EP1398509A2 - Vacuum pump - Google Patents
Vacuum pump Download PDFInfo
- Publication number
- EP1398509A2 EP1398509A2 EP20030020360 EP03020360A EP1398509A2 EP 1398509 A2 EP1398509 A2 EP 1398509A2 EP 20030020360 EP20030020360 EP 20030020360 EP 03020360 A EP03020360 A EP 03020360A EP 1398509 A2 EP1398509 A2 EP 1398509A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- pump
- housing
- booster pump
- coupling member
- booster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 30
- 230000008878 coupling Effects 0.000 claims abstract description 25
- 238000010168 coupling process Methods 0.000 claims abstract description 25
- 238000005859 coupling reaction Methods 0.000 claims abstract description 25
- 230000005540 biological transmission Effects 0.000 claims abstract description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims 1
- 238000005192 partition Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000000717 retained effect Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 241001247986 Calotropis procera Species 0.000 description 2
- 241000212959 Cryptotaenia Species 0.000 description 2
- 235000014260 Cryptotaenia canadensis Nutrition 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01C—ROTARY-PISTON OR OSCILLATING-PISTON MACHINES OR ENGINES
- F01C21/00—Component parts, details or accessories not provided for in groups F01C1/00 - F01C20/00
- F01C21/007—General arrangements of parts; Frames and supporting elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
- F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
- F04B37/16—Means for nullifying unswept space
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C18/00—Rotary-piston pumps specially adapted for elastic fluids
- F04C18/08—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing
- F04C18/12—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type
- F04C18/126—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with radially from the rotor body extending elements, not necessarily co-operating with corresponding recesses in the other rotor, e.g. lobes, Roots type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
- F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
- F04C23/005—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of dissimilar working principle
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2220/00—Application
- F04C2220/10—Vacuum
Definitions
- the present invention relates to a vacuum pump equipped with a main pump and a booster pump.
- a vacuum pump is used in a semiconductor fabrication process and discharges a reaction product from a semiconductor process system.
- a reaction product is solidified and deposited in the booster pump. Deposition of a reaction product in a gas passage leads to a reduction in the performance of the vacuum pump.
- Japanese Laid-Open Patent Publication No. 5-113180 discloses a technique that permits heat in the housing of a main pump to be transmitted to the housing of a booster pump via a supporting member. This increases the temperature in the booster pump.
- Japanese Laid-Open Patent Publication No. 8-296557 discloses a vacuum pump equipped with a multi-stage pump mechanism, which performs gas discharging in multiple stages. The temperature of that portion of the housing of the vacuum pump which surrounds the last stage of the pump mechanism or the portion that becomes the hottest becomes higher than the temperatures of the other portions.
- Japanese Laid-Open Patent Publication No. 5-113180 employs the aforementioned structure for the purpose of making the entire vacuum pump compact, the structure that is suitable for effectively raising the temperature in the main pump equipped with a multi-stage pump mechanism.
- the present invention provides a vacuum pump.
- the vacuum pump has a main pump, a booster pump and a coupling member.
- the main pump has a first housing and a first pump mechanism accommodated in the first housing.
- the first pump mechanism is a multi-stage type.
- the booster pump has a second housing and a second pump mechanism accommodated in the second housing.
- the booster pump and the main pump are coupled in series such that gas is sent from the booster pump to the main pump.
- the coupling member couples the first housing and the second housing to each other.
- the coupling member is directly coupled to a portion of the first housing that surrounds a last stage of the first pump mechanism such that transmission of heat to the portion is permitted.
- a vacuum pump includes a main pump 11, which can be activated from the atmospheric pressure, and a booster pump 61.
- the vacuum pump is used in a semiconductor fabrication process and discharges a gaseous reaction product (e.g., ammonium chloride) from an unillustrated semiconductor process system.
- the booster pump 61 is located upstream (on the semiconductor process system side) of the position where the main pump 11 is located in the gas passage.
- the main pump 11 and the booster pump 61 are coupled in series. It is to be noted that the right-hand side in Fig. 1 is the front end of the vacuum pump and the left-hand side is the rear end of the vacuum pump.
- the main pump 11 has a rotor housing member 12, a front housing member 13, and a rear housing member 14, which constitute a first housing H1.
- the front housing member 13 is connected to the front end of the rotor housing member 12, and the rear housing member 14 to the rear end of the rotor housing member 12.
- the first housing H1 accommodates a multi-stage root type first pump mechanism P1 to be discussed later.
- the rotor housing member 12, the front housing member 13, and the rear housing member 14 are each made of an iron-based metal.
- Iron-based metals have smaller thermal expansion coefficient than, for example, aluminum-based metals. The iron-based metals can therefore reduce heat-oriented variation in the clearance of the individual sections to thereby ensure effective prevention of gas leakage or the like.
- the first pump mechanism P1 will be elaborated below.
- the rotor housing member 12 includes a cylinder block 15 and a plurality of first to fourth partition walls 16a, 16b, 16c, and 16d.
- the space between the front housing member 13 and the first partition wall 16a, the space between the first and second partition walls 16a and 16b, the space between the second and third partition walls 16b and 16c, the space between the third and fourth partition walls 16c and 16d, and the space between the fourth partition wall 16d and the rear housing member 14 are respectively equivalent to first to fifth pump chambers 51, 52, 53, 54, and 55.
- Formed in the four partition walls 16a, 16b, 16c, and 16d is a common passage 17, which connects the adjoining pump chambers 51, 52, 53, 54, and 55.
