EP1366538B1 - Microstrip transition - Google Patents

Microstrip transition Download PDF

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Publication number
EP1366538B1
EP1366538B1 EP02701844A EP02701844A EP1366538B1 EP 1366538 B1 EP1366538 B1 EP 1366538B1 EP 02701844 A EP02701844 A EP 02701844A EP 02701844 A EP02701844 A EP 02701844A EP 1366538 B1 EP1366538 B1 EP 1366538B1
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EP
European Patent Office
Prior art keywords
waveguide
microstrip line
conductor
cavity
microstrip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP02701844A
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German (de)
English (en)
French (fr)
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EP1366538A1 (en
Inventor
Jan Grabs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saab AB
Original Assignee
Saab AB
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Filing date
Publication date
Application filed by Saab AB filed Critical Saab AB
Publication of EP1366538A1 publication Critical patent/EP1366538A1/en
Application granted granted Critical
Publication of EP1366538B1 publication Critical patent/EP1366538B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions

Definitions

  • the present invention relates to the field of microwave technology and, in particular, a device for transferring microwaves between a mechanical waveguide and a microstrip line, which microstrip line comprises a conductor and an earth plane, which are arranged on each side of a dielectric substrate.
  • This type of transition for transferring microwaves will in this document also be referred to as microstrip transition.
  • Microwaves are used, among other things, in radar technology, in radio links, in satellite communication, in microwave ovens, in mobile telephony and in microwave measurement technology. At the high frequencies of microwaves, special components in the form of mechanical cavity waveguides are used.
  • a technology called microstrip technology is used for manufacturing transmission lines etc. on printed circuit cards and in integrated microwave circuits.
  • the microstrip technology means that conductors are applied to one side of a dielectric substrate, the other side of which consists of an earth plane. Within the field of microwave technology, transitions thus have to be designed for transferring microwaves between mechanical waveguides and printed circuit cards, or circuits, which use the microstrip technology.
  • the power which is obtained in the load i.e. in the microstrip conductor, be essentially as large as the power that is supplied to the waveguide.
  • a known way to form a transition between a mechanical waveguide and a microstrip conductor applied to a printed circuit card by using microstrip technology is to make contact between the top of the waveguide and the microstrip conductor at the end of the waveguide.
  • the contact is made, for example, by means of a metal sheet or a soldering point between the wall of the waveguide and the microstrip conductor.
  • applying this metal sheet or providing this soldering point is a difficult and laborious step and, thus, causes problem in automated manufacturing of the transition.
  • a further disadvantage of these types of transitions is that the microstrip line becomes earthed in terms of direct current.
  • An object of the invention is to provide an improved structure for transferring microwaves between a mechanical waveguide and a microstrip line. Another object is that this structure should be easy to implement and suitable for automated manufacturing.
  • the waveguide has at one end a cavity which extends perpendicular to the longitudinal direction of the waveguide.
  • the microstrip line is arranged plane-parallel to the longitudinal direction of the waveguide and is inserted into the waveguide end having said cavity.
  • the cavity constitutes a microwave resonator and is provided, for example, by a demarcated waveguide section.
  • the cavity can preferably be formed by letting a part of the waveguide, adjacent to its end into which the microstrip line is inserted, deflect perpendicular to the longitudinal direction of the rest of the waveguide.
  • the waveguide Since the waveguide is formed with a cavity at its end, the electromagnetic field in that part of the waveguide which precedes the cavity will interact with the electromagnetic fields in the cavity. Thus, the electromagnetic field will be at its strongest at the location where the microstrip line is inserted into the waveguide. If the waveguide is terminated with a perpendicular bend, interaction between electromagnetic fields will occur correspondingly and the electromagnetic field will be at its strongest immediately before the perpendicular bend, i.e. at the location where the microstrip line is inserted.
  • the construction according to the present invention thus satisfies the need for a microwave transition between a waveguide and a microstrip line, where the microstrip line is positioned in the same plane as the waveguide. It is advantageous to construct a microwave transition in one plane, which, among other things, allows a common cover to be positioned on the waveguide, to form its top, and on the printed circuit card on which the microstrip line is mounted.
