EP1554917A2 - Appareil et procede d'assemblage de reseaux d'elements fonctionnels sur des substrats - Google Patents

Appareil et procede d'assemblage de reseaux d'elements fonctionnels sur des substrats

Info

Publication number
EP1554917A2
EP1554917A2 EP03753896A EP03753896A EP1554917A2 EP 1554917 A2 EP1554917 A2 EP 1554917A2 EP 03753896 A EP03753896 A EP 03753896A EP 03753896 A EP03753896 A EP 03753896A EP 1554917 A2 EP1554917 A2 EP 1554917A2
Authority
EP
European Patent Office
Prior art keywords
substrate
microstructures
recesses
array
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03753896A
Other languages
German (de)
English (en)
Inventor
Ofer Avineri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP1554917A2 publication Critical patent/EP1554917A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Definitions

  • This invention refers to the field of handling a plurality of small objects, particularly functional objects that are organized in an orderly manner, such as in an array of functional objects.
  • functional objects particularly functional objects that are organized in an orderly manner, such as in an array of functional objects.
  • electronic microchips including their assemblage onto permanent or temporary substrates.
  • Microstructures such as electronic chips (typically up to 1000 microns), having microcircuits defined thereon, are generated onto wafers in very large numbers (up to several millions) for each wafer. For packaging and distribution purposes they cannot be handled in such large numbers. Therefore the art has defined and disclosed methods for assembling microstructures onto substrates, whereby a reasonably limited number of them can be assembled on each substrate. The resulting assemblies are packaged or transported and delivered to users, who can then use the vital structures in the way they desire.
  • USP 5,545,291 discloses a method for assembling microstructures on substrates, which substrates comprise a top surface with a number of recessed regions thereon.
  • the microstructures are blocks, having a shape which is typically trapezoidal or conical in cross section. A number of said shaped blocks are transferred into a fluid to form a slurry, and said slurry is dispensed over said substrate at a rate where at least one of said shaped blocks is disposed into a recessed region.
  • USP 5,545,291 states that upon dispensing the slurry or shaped blocks onto the substrate, "the blocks self-align through their shape into the recessed regions and integrate thereon". This process is called in later art “fLuidic self-assembly (FSA)". It is clear that it is essentially a statistical process, depending on a self-assembly rather than on a positive one.
  • FSA functional self-assembly
  • USP 3,439,416 describes components or structures placed, trapped, or vibrated on an array of magnets, which include magnetized layers alternating with non-magnetized layers to form a laminated structure.
  • USP 4,194,668 discloses an apparatus for aligning and soldering electrode pedestals onto solderable ohmic anode contacts, wherein said contacts are portions of individual semi-conductor chips located on a wafer.
  • USP 5,355,577 describes assembling integrated circuits onto a substrate through electrostatic forces, wherein said forces vibrate particles such that the particles are arranged at a state of minimum potential energy.
  • each microstructure is considered as an independent unit and no advantage is taken of the fact that generally large numbers of like microcircuits are created on a wafer and of the fact that they are distributed on the wafer in orderly rows and columns or partial matrices.
  • array will be used hereinafter to mean the arrangement of a number of microstructures in a regular geometric configurations, typically in a number of lines - rows, columns or vertical columns - arranged parallel to two or three coordinate axes.
  • Arrays can result from manufacturing operations and comprise all the relevant microstructures, and may be called “original arrays”, and may be limited each to a portion of an original array, and then may be called “selected arrays”.
  • the original array may be in form of a matrix and then selected arrays be in the form of submatrices.
  • wafer will mean a 2D monolithic array of microstructures.
  • the wafer is. composed of an array of microchips each carrying an electronic component or circuit, typically obtained by etching or slicing a conductive plate, such as silicon, GaAs, AlAs.
  • microstructures In the art, microstructures, mostly but not- exclusively functional, are handled singly.
  • handling are intended herein all operations that may involve in technological processes, including seizing, supporting, displacing, packaging, transporting, assembling them, placing them on supports or substrates in predetermined positions, and using them.
  • This invention provides methods and devices for handling microstructures, which comprises arranging them into in one -dimensional or two- dimensional arrays and displacing them as such, thereby handling them not singly, but in pluralities, and reducing operations and achieving an important saving of time, labor and apparatus.