- a first rotary shaft 19 and a second rotary shaft 20 are rotatably supported on the front housing member 13 and the rear housing member 14, respectively. Both rotary shafts 19 and 20 are laid out in parallel to each other. The rotary shafts 19 and 20 are inserted into the first to fourth partition walls 16a to 16d.
- a plurality of (five in the embodiment) first rotors 23 are formed integrally on the first rotary shaft 19. Each first rotor 23 has the shape of a honewort leaf.
- Plural second rotors 28 (only one shown in Fig. 2) equal in quantity to the first rotors 23 are formed integrally on the second rotary shaft 20. Each second rotor 28 likewise has the shape of a honewort leaf.
- the thicknesses of the first and second rotors 23 and 28 in the axial directions of the first and second rotary shafts 19 and 20 become gradually smaller in order from the front housing member 13 toward the rear housing member 14.
- the first and second rotors 23 and 28 are retained in engagement with each other in the first to fifth pump chambers 51 to 55 with slight clearances maintained.
- the volumes of the first to fifth pump chambers 51 to 55 become gradually smaller in order from the first pump chamber 51 toward the fifth pump chamber 55.
- a gear housing 38 which accommodates a gear unit 39 and a shaft coupling 40 is connected to the rear housing member 14.
- An electric motor M is mounted on the gear housing 38. The driving force of the electric motor M is transmitted to the first rotary shaft 19 via the shaft coupling 40 and is transmitted from the shaft coupling 40 to the second rotary shaft 20 (see Fig. 2) via the gear unit 39.
- the second rotary shaft 20 (second rotors 28) is turned in a direction different from the turning direction of the first rotary shaft 19 (first rotors 23) .
- a gas suction port 21 is formed in the cylinder block 15 at the upper part of a portion (peripheral wall) 45 of the foremost stage of the first pump mechanism P1 (the portion that is constituted by the first pump chamber 51 and the first and second rotors 23 and 28 to be retained in the first pump chamber 51).
- the portion 45 surrounds the first pump chamber 51 in such a way that the suction port 21 communicates with the first pump chamber 51.
- the suction port 21 is connected with the exhaust side of the booster pump 61.
- a gas exhaust port 22 is formed in the cylinder block 15 at the lower part of a portion (peripheral wall) 46 of the last stage of the first pump mechanism P1 (the portion that is constituted by the fifth pump chamber 55 and the first and second rotors 23 and 28 to be retained in the fifth pump chamber 55).
- the portion 46 surrounds the fifth pump chamber 55 in such a way that the exhaust port 22 communicates with the fifth pump chamber 55.
- the gas from the booster pump 61 that is led into the first pump chamber 51 through the suction port 21 is transferred to the adjoining second pump chamber 52 via the passage 17 in the first partition wall 16a as the first and second rotors 23 and 28 in the first pump chamber 51 rotate.
- the gas is transferred in a similar manner in the order from a larger-volume pump chamber to a smaller-volume pump chamber, i.e., in the order from the first pump chamber 51 toward the fifth pump chamber 55 through the second, third and fourth pump chambers 52, 53, and 54.
- the gas that has been transferred to the fifth pump chamber 55 is discharged toward an unillustrated exhaust-gas process system from the exhaust port 22.
- a great structural difference between the main pump 11 and the booster pump 61 lies in that the main pump 11 is a multi-stage (five stages in the embodiment) root pump, which performs gas discharging in multiple stages, whereas the booster pump 61 is a single-stage root pump, which performs gas discharging in a single stage.
- the booster pump 61 therefore, only what differs from the main pump 11 will be described, and the description of those components of the booster pump 61 that are identical or correspond to the components of the main pump 11 will be omitted with the same reference symbols given to the corresponding components.
- the booster pump 61 also has a rotor housing member 12, a front housing member 13, and a rear housing member 14.
- the rotor housing member 12, the front housing member 13, and the rear housing member 14 constitute a second housing H2, which accommodates a single-stage root type second pump mechanism P2.
- the rotor housing member 12 of the booster pump 61 does not have the first to fourth partition walls 16a to 16d of the main pump 11.
- the space in the rotor housing member 12 that is defined between the front housing member 13 and the rear housing member 14 is a sixth pump chamber 62, which is larger in volume than the first pump chamber 51 of the main pump 11.
- a first rotary shaft 119 and a second rotary shaft 120 of the booster pump 61 are respectively provided with a first rotor 63 and a second rotor 64 both having the shape of a cotyledon.
- the first and second rotors 63 and 64 are retained in engagement with each other in the sixth pump chamber 62 with a slight clearance kept therebetween.
- a suction port 65 is formed in the upper portion of the cylinder block 15 of the booster pump 61 in such a way as to communicate with the sixth pump chamber 62.
- the suction port 65 is connected with an exhaust-side pipe of the semiconductor process system.
- An exhaust port 66 is formed in the lower portion of the cylinder block 15 in such a way as to communicate with the sixth pump chamber 62. Therefore, the gas from the semiconductor process system, which is led into the sixth pump chamber 62 through the suction port 65, is discharged toward the main pump 11 from the exhaust port 66 as the first and second rotors 63 and 64 rotate.
- a support portion 67 as a support member is formed integrally with, and protrudes on, the lower portion of the cylinder block 15 of the booster pump 61.
- a support and protrusion portion 68 is formed integrally on the lower portion of the rear housing member 14 of the booster pump 61.
- a rubber bush 47 is attached to the upper portion of the rear housing member 14 of the main pump 11.
