EP1399976A1 - Dispositif de generation d'images et procede de fabrication d'un dispositif de generation d'images - Google Patents

Dispositif de generation d'images et procede de fabrication d'un dispositif de generation d'images

Info

Publication number
EP1399976A1
EP1399976A1 EP01955248A EP01955248A EP1399976A1 EP 1399976 A1 EP1399976 A1 EP 1399976A1 EP 01955248 A EP01955248 A EP 01955248A EP 01955248 A EP01955248 A EP 01955248A EP 1399976 A1 EP1399976 A1 EP 1399976A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
image
printed circuit
sensor
forming device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01955248A
Other languages
German (de)
English (en)
Inventor
Horst Belau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1399976A1 publication Critical patent/EP1399976A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Definitions

  • Image forming apparatus and method of manufacturing an image forming apparatus are described in detail below.
  • the present invention relates to an image generation device, in particular a 3D camera, with at least one image recording sensor which is arranged on a printed circuit board. Furthermore, the present invention relates to a method for producing an image generation device, in particular the image generation device according to the invention, the (completed) image generation device having a printed circuit board on which at least one image recording sensor and at least one further component are arranged.
  • the generic image generation devices can be used, inter alia, in connection with motor vehicle technology, for example to determine the position of objects within a scene, as described in WO 00/65538.
  • the image recording sensors are usually supplied in an encapsulated housing.
  • the mounting of such image pickup sensors housed in an encapsulated housing on the printed circuit board is usually carried out analogously to the mounting of ICs with corresponding housings.
  • the use of image pickup sensors supplied in encapsulated housings is therefore relatively expensive.
  • the object of the invention is therefore to further develop the generic imaging devices and the generic manufacturing methods in such a way that the manufacturing costs can be reduced. This object is achieved by the features specified in the independent claims.
  • the image generation device is based on the generic prior art in that the image recording sensor is formed by a bare integrated circuit which is arranged on a printed circuit board.
  • bare integrated circuit is to be understood as a semiconductor chip (die) which is intended to be mounted on a printed circuit board without an IC housing.
  • the image recording sensor is formed by a CMOS sensor
  • CMOS Complementary Metal Oxide Semiconductor / complementary metal oxide semiconductor
  • CCD Charge Coupled Device
  • a CMOS sensor generally has a lower power consumption than, for example, a CCD sensor. Since no charges have to be transported over light-sensitive sensor surfaces with the CMOS sensor, the so-called smear effect does not occur, which is considered to be extremely disadvantageous. With the CMOS sensor, an optional pixel access is usually still possible.
  • the image recording sensor is arranged on the printed circuit board by means of flip-chip technology.
  • flip-chip technology the pads of a silicon chip are provided with a solderable metal bump (solder bump).
  • solder bump solderable metal bump
  • the chips prepared in this way can be arranged with their active side (face-down) on a substrate with corresponding pads and can be contacted simultaneously by a reflow process.
  • the flip-chip technology for example, has the following advantages, in particular, compared to wire-bond technology. A larger number of connections is possible, less parasitic effects occur and the space requirement is less.
  • the underside of the image recording sensor is preferably covered with a plastic compound.
  • the active region of the at least one image recording sensor is arranged opposite a recess provided in the printed circuit board.
  • the dimensions of the recess are preferably adapted to the dimensions of the active area of the image pickup sensor.
  • the recess on the side of the printed circuit board opposite the image pickup sensor is at least partially covered by a cover element.
  • the cover element can be formed, for example, from glass, without being restricted thereto.
  • the cover element has filter properties.
  • the cover element can be part of an optics explained in more detail below.
  • a preferred development of the image generation device provides that it has optics which interact with the image recording sensor.
  • This optic can in particular comprise one or more lenses, diaphragms and the like. If a cover element mentioned above is used, this can also be part of the optics.
  • the image generation device has an optical system
  • the optical system is a pre-adjusted unit that is aligned with the image recording sensor using a printed circuit board surface as a reference plane.
  • the image generation device is preferably further developed in that the optics are arranged on the side of the printed circuit board opposite the image pickup sensor.
  • the side of the printed circuit board facing the image pickup sensor can form the reference plane already mentioned.
  • the imaging device has optics
  • the optics have an optics housing which is arranged in the region of the recess on the circuit board.
  • a lens that forms or co-forms the optics can be inserted into a recess in the optics housing.
  • the optics housing is sufficiently sealed with respect to the printed circuit board in order to be able to reliably avoid contamination of the active area of the image pickup sensor, in many cases the cover element already explained for covering the recess in the printed circuit board can be dispensed with.
  • a preferred further development of the image generation device according to the invention provides that the optics housing is fastened to the printed circuit board by fastening means.
  • the optics housing can be extended, for example, in a collar-like manner at its edge region facing the printed circuit board, and the collar can have bores which are aligned with bores provided in the printed circuit board, so that bolts or the like can be guided through the aligned bores for fastening the optics housing.
