EP1374138A2 - Device with at least two organic electronic components and method for producing the same - Google Patents

Device with at least two organic electronic components and method for producing the same

Info

Publication number
EP1374138A2
EP1374138A2 EP02753693A EP02753693A EP1374138A2 EP 1374138 A2 EP1374138 A2 EP 1374138A2 EP 02753693 A EP02753693 A EP 02753693A EP 02753693 A EP02753693 A EP 02753693A EP 1374138 A2 EP1374138 A2 EP 1374138A2
Authority
EP
European Patent Office
Prior art keywords
organic
components
substrate
electronic components
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02753693A
Other languages
German (de)
French (fr)
Inventor
Adolf Bernds
Wolfgang Clemens
Walter Fix
Markus Lorenz
Henning Rost
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PolyIC GmbH and Co KG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1374138A2 publication Critical patent/EP1374138A2/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

Definitions

  • the invention relates to a device with at least two electronic components, which comprise at least one organic functional layer, and a manufacturing method therefor.
  • a device e.g. a display with at least one organic functional layer, which is controlled by external conventional electronics (that is to say using silicon-containing semiconductor materials).
  • external conventional electronics that is to say using silicon-containing semiconductor materials.
  • a solar cell / photocell with at least one organic functional layer is also known, but the
  • the disadvantage is that, like the displays, it has to be controlled via conventional electronics.
  • a disadvantage of the previously known devices with at least two electronic components is that they comprise components made from conventional silicon semiconductor technology, which, compared to the organic electronic components, are considerably more complex in terms of process costs and production.
  • the object of the present invention is therefore to develop a complex, i.e. To provide at least two electronic components comprising device that is simple and inexpensive to manufacture, so that use as a disposable product is economical.
  • the invention relates to a device with at least two electronic organic components, the two components each comprising at least one organic functional layer and being functionally connected directly or indirectly.
  • the invention furthermore relates to a method for producing a device having at least two electronic electronic devices.
  • ganic components wherein the electronic organic components can be produced by printing, spraying, coating, embossing, imprinting, heating and / or irradiating a substrate.
  • the substrate is either coated or uncoated during manufacture. If it is coated, a functional layer can be produced by irradiation. Functional layers can be produced on the uncoated substrate by printing and / or embossing and knife application of a functional polymer, etc.
  • An electronic organic component is a component with at least one organic functional layer, which means that it has at least one crucial electronic component, such as. B. comprises the semiconducting and / or the conductive layer of organic material.
  • organic material and / or “organic” here encompasses all types of organic, organometallic and / or inorganic plastics which, for example, be called "plastics". These are all types of substances with the exception of the semiconductors that form the classic diodes (germanium, silicon) and the typical metallic conductors. A restriction in the dogmatic sense to organic material as carbon-containing material is therefore not provided, but rather is also due to the widespread use of e.g. Silicones thought. Furthermore, the term should not be subject to any restriction with regard to the large molecules, in particular to polymeric and / or oligomeric materials, but it is also entirely possible to use "small molecules”.
  • FIG. 1 shows a top view of a pocket calculator
  • FIG. 2 shows a cross section of a pocket calculator
  • Figure 3 shows a circuit for an optocoupler
  • Figure 4 shows a cross section through an optocoupler.
  • the calculator 1 can be seen as a device in an overall view from above.
  • the following electronic organic components are combined in this device: the organic display 2, which fulfills the monitor function of the calculator 1, and an organic energy store 3, such as an organic solar cell unit and / or battery, which supplies the energy for the calculator 1.
  • the calculator 1 has a keyboard 4, which works, for example, via organic electronics 6, for example pressure sensors, which are attached under the respective keys and therefore cannot be seen here.
  • the parts / components listed so far are here on a single substrate 5, which e.g. can be a flexible substrate like a film.
  • a pocket calculator 1 is produced, for example, using large-area processes in which various organic components are applied to a substrate by printing, spraying, spin coating or the like in a continuous process.
  • the substrates can be drawn over a plurality of rollers connected in series until the functional layers of the individual organic components are completely applied.
  • the occupied Substrates then only have to be cut before a single device such as a calculator 1 is manufactured.
  • the three components display 2, organic energy store 3 and keyboard 4 are functionally connected so that the calculator 1 shows the results requested on the display 2 during operation by actuating the keyboard 4 with the aid of the energy provided by the energy store 3.
  • Figure 2 shows the calculator 1 in cross section.
  • the substrate 5, on which the organic display 2, the organic energy store 3 and the keyboard 4, with organic electronics 6 underneath, is applied, can be seen below. All components can be produced by simply printing on the substrate. Thus, a possibility for an inexpensive manufacture of these devices and an application as disposable products is realistic.
  • Figure 3 shows a circuit for an optocoupler. You can see the contacts or connections 8,9,12 and 17 that
  • Driver electronics 10 the light-emitting diode 11, a transparent, isolating separating layer 13 through which the light beam 14 penetrates, a receiving diode (light detector) 15 which is separated from the light-emitting diode 11 by the separating layer 13 and finally the evaluation electronics 16.
  • Figure 4 shows the same optocoupler in cross section.
  • the light-emitting diode 11 with the driver electronics 10 is located on a substrate 18, which can also be a flexible substrate, on which there is a cover layer 19 (optional) on which the insulating, transparent separating layer 13 is located, which in turn, as it were, as a substrate for the receiving diode 15 and the evaluation electronics 16 is used.