  • the bottom and walls of the waveguide as a bottom plate and the top of the waveguide as a cover, the bottom plate and the cover being formed in blocks, for example, by casting or by some other mechanical process, the cover can easily be placed on the bottom plate and on the applied microstrip line as well as on part of, or the whole, associated printed circuit card during an automated manufacturing process. Consequently, an assembly which includes the printed circuit card, the waveguide and the transition therebetween can be manufactured in a considerably easier way.
  • the construction also allows the microstrip line to be plane-parallel to the waveguide at the same time as the waveguide has a cavity in the end which communicates with the microstrip line. The construction thus provides advantages in manufacturing as regards, among other things, complexity and price, at the same time as it provides a high degree of efficiency.
  • the present construction has no direct wiring between the top of the waveguide and the conductor of the microstrip line.
  • the absence of metal sheets, soldering points and the like between the waveguide top and the conductor of the microstrip line further contributes to a simpler automated manufacturing of the construction which includes the microstrip transition.
  • the construction requires only accurate positioning of the microstrip line, but not necessarily of the top of the waveguide, any metal sheet or any soldering point.
  • the construction then avoids possible breaks which otherwise may arise at the contact which is provided by such metal sheets and soldering points.
  • the inner dimensions of the mechanical waveguide are such that the mechanical waveguide is limited to form at its end a narrow section into which the microstrip line is inserted.
  • This section is narrower than 1/2 wavelength in free space in order to prevent the waveguide mode from leaking out of the waveguide.
  • the top of that part of the waveguide which constitutes the wall of the cavity nearest said end of the waveguide into which the microstrip line is inserted has a bevel of the edge facing the cavity. Surprisingly enough, it has been found that this bevel results in the degree of efficiency of the transition of microwaves between the waveguide and the microstrip line being reinforced.
  • the frequency range for which the cavity gives resonance can advantageously be made trimmable after the manufacturing of said cavity.
  • One way is to make at least one of the walls of the cavity movable, whereby displacement of this wall, by e.g. a screw means, affects the resonance frequency of the cavity.
  • displacement of this wall by e.g. a screw means, affects the resonance frequency of the cavity.
  • Those skilled in the art realise that also other shapes of the cavity are possible.
  • the microstrip line which is inserted into the waveguide end has no earth plane in that portion of the microstrip line which is positioned in the cavity, while the line on each side of the cavity comprises an earth plane.
  • the conductor of the microstrip line is connected to the earth plane of the microstrip line near to that end of the line which is inserted into the mechanical waveguide and which is positioned just outside the cavity. The cavity will then reinforce the coupling between the magnetic field of the waveguide and the current loop which is thus formed at the end of the microstrip conductor, the current loop consisting of the conductor, the earth plane and part of the waveguide which defines the cavity.
  • the conductor of the microstrip line is connected to the earth plane over the end of the substrate and, according to another embodiment, via a lead-through in the substrate. Both embodiments make it easy to manufacture a microstrip transition in a plane where the conductor of a printed circuit card is inductively coupled to the magnetic field of the waveguide.
  • the conductor of the microstrip line is unearthed at the mechanical waveguide and, thus, has the function of a capacitively operative aerial. Consequently, the conductor of the microstrip line has no connection with the earth plane of the microstrip line, and the cavity will then reinforce the coupling between the electric field of the waveguide and the microstrip conductor.
  • the present invention implies an easier way to provide the printed circuit card with a cover
  • the invention also results in simplifications as regards the construction of the actual printed circuit card whether or not the microstrip conductor is inductively or capacitively coupled to the electromagnetic field of the microwave guide.
  • the cavity described above allows a high power drain in the microstrip conductor, even though this is plane-parallel to the longitudinal direction of the waveguide. Since it is desirable that the power which is supplied to the microstrip conductor be essentially as large as the power that is supplied to the waveguide, there is, however, a need of attempting to further increase the efficiency, i.e. further increasing the field strength in the waveguide. Usually, the width of the waveguide is double the size of its height. An optimal power drain is not obtained with these dimensions in a plane-parallel microstrip conductor arranged according to the invention.
  • One way of further increasing the field strength is to reduce the height of the waveguide. Since the power in the waveguide is transmitted in the form of electric and magnetic fields, the flow area will then decrease, whereby the field strengths will increase in order to maintain the power level.