  • Such bolts can be attached, for example, by a solder connection.
  • the printed circuit board has a protective layer in the region of the recess.
  • a protective layer can be formed, for example, by a metallized layer which serves as protection against moisture.
  • the image generation device has a further image recording sensor.
  • a 3D camera can be formed in this way, for example.
  • the further image pickup sensor is preferably of the same type as the image pickup sensor provided in each case and mounted in the same way.
  • the printed circuit board is arranged in a housing with at least one optical window. If more than one image recording sensor is provided, the housing either has a separate optical window for each image recording sensor or a correspondingly larger optical window.
  • the one or more optical windows are preferably permeable to infrared radiation, especially to enable night shots.
  • the method according to the invention ensures that the comparatively unfavorable conditions of the printed circuit board production with regard to contamination and thermal stress do not act on the image recording sensor.
  • sensitive image pickup sensors can also be used, in particular image pickup sensors that do not have their own housing.
  • the area provided for mounting the image recording sensor is at least partially covered. This measure serves to avoid possible contamination of the area provided for mounting the image pickup sensor during the assembly of the circuit board with one or more components.
  • the image pick-up sensor mounted when performing method step c) is formed by a bare integrated circuit.
  • bare integrated circuit is also in connection with the inventive method to understand a semiconductor chip (Die), which is intended to be mounted without an IC package on a circuit board.
  • Die semiconductor chip
  • the use of such an image pickup sensor means that expensive optical IC housings can be dispensed with and mechanical separation of the printed circuit board and, for example, a camera housing is possible.
  • the method according to the invention preferably provides that flip-chip technology is used when carrying out method step c).
  • the mounting of the image recording sensor by means of flip-chip technology preferably includes that the underside of the image recording sensor is covered with a plastic compound after contacting.
  • a preferred embodiment of the method according to the invention provides that when the method step c) is carried out, an active area of the image recording sensor is arranged opposite a recess provided in the printed circuit board.
  • the dimensions of the recess are preferably adapted to the dimensions of the active region of the image pickup sensor.
  • cover element Covering the recess on the side of the circuit board opposite the image pickup sensor with a cover element.
  • the cover element can also be formed from glass, for example, in connection with the method according to the invention, without being limited thereto.
  • the cover element used in method step d) has filter properties. Additionally or alternatively, it is also conceivable that the cover element is formed by a lens. Similar to the image generation device according to the invention, the cover element can also be part of an optical system that interacts with the image recording sensor in this case.
  • the method according to the invention preferably comprises the following further step:
  • the optics have an optics housing or form a housing that at least protects the active area of the image recording sensor from dirt.
  • Such an optics housing, and with it the optics can be attached to the printed circuit board, for example, in the way that was explained in connection with the image generation device according to the invention.
  • the optics can in particular comprise one or more lenses, diaphragms and the like. If a cover element mentioned above is used, this can also be part of the optics. However, embodiments are also possible in which a cover element can be dispensed with because the optics housing already sufficiently protects the active area of the image recording sensor, in particular from contamination.
  • the method according to the invention preferably provides that the optical system is aligned with the image recording sensor when carrying out method step e) by using a circuit board surface as reference plane.
  • the reference plane is the same plane that is also formed by the sensor surface. In this way, subsequent adjustment processes can be omitted in most cases, which also contributes to a reduction in costs.
  • the method according to the invention preferably provides that the optical system is arranged on the side of the printed circuit board opposite the image recording sensor when carrying out process step e).
  • the side of the printed circuit board facing the image pickup sensor can form the reference plane mentioned, as has already been explained in connection with the image forming device according to the invention.
  • the inventive method comprises the following further step:
  • the housing preferably has at least one optical window, which lies opposite the active area of the image pickup sensor or the optics after the insertion of the assembled printed circuit board. If more than one image recording sensor is provided, the housing either has a separate optical window for each image recording sensor or a correspondingly larger optical window.
  • the optical window or windows are preferably transparent to infrared radiation, in particular in order to enable night shots, as has already been explained in connection with the image generation device according to the invention. The invention is explained in more detail below on the basis of exemplary embodiments illustrated in the drawings.
  • FIG. 1 shows a schematic sectional view of a first embodiment of the image forming device according to the invention
  • FIG. 2 shows a schematic sectional view of a second embodiment of the image forming device according to the invention while the method according to the invention is being carried out
  • Figure 3 is a schematic sectional view of a third embodiment of the image forming device according to the invention.
  • the embodiment of the image forming device according to the invention shown in FIG. 1 comprises a printed circuit board 12 which has a recess 16 which can be circular, for example.