Abstract

The invention relates to a device with at least two organic electronic components that comprise at least one organic functional layer, as well as to a method for producing the same. Unlike conventional devices, the inventive device comprises at least two components from organic material and is therefore substantially less expensive and less complicated to produce than known devices that require a combination of organic with conventional electronic components. The inventive device completely eliminates, under certain circumstances, the need for conventional silicon semiconductor technology.

Description

Beschreibungdescription
Gerät mit zumindest zwei organischen elektronischen Bauteilen und Verfahren zur Herstellung dazuDevice with at least two organic electronic components and method for manufacturing the same
Die Erfindung betrifft ein Gerät mit zumindest zwei elektronischen Bauteilen, die zumindest eine organische Funktionsschicht umfassen, sowie ein Herstellungsverfahren dazu.The invention relates to a device with at least two electronic components, which comprise at least one organic functional layer, and a manufacturing method therefor.
Bekannt ist ein Gerät, wie z.B. ein Display mit zumindest einer organischen Funktionsschicht, das durch eine externe konventionelle (d.h. unter Verwendung von Silizium-haltigen Halbleitermaterialien funktionierende) Elektronik angesteuert wird. Es ist auch eine Solarzelle/Photozelle mit zumindest einer organischen Funktionsschicht bekannt, die jedoch denA device is known, e.g. a display with at least one organic functional layer, which is controlled by external conventional electronics (that is to say using silicon-containing semiconductor materials). A solar cell / photocell with at least one organic functional layer is also known, but the
Nachteil hat, dass sie, wie die Displays, über konventionelle Elektronik angesteuert werden muss.The disadvantage is that, like the displays, it has to be controlled via conventional electronics.
Nachteilig an den bisher bekannten Geräten mit zumindest zwei elektronischen Bauteilen ist, dass sie Bauteile aus herkömmlicher Silizium-Halbleitertechnologie umfassen, die im Vergleich zu den organischen elektronischen Bauteilen wesentlich aufwendiger in den Prozesskosten und in der Herstellung sind.A disadvantage of the previously known devices with at least two electronic components is that they comprise components made from conventional silicon semiconductor technology, which, compared to the organic electronic components, are considerably more complex in terms of process costs and production.
Aufgabe der vorliegenden Erfindung ist es daher, ein komplexes, d.h. zumindest zwei elektronische Bestandteile umfassendes Gerät zur Verfügung zu stellen, das einfach und preiswert herstellbar ist, so dass eine Verwendung als Einwegprodukt wirtschaftlich ist.The object of the present invention is therefore to develop a complex, i.e. To provide at least two electronic components comprising device that is simple and inexpensive to manufacture, so that use as a disposable product is economical.
Gegenstand der Erfindung ist ein Gerät mit zumindest zwei elektronischen organischen Bauteilen, wobei die beiden Bauteile jeweils zumindest eine organische FunktionsSchicht umfassen und funktionell direkt oder indirekt verbunden sind.The invention relates to a device with at least two electronic organic components, the two components each comprising at least one organic functional layer and being functionally connected directly or indirectly.
Weiterhin ist Gegenstand der Erfindung ein Verfahren zur Herstellung eines Gerätes mit zumindest zwei elektronischen or- ganischen Bauteilen, wobei die elektronischen organischen Bauteile durch Bedrucken, Besprühen, Beschichten, Prägen, Imprint, Erwärmen und/oder Bestrahlen eines Substrates herstellbar sind.The invention furthermore relates to a method for producing a device having at least two electronic electronic devices. ganic components, wherein the electronic organic components can be produced by printing, spraying, coating, embossing, imprinting, heating and / or irradiating a substrate.
Das Substrat ist bei der Herstellung entweder beschichtet oder unbeschichtet. Wenn es beschichtet ist, dann kann eine Funktionsschicht durch Bestrahlen hergestellt werden. Auf dem unbeschichteten Substrat können Funktionsschichten durch Be- drucken und/oder Prägen und Einrakeln eines Funktionspolymers etc. hergestellt werden.The substrate is either coated or uncoated during manufacture. If it is coated, a functional layer can be produced by irradiation. Functional layers can be produced on the uncoated substrate by printing and / or embossing and knife application of a functional polymer, etc.
Als elektronisches organisches Bauteil wird ein Bauteil mit zumindest einer organischen Funktionsschicht bezeichnet, das heißt, das es zumindest einen entscheidenden elektronischen Bestandteil, wie z. B. die halbleitende und/oder die leitende Schicht aus organischem Material umfasst .An electronic organic component is a component with at least one organic functional layer, which means that it has at least one crucial electronic component, such as. B. comprises the semiconducting and / or the conductive layer of organic material.