  • microstructures are: (a) a liquid crystal display pixel; (b) a light emitting diode display pixel; (c) an organic light emitting diode pixel; (d) a solar cell element; (e) an electromagnetic signal detector; (f) plasma display pixel; (g) integrated circuit or, (h) any other material.
  • the part itself could be shaped in the special form in order to fit the holes of a support or substrate to which they are to be connected.
  • microstructures which are microchips, typically of silicon, on which electronic components or circuits are defined and which are obtained from wafers by cutting or etching said wafers and dividing them into individual chips.
  • microchips is made for purposes of illustration and clear understanding of the invention, but is not at all limiting, as the methods and devices described are suitable for handling all sorts of small objects.
  • Wafers of very small microchips in the size of up to 1000 microns normally comprise of an extremely large number of electronic components or microcircuits, which are arranged in straight rows and columns, and may be considered as comprising a number of submatrices, except in the vicinity of their round borders. It is customary practice to cut, etch or otherwise reduce the wafer along the intervals between the rows and columns, thus isolating the individual microcircuits, but in order to avoid dispersion of the microcircuits, they are previously attached to a temporary support such as a sheet of- tape over which an adhesive including, such as a UV cured " adhesive or other a conductive or non- conductive adhesive material is spread to retain the microcircuits. Said operations are relatively conventional and therefore will not be described. It will be understood that they will be carried out by anyone wishing to later implement this invention for electronic microchips, and this fact is implicit in the following description.
  • the individual microchips are separated from the provisional support and handled individually, or are dispersed in a liquid medium, and dispensed over a substrate into which the chips self- align, or vibrated or pulsated (using magnetic energy) to self align.
  • These references describe displacement of a plurality of microchips, but each microchip is individually positioned in an unorganized manner, such that the original order of said array of microchips on the wafer is not maintained. It will be understood that the distances between recesses in said supports could be substantially larger than the distances between rows of microcircuits in the wafer. What is done thereafter with the chips to form electronic devices is a matter of common knowledge and conventional technology and will not be discussed herein.
  • This invention provides means for handling microchips or other microstructures in one dimensional (ID) or two dimensional (2D) arrays.
  • ID arrays are constituted by lines which may be straight or curved or constituted of different connected sections.
  • lines when the term "lines” is used without further specification it should be understood that reference is made to straight lines - rows or columns - in which the microstructures are placed at uniform intervals. What will be said, however, generally applies to any ID arrays or "lines”.
  • 2D arrays may be constituted by a plurality of objects placed in any positional relationship and configuration on a plane. Matrices are a particular case of such arrays.
  • matrix refers to regular matrices constituted by a plurality of rows or columns in which the objects are placed in straight lines at regular intervals.
  • support will be used hereinafter to define a temporary support, with or without holes, from which the supported objects will be detached or re-placed at various locations during the assembly process.
  • substrate will be used hereinafter to define a functional support, with or without holes, on which the supported objects are maintained in their use.
  • the invention provides methods and means for handling small objects in all of the above cases.
  • cases a) and b) the only problem is constituted by the means in which pluralities - files or matrixes - of objects can be moved them in any desired direction and transported.
  • cases c) and d) the same need exists but there is the additional need of enlarging the original distance, which is fulfilled by the present invention.
  • the objects are deposited onto a support provided with seats by drawing them as files into the seat by means of fluid streams which are caused to flow through the seats by a pulling force, such as a vacuum, magnetic, electromagnetic or electric forces that can be applied on one side of the support, or by a pushing force, such as pressure applied on the other side.
  • a pulling force such as a vacuum, magnetic, electromagnetic or electric forces that can be applied on one side of the support, or by a pushing force, such as pressure applied on the other side.
  • the fluid may be a gas liquid and is caused to flow by the application of a vacuum.
  • the objects are placed in a temporary support in which they can be covered, are displaced by any suitable means in any desired direction.
  • Said temporary support can be moved or rotated in any desired direction, such as tilting the temporary support form horizontal orientation to vertical orientation.
  • the said temporary support can be uncovered, and the said objects can be picked up from said section by any suitable means. This process can be repeated in order to obtain temporary supports comprising selected rows/columns.
  • the objects are placed in a file and are distanced from one another by two-part wedges, as more particularly described hereinafter.
  • the objects are placed in a file directly from the wafer by pushing them directly, or indirectly.