  • An image pick-up sensor 10 is arranged opposite the recess 16, which can in particular be a CMOS sensor.
  • the image pickup sensor 10 is fastened on the printed circuit board 12 by means of flip-chip technology and is connected by flip-chip solder 38 to connection pads of the printed circuit board 12, not shown in FIG. 1.
  • the image pickup sensor 10 has an active area 14, the dimensions of the recess 16 in the circuit board 12 being matched to the dimensions of the active area 14 of the image pickup sensor 10.
  • the lower side of the image pickup sensor 10, based on the illustration in FIG. 1, is covered with a plastic compound (glop-top).
  • a cover element 18 is provided on the side of the printed circuit board 12 opposite the image pickup sensor 10, said cover element being made of glass, for example, and having filter properties. Also on the image sensor 10 An optics housing 24 is arranged on the overlying side of the printed circuit board 12 and carries an aperture 20 and a lens system 22. The aperture 20, the lens system 22 and, if appropriate, the cover element 18 together form an optical system which interacts with the active region 14 of the image recording sensor 10.
  • the cover element 18 is preferably transparent to infrared rays, the distance between the cover element 18 and the active area 14 of the image sensor 10 ensuring that any dust particles on the cover element 18 do not have any appreciable negative effects on the imaging properties.
  • the cover element 18 can be dispensed with, in particular if the optical housing 24 seals the active region 14 of the image recording sensor 10 from the surroundings.
  • the diaphragm 20, the lens system 22 and the optics housing 24 together form a pre-adjusted unit, the lower side of the circuit board 12 relative to the illustration in FIG. 1 being used as reference plane 34 during assembly - is applied. As a result, no further adjustment processes are required after assembly.
  • the method according to the invention can be carried out, for example, as follows.
  • the printed circuit board 12 in the printed circuit board production is equipped with at least one, in practice, however, as a rule, several further components, only one further component 58 being indicated.
  • the area provided for mounting the image pickup sensor 10 (and preferably also the area provided for mounting the optics 20, 22, 24) is covered by this area or these areas To protect dirt.
  • the image pickup sensor 10 is arranged in the position shown in FIG. 1 by means of the flip chip technology.
  • the underside of the image pickup sensor 10 is then covered with a plastic compound 36.
  • the recess 16 in the circuit board 12 is covered on its side of the circuit board 12 opposite the image pickup sensor 10 with a cover element 18.
  • the pre-adjusted optics unit is then attached, which comprises the optics housing 24, the diaphragm 20 and the lens system 22.
  • the lower side of the printed circuit board 12 with reference to FIG. 1 is used as the reference plane 26.
  • a possible fastening variant for the optics housing 24 is explained in more detail below with reference to the illustration in FIG. 2.
  • FIG. 2 shows a schematic sectional view of a second embodiment of the image generation device according to the invention while the method according to the invention is being carried out.
  • an image pickup sensor 10 having an active area 14 is arranged by means of flip-chip technology under a recess 16 which is provided in a printed circuit board 12.
  • the reference number 38 again indicates flip chip solder.
  • a protective layer 56 is provided in the region of the recess 16, which can be, for example, a metallized layer as protection against moisture.
  • no cover element is provided for the recess 16 and the optics only comprise a lens system 22 which is held by an optics housing 24.
  • the optics housing 24 has a collar 28 for connection to the printed circuit board 12, which collar is provided in the lower end section of the optics housing 24 in relation to the illustration in FIG. 2.
  • the collar 28 has a bore 30 which is aligned with a bore 32 which is provided in the printed circuit board 12.
  • a bolt 34 is leads, which is attached to the circuit board 12 by a solder connection.
  • a soldering iron 40 which is only schematically indicated in FIG. 2, can interact with a suitable tool counter-bearing 42, while the optics housing with the lens system 22 is mounted in a clean room.
  • FIG. 3 shows a schematic sectional view of a third embodiment of the image generation device according to the invention.
  • a circuit board 12 has a recess 16 and a further recess 62.
  • An image pickup sensor 10 is arranged adjacent to the recess 16, while a further image pickup sensor 44 is provided adjacent to the further recess 62.
  • the type and the arrangement of the image recording sensors 10, 44 can correspond to the embodiments according to FIGS. 1 or 2.
  • An optics housing 24, which carries a lens system 22, is assigned to the image recording sensor 10.
  • the further image recording sensor 44 is assigned a further optical housing 48 which carries a further lens system 46.
  • the mounting of the image recording sensors 10, 44 and the optics housing 24, 48 with the lens systems 22, 46 was carried out in a clean room, while further components 58 were arranged during the usual printed circuit board production.
  • the circuit board 12 is arranged within a housing 50 by means of brackets 60 in such a way that the circuit board 12 with the image pickup sensors 10, 44, the optical housing 24, 48 and the lens systems 22, 46 is largely mechanically decoupled from the housing 50.
  • the printed circuit board 12 with the components arranged on it is well protected against external influences without additional seals.
  • the housing 50 has an optical window 52 assigned to the image recording sensor 10 and a further optical window 54 assigned to the image recording sensor 44, the overall arrangement being such that radiation incident through the optical windows 52, 54 detects the active areas of the image recording sensors 10, 44 reached.
  • the optical windows 52, 54 are formed from a material that transmits infrared radiation.
  • Environmental influences for example in the form of moisture or temperature fluctuations, can be taken into account by means of a suitable circuit board structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)