Der Begriff "organisches Material" und/oder "organisch" um- fasst hier alle Arten von organischen, metallorganischen und/oder anorganischen Kunststoffen, die im Englischen z.B. mit "plastics" bezeichnet werden. Es handelt sich um alle Arten von Stoffen mit Ausnahme der Halbleiter, die die klassischen Dioden bilden (Germanium, Silizium) und der typischen metallischen Leiter. Eine Beschränkung im dogmatischen Sinn auf organisches Material als Kohlenstoff-enthaltendes Material ist demnach nicht vorgesehen, vielmehr ist auch an den breiten Einsatz von z.B. Siliconen gedacht. Weiterhin soll der Term keinerlei Beschränkung im Hinblick auf die Molekül- große, insbesondere auf polymere und/oder oligomere Materialien unterliegen, sondern es ist durchaus auch der Einsatz von "small molecules" möglich.The term “organic material” and / or “organic” here encompasses all types of organic, organometallic and / or inorganic plastics which, for example, be called "plastics". These are all types of substances with the exception of the semiconductors that form the classic diodes (germanium, silicon) and the typical metallic conductors. A restriction in the dogmatic sense to organic material as carbon-containing material is therefore not provided, but rather is also due to the widespread use of e.g. Silicones thought. Furthermore, the term should not be subject to any restriction with regard to the large molecules, in particular to polymeric and / or oligomeric materials, but it is also entirely possible to use "small molecules".
Als „funktioneil direkt" wird hier eine Verbindung zweier Module bezeichnet, die ohne zwischengeschaltetes weiteres Modul besteht und als „funktionell indirekt" eine, bei der andere Module zwischengeschaltet sind. Beispielsweise sind p. I P-" 3 Φ N W Φ J φ p- SD P- P P o= (-■ A “functionally direct” is a connection between two modules that exists without an additional module in between, and a “functionally indirect” one in which other modules are connected. For example p. I P- "3 Φ NW Φ J φ p- SD P- PP o = (- ■
N P- Ω rr Ω IQ 3 3 ΦN P- Ω rr Ω IQ 3 3 Φ
P P fr P t PJ= p- 3 - Q Φ rr p- rr P P rr φ Φ X P- N P- P- f i-r1 ω 3 PJ Φ φ φ Ω 0PP fr P t PJ = p- 3 - Q Φ rr p- rr PP rr φ Φ X P- N P- P- f ir 1 ω 3 PJ Φ φ φ Ω 0
0= Φ P- P rr P CQ PJ P t CD rr tsi Φ rt Φ H-0 = Φ P- P rr P CQ P J P t CD rr tsi Φ rt Φ H-
P- Ω rr Φ ?f s i CQ Q tr P- P- et P- N ΩP- Ω rr Φ? F s i CQ Q tr P- P- et P- N Ω
Φ P Φ LQ P- Φ S W 'Φ P Φ LQ P- Φ S W '
PJ: ι-i Φ Φ Φ PJ φPJ: ι-i Φ Φ Φ PJ φ
P Φ - ι-i INI P-P Φ - ι-i INI P-
?V P Φ • tr ω? V P Φ • tr ω
CQ P P- Φ P ω Φ PJ rr P Φ tr P- • H Φ φ LQ P Φ Φ Φ P- rtCQ P P- Φ P ω Φ PJ rr P Φ tr P- • H Φ φ LQ P Φ Φ Φ P- rt
P P Q Φ W rr ΦP P Q Φ W rr Φ
Φ P- t ) CQ P- rt Φ H- ü P PJ o ω P H h-1 Φ P- t) CQ P- rt Φ H- ü P PJ o ω PH h- 1
P P PJ 0 rt φP P PJ 0 rt φ
P P> rt Φ P P Φ Q φ φ P- rr P- P- Ω PP P> rt Φ P P Φ Q φ φ P- rr P- P- Ω P
3 P- P Φ Ω Cß T 33 P- P Φ Ω Cß T 3
P> P-1 P- tr Ω P HiP> P- 1 P- tr Ω P Hi
P- co α P rt tr o ) φ P- O PS Φ φ P-1 CQP- co α P rt tr o ) φ P- O PS Φ φ P- 1 CQ
P P- P P- 3 P o CQP P- P P- 3 P o CQ
N 3 φ Ω P P- LQ Φ ωN 3 φ Ω P P-LQ Φ ω
P π ^ rt tö P- PP π ^ rt tö P- P
3 <; ω ϊ*i rr ) φ3 <; ω ϊ * i rr ) φ
P- 0 PJ: φ 0 P- PP- 0 PJ: φ 0 P- P
P ^ tr P Φ rr tr P.P ^ tr P Φ rr tr P.
P- P CQ §■ P Φ Φ H- φ & f-1 o H- Φ P- f-i Φ ra J P- P P P LQ rt CD Ω PJ P. Φ Φ H-P- P CQ § ■ P Φ Φ H- φ & f- 1 o H- Φ P- fi Φ ra J P- PPP LQ rt CD Ω PJ P. Φ Φ H-
CD P" 3 rr Φ CQ PJ CD P "3 rr Φ CQ P J
N Φ H- P- CQ rr HN Φ H- P- CQ rr H
3 Φ 01 rt 0 0= Φ Φ3 Φ 01 rt 0 0 = Φ Φ
Φ P- . P P P tΦ P-. P P P t
P- P Φ P P CQP- P Φ P P CQ
K P- 3 - φ rr ΦK P- 3 - φ rr Φ
Ώ Ω to P P- P H- φ Φ Φ rt Φ CQ rr p P. 3 P- φ Φ QΏ Ω to P P- P H- φ Φ Φ rt Φ CQ rr p P. 3 P- φ Φ Q
Oj: PJ: P- Φ P P- 1- rt rr φ H- P P J φ LQ P PJ POj: PJ: P- Φ P P- 1 - rt rr φ H- PPJ φ LQ P PJ P
P rt Φ P ?T ΩP rt Φ P? T Ω
P P P- o= PJ p. tr φ PPP P- o = P J p. tr φ P
P- J P P 3P- J P P 3
P. Φ ^ Φ H- p- P rr P rtP. Φ ^ Φ H- p- P rr P rt
Φ P- •Φ P- •
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darstellen, sondern es ist insbesondere an eine Kombination zweier an sich eigenständiger Geräte dergleichen organischen Halbleitertechnologie gedacht.represent, but it is particularly thought of a combination of two independent devices of the same type of organic semiconductor technology.
Im folgenden wird die Erfindung noch anhand von vier Figuren, die beispielhafte Ausführungsformen der Erfindung beschreiben, erläutert:In the following, the invention will be explained with reference to four figures, which describe exemplary embodiments of the invention:
Figur 1 zeigt eine Draufsicht auf einen Taschenrechner, Figur 2 zeigt einen Querschnitt eines Taschenrechners,FIG. 1 shows a top view of a pocket calculator, FIG. 2 shows a cross section of a pocket calculator,
Figur 3 zeigt eine Schaltung für einen Optokoppler undFigure 3 shows a circuit for an optocoupler and
Figur 4 zeigt einen Querschnitt durch einen Optokoppler.Figure 4 shows a cross section through an optocoupler.
In Figur 1 ist als Gerät der Taschenrechner 1 in einer Ge- samtansicht von oben zu sehen. In diesem Gerät sind folgende elektronische organische Bauteile kombiniert: Das organische Display 2, das die Monitorfunktion des Taschenrechners 1 erfüllt und ein organischer Energiespeicher 3 wie eine organische Solarzelleneinheit und/oder Batterie, die die Energie für den Taschenrechner 1 liefert.In FIG. 1, the calculator 1 can be seen as a device in an overall view from above. The following electronic organic components are combined in this device: the organic display 2, which fulfills the monitor function of the calculator 1, and an organic energy store 3, such as an organic solar cell unit and / or battery, which supplies the energy for the calculator 1.