- the booster pump 61 is fixed to the top surface (flat surface) 15a of the cylinder block 15 of the main pump 11 by the support portion 67, and is securely mounted on the main pump 11 by the support and protrusion portion 68 placed on the rubber bush 47. That is, the support portion 67 of the booster pump 61 serves as a support stand for supporting the booster pump 61 on the main pump 11.
- a communication passage 69 which connects the exhaust side (exhaust port 66) of the booster pump 61 to the suction side (suction port 21) of the main pump 11, is formed inside the support portion 67.
- an exhaust flange 70 that is connected to the exhaust port 66 of the booster pump 61
- a suction flange 71 that is connected to the suction port 21 of the main pump 11
- a communication portion 72 that connects both flanges 70 and 71 together are integrated with one another.
- the suction flange 71 is connected to the top surface, 45a, of the portion 45 of the cylinder block 15 that surrounds the first pump chamber 51 of the first pump mechanism P1.
- the shape of the communication portion 72 becomes narrower toward the suction flange 71 along the shape of the communication passage 69.
- the booster pump 61 is securely mounted on the main pump 11 via the support portion 67 in this way, the cylinder blocks 15 of the main pump 11 and the booster pump 61 are directly connected to each other by the support portion 67 such that transmission of heat to the cylinder block 15 of the booster pump 61 is permitted. Therefore, the heat in the main pump 11 is transmitted to the cylinder block 15 of the booster pump 61 from the cylinder block 15 of the main pump 11 via the support portion 67 of the booster pump 61, thereby raising the temperature inside the booster pump 61 (including the inside of the communication passage 69). Raising the temperature in the booster pump 61 prevents the solidification of a reaction product in the booster pump 61.
- the embodiment uses a multi-stage root pump as the main pump 11. Therefore, the temperature of the portion 46 of the cylinder block 15 of the main pump 11 that surrounds the last stage of the first pump mechanism P1 or the portion that becomes the hottest becomes higher than the temperatures of the other portions (for example, the portion 45 that surrounds the foremost stage).
- the temperature in the booster pump 61 by using the heat generated in the main pump 11, therefore, it is necessary to transmit the heat at the high-temperature portion of the cylinder block 15 of the main pump 11 to the cylinder block 15 of the booster pump 61.
- the support portion 67 of the booster pump 61 is directly coupled to the (high-temperature) portion 46 of the cylinder block 15 of the main pump 11 such that transmission of heat to the cylinder block 15 of the booster pump 61 is permitted.
- a flat heat-extracting portion 73 is formed on the suction flange 71 of the support portion 67 in such a way as to extend toward the rear housing member 14.
- the heat-extracting portion 73 is directly mounted on the top surface 15a of the cylinder block 15 of the main pump 11 in an area between the top surface 46a of the (high-temperature) portion 46 and the top surface 45a of the portion 45 to include the top surface 46a.
- the heat generated by the last stage of the first pump mechanism P1 is taken directly to the support portion 67 via the heat-extracting portion 73 from the high-temperature portion 46 of the cylinder block 15. This can effectively raise the temperature in the booster pump 61, thus reliably ensuring the prevention of the solidification of a reaction product in the booster pump 61.
- the embodiment has the following advantages.
- the heat generated by the last stage of the first pump mechanism P1 can efficiently be transmitted to the booster pump 61, thereby effectively raising the temperature in the booster pump 61. This makes it possible to more reliably prevent the solidification of a reaction product in the booster pump 61, thereby surely inhibiting a reduction in the performance of the vacuum pump that would otherwise be originated from the deposition of a reaction product in the gas passage.
- the support portion 67 is formed integrally on the cylinder block 15 of the booster pump 61. This ensures efficient thermal conduction between the support portion 67 and the cylinder block 15 of the booster pump 61, thus making it possible to raise the temperature in the booster pump 61 more effectively. Further, it is unnecessary to separately provide the support portion 67 for both pumps 11 and 61, thereby contributing to reducing the number of components of the vacuum pump.
- the support portion 67 also serves as the support stand that supports the booster pump 61 on the main pump 11. This makes it unnecessary to provide an exclusive support stand for supporting the booster pump 61, thereby also contributing to reducing the number of components of the vacuum pump.
- the communication passage 69 which connects the exhaust port 66 of the booster pump 61 to the suction port 21 of the main pump 11, is formed inside the'support portion 67. This eliminates the need for an exclusive pipe for forming the communication passage 69, so that the number of required components of the vacuum pump can be reduced.
- the support portion 67 abuts on the top surface 15a of the cylinder block 15 of the main pump 11 in a wider area stretching from the top surface 45a of the portion 45 corresponding to the foremost stage of the first pump mechanism P1 to the top surface 46a of the portion 46 corresponding to the last stage of that. Accordingly, the booster pump 61 is stably supported on the main pump 11 by the support portion 67.
- the support portion 67 may be formed integrally on the cylinder block 15 of the main pump 11.
- the support portions 67 may be formed separately on the cylinder block 15 of the main pump 11 and the cylinder block 15 of the booster pump 61 as shown in Fig. 4.
- the support portion 67 may be formed integrally on both the cylinder block 15 of the main pump 11 and the cylinder block 15 of the booster pump 61, though not illustrated.
- a thermal conductive grease as a thermal-conductance improver may be intervened in the portion where the support portion 67 is connected to the cylinder block 15 of the main pump 11. This improves the adhesion of the support portion 67 to the cylinder block 15 of the main pump 11, thus improving the thermal conductance between those cylinder block 15 and support portion 67. As a result, the temperature in the booster pump 61 can be raised more effectively.
- a substitute thermal conductive material for the thermal conductive grease may be a copper paste, a resin sheet, or a rubber sheet.