  • the wafer can be placed on an adhesive tape.
  • the objects need not be arrayed in horizontal files, but may be arrayed in vertical files and picked up and, if needed, distanced by the same means used when they are in horizontal files. Further, what has been said or will be said about the handling of files, generally applies to the handling of matrices and 2d arrays in general, which this invention includes.
  • the objects, which are arranged in a closely packed 2D array particularly are microchips closely packed in a wafer and separated from one another while remaining at the original very small distance at which they have been generated, are picked up or pushed at a desired increased distance. For instance, when picking up or pushing one row, the distance between subsequent chips in that row is at the desired increased distance and the chips that are between said subsequent chips are left in place. This operation is repeated until all chips are been removed.
  • this invention provides a method for carrying out the assemblage of microcircuits on substrates, which comprises: withdrawing the microstructures from the temporary support to which they are adhesively connected; concurrently distancing them from one another to correspond to the distance between recesses in the substrate that it is intended to use, or, if the substrate does not have recesses, to correspond to the position which they must have in said substrate; holding them at said distance; introducing them into the recesses of the substrate, if it is provided with recesses, or placing them at, or near, the appropriate positions, optionally with an a conductive or non-conductive adhesive material, if the substrate is not provided with recesses; and releasing them.
  • this invention provides a method for carrying out the assemblage of microcircuits on substrates, which comprises: Placing the array of functional microstructures on a support substrate with seats; holding said array of functional microstructures in said seats, a pulling force such as vacuum or by a pushing force applied to said array; removing the adhesive or tape that is near the said area of functional microstructures;
  • this invention provides a method for carrying out the assemblage of microcircuits on substrates, which comprises:
  • this invention provides a method for carrying out the assemblage of microcircuits on substrates, which comprises:
  • Fig. 1 is a schematic plane view of a support
  • Fig. 2 is a cross-section of the support of Fig. 1 taken along a row of seats.
  • Fig. 3 shows a single microchip in lateral view and in plane
  • Fig. 4 illustrates the insertion of the microchips into supports
  • Fig. 5 is a cross-section of a support having the microchips inserted therein;
  • Fig. 6 is a cross-section showing a support with microchips as surface coating
  • Fig. 7 is a plane view of a support having microchips arranged on it in a square matrix
  • Fig. 8 shows the same matrix placed on a temporary support for carrying out the embodiment of the invention
  • Fig. 9 and Fig. 10 illustrate the use of a designed shaped container/part for microstructures
  • Fig. 11 schematically illustrates an embodiment of the invention applied to the matrix of Fig. 7;
  • Fig. 12 schematically shows a vertical row of objects
  • Figs. 13A to 13C show various column arrays
  • Figs. 13D to 13F show row arrays, all in schematic plane view
  • Figs. 14A and 14B show two column arrays in side view, and Figs. 14C and 14D show the same in plane view;
  • Fig. 15 shows a number of microchips attached to a connector for the implementation of another embodiment of the invention.
  • Figs. .16 and 17 schematically illustrate two steps of said other embodiment
  • FIG. 18 and 19 schematically illustrate still another embodiment
  • FIG. 20 and 21 illustrate a further embodiment of the invention
  • Figs. 22A to 22E are schematic illustrations of various examples of picking arms
  • Fig. 23 shows a picking arm for charging microstructures into the seats , of a support.
  • a schematic perspective of the support schematically illustrates the position of functional elements on a support having seats;
  • Figs ' . 24 and 25 are perspective views of different supports
  • Fig. 26 is a schematic block illustration of various operations of the invention.
  • Figs. 27A and 27B schematically illustrate the transfer of a row of a 3D array onto a support.
  • Fig. 26 The general method, to which the embodiments to be described belong, is schematically illustrated in Fig. 26.
  • the components (microstructures) the handling of which is the purpose of the invention, can be provided in a 3-D array, which is constituted by lines parallel to the X-axis (which will be called “rows"), or in lines parallel to the Y-axis (which will be called “columns”), or also, in less common case, in lines parallel to the Z-axis (which will be called “vertical columns”).
  • a 3-D array constituted by lines parallel to the X-axis (which will be called “rows"), or in lines parallel to the Y-axis (which will be called “columns”), or also, in less common case, in lines parallel to the Z-axis (which will be called “vertical columns”).