Weiterhin hat der Taschenrechner 1 eine Tastatur 4, die beispielsweise über organische Elektronik 6, beispielsweise Drucksensoren funktioniert, die unter den jeweiligen Tasten angebracht und deshalb hier nicht zu sehen sind. Die bisher aufgezählten Bauteile/Komponenten befinden sich hier auf einem einzigen Substrat 5, das z.B. ein flexibles Substrat wie eine Folie sein kann.Furthermore, the calculator 1 has a keyboard 4, which works, for example, via organic electronics 6, for example pressure sensors, which are attached under the respective keys and therefore cannot be seen here. The parts / components listed so far are here on a single substrate 5, which e.g. can be a flexible substrate like a film.
Die Herstellung eines Taschenrechners 1 erfolgt beispielsweise über großflächige Prozesse, in denen auf einem Substrat verschiedene organische Bauteile durch Bedrucken, Besprühen, spin coating oder ähnliches in einem kontinuierlichen Verfahren aufgebracht werden. Die Substrate können dabei im ein- fachsten Fall über mehrere hintereinandergeschaltete Walzen gezogen werden, bis die Funktionsschichten der einzelnen organischen Bauteile vollständig aufgebracht sind. Die belegten Substrate müssen dann nur noch geschnitten werden, bevor ein einzelnes Geräte wie ein Taschenrechner 1 gefertigt ist.A pocket calculator 1 is produced, for example, using large-area processes in which various organic components are applied to a substrate by printing, spraying, spin coating or the like in a continuous process. In the simplest case, the substrates can be drawn over a plurality of rollers connected in series until the functional layers of the individual organic components are completely applied. The occupied Substrates then only have to be cut before a single device such as a calculator 1 is manufactured.
Die drei Bauteile Display 2, organischer Energiespeicher 3 und Tastatur 4 sind funktionell verbunden damit der Taschenrechner 1 im Betrieb über Betätigung der Tastatur 4 mit Hilfe der vom Energiespeicher 3 zur Verfügung gestellten Energie angeforderte Resultate auf dem Display 2 zeigt.The three components display 2, organic energy store 3 and keyboard 4 are functionally connected so that the calculator 1 shows the results requested on the display 2 during operation by actuating the keyboard 4 with the aid of the energy provided by the energy store 3.
Figur 2 zeigt den Taschenrechner 1 im Querschnitt. Zu sehen ist unten das Substrat 5, auf dem das organische Display 2 der organische Energiespeicher 3 und die Tastatur 4, mit darunter liegender organischer Elektronik 6 aufgebracht ist. Alle Bauteile können durch einfaches Bedrucken des Substrates erzeugt werden. Somit ist eine Möglichkeit für eine preiswerte Herstellung dieser Geräte und eine Anwendung als Einwegprodukte realistisch.Figure 2 shows the calculator 1 in cross section. The substrate 5, on which the organic display 2, the organic energy store 3 and the keyboard 4, with organic electronics 6 underneath, is applied, can be seen below. All components can be produced by simply printing on the substrate. Thus, a possibility for an inexpensive manufacture of these devices and an application as disposable products is realistic.
Figur 3 zeigt eine Schaltung für einen Optokoppler. Zu sehen sind die Kontakte oder Anschlüsse 8,9,12 und 17, dieFigure 3 shows a circuit for an optocoupler. You can see the contacts or connections 8,9,12 and 17 that
Treiberelektronik 10, die Leuchtdiode 11, eine transparente, isolierende Trennschicht 13, durch die der Lichtstrahl 14 dringt, eine Empfangsdiode (Lichtdetektor) 15, die von der Leuchtdiode 11 durch die Trennschicht 13 getrennt ist und schließlich die Auswerteelektronik 16.Driver electronics 10, the light-emitting diode 11, a transparent, isolating separating layer 13 through which the light beam 14 penetrates, a receiving diode (light detector) 15 which is separated from the light-emitting diode 11 by the separating layer 13 and finally the evaluation electronics 16.
Figur 4 zeigt denselben Optokoppler im Querschnitt. Auf einem Substrat 18, das auch ein flexibles Substrat sein kann, befindet sich die Leuchtdiode 11 mit der Treiberelektronik 10, darauf eine Deckschicht 19 (fakultativ) auf der sich die isolierende, transparente Trennschicht 13 befindet, die ihrerseits sozusagen als Substrat für die Empfangsdiode 15 und die Auswerteelektronik 16 dient.Figure 4 shows the same optocoupler in cross section. The light-emitting diode 11 with the driver electronics 10 is located on a substrate 18, which can also be a flexible substrate, on which there is a cover layer 19 (optional) on which the insulating, transparent separating layer 13 is located, which in turn, as it were, as a substrate for the receiving diode 15 and the evaluation electronics 16 is used.
Alle Komponenten der gezeigten Geräte können z.B. durch einfaches Bedrucken, Besprühen und/oder Beschichten etc. mit organischem Material hergestellt werden. P> H in O LΠAll components of the devices shown can be produced, for example, by simply printing, spraying and / or coating etc. with organic material. P> H in O LΠ

