EP1525580A1 - Support de stockage de donnees optiques a empilements multiples et utilisation d'un tel support - Google Patents
Support de stockage de donnees optiques a empilements multiples et utilisation d'un tel supportInfo
- Publication number
- EP1525580A1 EP1525580A1 EP03738448A EP03738448A EP1525580A1 EP 1525580 A1 EP1525580 A1 EP 1525580A1 EP 03738448 A EP03738448 A EP 03738448A EP 03738448 A EP03738448 A EP 03738448A EP 1525580 A1 EP1525580 A1 EP 1525580A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- recording
- layer
- stack
- storage medium
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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Classifications
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Definitions
- Multi-stack optical data storage medium and use of such medium
- the invention relates to a multi-stack optical data storage medium for rewritable recording using a focused radiation beam entering through an entrance face of the medium during recording, comprising:
- -a substrate with deposited on a side thereof -a first recording stack L 0 comprising a first phase-change type recording layer, said first recording stack being present at a position most remote from the entrance face,
- said transparent spacer layer having a thickness larger than the depth of focus of the focused radiation beam.
- the invention also relates to the use of such an optical recording medium in high-speed applications.
- An embodiment of an optical data storage medium of the type mentioned in the opening paragraph is known from United States patent US 6,190,750, filed by Applicants.
- An optical data storage medium based on the phase-change principle is attractive, because it combines the possibilities of direct overwrite (DOW) and high storage density with easy compatibility with read-only optical data storage systems.
- Data storage in this context, includes digital video-, digital audio- and software-data storage.
- Phase-change optical recording involves the formation of submicrometer-sized amorphous recording marks in a crystalline recording layer using a focused relatively high power radiation beam, e.g. a focused laser-light beam. During recording of information, the medium is moved with respect to the focused laser-light beam that is modulated in accordance with the information to be recorded.
- Marks are formed when the high power laser-light beam melts the crystalline recording layer.
- quenching of the molten marks takes place in the recording layer, leaving an amorphous information mark in the exposed areas of the recording layer that remains crystalline in the unexposed areas. Erasure of written amorphous marks is realized by recrystallization through heating with the same laser at a lower power level, without melting the recording layer.
- the amorphous marks represent the data bits, which can be read, e.g. via the substrate, by a relatively low-power focused laser-light beam. Reflection differences of the amorphous marks with respect to the crystalline recording layer bring about a modulated laser-light beam which is subsequently converted by a detector into a modulated photocurrent in accordance with the recorded information.
- a high data rate is particularly required in high-density recording and high data rate optical recording media, such as in disk-shaped CD-RW high speed, DVD-RW, DVD+RW, DVD-RAM, DVR-red and DVR-blue, also called Blu-ray Disk (BD), which respectively are abbreviations of the known Compact Disk and the new generation high density Digital Versatile or Video Disk+RW and -RAM, where RW and RAM refer to the rewritability of such disks, and Digital Video Recording optical storage disks, where red and blue refer to the used laser wavelength.
- BD Blu-ray Disk
- Such a high data rate requires the recording layer to have a high crystallization speed, i.e. a crystallization time of lower than 30 ns, during DOW.
- a crystallization time of lower than 30 ns, during DOW.
- the complete erasure time is defined as the minimum duration of an erasing pulse for complete crystallization of a written amorphous mark in a crystalline environment.
- the CET is generally measured with a static tester.
- the AV-information stream determines the data rate for Audio/Video (AV) -applications but for computer-data applications no restrictions in data rate apply, i.e. the higher the better.
- Each of these data bit rates can be translated to a maximum CET which is influenced by several parameters, e.g. thermal design of the recording stacks and the recording layer materials used.
- the recording layer must have a proper crystallization speed to match the velocity of the medium relative to the laser-light beam during DOW, i.e. the linear recording velocity. If the crystallization speed is not high enough the amorphous marks from the previous recording, representing old data, cannot be completely erased, meaning recrystallized, during DOW. On the other hand, when the crystallization time is short, amorphization becomes difficult because crystallite growth from the crystalline background is unavoidable. This results in relatively small amorphous marks (low modulation) with irregular edges, causing a high jitter level. This limits the density and data rate of the disk.