- the heat-extracting portion 73 may be separated from the support portion 67, and the separated heat-extracting portion 73 may be provided on the cylinder block 15 of the booster pump 61 separately from the support portion 67. In this case, the heat-extracting portion 73 only serves as a coupling member. This structure can allow the heat from the heat-extracting portion 73 to be transmitted directly to the cylinder block 15 of the booster pump 61, so that the temperature in the booster pump 61 can be raised more efficiently.
- the support portion 67, the support protrusion portion 68 and the bush 47 may be eliminated, and the booster pump 61 may be mounted directly on the main pump 11.
- the cylinder block 15 of the booster pump 61 that is connected directly to the cylinder block 15 of the main pump 11 serves as a coupling member.
- This structure causes the (high-temperature) portion 46 of the cylinder block 15 of the main pump 11 to directly abut on the cylinder block 15 of the booster pump 61, so that the heat generated by the last stage of the first pump mechanism P1 of the main pump 11 can be transmitted to the booster pump 61 more efficiently.
- This mode is advantageous in making the vacuum pump compact.
- At least the cylinder block 15 (inclusive of the support portion 67 integral with the cylinder block 15) in the second housing H2 of the booster pump 61 may be formed of an aluminum-based metal, which has an excellent thermal conductance. This structure can allow the heat from the heat-extracting portion 73 to be efficiently transmitted to the cylinder block 15 of the booster pump 61, thus making it possible to raise the temperature in the booster pump 61 more efficiently.
- a vacuum pump has a main pump, a booster pump and a coupling member.
- the main pump has a first housing and a first pump mechanism accommodated in the first housing.
- the booster pump has a second housing and a second pump mechanism accommodated in the second housing.
- the booster pump and the main pump are coupled in series such that gas is sent from the booster pump to the main pump.
- the coupling member couples the first housing and the second housing to each other.
- the coupling member is directly coupled to a portion of the first housing that surrounds a last stage of the first pump mechanism such that transmission of heat to the portion is permitted.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Applications Or Details Of Rotary Compressors (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
Abstract
Description
- The present invention relates to a vacuum pump equipped with a main pump and a booster pump.
- A vacuum pump is used in a semiconductor fabrication process and discharges a reaction product from a semiconductor process system. As the temperature in the booster pump of the vacuum pump becomes lower than the temperature in the main pump, a reaction product is solidified and deposited in the booster pump. Deposition of a reaction product in a gas passage leads to a reduction in the performance of the vacuum pump.
- To overcome the problem, it is desirable to raise the temperature in the booster pump. Japanese Laid-Open Patent Publication No. 5-113180, for example, discloses a technique that permits heat in the housing of a main pump to be transmitted to the housing of a booster pump via a supporting member. This increases the temperature in the booster pump.
- Japanese Laid-Open Patent Publication No. 8-296557 discloses a vacuum pump equipped with a multi-stage pump mechanism, which performs gas discharging in multiple stages. The temperature of that portion of the housing of the vacuum pump which surrounds the last stage of the pump mechanism or the portion that becomes the hottest becomes higher than the temperatures of the other portions.
- However, the invention disclosed in Japanese Laid-Open Patent Publication No. 5-113180 employs the aforementioned structure for the purpose of making the entire vacuum pump compact, the structure that is suitable for effectively raising the temperature in the main pump equipped with a multi-stage pump mechanism.
- While, how to efficiently transmit the heat generated by the pump mechanism to the booster pump is important in effectively raising the temperature in the booster pump, the prior art describes nothing about this important point.
- Accordingly, it is an object of the invention to provide a vacuum pump capable of efficiently transmitting the heat in the main pump to the booster pump.
- To attain the above object, the present invention provides a vacuum pump. The vacuum pump has a main pump, a booster pump and a coupling member. The main pump has a first housing and a first pump mechanism accommodated in the first housing. The first pump mechanism is a multi-stage type. The booster pump has a second housing and a second pump mechanism accommodated in the second housing. The booster pump and the main pump are coupled in series such that gas is sent from the booster pump to the main pump. The coupling member couples the first housing and the second housing to each other. The coupling member is directly coupled to a portion of the first housing that surrounds a last stage of the first pump mechanism such that transmission of heat to the portion is permitted.
- Other aspects and advantages of the invention will become apparent from the following description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
- The invention, together with objects and advantages thereof, may best be understood by reference to the following description of the presently preferred embodiments together with the accompanying drawings in which:
- Fig. 1 is a cross-sectional view of a vacuum pump according to one embodiment of the present invention;
- Fig. 2 is a cross-sectional view along the line 2-2 in Fig. 1;
- Fig. 3 is a partly cross-sectional view of a vacuum pump according to another embodiment of the embodiment; and
- Fig. 4 is a partly cross-sectional view of a vacuum pump according to a further embodiment of the embodiment.
-
- One embodiment of the invention will be described below with reference to Figs. 1 and 2.