  • the array is a 3-D array, a physical force can be applied in the Z direction, forcing a vertical column out of the array.
  • the spacing between the components, as the array is generated may be too small for their final use, and an ' operation of spacing enlargement is required.
  • a mediating template should be used for displacing the components, and it may hold said components at the original spacing from one another or at an enlarged spacing.
  • Fig. 1 schematically shows in plane view a support 10 having therein seats 11 for microstructures.
  • the support 10 may be the final substrate or a temporary support in which the seats for the microstructures have the same spacing as in the final substrate, so that they already define the final configuration of the microstructures.
  • the microstructures 12 are assumed to have a trapezoidal cross section on a plane perpendicular to the support, which may be called generally "vertical", the support being considered in the horizontal position; however, this is only an example and the microstructures could have different shapes.
  • the bottom surfaces, indicated by 12', of the microstructures 12 are the active surfaces, on which the electronic circuit elements are defined. Alternatively, the opposite surface can be active.
  • Fig. 4 shows one microstructure in vertical lateral view (A) and in plane view from above (B).
  • FIGs. 4 and 5 illustrate an embodiment of the invention.
  • a cover 13 is placed below the support 10.
  • a vacuum can be applied if, as is assumed herein, the seats 11 are open at the bottom or at least have an opening therein, the vacuum that directly or indirectly draws the microstructures 12 into their seats. The same effect can be achieved while exerting a pressure above the support 10.
  • microstructures are chips carrying electronic circuits, but this is merely an example, and no limitation is intended by it.
  • the support 10 with the microstructures 12 are provided with two coatings 15 and 16, and in such a condition can be easily transported and package if desired.
  • Coating 16 is a protective layer which prevents the objects 12' from being contaminated or damaged.
  • coating 15 holds the microstructures 12 together and prevents them from becoming detached.
  • the coatings may • consist of adhesive layers, and one of the, particularly 15, may be made of an adhesive which is a conductor of electricity when dry. In this case, when the array of microstructures with the coating 15 is placed on an electrically functional substrate, and the coating is then dried, it not only connects the microstructures mechanically, but also maintains them in electrical contact with plated areas on the substrate.
  • the device wJhich will comprise the microstructures consists of very small parts (1-1000 microns, but not limited to) that are placed on a special substrate.
  • the substrate can be made from any kind of material.
  • the proprietary form of the material is that it is punched, etched or laser drilled or any other way shaped, holed formed or molded to have special holes in it.
  • the functional parts are very small shaped material made from any kind of form that contains the assembled parts.
  • the functional parts could be manufactured from any material and can be shaped in any form that could match the special holes in the proprietary substrate.
  • the functional parts could be manufactured from any material including, plastic, silicon or any other material.
  • the substrate with the holes is placed on a fluid-based rail or a negative force based air and/or any other fluid or vacuum shaped material rail.
  • the rail can be described but not limited to suction tunnel, box or any other shape that forces the air/fluid through the substrate's holes.
  • the bottom of the substrate is placed on the vacuum/air/fluid rail that fits the shape of the substrate (see Fig. 4).
  • the substrate is placed on the rail so there is a perfect match between the rail and the substrate and no vacuum/air/fluid leaks from the sides of the substrate.
  • the substrate's holes that are placed on the vacuum/air/ fluid rail are the only way for the vacuum /air/fluid to come out through the substrate.
  • the holes in the substrate enable the vacuum/air/fLuid to continue their downward force through the substrate, and thus create a suction force and suck the vacuur ⁇ air/gas located above the substrate downward into the rail through the substrate's holes (see Fig. 4).
  • the method creates a downward suction force coming out only from the holes of the substrate. This operation could be also performed upwardly, where the said shape or tunnel is located above the objects.
  • the designed containers or parts are placed on top or near the substrate.
  • the vacuum/air/fluid acting as a downward force is "pulling" or suctioning the containers/parts downward to the substrate's holes.
  • the force of the vacuum/air/fluid is greater than the force of the substrate and thus, the containers/parts are fitted to the substrate holes.
  • the force of the downward- vacuum/air/fluid pulls the container/parts down while the substrate edges, around the holes force the functional parts not to be suctioned into the vacuum/air/fluid tunnel (see Fig. 5).
