EP1441868A4 - Reproduction d'un structure a motifs a l'aide d'un moule antiadhesif - Google Patents

Reproduction d'un structure a motifs a l'aide d'un moule antiadhesif

Info

Publication number
EP1441868A4
EP1441868A4 EP02784090A EP02784090A EP1441868A4 EP 1441868 A4 EP1441868 A4 EP 1441868A4 EP 02784090 A EP02784090 A EP 02784090A EP 02784090 A EP02784090 A EP 02784090A EP 1441868 A4 EP1441868 A4 EP 1441868A4
Authority
EP
European Patent Office
Prior art keywords
nonsticking
mold
patterned structure
structure reproduction
reproduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02784090A
Other languages
German (de)
English (en)
Other versions
EP1441868A2 (fr
Inventor
Wu-Sheng Shih
James E Lamb Iii
Mark Daffron
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brewer Science Inc
Original Assignee
Brewer Science Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brewer Science Inc filed Critical Brewer Science Inc
Priority claimed from PCT/US2002/032655 external-priority patent/WO2003031096A2/fr
Publication of EP1441868A2 publication Critical patent/EP1441868A2/fr
Publication of EP1441868A4 publication Critical patent/EP1441868A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
EP02784090A 2001-10-11 2002-10-10 Reproduction d'un structure a motifs a l'aide d'un moule antiadhesif Withdrawn EP1441868A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32884101P 2001-10-11 2001-10-11
US328841P 2001-10-11
PCT/US2002/032655 WO2003031096A2 (fr) 2001-10-11 2002-10-10 Reproduction d'un structure a motifs a l'aide d'un moule antiadhesif

Publications (2)

Publication Number Publication Date
EP1441868A2 EP1441868A2 (fr) 2004-08-04
EP1441868A4 true EP1441868A4 (fr) 2006-08-30

Family

ID=32654286

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02784090A Withdrawn EP1441868A4 (fr) 2001-10-11 2002-10-10 Reproduction d'un structure a motifs a l'aide d'un moule antiadhesif

Country Status (2)

Country Link
EP (1) EP1441868A4 (fr)
KR (1) KR20050035134A (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101366505B1 (ko) * 2005-06-10 2014-02-24 오브듀캇 아베 고리형 올레핀 공중합체를 포함하는 임프린트 스탬프
JP4533358B2 (ja) * 2005-10-18 2010-09-01 キヤノン株式会社 インプリント方法、インプリント装置およびチップの製造方法
KR101171190B1 (ko) 2005-11-02 2012-08-06 삼성전자주식회사 표시장치의 제조방법과 이에 사용되는 몰드
KR101049218B1 (ko) * 2008-09-29 2011-07-13 한국기계연구원 적용 가압력 제거를 이용한 미세 패턴 형성 방법
KR101136899B1 (ko) * 2012-02-22 2012-04-20 인산디지켐 주식회사 메탈호일몰드의 제조방법 및 제조장치
KR101649557B1 (ko) * 2015-02-10 2016-08-22 인하대학교 산학협력단 전도성 패턴의 제조방법 및 이에 따라 제조되는 전도성 패턴
CN105856947A (zh) * 2016-06-03 2016-08-17 杨传祥 一种北红玛瑙粘贴木面装饰画
KR102014100B1 (ko) * 2017-08-22 2019-08-26 한국세라믹기술원 가압방식 소성변형 패터닝 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148009A (ja) * 1984-12-24 1986-07-05 Sumitomo Bakelite Co Ltd 注形型
US6033202A (en) * 1998-03-27 2000-03-07 Lucent Technologies Inc. Mold for non - photolithographic fabrication of microstructures
EP1003078A2 (fr) * 1998-11-17 2000-05-24 Corning Incorporated Procédé pour reproduire un motif nanométrique
WO2000054107A1 (fr) * 1999-03-11 2000-09-14 Board Of Regents, The University Of Texas System Lithogravure en photorepetition
US6228294B1 (en) * 1998-07-06 2001-05-08 Hyundai Electronics Industries Co., Ltd. Method for compression molding

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148009A (ja) * 1984-12-24 1986-07-05 Sumitomo Bakelite Co Ltd 注形型
US6033202A (en) * 1998-03-27 2000-03-07 Lucent Technologies Inc. Mold for non - photolithographic fabrication of microstructures
US6228294B1 (en) * 1998-07-06 2001-05-08 Hyundai Electronics Industries Co., Ltd. Method for compression molding
EP1003078A2 (fr) * 1998-11-17 2000-05-24 Corning Incorporated Procédé pour reproduire un motif nanométrique
WO2000054107A1 (fr) * 1999-03-11 2000-09-14 Board Of Regents, The University Of Texas System Lithogravure en photorepetition

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
BECKER H ET AL: "Hot embossing as a method for the fabrication of polymer high aspect ratio structures", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 83, no. 1-3, May 2000 (2000-05-01), pages 130 - 135, XP004198304, ISSN: 0924-4247 *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 349 (M - 538) 26 November 1986 (1986-11-26) *
See also references of WO03031096A2 *
TORMEN M ET AL: "Thermocurable polymers as resists for imprint lithography", ELECTRONICS LETTERS, IEE STEVENAGE, GB, vol. 36, no. 11, 25 May 2000 (2000-05-25), pages 983 - 984, XP006015268, ISSN: 0013-5194 *

Also Published As

Publication number Publication date
KR20050035134A (ko) 2005-04-15
EP1441868A2 (fr) 2004-08-04

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20040408

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

RIN1 Information on inventor provided before grant (corrected)

Inventor name: DAFFRON, MARK

Inventor name: LAMB, JAMES, E., III

Inventor name: SHIH, WU-SHENG

A4 Supplementary search report drawn up and despatched

Effective date: 20060727

RIC1 Information provided on ipc code assigned before grant

Ipc: B29C 33/62 20060101ALI20060721BHEP

Ipc: G03F 7/00 20060101AFI20060721BHEP

17Q First examination report despatched

Effective date: 20070209

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20080619