- As shown in Figs. 1 and 2, a vacuum pump includes a
main pump 11, which can be activated from the atmospheric pressure, and abooster pump 61. The vacuum pump is used in a semiconductor fabrication process and discharges a gaseous reaction product (e.g., ammonium chloride) from an unillustrated semiconductor process system. Thebooster pump 61 is located upstream (on the semiconductor process system side) of the position where themain pump 11 is located in the gas passage. Themain pump 11 and thebooster pump 61 are coupled in series. It is to be noted that the right-hand side in Fig. 1 is the front end of the vacuum pump and the left-hand side is the rear end of the vacuum pump. - As shown in Figs. 1 and 2, the
main pump 11 has arotor housing member 12, afront housing member 13, and arear housing member 14, which constitute a first housing H1. Thefront housing member 13 is connected to the front end of therotor housing member 12, and therear housing member 14 to the rear end of therotor housing member 12. The first housing H1 accommodates a multi-stage root type first pump mechanism P1 to be discussed later. - The
rotor housing member 12, thefront housing member 13, and therear housing member 14 are each made of an iron-based metal. Iron-based metals have smaller thermal expansion coefficient than, for example, aluminum-based metals. The iron-based metals can therefore reduce heat-oriented variation in the clearance of the individual sections to thereby ensure effective prevention of gas leakage or the like. - The first pump mechanism P1 will be elaborated below.
- The
rotor housing member 12 includes acylinder block 15 and a plurality of first tofourth partition walls front housing member 13 and thefirst partition wall 16a, the space between the first andsecond partition walls third partition walls fourth partition walls fourth partition wall 16d and therear housing member 14 are respectively equivalent to first tofifth pump chambers partition walls common passage 17, which connects the adjoiningpump chambers - A first
rotary shaft 19 and a secondrotary shaft 20 are rotatably supported on thefront housing member 13 and therear housing member 14, respectively. Bothrotary shafts rotary shafts fourth partition walls 16a to 16d. A plurality of (five in the embodiment)first rotors 23 are formed integrally on the firstrotary shaft 19. Eachfirst rotor 23 has the shape of a honewort leaf. Plural second rotors 28 (only one shown in Fig. 2) equal in quantity to thefirst rotors 23 are formed integrally on the secondrotary shaft 20. Eachsecond rotor 28 likewise has the shape of a honewort leaf. The thicknesses of the first andsecond rotors rotary shafts front housing member 13 toward therear housing member 14. - The first and
second rotors fifth pump chambers 51 to 55 with slight clearances maintained. The volumes of the first tofifth pump chambers 51 to 55 become gradually smaller in order from thefirst pump chamber 51 toward thefifth pump chamber 55. - As shown in Fig. 1, a
gear housing 38, which accommodates agear unit 39 and ashaft coupling 40 is connected to therear housing member 14. An electric motor M is mounted on thegear housing 38. The driving force of the electric motor M is transmitted to the firstrotary shaft 19 via theshaft coupling 40 and is transmitted from theshaft coupling 40 to the second rotary shaft 20 (see Fig. 2) via thegear unit 39. The second rotary shaft 20 (second rotors 28) is turned in a direction different from the turning direction of the first rotary shaft 19 (first rotors 23) . - A
gas suction port 21 is formed in thecylinder block 15 at the upper part of a portion (peripheral wall) 45 of the foremost stage of the first pump mechanism P1 (the portion that is constituted by thefirst pump chamber 51 and the first andsecond rotors portion 45 surrounds thefirst pump chamber 51 in such a way that thesuction port 21 communicates with thefirst pump chamber 51. Thesuction port 21 is connected with the exhaust side of thebooster pump 61. Agas exhaust port 22 is formed in thecylinder block 15 at the lower part of a portion (peripheral wall) 46 of the last stage of the first pump mechanism P1 (the portion that is constituted by thefifth pump chamber 55 and the first andsecond rotors portion 46 surrounds thefifth pump chamber 55 in such a way that theexhaust port 22 communicates with thefifth pump chamber 55. - The gas from the
booster pump 61 that is led into thefirst pump chamber 51 through thesuction port 21 is transferred to the adjoiningsecond pump chamber 52 via thepassage 17 in thefirst partition wall 16a as the first andsecond rotors first pump chamber 51 rotate. The gas is transferred in a similar manner in the order from a larger-volume pump chamber to a smaller-volume pump chamber, i.e., in the order from thefirst pump chamber 51 toward thefifth pump chamber 55 through the second, third andfourth pump chambers fifth pump chamber 55 is discharged toward an unillustrated exhaust-gas process system from theexhaust port 22. - As shown in Figs. 1 and 2, a great structural difference between the
main pump 11 and thebooster pump 61 lies in that themain pump 11 is a multi-stage (five stages in the embodiment) root pump, which performs gas discharging in multiple stages, whereas thebooster pump 61 is a single-stage root pump, which performs gas discharging in a single stage. With regard to thebooster pump 61, therefore, only what differs from themain pump 11 will be described, and the description of those components of thebooster pump 61 that are identical or correspond to the components of themain pump 11 will be omitted with the same reference symbols given to the corresponding components. - The
booster pump 61 also has arotor housing member 12, afront housing member 13, and arear housing member 14. Therotor housing member 12, thefront housing member 13, and therear housing member 14 constitute a second housing H2, which accommodates a single-stage root type second pump mechanism P2. Therotor housing member 12 of thebooster pump 61 does not have the first tofourth partition walls 16a to 16d of themain pump 11. The space in therotor housing member 12 that is defined between thefront housing member 13 and therear housing member 14 is asixth pump chamber 62, which is larger in volume than thefirst pump chamber 51 of themain pump 11. A firstrotary shaft 119 and a secondrotary shaft 120 of thebooster pump 61 are respectively provided with afirst rotor 63 and asecond rotor 64 both having the shape of a cotyledon. The first andsecond rotors sixth pump chamber 62 with a slight clearance kept therebetween. - A