- Multi-stack designs may be represented by a symbol L n in which n denotes 0 or a positive integer number, hi this document, the "further" stack through which the radiation beam enters is called L n , while each deeper stack is represented by L n -i.. L 0 . Deeper is to be understood in terms of the direction of the incoming radiation beam. Note that in other documents this notation may be reversed and that L 0 represents the stack closest to the entrance face and L n the stack farthest form the entrance face.
- Said known medium of US patent 6,190,750 has a ⁇ TP 2 TM 2 f
- I represents a dielectric layer
- ? ⁇ represents a further dielectric layer.
- Pi and P 2 represent phase-change- recording layers, and S represents a transparent spacer layer.
- the laser-light beam enters first through the stack containing P 2 .
- the metal layers not only serve as a reflective layer, but also as a heat sink to ensure rapid cooling for quenching the amorphous phase during writing.
- the Pi layer is present proximate a relatively thick metal mirror layer Mi which causes substantial cooling of the Pi layer during recording while the P 2 layer is present proximate a relatively thin metal layer M 2 with limited heat sink properties.
- the cooling behavior of a recording layer determines to a large extent the correct formation of amorphous marks during recording. Sufficient heat sink action is required in order to ensure proper amorphous mark formation during recording.
- additional thin M and I layers were introduced in the known medium from US 6,190,750.
- Stoichiometric or compound Ge-Sb-Te materials e.g. Ge 2 Sb 2 Te 5 , are used as the recording layer for the known recording medium, e.g. DVD-RAM disks.
- the recording layers which are closest to the entrance face of the recording/reading laser-light beam, have a relatively high optical transmission, hence a relatively low thickness, in order to allow writing and reading in underlying recording layers combined with a low CET.
- High-speed recording is to be understood as recording at a linear recording velocity, i.e. the velocity of the focused radiation beam relatively to optical data storage medium, of at least 12 m/s.
- These materials can be considered as the area surrounding and including the eutectic Sb 70 Te 30 doped with Ge and have a growth-dominated crystallization process. It means that mark erasure occurs by direct growth from the edge between the written amorphous mark and crystalline background. Nucleation within the written amorphous mark does not occur before this growth finished.
- the CET of these materials first decreases rapidly with increasing the layer thickness and then increases again upon further increasing layer thickness. The shortest crystallization time is found at a thickness of about 10 nm.
- the thickness of the recording layer should be as thin as possible, preferably about 5 nm, to allow a high transmission.
- the shortest CET of doped "eutectic" Sb-Te (growth-type) recording materials is obtained at about lOnm. A short CET at a still thinner layer is required. It is proposed to use the eutectic Ge-doped SbTe as recording layer, which is in contact with a crystallization promoting layer and preferably sandwiched between two crystallization promoting layers such as nitrides, oxides of Si, Al and Hf.
- crystallization promoting layers is to enhance the crystallization rate of the recording layer, leading to a CET of about 30ns at a thickness of about 5 nm and a recording-layer composition of Ge .oSb 76 . Te ⁇ 6 . 6 .
- the low-CET window is also improved (see Fig. 2).
- "eutectic"- GeSbTe compositions may be understood as follows: the strong decrease of the CET with the increase of the phase change layer thickness is a result of competition between the contributions of the interface material and the bulk material. When the layer is relatively thin, the volume fraction of the material located at the interface is large, which is often structurally very different from its bulk form, e.g. has more defects. With the increase of layer thickness, the fraction of the material that is in bulk form will increase, and above a certain thickness the bulk form will govern the behavior of the material. Apparently, the bulk materials have a more favorable growth speed than the interface materials. The increase of the CET with the phase change layer thickness may be caused by the volume increase of the material.
- the crystallization process of a Ge-Sb-Te layer according to claim 1 is growth-dominated.
- the volume of the material to be crystallized becomes important.
- the size of the crystallites is typically 10 nm.
- the interface plays a dominant role and may reduce the growth speed.
- the improvement of the interface results in a significant enhancement of crystallization speed.
- the transparent crystallization-promoting layer mainly comprises a material selected from the group of nitrides, oxides of Si, Al and Hf and even more preferably a material selected from the group of nitrides of Al and nitrides of Si.
- Nitrides of Al and Si, e.g. Si 3 N 4 have a very good crystallization promoting behavior.
- the further recording layer has a thickness selected from the range of 4 to 8 nm. At the lower end of this range an optical transmission of the Li -stack may be achieved which is larger than 50 %.