  • the Containers/Parts are "locked” onto the substrate by the two opposite forces.
  • a coating could be placed above and below the substrate so the substrate and the container/parts are physically locked between the upper and lower layers of the coating.
  • the substrate and the containers/parts are now fitted together between the two coating layers, (see Figure 6).
  • Fig. 7 is a schematic view of an array of microstructures which are functional parts 12 in the form of the matrix 20, the said functional parts being attached to a tape or other connecting element 21.
  • Said figure may be considered as schematically representing the original wafer, viz. the original array of microstructures, or may be considered as schematically representing a processed wafer and particularly selected rows and columns separated from the original wafer.
  • the system includes a mono- dimensional (ID) or two-dimensional (2D) array or matrix of functional parts that are aligned to each other. Alignment can be done by any form including, but not limited to, tape, gel, or any other material.
  • the said array or matrix consist of 1 (one) or more rows of the said functional parts, or 1 (one) or more columns of the said functional parts.
  • the said array or matrix of the said functional parts can have spaces between the functional parts (Fig. 7).
  • This array or matrix of functional parts can include, but is not limited to, silicon wafers, waffle packs, or gel packs.
  • Fig. 8 the functional parts 12 are applied, still in the same matrix configuration, to a support 25 which is provided with tunnels 26. It can be detached from the tape- or other connecting member 21 by any suitable means: for instance, if said parts have been attached to said connecting member by a radiation sensitive glue, the said glue may be removed by a suitable tunnel.
  • the tunnels 26 may be continuous or comprise a number of seats for the microstructures, though said seats are not shown in the figure.
  • the tunnels described hereinabove may vary in shape and could have special characteristics, such as bends, curves, tapers, or other geometric shapes.
  • Figs. 9 is similar to Fig. 8, but additionally shows a pressing arm 17 comprising pressing fingers 18, the purpose of which is to press the microstructures 12 firmly into the tunnels 26 or the seats comprised in said tunnels.
  • the microstructures are covered by a tape indicated at 19.
  • the pressing arms may be continuous ribs extending along the length of the columns of the array or may be constituted by fingers, each of which engages and presses each microstructure in the corresponding column.
  • a stage of the present embodiment is schematically shown.
  • the microstructures 12 are positioned on the tunnels 26. In the other part of the figure they are covered by a cover 27 which reaches only to the line 28.
  • Any pushing means which are schematically indicated by arrows 29, push the microstructures 12 from the covered section of the support 25 to the uncovered section.
  • they are shown as partly in the covered and partly in the uncovered section. When they have been completely pushed into the uncovered section, they can be picked up by any suitable device. While been pushed, the microstructures 12 contact one another and there are no intervals between them in the column.
  • a 3-D array consisting of a plurality of 2-D arrays, as such that have been described so far and which exist, for instance, in a microcircuits wafer, said 2-D arrays being superimposed to one another along the Z-axis in a system of coordinates in which each 2-D array is composed of X-axis rows and Y-axis columns.
  • the microstructures which are superimposed to one anther along a line parallel to the Z-axis can be called “vertical columns” or "Z-axis columns”.
  • a mechanical force, applied by an appropriate device can draw or push a vertical column out of a 3-D array. This action is not essentially different from the isolation of an X-axis row or a Y-axis column from a 2-D array.
  • a plate, or any other shaped surface, or a number of surfaces or other shaped material, from any kind of material with corresponding tunnels, dents or any other reduced form material is attached, placed, or in any other form cover the bottom and /or sides of said array or matrix of the functional parts, in a manner that the functional parts fit the said tunnels or dents of the surface (Fig. 8).
  • This surface can be made from a number of different surfaces aligned together, to create one surface, surface like shape, or any other shape.
  • An additional surface which can be shaped in any form and made from any Jkind of material is attached, placed from any side, or in any other form cover the top and/ or sides of said functional parts, or the array or matrix of the functional parts, in a manner that the surface creates a closed shaped tunnels, dents, or any other form shaped in between the two or more surfaces, holding the said functional parts in between the two or more surfaces ( Figure 9).
  • This surface can be made from a number of different surfaces aligned together, to create one surface, surface like shape, or any other " shape, the surfaces and the said array or matrix of functional parts can be any angle on the X, Y and Z-axis. This could be, but not limited to, vertical horizontal or any other angle.