suction port 65 is formed in the upper portion of thecylinder block 15 of thebooster pump 61 in such a way as to communicate with thesixth pump chamber 62. Thesuction port 65 is connected with an exhaust-side pipe of the semiconductor process system. Anexhaust port 66 is formed in the lower portion of thecylinder block 15 in such a way as to communicate with thesixth pump chamber 62. Therefore, the gas from the semiconductor process system, which is led into thesixth pump chamber 62 through thesuction port 65, is discharged toward themain pump 11 from theexhaust port 66 as the first andsecond rotors - As shown in Figs. 1 and 2, a
support portion 67 as a support member is formed integrally with, and protrudes on, the lower portion of thecylinder block 15 of thebooster pump 61. A support andprotrusion portion 68 is formed integrally on the lower portion of therear housing member 14 of thebooster pump 61. Arubber bush 47 is attached to the upper portion of therear housing member 14 of themain pump 11. - The
booster pump 61 is fixed to the top surface (flat surface) 15a of thecylinder block 15 of themain pump 11 by thesupport portion 67, and is securely mounted on themain pump 11 by the support andprotrusion portion 68 placed on therubber bush 47. That is, thesupport portion 67 of thebooster pump 61 serves as a support stand for supporting thebooster pump 61 on themain pump 11. - A
communication passage 69, which connects the exhaust side (exhaust port 66) of thebooster pump 61 to the suction side (suction port 21) of themain pump 11, is formed inside thesupport portion 67. Specifically, in thesupport portion 67, anexhaust flange 70 that is connected to theexhaust port 66 of thebooster pump 61, asuction flange 71 that is connected to thesuction port 21 of themain pump 11 and acommunication portion 72 that connects bothflanges suction flange 71 is connected to the top surface, 45a, of theportion 45 of thecylinder block 15 that surrounds thefirst pump chamber 51 of the first pump mechanism P1. The shape of thecommunication portion 72 becomes narrower toward thesuction flange 71 along the shape of thecommunication passage 69. - As the
booster pump 61 is securely mounted on themain pump 11 via thesupport portion 67 in this way, the cylinder blocks 15 of themain pump 11 and thebooster pump 61 are directly connected to each other by thesupport portion 67 such that transmission of heat to thecylinder block 15 of thebooster pump 61 is permitted. Therefore, the heat in themain pump 11 is transmitted to thecylinder block 15 of thebooster pump 61 from thecylinder block 15 of themain pump 11 via thesupport portion 67 of thebooster pump 61, thereby raising the temperature inside the booster pump 61 (including the inside of the communication passage 69). Raising the temperature in thebooster pump 61 prevents the solidification of a reaction product in thebooster pump 61. - As mentioned above, the embodiment uses a multi-stage root pump as the
main pump 11. Therefore, the temperature of theportion 46 of thecylinder block 15 of themain pump 11 that surrounds the last stage of the first pump mechanism P1 or the portion that becomes the hottest becomes higher than the temperatures of the other portions (for example, theportion 45 that surrounds the foremost stage). To efficiently increase the temperature in thebooster pump 61 by using the heat generated in themain pump 11, therefore, it is necessary to transmit the heat at the high-temperature portion of thecylinder block 15 of themain pump 11 to thecylinder block 15 of thebooster pump 61. - In this respect, the
support portion 67 of thebooster pump 61 is directly coupled to the (high-temperature)portion 46 of thecylinder block 15 of themain pump 11 such that transmission of heat to thecylinder block 15 of thebooster pump 61 is permitted. Specifically, a flat heat-extractingportion 73 is formed on thesuction flange 71 of thesupport portion 67 in such a way as to extend toward therear housing member 14. The heat-extractingportion 73 is directly mounted on thetop surface 15a of thecylinder block 15 of themain pump 11 in an area between thetop surface 46a of the (high-temperature)portion 46 and thetop surface 45a of theportion 45 to include thetop surface 46a. - Therefore, the heat generated by the last stage of the first pump mechanism P1 is taken directly to the
support portion 67 via the heat-extractingportion 73 from the high-temperature portion 46 of thecylinder block 15. This can effectively raise the temperature in thebooster pump 61, thus reliably ensuring the prevention of the solidification of a reaction product in thebooster pump 61. - The embodiment has the following advantages.
- The heat generated by the last stage of the first pump mechanism P1 can efficiently be transmitted to the
booster pump 61, thereby effectively raising the temperature in thebooster pump 61. This makes it possible to more reliably prevent the solidification of a reaction product in thebooster pump 61, thereby surely inhibiting a reduction in the performance of the vacuum pump that would otherwise be originated from the deposition of a reaction product in the gas passage. - The
support portion 67 is formed integrally on thecylinder block 15 of thebooster pump 61. This ensures efficient thermal conduction between thesupport portion 67 and thecylinder block 15 of thebooster pump 61, thus making it possible to raise the temperature in thebooster pump 61 more effectively. Further, it is unnecessary to separately provide thesupport portion 67 for bothpumps - The
support portion 67 also serves as the support stand that supports thebooster pump 61 on themain pump 11. This makes it unnecessary to provide an exclusive support stand for supporting thebooster pump 61, thereby also contributing to reducing the number of components of the vacuum pump. - The
communication passage 69, which connects theexhaust port 66 of thebooster pump 61 to thesuction port 21 of themain pump 11, is formed insidethe'support portion 67. This eliminates the need for an exclusive pipe for forming thecommunication passage 69, so that the number of required components of the vacuum pump can be reduced. - As the heat-extracting
portion 73 is formed on thesuction flange 71 of thesupport portion 67, thesupport portion 67 abuts on thetop surface 15a of thecylinder block 15 of themain pump 11 in a wider area stretching from thetop surface 45a of theportion 45 corresponding to the foremost stage of the first pump mechanism P1 to thetop surface 46a of theportion 46 corresponding to the last stage of that. Accordingly, thebooster pump 61 is stably supported on themain pump 11 by thesupport portion 67. - It should be apparent to those skilled in the art that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention. Particularly, it should be understood that the invention may be embodied in the following forms.