- a recording layer with a composition in this range has proven to give excellent CET values as low as 25 ns at an optimal thickness of 10 nm.
- a metal reflective layer, semi-transparent for the radiation beam, is present in the further recording stack.
- This reflective layer combines a relatively large heat conductivity with a relatively high optical transparency.
- the heat conductivity is advantageous for the amorphous mark formation process, especially when using growth dominated recording layer materials according to the invention.
- Especially Cu is preferred because it combines excellent heat conductivity with a relatively low chemical reactivity compared to for example Ag.
- a high heat conductivity is advantageous for cooling the recording layer of the recording stack.
- the recording layer of the further recording stack and one or two crystallization promoting layers in contact with the further recording layer is sandwiched between further dielectric layers.
- An optimum thickness range for e.g. a dielectric layer between the recording layer and the metal reflective layer is found between 3 and 30 nm, preferably between 4 and 20 nm.
- This dielectric layer may be used to tune the optical properties of the recording stack.
- this layer is relatively thin, the thermal insulation between the recording layer and the metal reflective layer is decreased. As a result, the cooling rate of the recording layer is increased. Increasing the thickness of the dielectric layer will decrease the cooling rate.
- An optimal thickness range for a further dielectric layer at a side of the recording stack closest to the entrance face is between 50 and 200 nm.
- the optical properties of the stack may be adversely affected. Thicknesses larger than 200 nm may cause stresses in the layer and are more expensive to deposit.
- the first recording layer has the same composition as a further recording layer.
- the first recording may be sandwiched between dielectric layers similar to the dielectric layers of the further recording layer. Crystallization promoting layers in contact with the first recording layer may be present but are optional.
- the thickness of the first recording layer may be thicker than 12 nm because it does not need to have a high optical transparency.
- the dielectric layers may be made of a mixture of ZnS and SiO 2 , e.g. (ZnS) 80 (SiO 2 ) 20 .
- Alternatives are, e.g. SiO 2 , TiO 2 , ZnS, A1N and Ta 2 O 5 .
- the dielectric layers of the first recording stack comprises a carbide, like SiC, WC, TaC, ZrC or TiC. These materials may give a higher crystallization speed and better cyclability than a ZnS-SiO 2 mixture.
- metals such as Al, Ti, Au, Ni, Cu, Ag, Cr, Mo, W, and Ta and alloys of these metals, can be used.
- the substrate of the data storage medium is at least transparent for the laser wavelength, and is made, for example, of polycarbonate (PC), polymethyl methacrylate (PMMA), amorphous polyolefin or glass. Transparency of the substrate is only required when the laser-light beam enters the recording stacks via the entrance face of the substrate.
- the substrate is disk-shaped and has a diameter of 120 mm and a thickness of 0.1, 0.6 or 1.2 mm.
- the substrate may be opaque when the laser-light beam enters the stack via the side opposite from the side of the substrate. In the latter case the metal reflective layer of the stack is adjacent the substrate. This is also referred to as an inversed stack.
- An inversed stack is e.g. used in the DVR disk.
- the surface of the disk-shaped substrate on the side of the recording stacks is, preferably, provided with a servotrack, which can be scanned optically.
- This servotrack is often constituted by a spiral-shaped groove and is formed in the substrate by means of a mould during injection molding or pressing.
- These grooves can be alternatively formed in a replication process in the synthetic resin of the spacer layer, for example, a UV light-curable acrylate.
- the outermost layer of the stack is screened from the environment by means of a protective layer of, for example, UV light-cured poly(meth)acrylate.
- the protective layer must be of good optical quality, i.e. substantially free from optical aberrations and substantially uniform in thickness, when the laser-light enters the recording stacks via the protective layer.
- the protective layer is transparent to the laser-light and is also called cover layer. For DVR disks this cover layer has a thickness of 0.1 mm.
- Recording and erasing data in the recording layers of the recording stacks may be achieved by using a short- wavelength laser, e.g. with a wavelength of 660 nm or shorter (red to blue).
- a short- wavelength laser e.g. with a wavelength of 660 nm or shorter (red to blue).
- Both the metal reflective layer, and the dielectric layers can be provided by evaporation or sputtering.
- the phase-change recording layer can be applied to the substrate by vacuum deposition.