  • a UV, but not limited to, radiation, or any other electrical, photoelectrical, chemical, or any other process is applied, including but not limited to the said array or matrix of the functional parts so the material in between the said array or matrix, or on the array or matrix of the functional parts, or the adhesive on, or between the array or matrix of the functional parts, or the adhesive in between the said array or matrix and a tape, or on the surfaces, is removed, etched or in any other way reduced, including but not limited to , electrical, photoelectrical, chemical or any other way (Fig. 10).
  • These materials can be, but not limited to, a tape, an adhesive material of any kind or of any chemical material, gel, or any other material that is present near, in between or on the array or matrix of the functional parts, or on the surfaces.
  • a direct or indirect force is applied on the functional parts, so the functional parts are moved in between the said surfaces, or any other shape, outside the area of the two surfaces.
  • An additional type of material, liquid, plasma or gas can be added to the said tunnels of dents creating a surface, or volume in between, or around the said functional parts.
  • the functional parts are moved, pushed, pulled, fall, glide, slide or any other way moved, to corresponding open or closed tunnels or dents or any other shape outside the area of the surfaces (Fig. 11).
  • the force can be but not limited to, gravity force, vacuum force, and mechanical force by pushing arms, magnetic force, fluid force or any other force.
  • One of the surfaces can be removed, thus to leave the objects near one of the surfaces and out of between the two surfaces.
  • the surfaces can be made from any kind of material.
  • the form of the surfaces is that it is punched, etched or laser drilled or any other way shaped, holed formed or molded to have special tunnels, dents, or any other shaped in it (Figs. 7 and 8).
  • Surfaces could also, but not limited to consist of a number of surfaces or shapes that create the said surface. This surface can be made from a number of different surfaces aligned together, to create one surface, surface like shape, or any other shape.
  • the microstructures are very small shaped material (1-1000 micron, but not limited to) made from any kind of form that contains the assembled parts. They could be manufactured from any material and can be shaped in any form. They can be the part itself or a special container that holds the part. They could be manufactured from any material including, plastic, silicon or any other material. A designed shaped container/part is described in Fig. 9, but this is an example of the shape and not the exclusive shape. Other shapes could be used as well, including cube shaped parts. Any chemical material can cover the functional containers/parts.
  • the described array or matrix of microstructures can include, but is not limited to, silicon wafers, waffle packs, or gel packs.
  • Figs. 13A to 13 C show column arrays in a 2D matrix configuration.
  • a full column 30 is shown
  • a partial column 31 is shown
  • Fig. 13C three full columns are shown.
  • Fig. 13D a single row 35 is shown
  • Fig. 13E a partial row 36 is shown
  • Fig. 13F two full rows 25 are shown.
  • FIGs. 14A to 14D illustrate 3D arrays of microstructures 38.
  • Figs. 14A and 14B schematically show vertical columns 37 of said microstructures, seen in a vertical plane.
  • Figs. 14C and 14D shows the same arrays in plan view and it is seen that only one vertical column out of two is seen in Figs. 14A and 14B.
  • the selected array is illustrated where selected microstructures are spaced by unselected microstructures.
  • Fig. 14A is a view in a vertical plane parallel to the X-axis
  • Fig. 14B is a view in a vertical plane parallel to the Y-axis.
  • the microstructures can be arbitrarily placed on, in or near a tape, substrate or surface of any kind, or a number of surfaces or shapes.
  • the resulting array of microstructures can be attached by adhesive or by direct or indirect force such as vacuum, stress or any other force to the said functional parts, surfaces or shapes, other materials, gel, liquid or gas can be near, on or in between the surfaces or the array of the functional parts.
  • the array of said microstructures can also be placed in or in between a number of surfaces or shapes that create a form of a tube or tunnel.
  • the said tubes or tunnels can be either open or closed or in part open or in part closed.
  • microstructures 12 are shown as connected by adhesive to a tape or surface 40.
  • Fig. 16 schematically shows how the microstructures 12 of Fig. 15 can be separated to increase the distances between them.
  • the tape or surface 40 is not shown in this figure, since it is assumed that its adhesive connection to the microstructures 12 has been eliminated.
  • wedges 45 are shown as penetrating between adjacent microstructures 12.