- As shown in Fig. 3, for example, the
support portion 67 may be formed integrally on thecylinder block 15 of themain pump 11. As another embodiment, thesupport portions 67 may be formed separately on thecylinder block 15 of themain pump 11 and thecylinder block 15 of thebooster pump 61 as shown in Fig. 4. Alternatively, thesupport portion 67 may be formed integrally on both thecylinder block 15 of themain pump 11 and thecylinder block 15 of thebooster pump 61, though not illustrated. - A thermal conductive grease as a thermal-conductance improver may be intervened in the portion where the
support portion 67 is connected to thecylinder block 15 of themain pump 11. This improves the adhesion of thesupport portion 67 to thecylinder block 15 of themain pump 11, thus improving the thermal conductance between thosecylinder block 15 andsupport portion 67. As a result, the temperature in thebooster pump 61 can be raised more effectively. A substitute thermal conductive material for the thermal conductive grease may be a copper paste, a resin sheet, or a rubber sheet. - The heat-extracting
portion 73 may be separated from thesupport portion 67, and the separated heat-extractingportion 73 may be provided on thecylinder block 15 of thebooster pump 61 separately from thesupport portion 67. In this case, the heat-extractingportion 73 only serves as a coupling member. This structure can allow the heat from the heat-extractingportion 73 to be transmitted directly to thecylinder block 15 of thebooster pump 61, so that the temperature in thebooster pump 61 can be raised more efficiently. - The
support portion 67, thesupport protrusion portion 68 and thebush 47 may be eliminated, and thebooster pump 61 may be mounted directly on themain pump 11. In this case, thecylinder block 15 of thebooster pump 61 that is connected directly to thecylinder block 15 of themain pump 11 serves as a coupling member. This structure causes the (high-temperature)portion 46 of thecylinder block 15 of themain pump 11 to directly abut on thecylinder block 15 of thebooster pump 61, so that the heat generated by the last stage of the first pump mechanism P1 of themain pump 11 can be transmitted to thebooster pump 61 more efficiently. This mode is advantageous in making the vacuum pump compact. - At least the cylinder block 15 (inclusive of the
support portion 67 integral with the cylinder block 15) in the second housing H2 of thebooster pump 61 may be formed of an aluminum-based metal, which has an excellent thermal conductance. This structure can allow the heat from the heat-extractingportion 73 to be efficiently transmitted to thecylinder block 15 of thebooster pump 61, thus making it possible to raise the temperature in thebooster pump 61 more efficiently. - The present examples and embodiments are to be considered as illustrative and not restrictive and the invention is not be limited to the details given herein, but may be modified within the scope and equivalence of the appended claims.
- A vacuum pump has a main pump, a booster pump and a coupling member. The main pump has a first housing and a first pump mechanism accommodated in the first housing. The booster pump has a second housing and a second pump mechanism accommodated in the second housing. The booster pump and the main pump are coupled in series such that gas is sent from the booster pump to the main pump. The coupling member couples the first housing and the second housing to each other. The coupling member is directly coupled to a portion of the first housing that surrounds a last stage of the first pump mechanism such that transmission of heat to the portion is permitted.
Claims (8)
- A vacuum pump has a main pump, wherein the main pump has a first housing and a first pump mechanism accommodated in the first housing, the first pump mechanism being of a multi-stage type, a booster pump, wherein the booster pump has a second housing and a second pump mechanism accommodated in the second housing, wherein the booster pump and the main pump are coupled in series such that gas is sent from the booster pump to the main pump, a coupling member for coupling the first housing and the second housing to each other; the vacuum pump being characterized in that:the coupling member is directly coupled to a portion of the first housing that surrounds a last stage of the first pump mechanism such that transmission of heat to the portion is permitted.
- The vacuum pump according to claim 1, characterized in that the coupling member is integrally formed with at least one of the first housing and the second housing.
- The vacuum pump according to claim 1, characterized in that the coupling member is formed separately from the first housing, and wherein the coupling member abuts on an outer surface of the portion of the first housing that surrounds the last stage of the first pump mechanism.
- The vacuum pump according to claim 3, characterized in that a thermal-conductance improver is provided at the joint between the coupling member and the first housing.
- The vacuum pump according to claim 4, characterized in that the thermal-conductance improver is located between the coupling member and the first housing such that adhesion of the coupling member to the first housing is improved.
- The vacuum pump according to any one of claims 1 to 5, characterized in that the coupling member supports one of the main pump and the booster pump such that the supported pump is located above the other pump.
- The vacuum pump according to any one of claims 1 to 6, characterized in that the coupling member has a communication passage, wherein the communication passage connects a gas exhaust port of the booster pump to a gas suction port of the main pump.