Claims

Patentansprüche claims
1. Gerät mit zumindest zwei elektronischen organischen Bauteilen, wobei die beiden Bauteile jeweils zumindest eine or- ganische FunktionsSchicht umfassen und funktionell direkt oder indirekt verbunden sind.1. Device with at least two electronic organic components, the two components each comprising at least one organic functional layer and being functionally connected directly or indirectly.
2. Gerät nach Anspruch 1, bei dem die Bauteile auf einem Substrat aufgebracht sind.2. Apparatus according to claim 1, wherein the components are applied to a substrate.
3. Gerät nach einem der Ansprüche 1 oder 2, bei dem das Substrat ein flexibles Substrat ist.3. Device according to one of claims 1 or 2, wherein the substrate is a flexible substrate.
4. Gerät nach einem der vorstehenden Ansprüche, bei dem die Bauteile verkapselt sind.4. Device according to one of the preceding claims, in which the components are encapsulated.
5. Gerät nach einem der vorstehenden Ansprüche, bei dem die funktioneile Verbindung über Leiterbahnen mit organischer Elektronik stattfindet.5. Device according to one of the preceding claims, wherein the functional connection takes place via conductor tracks with organic electronics.
6. Verfahren zur Herstellung eines Gerätes mit zumindest zwei elektronischen organischen Bauteilen, wobei die elektronischen organischen Bauteile durch Bedrucken, Besprühen, Beschichten, Prägen und/oder Einrakeln, Imprint, Erwärmen und/oder Bestrahlen eines Substrates herstellbar sind.6. A method for producing a device with at least two electronic organic components, the electronic organic components being able to be produced by printing, spraying, coating, embossing and / or knife coating, imprinting, heating and / or irradiating a substrate.
7. Verfahren nach Anspruch 6, bei dem die Herstellung in einem kontinuierlichen Prozess erfolgt.7. The method according to claim 6, wherein the production takes place in a continuous process.
8. Verfahren nach einem der Ansprüche 6 oder 7, bei dem die Herstellung großflächig erfolgt. 8. The method according to any one of claims 6 or 7, in which the production takes place over a large area.
EP02753693A 2001-03-26 2002-03-15 Device with at least two organic electronic components and method for producing the same Withdrawn EP1374138A2 (en)