  • the perpendicular distance between the inner bottom of the waveguide and the inner top of the waveguide decreases gradually as regards a portion of the waveguide in the direction of, and in connection with, that part of the end of the waveguide which communicates with the microstrip line. In two alternative embodiments this can take place either by discrete steps or continuously. Apart from the fact that the decreasing distance between bottom and top allows a higher power drain in a plane-parallel microstrip conductor, this also leads to adaptation of the impedance of the waveguide to the impedance of the microstrip line by the impedance of the waveguide decreasing in the direction of the microstrip line.
  • the steps are adapted in such a manner that the desirable impedance is obtained as regards the end of the waveguide.
  • the change in size is made over a longer portion of the waveguide than in the case of discrete steps with the purpose of obtaining the desirable impedance.
  • the conductor of the microstrip line cannot only be earthed to the earth plane belonging to the microstrip technology, or unearthed with respect to this earth plane, but also connected to a matching network made by microstrip technology.
  • the conductor can be designed in a shape that is straight, zigzag-shaped for a longer conductor length with maintained plug-in depth, or in some other shape.
  • the transition can be formed by a printed board, in which the conductor of the microstrip line has not been pulled down to the earth plane of the microstrip line, being inserted into the end of a waveguide, which end comprises a cavity, the resonance frequency of which can be adjusted by means of a screw, and one wall of which has a bevelled edge, and where the waveguide for a portion beyond the cavity has an inner size that increases continuously along the waveguide in the direction away from the microstrip line of the printed board.
  • Figs 1a and 1b show a transition, also referred to as microstrip transition, between a mechanical waveguide and a microstrip line.
  • Fig. 1a is a top plan view of the microstrip transition and
  • Fig. 1b is a cross-section through the microstrip transition along the line I-I in Fig. 1a.
  • the plane shown in Fig. 1a will in the following be referred to as the horizontal plane.
  • the conductive walls of the mechanical waveguide 115 are formed from a bottom plate 120 and a cover 110.
  • the part of the cover that is placed over the waveguide part is in the shown embodiment completely plane.
  • the bottom plate forms the bottom and walls of the waveguide while the cover only forms the top of the waveguide.
  • the bottom plate and the cover can be formed in blocks, for example by casting or by some other mechanical working. It should here be pointed out that the cover does not need to be plane with grooves formed in the bottom plate, but the grooves can, wholly or partly, also be formed in the cover which thus is not plane.
  • the cover does not only constitute a top of the waveguide but also a cover of the printed circuit card, on which the microstrip line is positioned.
  • the microstrip line comprises a conductor 140 which is also referred to as a microstrip and is arranged on one side of a dielectric substrate 130, and a conductive earth plane 150, 151 arranged on the other side of the substrate.
  • the microstrip line is via its earth plane attached directly to the bottom plate 120 by means of layers of adhesive 160, 161 which have electrically conductive properties. Alternatively, the direct contact is provided by soldering.
  • the microstrip line is attached in such a manner that the dielectric substrate is plane-parallel to the mechanical waveguide 115, i.e. so that the extension of the microstrip line at least adjacent to the waveguide is horizontal.
  • Fig. 1b there is an intervening space, or an air gap, 145 between the top 110 of the waveguide and the conductor 140 of the microstrip line. Consequently, the conductor 140 has no contact with the cover 110.
  • the conductor will have the function of an aerial which provides a capacitive coupling to the electric field in the waveguide.
  • the walls of the groove have a pair of protruding portions 128 extending perpendicular to the longitudinal direction of the waveguide at the end of the mechanical waveguide into which the microstrip line is inserted.
  • the microstrip line is inserted into the section that is formed between these protruding portions.
  • a portion of the waveguide forms a cavity 124 which communicates with the remaining part of the waveguide.
  • the cavity 124 has been formed in the bottom of the waveguide by a perpendicular bend of the waveguide relative to the overall longitudinal direction of the waveguide.
  • the cavity constitutes a microwave resonator which reinforces the electromagnetic field of the microwaves within a frequency range that is desirable for the application.
  • the bottom of the cavity 124 is positioned at a distance D2 from the conductor 140 of the microstrip line, preferably corresponding to 1/4 of a waveguide wavelength.
  • the bottom of the cavity constitutes a short-circuit plane, a maximum for the electric field of the microwaves arising 1/4 wavelength from the bottom, i.e. at the location of the conductor 140.