- vacuum deposition processes are evaporation (E-beam evaporation, resistant heat evaporation from a crucible), sputtering, low pressure Chemical Vapor Deposition (CVD), Ion Plating, Ion Beam Assisted Evaporation, Plasma enhanced CVD. Normal thermal CVD processes are not applicable because of too high reaction temperature.
- the layer thus deposited is amorphous and exhibits a low reflection. In order to constitute a suitable recording layer having a high reflection, this layer must first be completely crystallized, which is commonly referred to as initialization.
- the recording layer can be heated in a furnace to a temperature above the crystallization temperature of the Ge-Sb-Te alloy, e.g. 180°C.
- a synthetic resin substrate, such as PC can alternatively be heated by a special laser-light beam of sufficient power. This can be realized, e.g. in a special recorder, in which case the special laser-light beam scans the moving recording layer.
- the amorphous layer is then locally heated to the temperature required for crystallizing the layer, without the substrate being subjected to a disadvantageous heat load.
- High-density recording and erasing can be achieved by using a short- wavelength laser, e.g. with a wavelength of 670 nm or shorter (red to blue).
- Fig. 1 shows a schematic cross-sectional view of an optical storage medium in accordance with the invention
- Fig. 2 shows the relation between CET (in ns) and the thickness d (in nm) of the recording layer of the Li or L 0 stack for a Ge 7 Sb 76 . 4 Te ⁇ 6 . 6 material with and without crystallization promoting layer,
- Fig. 3 shows a ternary phase diagram for Ge-Sb-Te.
- FIG 1 the multi-stack optical data storage medium 20 for rewritable recording is shown.
- the medium has a substrate 1 made of PC having a diameter of 120 mm and a thickness of 0.6 mm, with deposited on a side thereof a first recording stack 2 comprising a first phase-change type recording layer 6.
- the first recording stack 2 is present at a position most remote from the entrance face 16.
- a further recording stack 3 which comprises a further phase-change type recording layer 12, is present closer to the entrance face 16 than the first recording stack.
- a transparent spacer layer 9 is present between the recording stacks 2, 3.
- the transparent spacer 9 layer has a thickness of 30 ⁇ m and may be made of a UV curable resin known in the art provided by spin coating or a plastic sheet of e.g. PMMA or PC including a pressure sensitive adhesive (PSA) layer.
- the further recording layer 12 is substantially of an alloy defined by the formula Ge 7 Sb 76 . 4 Te ⁇ 6 . 6 in atomic percentages and has a thickness of 5 nm.
- Two transparent crystallization promoting layer 11', 13' having a thickness of 2 nm are present in contact with the further recording layer 12.
- the transparent crystallization promoting layers 11', 13' mainly comprise the material Si 3 N .
- a metal reflective layer 14, semi-transparent for the radiation beam 19, is present in the further recording stack 3 and mainly comprises the element Cu and has a thickness of 6 nm.
- the first recording layer 6 is substantially of an alloy defined by the formula Ge Sb 76 . Te ⁇ 6 6 in atomic percentages and has a thickness of 10 nm.
- Two optional transparent crystallization promoting layer 5', 7' having a thickness of 2 nm are present in contact with the first recording layer 6.
- the transparent crystallization promoting layers 5', 7' mainly comprise the material Si 3 N 4 .
- a second metal reflective layer 4 is present in the first recording stack 3 and mainly comprises the element Cu and has a thickness of 100 nm. Recording and reading is performed by means of a laser-light beam 19.
- Further dielectric layers 5 and 7 are present made of (ZnS) 8 o(SiO 2 ) 0 with thicknesses of 20 and 90 nm respectively.
- the thickness d of the recording layer 6 may be varied between 4 and 20 nm. Results of the effect of this variation on the CET are shown in Fig. 2.
- the structure of Li maybe: I(60)-N(2)-P(5)-N(2)-M(6)-I(80). Note that, compared to Fig. 1, the dielectric layer 11 between the metal layer 14 and the crystallization promoting layer 11 ' has been deleted. This deletion may increase the cooling behavior of the stack 3 because the distance between the recording layer 12 and the metal layer 14 has decreased.
- the phase-change recording layers 6 and 12 are applied to the substrate by vapor depositing or sputtering of a suitable target.
- the layers thus deposited is amorphous and is initialized, i.e. crystallized, in a special recorder also called initializer.