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PCT/DE2002/000937 WO2002078052A2 (en) 2001-03-26 2002-03-15 Device with at least two organic electronic components and method for producing the same

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10043204A1 (en) * 2000-09-01 2002-04-04 Siemens Ag Organic field-effect transistor, method for structuring an OFET and integrated circuit
DE102006001854A1 (en) * 2006-01-13 2007-07-26 Siemens Ag Display with energy storage, as well as manufacturing process
ES2587082T3 (en) * 2009-12-16 2016-10-20 Heliatek Gmbh Photoactive building element with organic layers

Family Cites Families (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512052A (en) * 1968-01-11 1970-05-12 Gen Motors Corp Metal-insulator-semiconductor voltage variable capacitor with controlled resistivity dielectric
US3769096A (en) * 1971-03-12 1973-10-30 Bell Telephone Labor Inc Pyroelectric devices
JPS543594B2 (en) * 1973-10-12 1979-02-24
JPS54101176A (en) * 1978-01-26 1979-08-09 Shinetsu Polymer Co Contact member for push switch
US4442019A (en) * 1978-05-26 1984-04-10 Marks Alvin M Electroordered dipole suspension
US4340657A (en) * 1980-02-19 1982-07-20 Polychrome Corporation Novel radiation-sensitive articles
US4926052A (en) * 1986-03-03 1990-05-15 Kabushiki Kaisha Toshiba Radiation detecting device
GB2215307B (en) * 1988-03-04 1991-10-09 Unisys Corp Electronic component transportation container
US5364735A (en) * 1988-07-01 1994-11-15 Sony Corporation Multiple layer optical record medium with protective layers and method for producing same
US4937119A (en) * 1988-12-15 1990-06-26 Hoechst Celanese Corp. Textured organic optical data storage media and methods of preparation
US5892244A (en) * 1989-01-10 1999-04-06 Mitsubishi Denki Kabushiki Kaisha Field effect transistor including πconjugate polymer and liquid crystal display including the field effect transistor
FR2644920B1 (en) * 1989-03-21 1993-09-24 France Etat POLYCHROMIC DISPLAY DEVICE WITH PHOTOCONDUCTOR-LIGHT EMITTING TYPE
US6331356B1 (en) * 1989-05-26 2001-12-18 International Business Machines Corporation Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
US5206525A (en) * 1989-12-27 1993-04-27 Nippon Petrochemicals Co., Ltd. Electric element capable of controlling the electric conductivity of π-conjugated macromolecular materials
FR2664430B1 (en) * 1990-07-04 1992-09-18 Centre Nat Rech Scient THIN FILM FIELD EFFECT TRANSISTOR WITH MIS STRUCTURE, IN WHICH THE INSULATION AND THE SEMICONDUCTOR ARE MADE OF ORGANIC MATERIALS.
FR2673041A1 (en) * 1991-02-19 1992-08-21 Gemplus Card Int METHOD FOR MANUFACTURING INTEGRATED CIRCUIT MICROMODULES AND CORRESPONDING MICROMODULE.
US5408109A (en) * 1991-02-27 1995-04-18 The Regents Of The University Of California Visible light emitting diodes fabricated from soluble semiconducting polymers
JPH0580530A (en) * 1991-09-24 1993-04-02 Hitachi Ltd Production of thin film pattern
US5173835A (en) * 1991-10-15 1992-12-22 Motorola, Inc. Voltage variable capacitor
EP0610183B1 (en) * 1991-10-30 1995-05-10 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Exposure device
JP2709223B2 (en) * 1992-01-30 1998-02-04 三菱電機株式会社 Non-contact portable storage device
JP3457348B2 (en) * 1993-01-15 2003-10-14 株式会社東芝 Method for manufacturing semiconductor device
FR2701117B1 (en) * 1993-02-04 1995-03-10 Asulab Sa Electrochemical measurement system with multizone sensor, and its application to glucose measurement.
JP3334211B2 (en) * 1993-02-10 2002-10-15 株式会社日立製作所 display
US5567550A (en) * 1993-03-25 1996-10-22 Texas Instruments Incorporated Method of making a mask for making integrated circuits
JPH0722669A (en) * 1993-07-01 1995-01-24 Mitsubishi Electric Corp Plastic functional element
JP3035352B2 (en) * 1993-08-24 2000-04-24 メトリカ・インコーポレーテッド New disposable electronic test device
JP3460863B2 (en) * 1993-09-17 2003-10-27 三菱電機株式会社 Method for manufacturing semiconductor device
FR2710413B1 (en) * 1993-09-21 1995-11-03 Asulab Sa Measuring device for removable sensors.
US5556706A (en) * 1993-10-06 1996-09-17 Matsushita Electric Industrial Co., Ltd. Conductive layered product and method of manufacturing the same
