 EP1573825 A4 EP 1573825A4 EP 03786840 A EP03786840 A EP 03786840A EP 03786840 A EP03786840 A EP 03786840A EP 1573825 A4 EP1573825 A4 EP 1573825A4
Authority
EP
European Patent Office
Prior art keywords
component mounting
optical component
interconnect apparatus
interconnect
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03786840A
Other languages
English (en)
French (fr)
Other versions
EP1573825A2 (de
Inventor
Michael H Ayliffe
Phillip J Edwards
Bradley S Levin
Robert William Musk
Joseph John Vandenberg
Brett M Zaborsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumentum Technology UK Ltd
Original Assignee
Bookham Technology PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bookham Technology PLC filed Critical Bookham Technology PLC
Publication of EP1573825A2 publication Critical patent/EP1573825A2/de
Publication of EP1573825A4 publication Critical patent/EP1573825A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
EP03786840A 2002-11-19 2003-11-19 Anbring- und verbindungsvorrichtung für optische komponenten Withdrawn EP1573825A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US42744102P 2002-11-19 2002-11-19
US427441P 2002-11-19
PCT/US2003/036930 WO2004046766A2 (en) 2002-11-19 2003-11-19 Optical component mounting and interconnect apparatus

Publications (2)

Publication Number Publication Date
EP1573825A2 EP1573825A2 (de) 2005-09-14
EP1573825A4 true EP1573825A4 (de) 2006-02-08

Family

ID=32326537

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03786840A Withdrawn EP1573825A4 (de) 2002-11-19 2003-11-19 Anbring- und verbindungsvorrichtung für optische komponenten

Country Status (4)

Country Link
EP (1) EP1573825A4 (de)
CN (1) CN1711646A (de)
AU (1) AU2003295639A1 (de)
WO (1) WO2004046766A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110249947A1 (en) * 2010-04-12 2011-10-13 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Opto-electronic transceiver module with castellated electrical turn
CN110275252B (zh) * 2018-03-13 2023-06-30 珠海保税区光联通讯技术有限公司 光收发模组
US12111512B2 (en) 2020-12-15 2024-10-08 Plx, Inc. Mount for an optical structure and method of mounting the optical structure to the mount

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0924540A1 (de) * 1997-12-16 1999-06-23 Robert Bosch Gmbh Auf Leiterrahmen montiertes elektrooptisches Modul
EP1154300A2 (de) * 2000-05-08 2001-11-14 Mitel Semiconductor AB Faseroptische Schnittstelle auf gefalteter Leiterplatte und Methode zur Herstellung der Schnittstelle
US20020085256A1 (en) * 2000-12-18 2002-07-04 Franz Auracher Configuration for operating an optical transmission or reception module at high data rates of up to 10 Gbit /s
US20020105042A1 (en) * 2000-12-15 2002-08-08 Kim Brian H. Flexible circuit with two stiffeners for optical module packaging
US20020106169A1 (en) * 1998-03-16 2002-08-08 Sumitomo Electric Industries, Ltd. Lead frame, optical module, and a method of optical module
US6477056B1 (en) * 2001-03-12 2002-11-05 Phillip J. Edwards Optoelectric mounting and interconnect apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3067151B2 (ja) * 1990-03-13 2000-07-17 日本電気株式会社 光電気変換素子サブキャリア
US5841178A (en) * 1996-10-04 1998-11-24 Lucent Technologies Inc. Optical component package

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0924540A1 (de) * 1997-12-16 1999-06-23 Robert Bosch Gmbh Auf Leiterrahmen montiertes elektrooptisches Modul
US20020106169A1 (en) * 1998-03-16 2002-08-08 Sumitomo Electric Industries, Ltd. Lead frame, optical module, and a method of optical module
EP1154300A2 (de) * 2000-05-08 2001-11-14 Mitel Semiconductor AB Faseroptische Schnittstelle auf gefalteter Leiterplatte und Methode zur Herstellung der Schnittstelle
US20020105042A1 (en) * 2000-12-15 2002-08-08 Kim Brian H. Flexible circuit with two stiffeners for optical module packaging
US20020085256A1 (en) * 2000-12-18 2002-07-04 Franz Auracher Configuration for operating an optical transmission or reception module at high data rates of up to 10 Gbit /s
US6477056B1 (en) * 2001-03-12 2002-11-05 Phillip J. Edwards Optoelectric mounting and interconnect apparatus

Also Published As

Publication number Publication date
WO2004046766A2 (en) 2004-06-03
WO2004046766A3 (en) 2004-12-29
AU2003295639A1 (en) 2004-06-15
EP1573825A2 (de) 2005-09-14
AU2003295639A8 (en) 2004-06-15
CN1711646A (zh) 2005-12-21

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20050509

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

RIN1 Information on inventor provided before grant (corrected)

Inventor name: ZABORSKY, BRETT M.

Inventor name: VANDENBERG, JOSEPH JOHN

Inventor name: MUSK, ROBERT WILLIAM

Inventor name: LEVIN, BRADLEY S.

Inventor name: EDWARDS, PHILLIP J.

Inventor name: AYLIFFE, MICHAEL H.

A4 Supplementary search report drawn up and despatched

Effective date: 20051222

RIC1 Information provided on ipc code assigned before grant

Ipc: G02B 6/42 20060101ALI20051216BHEP

Ipc: H01L 23/48 20060101ALI20051216BHEP

Ipc: H01L 31/00 20060101ALI20051216BHEP

Ipc: H01L 31/0232 20060101ALI20051216BHEP

Ipc: H01L 31/0203 20060101AFI20050105BHEP

RIN1 Information on inventor provided before grant (corrected)

Inventor name: ZABORSKY, BRETT M.

Inventor name: VANDENBERG, JOSEPH JOHN

Inventor name: MUSK, ROBERT WILLIAM

Inventor name: LEVIN, BRADLEY S.

Inventor name: EDWARDS, PHILLIP J.

Inventor name: AYLIFFE, MICHAEL H.

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE FR GB

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20060322