EP1464084A1 - Ensemble photodiode et procede pour la production d'une liaison entre un premier composant semi-conducteur et un deuxieme composant semi-conducteur - Google Patents

Ensemble photodiode et procede pour la production d'une liaison entre un premier composant semi-conducteur et un deuxieme composant semi-conducteur

Info

Publication number
EP1464084A1
EP1464084A1 EP02704576A EP02704576A EP1464084A1 EP 1464084 A1 EP1464084 A1 EP 1464084A1 EP 02704576 A EP02704576 A EP 02704576A EP 02704576 A EP02704576 A EP 02704576A EP 1464084 A1 EP1464084 A1 EP 1464084A1
Authority
EP
European Patent Office
Prior art keywords
photodiode
submount
wafer
metallization
semiconductor components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02704576A
Other languages
German (de)
English (en)
Inventor
Frank Singer
Robert FÜRST
Melanie Ring
Mathias KÄMPF
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Infineon Technologies AG
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG, Osram Opto Semiconductors GmbH filed Critical Infineon Technologies AG
Publication of EP1464084A1 publication Critical patent/EP1464084A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02016—Circuit arrangements of general character for the devices
    • H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity

Definitions

  • the invention relates to a photodiode arrangement with a photodiode and a submount, via which electrical contact is made with the photodiode, and a method for establishing a connection between a first
  • Semiconductor component and a second semiconductor component in particular between a photodiode and a submount for a photodiode, the interconnected semiconductor components having a different outer contour.
  • an electro-optical coupling module with a laser diode arrangement in which a plurality of vertically emitting VCSEL laser diodes are arranged in an array.
  • the laser diodes are assigned optical fibers arranged in one plane, the end faces of which on the coupling side cause the light emitted by the laser diodes to be deflected into the optical fibers.
  • FIG. 7 A corresponding structure known in the prior art is shown schematically in FIG. 7. Thereafter, a laser diode array 101 is arranged on a submount 100, which in the exemplary embodiment shown consists of sixteen VCSEL diodes 102. Twelve of these laser diodes 102 are used for data communications and accordingly a schematically represented optical waveguide 103 is assigned to each of them.
  • monitor diode 111, 112 consisting of gallium arsenide is assigned, the optically active surface of which is positioned directly above the outermost laser diode 104, 105 and faces it.
  • the optically active surface of the photodiode on the side facing away from the laser diodes 104, 105, that is to say at the top.
  • a deflection optics would then be required in order to direct the laser beam onto the optically active surface of the monitor diode.
  • the monitor diode 111, 112 is formed in each case in a carrier 113, 114 which is attached to a submount 115, 116 serving as a spacer.
  • the submount is a ceramic carrier.
  • the contacting of the monitor diodes 111-, 112 and also of the laser diodes 102, 104, 105 takes place via bond wires 117, which are connected via metallizations 118 and further bond wires 119 to contacts of a schematically illustrated control and driver circuit 120.
  • Submount 115, 116 and monitor diode 111, 112 are positioned at a right angle to one another, so that on the one hand the monitor diode with its optically active surface projects beyond the spacer and on the other hand there is space on the spacer for contact pads for connecting the bonding wires 119.
  • the two monitor diodes 111, 112 are usually used in such a way that the optical output power of the laser diodes 102 is regulated with the aid of a monitor diode 111, while the other laser diode 112 brings about a safety shutdown in the event that the laser power exceeds a predetermined limit value.
  • Such regulations are known per se.
  • the flip-chip assembly adjusts the two isolated components by turning one chip and then positioning it on the other chip in a workpiece carrier.
  • the disadvantage of this method is that one component must be positioned in a workpiece carrier after being separated. The process is time consuming and the small size of the individual chips (about 2mm x 2mm) difficult to handle. The process is also cost-intensive, since it is a single chip process, ie complex and expensive one-off productions.
  • the present invention is therefore based on the object of a photodiode arrangement and a method for. To provide a connection between a first semiconductor component and a second semiconductor component, which enable a connection of the semiconductor components using standard processes and thereby in a cost-effective and effective manner.
  • the solution according to the invention is characterized by a photodiode arrangement in which a photodiode and a submount for contacting the photodiode are connected to one another by eutectic bonding. Both elements have a corresponding metallization on the side facing each other.
  • a submount is understood to mean a carrier element for the photodiode.
  • the invention provides a method for producing a connection between a first semiconductor component and a second semiconductor component, which have a different outer contour. In particular, the method serves to connect a photodiode to a submount for producing a photodiode arrangement.
  • the method has the following steps: a) producing a multiplicity of first semiconductor components on a first wafer, b) producing a multiplicity of second semiconductor components on a 'second wafer, c) applying a metallization to the first semiconductor components of the first wafer, d) applying a metallization on the second semiconductor components of the second wafer, e) formation of trenches in the first and / or the second semiconductor components, then f) connection of the two wafers by eutectic bonding of the respective metallizations, the resulting wafer composite having a front and a back , then g) separating the front of the array of wafers according to a first outer contour of the first semiconductor components to be separated, only the first wafer being cut, and subsequently h) separating the back of the composite wafer according to a second outer contour of the second semiconductor to be separated construction elements, with only the second wafer being cut.