JP3246189B2 (en) * 1994-06-28 2002-01-15 株式会社日立製作所 Semiconductor display device
US5574291A (en) * 1994-12-09 1996-11-12 Lucent Technologies Inc. Article comprising a thin film transistor with low conductivity organic layer
US5630986A (en) * 1995-01-13 1997-05-20 Bayer Corporation Dispensing instrument for fluid monitoring sensors
JP3068430B2 (en) * 1995-04-25 2000-07-24 富山日本電気株式会社 Solid electrolytic capacitor and method of manufacturing the same
GB2310493B (en) * 1996-02-26 2000-08-02 Unilever Plc Determination of the characteristics of fluid
JP3080579B2 (en) * 1996-03-06 2000-08-28 富士機工電子株式会社 Manufacturing method of air rear grid array package
JP2000512428A (en) * 1996-06-12 2000-09-19 ザ トラスティーズ オブ プリンストン ユニバーシテイ Thin film patterning for organic multicolor display manufacturing
DE19629656A1 (en) * 1996-07-23 1998-01-29 Boehringer Mannheim Gmbh Diagnostic test carrier with multilayer test field and method for the determination of analyte with its aid
US6344662B1 (en) * 1997-03-25 2002-02-05 International Business Machines Corporation Thin-film field-effect transistor with organic-inorganic hybrid semiconductor requiring low operating voltages
KR100248392B1 (en) * 1997-05-15 2000-09-01 정선종 The operation and control of the organic electroluminescent devices with organic field effect transistors
EP0968537B1 (en) * 1997-08-22 2012-05-02 Creator Technology B.V. A method of manufacturing a field-effect transistor substantially consisting of organic materials
US5973598A (en) * 1997-09-11 1999-10-26 Precision Dynamics Corporation Radio frequency identification tag on flexible substrate
KR20010031169A (en) * 1997-10-17 2001-04-16 더 리전트 오브 더 유니버시티 오브 캘리포니아 Process for fabricating organic semiconductor devices using ink-jet printing technology and device and system employing same
US6251513B1 (en) * 1997-11-08 2001-06-26 Littlefuse, Inc. Polymer composites for overvoltage protection
US5997817A (en) * 1997-12-05 1999-12-07 Roche Diagnostics Corporation Electrochemical biosensor test strip
WO1999030432A1 (en) * 1997-12-05 1999-06-17 Koninklijke Philips Electronics N.V. Identification transponder
US5998805A (en) * 1997-12-11 1999-12-07 Motorola, Inc. Active matrix OED array with improved OED cathode
US6083104A (en) * 1998-01-16 2000-07-04 Silverlit Toys (U.S.A.), Inc. Programmable toy with an independent game cartridge
EP1051745B1 (en) * 1998-01-28 2007-11-07 Thin Film Electronics ASA A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
US6087196A (en) * 1998-01-30 2000-07-11 The Trustees Of Princeton University Fabrication of organic semiconductor devices using ink jet printing
US6045977A (en) * 1998-02-19 2000-04-04 Lucent Technologies Inc. Process for patterning conductive polyaniline films
US6033202A (en) * 1998-03-27 2000-03-07 Lucent Technologies Inc. Mold for non - photolithographic fabrication of microstructures
GB9808061D0 (en) * 1998-04-16 1998-06-17 Cambridge Display Tech Ltd Polymer devices
US6350996B1 (en) * 1998-04-24 2002-02-26 Canon Kabushiki Kaisha Light emitting diode device
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
TW410478B (en) * 1998-05-29 2000-11-01 Lucent Technologies Inc Thin-film transistor monolithically integrated with an organic light-emitting diode
US5967048A (en) * 1998-06-12 1999-10-19 Howard A. Fromson Method and apparatus for the multiple imaging of a continuous web
US6215130B1 (en) * 1998-08-20 2001-04-10 Lucent Technologies Inc. Thin film transistors
AU770909B2 (en) * 1998-08-26 2004-03-04 Sensors For Medicine And Science, Inc. Optical-based sensing devices
US6384804B1 (en) * 1998-11-25 2002-05-07 Lucent Techonologies Inc. Display comprising organic smart pixels
US6506438B2 (en) * 1998-12-15 2003-01-14 E Ink Corporation Method for printing of transistor arrays on plastic substrates
US6321571B1 (en) * 1998-12-21 2001-11-27 Corning Incorporated Method of making glass structures for flat panel displays
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
GB2347013A (en) * 1999-02-16 2000-08-23 Sharp Kk Charge-transport structures
WO2000052457A1 (en) * 1999-03-02 2000-09-08 Helix Biopharma Corporation Card-based biosensor device