  • Each wedge 45 comprises two separate parts 46 and 47. Two parts 46 or two parts 47 engage each microstructure 12. If the part 45 is distanced from the part 47 in the same wedge 45, the 'adjacent microstructures 12 have been separated as shown in Fig. 17. This can be done in various ways. A particularly simple one is to charge the parts 45 with electricity of one sign and the parts 47 with a charge of the opposite sign, leading to the separation of each wedge into two separate parts.
  • Figs. 18 and 19 illustrate a further method to increase the distance between microstructures 12. If they are attached to a tape of surface 50, which is extendable, said surface can be pulled at its two ends by any suitable means schematically indicated by arrows 51, and their distance can be increased, as is seen by comparison of the two figures.
  • Figs. 20 and 21 illustrate still another embodiment of the invention.
  • microstructures 55 are schematically indicated as arranged in a matrix, no supporting means being shown.
  • Arms 56 engage one microstructure 55 out of two, both in rows and in columns.
  • Fig. 21 it is schematically shown that the arms 56 have pushed downward the microstructure 55 which they engage.
  • one row and one column is left untouched between each couple of arms 56, and the array generated by them is comprised of microstructure 55 having a distance therebetween that is twice the original distance shown in Fig. 20.
  • the pushing arms 56 could be applied at greater distances, so that they select, so to speak, microstructures 55 having distances therebetween that are any desired multiple of the original distance.
  • the rams 56 are shown in these figures as pushing the microstructures downwards, they could be so arranged as to lift them upwards, either because they are differently located, or because they are temporarily connected by adhesive to the microstructures.
  • Figs. 22A to 22E show different arrangements of picking arms 61 to 65, which may engage the microstructures 60 by applying a vacuum or by any mechanical means not illustrated.
  • Fig. 23 shows how a picking arm, indicated therein by 65, charges the microstructures 66 into the seat 67 of a support 68.
  • a schematic perspective of the support 68 is shown in Fig. 24, and it is shown that it may optionally comprise holes 69 in seats 70.
  • Fig. 25 shows another support" 71, which is provided with longitudinal seats 72. Continuous hole 69' allows the flow of fluid the substrate 71.
  • a direct or indirect force can move the arrays of microstructures upwards, downwards, sideward or in any other direction, the array of said functional parts or the tape, surface or a number of surfaces or shapes, can also be pushed, pulled, sucked, rotated or moved in any other way in any direction so the said array of functional parts will also move.
  • the spaces in between the microstructures can be increased or decreased.
  • the said arrays can also move or change their shapes and sizes by applying direct or indirect force to them, so they will also move during the said movement or change, and the spaces in between the microstructures can be increased or decreased (see e.g. Figs. 16 and 17).
  • the array of microstructures could also be covered by adhesive or other material in between the spaces of the functional parts so the adhesive or material would fill the spaces between the functional parts to create a surface or shape that would be the negative shape of the array.
  • the said array of microstructures could also be made from an existing surface or shape, which was cut, etched or otherwise reduced to produce the said array. It is also possible that before the surface was cut or otherwise reduced, that an additional surface or a number or surfaces or other material including adhesive of any kind will be near, between, on top, bottom or sides of the said functional parts before the surface was cut or otherwise reduced. Once the surface is cut or otherwise reduced, the said additional surfaces, shapes or other material will create a surface or shape that will hold the said microstructures in place.
  • the microstructures are very small shaped material made from any mind of form contains the assembled parts. They could be manufactured from any material and can be shaped in ' any form that will match the special holes in the substrate. ' The microstructures can be the part itself or a special container that holds the part. They could be manufactured from any material including, plastic, silicon or any other material. An example of the shape is shown in the drawings, but this is not the exclusive shape. Other shapes could be used as well.
  • the array of microstructures can also be placed in or in between a number of surfaces or shapes that create a form of a tube or a tunnel.
  • the said tubes or tunnels can be either open or closed or in part open and in part closed.
  • the said surfaces or shapes can also move or change their shapes and sizes by applying a direct or indirect force to them, so the said array of microstructures will also move during the said movement or change, the spaces in between the microstructures can be increased or decreased
  • a picJking arm, robot, surface gripper, vacuum holder or other shape can also pick or push the said array of microstructures in any direction. During the said movement, the spaces in between the said functional parts can be increased or decreased.
  • the array of microstructures can be placed on, hear or in a surface, substrate, tape, or a number of surfaces or shapes.