  • the semiconductor components to be connected are thus already connected to one another in the wafer assembly. This is done by eutectic bonding of the metallizations formed on the respective semiconductor components. For example, there is gold metallization on one wafer and one on the other wafer Gold-tin plating.
  • the trenches that are etched into the respective surface before the bonding process ensure that the photodiode and the submount only connect to one another at defined points. So the formation of trenches makes it topographical
  • the front side is separated first and then - preferably after the wafer assembly is turned - the back side.
  • the separation is preferably carried out by sawing the respective side. It is not the complete wafer composite that is separated, but only the one above
  • end components can be produced in the wafer process which have different contours, in particular are arranged at an angle to one another.
  • the method according to the invention is extremely effective and time-saving, since up to several thousand semiconductor components can be mounted on one another at the same time. Proven procedures are advantageously combined in a new way and existing logistics chains can be used.
  • the method can be applied to all semiconductor components which are individually connected to one another with flip-chip assembly. It only has to be possible to apply the metallizations required for eutectic bonding to the respective semiconductor components already in the wafer assembly. By using eutectic substance mixtures (e.g. gold-tin with gold), the melting point for the bonding of the metallizations is reduced, so that structures of the semiconductor components formed on the wafers, for example optically active areas of a photodiode, are not destroyed or damaged when the wafers are bonded.
  • eutectic substance mixtures e.g. gold-tin with gold
  • the respective semiconductor components i.e. in particular one photodiode and one submount in each case, are preferably silicon chips. Silicon is a relatively inexpensive material and can rely on tried and tested processing methods.
  • Figure 1 is a side view of a
  • Photodiode arrangement with a photodiode and a submount for carrying and contacting the
  • FIG. 2 shows two wafers to be connected by means of eutectic bonding before the connection
  • FIG. 3 shows the two wafers connected by eutectic bonding
  • FIG. 4 shows a first singulation process on one side of the interconnected wafers
  • FIG. 5 shows a second singulation process on the other side of the interconnected wafers
  • FIG. 7 shows a photodiode arrangement known from the prior art.
  • FIG. 1 shows a photodiode arrangement in which a monitor diode 1 is arranged on a spacer 2. Both the spacer 2 and an array 3 of vertically emitting semiconductor lasers (VCSEL) are positioned on a common carrier 4 in such a way that a lateral one
  • VCSEL vertically emitting semiconductor lasers
  • the monitor diode 1 is preferably a silicon photodiode.
  • the submount 2 is preferably a silicon chip.
  • the two components 1, 2 each have metallizations.
  • the metallizations of the spacer 2 can each be connected to a bonding wire via a contact pad 21.
  • the two components 1, 2 are connected via eutectic bonding even in the wafer assembly, as a result of which the monitor diode 1 and the submount 2 are electrically and mechanically connected to one another in a region 6. This is explained in more detail below with reference to FIGS. 2 to 5.
  • a multiplicity of semiconductor components 1 ′, 2 ′ are respectively structured on the front side of a first wafer 7 and the front side of a second wafer 8.
  • the semiconductor components 1 'of the first wafer 7 are photodiodes with optically active areas and the semiconductor components 2' of the second wafer 8 are submounts, as are used in the arrangement in FIG. 1.
  • the surfaces of the two wafers 7, 8 are placed on top of one another and directly connected to one another by means of eutectic bonding.
  • the two wafers 7, 8 each have a metallization 12 ', 21'.
  • the one metallization is preferably a gold metallization 12 '
  • the other metallization is preferably a gold-tin metallization 21'.
  • trenches or recesses 9 are provided in the surface of at least one wafer. The recesses 9 ensure that a connection between the two wafers takes place only in defined areas. Adjustment aids (so-called fiducials) are also attached to the wafers 7, 8 (not shown). The eutectic bonding of the two wafers is carried out in a manner known per se.
  • the wafer 7 is separated by sawing along the lines 10-b. This is the one to be separated
  • Semiconductor components give a second desired outer contour, that of the outer contour of the first
  • Semiconductor components 2 deviates. After the second wafer 7 has also been separated, the end components already connected are units from the two semiconductor components 1, 2, which are, for example, a monitor diode 1 and a submount 2 according to FIG. 1.
  • the wafers 7, 8 can also be separated by other separation techniques.
  • FIG. 6 shows the metallizations of the two semiconductor components for the example of a monitor diode 1 and a submount 2.
  • the monitor diode 1 has an optically active region 14 which is electrically contacted via metallizations 12, 13.
  • the metallizations 12, 13 each merge into flat metallization regions 12a, 13a.
  • the submount 2 has two contact pads 21 for contacting the monitor diode 1, which are each connected to metallizations 22, 23.
  • the metallizations 22, 23 correspond to the metallizations 12, 13 of the monitor diode in a crossover area in which the monitor diode 1 and the submount 2 are eutectically bonded to one another and form planar metallization regions 22a, 23a, so that the respective metallizations 22a, 12a; 23a, 13a lie one on top of the other.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Lasers (AREA)