- Further layers, with the exception of spacer layer 9 and a cover layer 15 are also provided by vapor depositing or sputtering of a suitable target.
- the radiation beam 19 for recording, reproducing and erasing of information enters the recording layer 6 or 12 via the transparent cover layer 15.
- the transparent cover layer 15 has a thickness of 0.1 mm and is made of a UV cured resin provided by spin coating.
- the cover layer 15 may also be provided by application of a plastic sheet including a pressure sensitive adhesive (PSA) layer.
- PSA pressure sensitive adhesive
- Fig. 2 the dependence of the CET in ns on the thickness d in nm of the phase-change recording layer 6 or 12 for the compound Ge 7 Sb 76 . Te ⁇ 6 . 6 is shown.
- DVD+RW, DVR or BD disks are far from the stoichiometric compositions in region 31.
- the materials with compositions from area 32 can be considered as the eutectic Sb 7 oTe 30 doped with Ge and have a growth-dominated crystallization process. It means that mark erasure occurs by direct growth from the edge between the written amo ⁇ hous mark and crystalline background. Nucleation within the written amo ⁇ hous mark does not occur before this growth finished.
- the CET of these materials first decreases rapidly with increasing the layer thickness and then increases again upon further increasing layer thickness as shown in Fig. 2. The shortest crystallization time is found at a thickness of about 10 nm.
- These eutectic (growth type) materials are most suitable for high data rate and high density recording in both single and dual layer DVD and DVR recording systems because the crystallization time decreases with the decrease of the recording amo ⁇ hous mark size.
- a multi-stack optical data storage medium for rewritable recording using a focused radiation beam entering through an entrance face of the medium during recording.
- the medium comprises a substrate with deposited on a side thereof a first recording stack L 0 comprising a first phase-change type recording layer.
- the first recording stack is present at a position most remote from the entrance face.
- At least one further recording stack L reinforce which comprises a further phase-change type recording layer, is present closer to the entrance face than the first recording stack.
- a transparent spacer layer is present between the recording stacks.
- a high optical transmission combined with a low crystallization time of the recording layer of the L n stack is achieved making the medium suitable for multi-stack high speed recording with a linear recording velocity of at least 12 m/s.
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
Abstract
La présente invention concerne un support de stockage (20) de données optiques à empilements multiples qui permet d'effectuer l'enregistrement réinscriptible au moyen d'un pinceau (19) de rayonnement focalisé qui entre par une face d'entrée (16) du support (20) pendant l'enregistrement. Le support (20) comprend un substrat (1) sur un côté duquel est déposé un premier empilement (2) L0 comprenant une première couche (6) d'enregistrement du type à changement de phase. Le premier empilement (2) d'enregistrement se trouve à un endroit qui est le plus éloigné de la face d'entrée (16). Au moins un autre empilement (3) d'enregistrement Ln, qui comprend une autre couche (12) d'enregistrement du type à changement de phase, se trouve placé plus près de la face d'entrée (16) que le premier empilement (2) d'enregistrement. Une couche (9) d'espacement transparente se trouve entre les empilements (2, 3) d'enregistrement. L'autre couche (12) d'enregistrement est sensiblement constituée d'un alliage défini par la formule GexSbyTez, dans laquelle en pourcentages atomiques, 0 < x < 15, 50 < y < 80, 10 < z < 30 et x + y + z = 100, avec une épaisseur sélectionnée dans la plage comprise entre 4 et 12 nm et qui comprend au moins une couche transparente (11', 13') facilitant la cristallisation dont l'épaisseur est inférieure à 5nm et qui est en contact avec l'autre couche (12) d'enregistrement. On obtient ainsi une transmission optique élevée combinée à un court temps de cristallisation pour la couche (12) d'enregistrement de l'empilement Ln (3), ce qui rend ainsi le support (20) approprié pour l'enregistrement à grande vitesse sur des empilements multiples à une vitesse d'enregistrement linéaire au moins égale à 12 m/s.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03738448A EP1525580A1 (fr) | 2002-07-15 | 2003-06-20 | Support de stockage de donnees optiques a empilements multiples et utilisation d'un tel support |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02077860 | 2002-07-15 | ||