  • the reinforcement of the electromagnetic field depends on the Q value of the load and is proportional to ⁇ Q .
  • the Q value of the load indicates the ratio of the reactive power spinning in the cavity, or the microwave resonator, to the power which is taken out.
  • a high Q value gives high fields but at the same time the resonator serves as a bandpass filter having a relative bandwidth which is 1/Q. It is desirable that as low Q value of the resonator as possible be chosen. However, it should be taken into consideration that high Q values also make greater demands on manufacturing tolerances.
  • the resonance frequency should be accurate so that the transferred frequency does not fall outside the desired frequency band.
  • transition of power takes place between the waveguide and the conductor of the microstrip line by a capacitive coupling.
  • the conductor of the microstrip line forms a current loop and transition of power between the waveguide and the conductor of the microstrip line through an inductive coupling.
  • the mechanical waveguide 115 has an inner size which vertically, i.e. perpendicular relative to the horizontal plane, gradually and continuously increases along the waveguide in a direction away from the microstrip line as regards a portion of the waveguide. This is brought about by the groove in the upper side of the bottom plate gradually and continuously becoming deeper in a direction away from the microstrip line, a sloping bottom 126 being formed as regards a portion of the waveguide. This sloping bottom will cause an adaptation of the impedance of the waveguide to the impedance of the microstrip line by the impedance of the waveguide being reduced in the direction of the microstrip line.
  • FIG. 2a is a top plan view of the microstrip transition and Fig. 2b is a cross-section of the microstrip transition along the line II-II in Fig. 2a.
  • the plane shown in Fig. 2a will in the following be referred to as the horizontal plane.
  • the designation of the reference numerals in Figs 2a and 2b has been made by analogy with the designation in Figs 1a and 1b. However, it should be noted that in Figs 1a and 1b, the reference numerals begin with number 1, and in Figs 2a and 2b with number 2. In the description of the second embodiment, only features distinguishing it from the first embodiment are stated.
  • the mechanical waveguide 215 On the other side of the cavity 224, seen from the microstrip line, the mechanical waveguide 215 has an inner size which vertically, i.e. perpendicular relative to the horizontal plane, gradually increases by discrete steps along the waveguide in the direction away from the microstrip line as regards a portion of the waveguide. This is achieved by the groove in the upper side of the bottom gradually and by discrete steps becoming deeper in the direction away from the microstrip line and, thus, forming a step-shaped bottom 226 as regards a portion of the waveguide.
  • This step-shaped bottom implies an adaptation of the impedance of the waveguide to the impedance of the microstrip line.
  • the conductor 240 of the microstrip line is in Figs 2a and 2b connected to the conductive earth plane 251 of the microstrip line via a metallisation 242 which extends from the conductor to the earth plane over the end of the dielectric substrate 230 that is positioned beyond the cavity in the waveguide 215.
  • a metallisation 242 which extends from the conductor to the earth plane over the end of the dielectric substrate 230 that is positioned beyond the cavity in the waveguide 215.
  • an electric loop is formed by the conductor 240, earth planes 250, 251 and the part of the waveguide bottom that defines the cavity. This loop provides an inductive coupling to the magnetic field in the cavity.
  • Fig. 3a shows a microstrip transition between a mechanical waveguide and a microstrip line according to a third embodiment of the invention.
  • Fig. 3a is a top plan view of the microstrip transition and
  • Fig. 3b is a cross-section of the microstrip transition along the line III-III in Fig. 3a.
  • the plane which is shown in Fig. 3a will be referred to below as the horizontal plane.
  • the designation of the reference numerals in Figs 3a and 3b have been made by analogy with the designation in Figs 1a and 1b, and 2a and 2b. However, it should be noted that in Figs 3a and 3b, the reference numerals begin with number 3. In the description of this third embodiment, only features which distinguish it from the first and the second embodiments are indicated.
  • the cavity 324 exhibits a bevel 325 of the edge nearest the waveguide end into which the microstrip line is inserted. Surprisingly enough, it has been found that this bevel results in the degree of efficiency of the transfer of microwaves between the waveguide and the microstrip line being reinforced.
  • the conductor 340 of the microstrip line is here extended to the conductive earth plane 351 of the microstrip line via a lead-through 342 in that part of the dielectric substrate 330 which is located beyond the cavity in the waveguide 315.
  • the transition can, for example, be constructed with a bevel of the edge of the cavity, wherein no extension of the conductor of the microstrip line has been made to its earth plane.
  • This can then be combined with a waveguide which has a sloping bottom or a step-shaped bottom on the other side of the cavity seen from the microstrip line.

