EP1505694A3 - Oberflächenmontierbarer Verbinder - Google Patents
Oberflächenmontierbarer Verbinder Download PDFInfo
- Publication number
- EP1505694A3 EP1505694A3 EP04254764A EP04254764A EP1505694A3 EP 1505694 A3 EP1505694 A3 EP 1505694A3 EP 04254764 A EP04254764 A EP 04254764A EP 04254764 A EP04254764 A EP 04254764A EP 1505694 A3 EP1505694 A3 EP 1505694A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- soldering
- insulating housing
- vertical range
- pegs
- surface mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
- H01R13/6315—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only allowing relative movement between coupling parts, e.g. floating connection
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003287881A JP2005056748A (ja) | 2003-08-06 | 2003-08-06 | 表面実装型コネクタ |
JP2003287881 | 2003-08-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1505694A2 EP1505694A2 (de) | 2005-02-09 |
EP1505694A3 true EP1505694A3 (de) | 2007-08-29 |
Family
ID=33550031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04254764A Withdrawn EP1505694A3 (de) | 2003-08-06 | 2004-08-06 | Oberflächenmontierbarer Verbinder |
Country Status (5)
Country | Link |
---|---|
US (1) | US7056133B2 (de) |
EP (1) | EP1505694A3 (de) |
JP (1) | JP2005056748A (de) |
CN (1) | CN100380743C (de) |
TW (1) | TWM265789U (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6823127B2 (en) * | 2002-09-05 | 2004-11-23 | Intel Corporation | Apparatus for holding a fiber array |
JP4519724B2 (ja) * | 2005-07-01 | 2010-08-04 | 矢崎総業株式会社 | コネクタ固定構造 |
TWI303906B (en) * | 2006-01-27 | 2008-12-01 | Fci Asia Technology Pte Ltd | Connector |
US7393244B1 (en) * | 2007-03-08 | 2008-07-01 | International Business Machines Corporation | Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectors |
US7849592B2 (en) * | 2009-01-22 | 2010-12-14 | International Business Machines Corporation | Method of compensating for thermal expansion in SMT interconnects |
US8388373B2 (en) * | 2011-01-26 | 2013-03-05 | Proconn Technology Co., Ltd. | Connector with movable soldering attachments |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6361332B1 (en) * | 2001-04-06 | 2002-03-26 | Molex Incorporated | Retention system for electrical connectors |
EP1213797A2 (de) * | 2000-12-08 | 2002-06-12 | Tyco Electronics AMP K.K. | Leiterplattenrandverbinder |
JP2002305047A (ja) * | 2001-04-05 | 2002-10-18 | Japan Aviation Electronics Industry Ltd | 基板実装用コネクタ |
US6471544B1 (en) * | 2001-06-25 | 2002-10-29 | Ovilux Corporation | Fixing structure for connecting a connector and a printed circuit board |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4436358A (en) * | 1982-03-31 | 1984-03-13 | Amp Incorporated | Terminal tab intended for mounting on a circuit board |
US4842528A (en) * | 1987-03-27 | 1989-06-27 | Amp Incorporated | Solder post retention means |
US6050851A (en) * | 1997-06-20 | 2000-04-18 | Berg Technology, Inc. | Electric connector |
US6305976B1 (en) * | 2000-04-07 | 2001-10-23 | Amp (Japan), Ltd. | Electrical connector with planar mounting members |
US6319059B1 (en) * | 2000-07-25 | 2001-11-20 | Hon Hai Precision Ind. Co., Ltd. | Shielded electrical connector |
CN2459769Y (zh) * | 2000-12-07 | 2001-11-14 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
JP2004079202A (ja) * | 2002-08-09 | 2004-03-11 | Sharp Corp | レセプタクル |
-
2003
- 2003-08-06 JP JP2003287881A patent/JP2005056748A/ja active Pending
-
2004
- 2004-08-03 TW TW093212309U patent/TWM265789U/zh not_active IP Right Cessation
- 2004-08-06 EP EP04254764A patent/EP1505694A3/de not_active Withdrawn
- 2004-08-06 CN CNB2004100549994A patent/CN100380743C/zh not_active Expired - Fee Related
- 2004-08-06 US US10/913,198 patent/US7056133B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1213797A2 (de) * | 2000-12-08 | 2002-06-12 | Tyco Electronics AMP K.K. | Leiterplattenrandverbinder |
JP2002305047A (ja) * | 2001-04-05 | 2002-10-18 | Japan Aviation Electronics Industry Ltd | 基板実装用コネクタ |
US6361332B1 (en) * | 2001-04-06 | 2002-03-26 | Molex Incorporated | Retention system for electrical connectors |
US6471544B1 (en) * | 2001-06-25 | 2002-10-29 | Ovilux Corporation | Fixing structure for connecting a connector and a printed circuit board |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 02 5 February 2003 (2003-02-05) * |
Also Published As
Publication number | Publication date |
---|---|
TWM265789U (en) | 2005-05-21 |
JP2005056748A (ja) | 2005-03-03 |
CN1581586A (zh) | 2005-02-16 |
EP1505694A2 (de) | 2005-02-09 |
US7056133B2 (en) | 2006-06-06 |
US20050032420A1 (en) | 2005-02-10 |
CN100380743C (zh) | 2008-04-09 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR |
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AX | Request for extension of the european patent |
Extension state: AL HR LT LV MK |
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PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
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AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR |
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AX | Request for extension of the european patent |
Extension state: AL HR LT LV MK |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01R 13/631 20060101ALI20070726BHEP Ipc: H01R 12/18 20060101AFI20041110BHEP |
|
17P | Request for examination filed |
Effective date: 20080129 |
|
AKX | Designation fees paid |
Designated state(s): DE FR GB |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20100326 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: TYCO ELECTRONICS JAPAN G.K. |