JP4403596B2 (en) * 1999-03-05 2010-01-27 ソニー株式会社 Optical element and substrate for optical element
US6207472B1 (en) * 1999-03-09 2001-03-27 International Business Machines Corporation Low temperature thin film transistor fabrication
US6498114B1 (en) * 1999-04-09 2002-12-24 E Ink Corporation Method for forming a patterned semiconductor film
US6072716A (en) * 1999-04-14 2000-06-06 Massachusetts Institute Of Technology Memory structures and methods of making same
US6383664B2 (en) * 1999-05-11 2002-05-07 The Dow Chemical Company Electroluminescent or photocell device having protective packaging
JP4136185B2 (en) * 1999-05-12 2008-08-20 パイオニア株式会社 Organic electroluminescent multicolor display and method for manufacturing the same
US6452959B1 (en) * 1999-05-28 2002-09-17 Dot Wireless, Inc. Method of and apparatus for generating data sequences for use in communications
JP4201436B2 (en) * 1999-07-14 2008-12-24 日東電工株式会社 Manufacturing method of multilayer wiring board
EP1129484A1 (en) * 1999-08-24 2001-09-05 Koninklijke Philips Electronics N.V. Display device
US6593690B1 (en) * 1999-09-03 2003-07-15 3M Innovative Properties Company Large area organic electronic devices having conducting polymer buffer layers and methods of making same
JP4595143B2 (en) * 1999-09-06 2010-12-08 双葉電子工業株式会社 Organic EL device and manufacturing method thereof
US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
JP2004538618A (en) * 1999-10-11 2004-12-24 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ Integrated circuit
US6335539B1 (en) * 1999-11-05 2002-01-01 International Business Machines Corporation Method for improving performance of organic semiconductors in bottom electrode structure
US6284562B1 (en) * 1999-11-17 2001-09-04 Agere Systems Guardian Corp. Thin film transistors
US6197663B1 (en) * 1999-12-07 2001-03-06 Lucent Technologies Inc. Process for fabricating integrated circuit devices having thin film transistors
CA2394886C (en) * 1999-12-21 2012-07-17 Plastic Logic Limited Inkjet-fabricated integrated circuits
US6706159B2 (en) * 2000-03-02 2004-03-16 Diabetes Diagnostics Combined lancet and electrochemical analyte-testing apparatus
US6441196B2 (en) * 2000-05-19 2002-08-27 Alcon, Inc. Processes and novel intermediates for 11-oxa prostaglandin synthesis
US6329226B1 (en) * 2000-06-01 2001-12-11 Agere Systems Guardian Corp. Method for fabricating a thin-film transistor
DE10033112C2 (en) * 2000-07-07 2002-11-14 Siemens Ag Process for the production and structuring of organic field-effect transistors (OFET), OFET produced thereafter and its use
WO2002005349A1 (en) * 2000-07-12 2002-01-17 California Institute Of Technology Electrical passivation of silicon-containing surfaces using organic layers
JP2004506985A (en) * 2000-08-18 2004-03-04 シーメンス　アクチエンゲゼルシヤフト Encapsulated organic electronic component, method of manufacture and use thereof
US6699728B2 (en) * 2000-09-06 2004-03-02 Osram Opto Semiconductors Gmbh Patterning of electrodes in oled devices
KR20020036916A (en) * 2000-11-11 2002-05-17 주승기 Method of crystallizing a silicon thin film and semiconductor device fabricated thereby
KR100390522B1 (en) * 2000-12-01 2003-07-07 피티플러스(주) Method for fabricating thin film transistor including a crystalline silicone active layer
US20020170897A1 (en) * 2001-05-21 2002-11-21 Hall Frank L. Methods for preparing ball grid array substrates via use of a laser
US6870180B2 (en) * 2001-06-08 2005-03-22 Lucent Technologies Inc. Organic polarizable gate transistor apparatus and method
JP2003089259A (en) * 2001-09-18 2003-03-25 Hitachi Ltd Pattern forming method and pattern forming apparatus
US7351660B2 (en) * 2001-09-28 2008-04-01 Hrl Laboratories, Llc Process for producing high performance interconnects
US6946332B2 (en) * 2002-03-15 2005-09-20 Lucent Technologies Inc. Forming nanoscale patterned thin film metal layers
US6812509B2 (en) * 2002-06-28 2004-11-02 Palo Alto Research Center Inc. Organic ferroelectric memory cells
US6870183B2 (en) * 2002-11-04 2005-03-22 Advanced Micro Devices, Inc. Stacked organic memory devices and methods of operating and fabricating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO02078052A2 *

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