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  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
  • Waveguide Aerials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
EP02701844A 2001-03-05 2002-03-04 Microstrip transition Expired - Lifetime EP1366538B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0100725A SE518679C2 (sv) 2001-03-05 2001-03-05 Mikrostripövergång
SE0100725 2001-03-05
PCT/SE2002/000365 WO2002071533A1 (en) 2001-03-05 2002-03-04 Microstrip transition

Publications (2)

Publication Number Publication Date
EP1366538A1 EP1366538A1 (en) 2003-12-03
EP1366538B1 true EP1366538B1 (en) 2007-12-12

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ID=20283202

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EP02701844A Expired - Lifetime EP1366538B1 (en) 2001-03-05 2002-03-04 Microstrip transition

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EP (1) EP1366538B1 (es)
AT (1) ATE381118T1 (es)
DE (1) DE60224012T2 (es)
ES (1) ES2298344T3 (es)
SE (1) SE518679C2 (es)
WO (1) WO2002071533A1 (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3565055B1 (en) * 2018-05-04 2022-02-23 Whirlpool Corporation In line e-probe waveguide transition

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2850793A1 (fr) * 2003-01-31 2004-08-06 Thomson Licensing Sa Transition entre un circuit micro-ruban et un guide d'onde et unite exterieure d'emission reception incorporant la transition
DE10346847B4 (de) * 2003-10-09 2014-04-10 Robert Bosch Gmbh Mikrowellenantenne
KR100626652B1 (ko) * 2004-06-18 2006-09-25 한국전자통신연구원 능동 위상 배열 안테나 시스템의 직선 모드 변환기 및 그제조 방법
US7752911B2 (en) 2005-11-14 2010-07-13 Vega Grieshaber Kg Waveguide transition for a fill level radar
JP2007180655A (ja) * 2005-12-27 2007-07-12 New Japan Radio Co Ltd 帯域阻止フィルタ内蔵伝送モード変換器
JP2008079085A (ja) * 2006-09-22 2008-04-03 Mitsubishi Electric Corp 伝送線路導波管変換器
EP2201679B1 (en) * 2007-09-11 2019-02-20 ViaSat, Inc. Low-loss interface
US8212631B2 (en) 2008-03-13 2012-07-03 Viasat, Inc. Multi-level power amplification system
EP2769437B1 (en) 2011-10-18 2016-03-23 Telefonaktiebolaget LM Ericsson (publ) A microstrip to closed waveguide transition
JP5992881B2 (ja) * 2013-08-28 2016-09-14 日本電信電話株式会社 高周波接続構造
DE102015221142A1 (de) 2014-10-31 2016-05-19 Anritsu Corporation Übertragungsleitungs-Umwandlungsstruktur für ein Millimeterwellenband
US10811373B2 (en) * 2016-10-05 2020-10-20 Gapwaves Ab Packaging structure comprising at least one transition forming a contactless interface
US10530047B2 (en) * 2017-05-24 2020-01-07 Waymo Llc Broadband waveguide launch designs on single layer PCB

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4241635C2 (de) * 1992-12-10 1994-11-10 Ant Nachrichtentech Übergang von einer Microstrip-Leitung auf einen Hohlleiter
DE4441073C1 (de) * 1994-11-18 1996-01-18 Ant Nachrichtentech Übergang von einer Microstrip-Leitung auf einen Hohlleiter
DE19636890C1 (de) * 1996-09-11 1998-02-12 Bosch Gmbh Robert Übergang von einem Hohlleiter auf eine Streifenleitung
US6127901A (en) * 1999-05-27 2000-10-03 Hrl Laboratories, Llc Method and apparatus for coupling a microstrip transmission line to a waveguide transmission line for microwave or millimeter-wave frequency range transmission

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3565055B1 (en) * 2018-05-04 2022-02-23 Whirlpool Corporation In line e-probe waveguide transition

Also Published As

Publication number Publication date
DE60224012D1 (de) 2008-01-24
WO2002071533A1 (en) 2002-09-12
SE518679C2 (sv) 2002-11-05
SE0100725D0 (sv) 2001-03-05
EP1366538A1 (en) 2003-12-03
DE60224012T2 (de) 2008-11-27
ATE381118T1 (de) 2007-12-15
ES2298344T3 (es) 2008-05-16
SE0100725L (sv) 2002-09-06
WO2002071533A8 (en) 2004-06-03

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