Abstract

L'invention concerne un dispositif de génération d'images, en particulier une caméra 3-D, qui comporte au moins un capteur de prise de vues (10) placé sur une carte de circuit intégré (2). Il est prévu, selon l'invention que le capteur de prise de vues (10) soit formé par un circuit nu intégré, placé sur une plaque de circuits imprimés (12). L'invention concerne en outre un procédé de fabrication d'un tel dispositif de génération d'images.
EP01955248A 2001-06-29 2001-07-16 Dispositif de generation d'images et procede de fabrication d'un dispositif de generation d'images Withdrawn EP1399976A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10131605 2001-06-29
DE10131605 2001-06-29
PCT/DE2001/002654 WO2003005455A1 (fr) 2001-06-29 2001-07-16 Dispositif de generation d'images et procede de fabrication d'un dispositif de generation d'images

Publications (1)

Publication Number Publication Date
EP1399976A1 true EP1399976A1 (fr) 2004-03-24

Family

ID=7690054

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01955248A Withdrawn EP1399976A1 (fr) 2001-06-29 2001-07-16 Dispositif de generation d'images et procede de fabrication d'un dispositif de generation d'images

Country Status (5)

Country Link
US (1) US20040232312A1 (fr)
EP (1) EP1399976A1 (fr)
JP (1) JP2004537891A (fr)
KR (1) KR20040020943A (fr)
WO (1) WO2003005455A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1406311B1 (fr) * 2002-10-02 2008-07-23 STMicroelectronics Limited Méthode et appareil d'alignement d'un capteur
DE10259795A1 (de) * 2002-12-19 2004-07-08 Siemens Ag Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges
DE102004018222A1 (de) 2004-04-15 2005-11-10 Robert Bosch Gmbh Opto-elektronisches Modul
WO2006052024A1 (fr) * 2004-11-15 2006-05-18 Hitachi, Ltd. Camera stereo
US7576401B1 (en) * 2005-07-07 2009-08-18 Amkor Technology, Inc. Direct glass attached on die optical module
DE102006035232A1 (de) * 2006-07-26 2008-01-31 Robert Bosch Gmbh Optische Messeinrichtung mit einer Bildaufnahmeeinheit

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KR20040004472A (ko) * 1995-05-31 2004-01-13 소니 가부시끼 가이샤 촬상장치 및 그 제조방법, 촬상어댑터장치, 신호처리장치및 신호처리방법, 및 정보처리장치 및 정보처리방법
JPH09181287A (ja) * 1995-10-24 1997-07-11 Sony Corp 受光装置とその製造方法
US6130448A (en) * 1998-08-21 2000-10-10 Gentex Corporation Optical sensor package and method of making same
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JP2001119006A (ja) * 1999-10-19 2001-04-27 Sony Corp 撮像デバイス及びその製造方法
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US6809413B1 (en) * 2000-05-16 2004-10-26 Sandia Corporation Microelectronic device package with an integral window mounted in a recessed lip
JP4405062B2 (ja) * 2000-06-16 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置
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JP2003101063A (ja) * 2001-09-20 2003-04-04 Sony Corp 複合光学素子、受光素子装置及び複合光学素子の製造方法

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Also Published As

Publication number Publication date
KR20040020943A (ko) 2004-03-09
US20040232312A1 (en) 2004-11-25
JP2004537891A (ja) 2004-12-16
WO2003005455A1 (fr) 2003-01-16

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