  • the said surface, substrate or other shape can have designated holes, dents, closed or open tunnels or other way reduced surface or substrate to hold the said array.
  • Adhesive or other material can be near or on the microstructures or the surface or the substrate.
  • a fluid formed material or vacuum could also be passed near the substrate or the microstructures.
  • a fluid form material or vacuum can exist near the surface, or surfaces or shapes, forcing the microstructures to fit the corresponding holes in the substrate.
  • Lubricants or other liquids, gas or plasma can also be near the functional parts, shapes and substrate (Fig. 7).
  • the array of could also be covered by adhesive or other material in between the spaces of the microstructures so the adhesive or material would fill the spaces between the microstructures to create a surface or shape that would be the negative 3D shape of the array of said microstructures (Fig. 8).
  • Fig. 27A schematically shows a 3D array 70 of microstructures 71, each disposed vertically.
  • the X, Y and Z-axes are indicated in the drawing.
  • a arm 72, or other means of applying pressure to a row or column of microstructures can be used to push the row or column out of the affray and ion a convenient support.
  • Fig. 27B shows the action of such an arm on row 73 of microstructures.
  • the arm pushes the microstructures onto a support, which, in this particular embodiment, is shown in detail A of Fig. 27B as having the form of a tunnel 74.
  • a row of vertically disposed microstructures is thus generated on support 74.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)

Abstract

Cette invention se rapporte à un procédé de manutention de microstructures, qui consiste à agencer ces microstructures en réseaux unidimensionnels, bidimensionnels ou tridimensionnels, et à déplacer ces réseaux en tant que tels. Les réseaux unidimensionnels sont constitués par des lignes qui peuvent être droites ou courbes ou ils peuvent être constitués de sections différentes reliées, et les réseaux bidimensionnels sont constitués par des matrices. Ces microstructures peuvent être des pixels d'affichage à cristaux liquides, des pixels d'affichage de diodes électroluminescentes, des pixels de diodes électroluminescentes organiques, des éléments de piles solaires, des détecteurs de signaux électromagnétiques, des pixels d'affichage au plasma, et des circuits intégrés. Elles peuvent également être produites sous la forme de plaquettes à distances régulières les unes des autres, afin de former une matrice. La pièce en elle-même peut être façonnée sous une forme spéciale, pour s'adapter aux trous d'un support ou d'un substrat, auquel elle doit être connectée.
EP03753896A 2002-10-10 2003-10-10 Appareil et procede d'assemblage de reseaux d'elements fonctionnels sur des substrats Withdrawn EP1554917A2 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US41744702P 2002-10-10 2002-10-10
US417447P 2002-10-10
US46904303P 2003-05-06 2003-05-06
US469043P 2003-05-06
PCT/IL2003/000821 WO2004034441A2 (fr) 2002-10-10 2003-10-10 Appareil et procede d'assemblage de reseaux d'elements fonctionnels sur des substrats

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EP1554917A2 true EP1554917A2 (fr) 2005-07-20

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JP4748644B2 (ja) * 2005-02-28 2011-08-17 岐阜県 エクオールの検査方法及びエクオール産生菌の検査方法
KR101872764B1 (ko) * 2017-03-02 2018-06-29 주식회사 코엠에스 디스플레이용 엘이디칩 픽킹 배열 장치
CN113410368B (zh) * 2021-05-31 2023-03-21 长春希龙显示技术有限公司 高均匀性集成led显示模块芯片混编封装方法

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US4212102A (en) * 1978-11-22 1980-07-15 Burroughs Corporation IC Socket insertion tool
DE19625515C2 (de) * 1996-06-26 1999-03-18 Mci Computer Gmbh Vorrichtung zur Veränderung der Rasteranordnung von Aufnahmen einer Trägervorrichtung für Gegenstände, insbesondere elektronische Bauteile, und Verfahren zum Überführen von Gegenständen mittels einer derartigen Vorrichtung
GB2333904B (en) * 1998-01-29 2002-07-17 John Michael Lowe Component placement apparatus

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Title
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AU2003272055A8 (en) 2004-05-04
AU2003272055A1 (en) 2004-05-04
WO2004034441A3 (fr) 2004-06-10
WO2004034441A2 (fr) 2004-04-22

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