EP02077860 | 2002-07-15 | ||
PCT/IB2003/002956 WO2004008447A1 (fr) | 2002-07-15 | 2003-06-20 | Support de stockage de donnees optiques a empilements multiples et utilisation d'un tel support |
EP03738448A EP1525580A1 (fr) | 2002-07-15 | 2003-06-20 | Support de stockage de donnees optiques a empilements multiples et utilisation d'un tel support |
Publications (1)
Publication Number | Publication Date |
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EP1525580A1 true EP1525580A1 (fr) | 2005-04-27 |
Family
ID=30011200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP03738448A Withdrawn EP1525580A1 (fr) | 2002-07-15 | 2003-06-20 | Support de stockage de donnees optiques a empilements multiples et utilisation d'un tel support |
Country Status (8)
Country | Link |
---|---|
US (1) | US20050177842A1 (fr) |
EP (1) | EP1525580A1 (fr) |
JP (1) | JP2005533331A (fr) |
KR (1) | KR20050026477A (fr) |
CN (1) | CN1669080A (fr) |
AU (1) | AU2003244974A1 (fr) |
TW (1) | TW200403665A (fr) |
WO (1) | WO2004008447A1 (fr) |
Families Citing this family (3)
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JP2007533064A (ja) * | 2004-04-15 | 2007-11-15 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | マスク層を有する光学マスター基板及び高密度レリーフ構造の製造方法 |
US8017208B2 (en) | 2006-11-01 | 2011-09-13 | Panasonic Corporation | Information recording medium, target and method for manufacturing of information recording medium using the same |
JP4964093B2 (ja) * | 2006-11-01 | 2012-06-27 | パナソニック株式会社 | 情報記録媒体、並びに、ターゲットおよびそれを用いた情報記録媒体の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06195747A (ja) * | 1992-11-11 | 1994-07-15 | Nec Corp | 光ディスク |
US6143468A (en) * | 1996-10-04 | 2000-11-07 | Mitsubishi Chemical Corporation | Optical information recording medium and optical recording method |
TW473712B (en) * | 1998-05-12 | 2002-01-21 | Koninkl Philips Electronics Nv | Rewritable double layer optical information medium |
EP0957477A3 (fr) * | 1998-05-15 | 2003-11-05 | Matsushita Electric Industrial Co., Ltd. | Support d'enregistrement optique, procédé et système d'enregistrement et de reproduction d' information associés |
RU2002101129A (ru) * | 2000-04-20 | 2003-09-27 | Конинклейке Филипс Электроникс Н.В. (Nl) | Носитель оптической записи |
ES2210179T3 (es) * | 2000-07-12 | 2004-07-01 | Koninklijke Philips Electronics N.V. | Soporte optico de informacion con distintas capas de grabacion. |
TWI233098B (en) * | 2000-08-31 | 2005-05-21 | Matsushita Electric Ind Co Ltd | Data recoding medium, the manufacturing method thereof, and the record reproducing method thereof |
US20020160306A1 (en) * | 2001-01-31 | 2002-10-31 | Katsunari Hanaoka | Optical information recording medium and method |
US20030112731A1 (en) * | 2001-09-13 | 2003-06-19 | Shuichi Ohkubo | Phase-change recording medium, recording method and recorder therefor |
-
2003
- 2003-06-20 EP EP03738448A patent/EP1525580A1/fr not_active Withdrawn
- 2003-06-20 WO PCT/IB2003/002956 patent/WO2004008447A1/fr active Application Filing
- 2003-06-20 US US10/520,869 patent/US20050177842A1/en not_active Abandoned
- 2003-06-20 JP JP2004520983A patent/JP2005533331A/ja not_active Withdrawn
- 2003-06-20 KR KR1020057000579A patent/KR20050026477A/ko not_active Application Discontinuation
- 2003-06-20 AU AU2003244974A patent/AU2003244974A1/en not_active Abandoned
- 2003-06-20 CN CNA038166399A patent/CN1669080A/zh active Pending
- 2003-07-11 TW TW092118990A patent/TW200403665A/zh unknown
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Also Published As
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KR20050026477A (ko) | 2005-03-15 |
JP2005533331A (ja) | 2005-11-04 |
WO2004008447A1 (fr) | 2004-01-22 |
AU2003244974A1 (en) | 2004-02-02 |
CN1669080A (zh) | 2005-09-14 |
US20050177842A1 (en) | 2005-08-11 |
TW200403665A (en) | 2004-03-01 |
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