- The vacuum pump according to any one of claims 1 to 7, characterized in that the gas is a gaseous reaction product generated at a semiconductor machining apparatus.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002264327 | 2002-09-10 | ||
JP2002264327A JP2004100594A (en) | 2002-09-10 | 2002-09-10 | Vacuum pump device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1398509A2 true EP1398509A2 (en) | 2004-03-17 |
EP1398509A3 EP1398509A3 (en) | 2005-06-15 |
Family
ID=31884757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03020360A Withdrawn EP1398509A3 (en) | 2002-09-10 | 2003-09-09 | Vacuum pump |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040081565A1 (en) |
EP (1) | EP1398509A3 (en) |
JP (1) | JP2004100594A (en) |
KR (1) | KR20040023490A (en) |
CN (1) | CN1495363A (en) |
TW (1) | TW200404125A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011018370A3 (en) * | 2009-08-11 | 2011-12-08 | Oerlikon Leybold Vakuum Gmbh | Vacuum pump system |
GB2500603A (en) * | 2012-03-26 | 2013-10-02 | Edwards Ltd | Vacuum pump stators and vacuum pumps |
US20130259712A1 (en) * | 2012-03-30 | 2013-10-03 | Ebara Corporation | Vacuum evacuation apparatus |
EP2626562A3 (en) * | 2012-02-08 | 2014-03-26 | Edwards Limited | Pump |
WO2018229459A1 (en) * | 2017-06-12 | 2018-12-20 | Edwards Limited | Twin shaft pumps and a method of pumping |
CN112879290A (en) * | 2021-01-25 | 2021-06-01 | 马鞍山赛力文机械有限公司 | Double-screw main machine structure driven by front end gear and rear end gear |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4218756B2 (en) * | 2003-10-17 | 2009-02-04 | 株式会社荏原製作所 | Vacuum exhaust device |
KR100809852B1 (en) * | 2007-05-17 | 2008-03-04 | (주)엘오티베큠 | Intergrated apparatus for vacuum producing |
TWI518245B (en) * | 2010-04-19 | 2016-01-21 | 荏原製作所股份有限公司 | Dry vacuum pump apparatus, exhaust unit, and silencer |
JP2014029114A (en) * | 2010-11-17 | 2014-02-13 | Ulvac Japan Ltd | Connecting structure of vacuum evacuation device and vacuum evacuation device |
WO2012066782A1 (en) * | 2010-11-17 | 2012-05-24 | 株式会社アルバック | Vacuum exhaust device coupling structure and vacuum exhaust system |
JP2014001668A (en) * | 2012-06-18 | 2014-01-09 | Toshiba Corp | Roots pump |
DE202013003819U1 (en) * | 2013-04-24 | 2014-07-25 | Oerlikon Leybold Vacuum Gmbh | Vacuum system |
JP6441660B2 (en) * | 2014-03-17 | 2018-12-19 | 株式会社荏原製作所 | Vacuum pump with abatement function |
JP6472653B2 (en) * | 2014-03-17 | 2019-02-20 | 株式会社荏原製作所 | Vacuum pump with abatement function |
WO2017031807A1 (en) * | 2015-08-27 | 2017-03-02 | 上海伊莱茨真空技术有限公司 | Non-coaxial vacuum pump with multiple driving chambers |
GB201700995D0 (en) | 2017-01-20 | 2017-03-08 | Edwards Ltd | Multi-stage vacuum booster pump rotor |
CN107084135A (en) * | 2017-06-29 | 2017-08-22 | 德耐尔节能科技(上海)股份有限公司 | A kind of dry-type spiral vacuum pump |
US11313368B2 (en) * | 2020-03-05 | 2022-04-26 | Elivac Company, Ltd. | Multistage pump assembly with at least one co-used shaft |
JP7350398B2 (en) * | 2020-05-25 | 2023-09-26 | 樫山工業株式会社 | Vacuum exhaust device with silencer |
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- 2003-07-01 KR KR1020030044273A patent/KR20040023490A/en not_active Application Discontinuation
- 2003-09-09 EP EP03020360A patent/EP1398509A3/en not_active Withdrawn
- 2003-09-09 CN CNA031470238A patent/CN1495363A/en active Pending
- 2003-09-10 US US10/660,313 patent/US20040081565A1/en not_active Abandoned
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2011018370A3 (en) * | 2009-08-11 | 2011-12-08 | Oerlikon Leybold Vakuum Gmbh | Vacuum pump system |
CN102472107A (en) * | 2009-08-11 | 2012-05-23 | 厄利孔莱博尔德真空技术有限责任公司 | Vacuum pump system |
EP2626562A3 (en) * | 2012-02-08 | 2014-03-26 | Edwards Limited | Pump |
US9869317B2 (en) | 2012-02-08 | 2018-01-16 | Edwards Limited | Pump |
GB2500603A (en) * | 2012-03-26 | 2013-10-02 | Edwards Ltd | Vacuum pump stators and vacuum pumps |
US20130259712A1 (en) * | 2012-03-30 | 2013-10-03 | Ebara Corporation | Vacuum evacuation apparatus |
WO2018229459A1 (en) * | 2017-06-12 | 2018-12-20 | Edwards Limited | Twin shaft pumps and a method of pumping |
US11401935B2 (en) | 2017-06-12 | 2022-08-02 | Edwards Limited | Twin shaft pumps and a method of pumping |
CN112879290A (en) * | 2021-01-25 | 2021-06-01 | 马鞍山赛力文机械有限公司 | Double-screw main machine structure driven by front end gear and rear end gear |
CN112879290B (en) * | 2021-01-25 | 2022-06-14 | 马鞍山赛力文机械有限公司 | Double-screw main machine structure driven by front end gear and rear end gear |
Also Published As
Publication number | Publication date |
---|---|
TW200404125A (en) | 2004-03-16 |
EP1398509A3 (en) | 2005-06-15 |
KR20040023490A (en) | 2004-03-18 |
JP2004100594A (en) | 2004-04-02 |
CN1495363A (en) | 2004-05-12 |
US20040081565A1 (en) | 2004-04-29 |
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