Abstract

L'invention concerne un ensemble photodiode comprenant une photodiode et une embase permettant la mise en contact électrique de la photodiode, la photodiode (1) et l'embase (2) étant reliées l'une à l'autre au moyen d'une soudure par eutectique. L'invention concerne également un procédé pour la production d'une liaison entre un premier composant semi-conducteur et un deuxième composant semi-conducteur qui présentent un contour extérieur différent. A cet effet, une liaison est déjà réalisée dans la plaquette composite au moyen d'une soudure par eutectique. Les deux plaquettes reliées l'une à l'autre sont séparées l'une après l'autre et indépendamment l'une de l'autre en fonction d'un contour extérieur désiré respectif.
EP02704576A 2002-01-09 2002-01-09 Ensemble photodiode et procede pour la production d'une liaison entre un premier composant semi-conducteur et un deuxieme composant semi-conducteur Withdrawn EP1464084A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2002/000067 WO2003058720A1 (fr) 2002-01-09 2002-01-09 Ensemble photodiode et procede pour la production d'une liaison entre un premier composant semi-conducteur et un deuxieme composant semi-conducteur

Publications (1)

Publication Number Publication Date
EP1464084A1 true EP1464084A1 (fr) 2004-10-06

Family

ID=5648339

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02704576A Withdrawn EP1464084A1 (fr) 2002-01-09 2002-01-09 Ensemble photodiode et procede pour la production d'une liaison entre un premier composant semi-conducteur et un deuxieme composant semi-conducteur

Country Status (3)

Country Link
US (1) US7476906B2 (fr)
EP (1) EP1464084A1 (fr)
WO (1) WO2003058720A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006017293A1 (de) * 2005-12-30 2007-07-05 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer optisch pumpbaren Halbleitervorrichtung
CN102859410B (zh) 2009-11-03 2015-07-08 3M创新有限公司 光纤装置及制造光纤装置的方法
DE102012107409B4 (de) * 2012-08-13 2022-06-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiter-Laserelements
CN103928364B (zh) * 2014-04-14 2016-09-28 江苏艾特曼电子科技有限公司 一种用于检测共晶键合中合金化程度的结构
CN109632791B (zh) * 2018-11-12 2022-03-25 航天科工防御技术研究试验中心 一种半导体器件键合丝的键合质量评定方法

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US4143385A (en) 1976-09-30 1979-03-06 Hitachi, Ltd. Photocoupler
JPS59220982A (ja) * 1983-05-31 1984-12-12 Sumitomo Electric Ind Ltd 光素子用パッケ−ジ
JPH0746747B2 (ja) * 1986-09-09 1995-05-17 松下電器産業株式会社 半導体レーザのボンディング方法
EP0660467B1 (fr) * 1993-12-22 1997-03-19 Siemens Aktiengesellschaft Elément optoélectronique et sa méthode de fabrication
US5535296A (en) * 1994-09-28 1996-07-09 Optobahn Corporation Integrated optoelectronic coupling and connector
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
DE19709842C1 (de) 1997-02-28 1998-10-15 Siemens Ag Elektrooptische Koppelbaugruppe
US20020028390A1 (en) * 1997-09-22 2002-03-07 Mohammad A. Mazed Techniques for fabricating and packaging multi-wavelength semiconductor laser array devices (chips) and their applications in system architectures
DE19838518A1 (de) * 1998-08-25 2000-03-02 Bosch Gmbh Robert Anordnung
US6271049B1 (en) * 1998-09-14 2001-08-07 Siemens Aktiengesellschaft Method for producing an optoelectronic component
EP1436870A2 (fr) * 2001-10-09 2004-07-14 Infinera Corporation Circuits integres photoniques d'emetteurs (txpic) et reseaux de transport optique utilisant lesdits txpic

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See references of WO03058720A1 *

Also Published As

Publication number Publication date
US20050110025A1 (en) 2005-05-26
US7476906B2 (en) 2009-01-13
WO2003058720A1 (fr) 2003-07-17

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