EP1347407A3 - Capacitance detection type sensor and manufacturing method thereof - Google Patents
Capacitance detection type sensor and manufacturing method thereof Download PDFInfo
- Publication number
- EP1347407A3 EP1347407A3 EP02024737A EP02024737A EP1347407A3 EP 1347407 A3 EP1347407 A3 EP 1347407A3 EP 02024737 A EP02024737 A EP 02024737A EP 02024737 A EP02024737 A EP 02024737A EP 1347407 A3 EP1347407 A3 EP 1347407A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- esd
- manufacturing
- type sensor
- electrodes
- capacitance detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08006692A EP1944722B1 (en) | 2002-03-20 | 2002-11-06 | Capacitance detection type sensor and manufacturing method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002077937A JP3980387B2 (en) | 2002-03-20 | 2002-03-20 | Capacitance detection type sensor and manufacturing method thereof |
JP2002077937 | 2002-03-20 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08006692A Division EP1944722B1 (en) | 2002-03-20 | 2002-11-06 | Capacitance detection type sensor and manufacturing method thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1347407A2 EP1347407A2 (en) | 2003-09-24 |
EP1347407A3 true EP1347407A3 (en) | 2006-10-18 |
EP1347407B1 EP1347407B1 (en) | 2009-06-10 |
Family
ID=27785295
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08006692A Expired - Fee Related EP1944722B1 (en) | 2002-03-20 | 2002-11-06 | Capacitance detection type sensor and manufacturing method thereof |
EP02024737A Expired - Fee Related EP1347407B1 (en) | 2002-03-20 | 2002-11-06 | Capacitance detection type sensor and manufacturing method thereof |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08006692A Expired - Fee Related EP1944722B1 (en) | 2002-03-20 | 2002-11-06 | Capacitance detection type sensor and manufacturing method thereof |
Country Status (7)
Country | Link |
---|---|
US (2) | US7009410B2 (en) |
EP (2) | EP1944722B1 (en) |
JP (1) | JP3980387B2 (en) |
KR (1) | KR100997380B1 (en) |
CN (1) | CN1217186C (en) |
DE (1) | DE60232576D1 (en) |
TW (1) | TW555959B (en) |
Families Citing this family (43)
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US7356369B2 (en) | 2003-10-02 | 2008-04-08 | Medtronic, Inc. | Z-axis assembly of medical device programmer |
US7263406B2 (en) | 2003-10-02 | 2007-08-28 | Medtronic, Inc. | Medical device programmer with selective disablement of display during telemetry |
KR100633993B1 (en) * | 2004-06-11 | 2006-10-16 | 주식회사 팬택 | ESD induction apparatus for a communication mobile terminal having a fingerprint-recognition function and mobile communication terminal having the same |
JP4611046B2 (en) * | 2005-02-02 | 2011-01-12 | アルプス電気株式会社 | Input means |
US7433167B2 (en) * | 2005-03-08 | 2008-10-07 | Synaptics Incorporated | Strike ring based electrostatic discharge protection |
US20070077720A1 (en) * | 2005-10-04 | 2007-04-05 | Infineon Technologies Ag | Manufacturing method for an integrated semiconductor structure and corresponding integrated semiconductor structure |
JP4965151B2 (en) * | 2006-04-11 | 2012-07-04 | ルネサスエレクトロニクス株式会社 | Solid-state imaging device |
US7545621B2 (en) * | 2006-07-24 | 2009-06-09 | Yt Acquisition Corporation | Electrostatic discharge structure for a biometric sensor |
US8599144B2 (en) * | 2006-07-31 | 2013-12-03 | Cypress Semiconductor Corporation | Grounded button for capacitive sensor |
JP5045028B2 (en) * | 2006-08-16 | 2012-10-10 | 富士通セミコンダクター株式会社 | Surface shape sensor and manufacturing method thereof |
JP5098276B2 (en) * | 2006-09-29 | 2012-12-12 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device |
JP4833031B2 (en) * | 2006-11-06 | 2011-12-07 | 富士通セミコンダクター株式会社 | Surface shape sensor and manufacturing method thereof |
US7649255B2 (en) * | 2006-12-06 | 2010-01-19 | Sun Microsystems, Inc. | Determining chip separation by comparing coupling capacitances |
KR100776167B1 (en) * | 2006-12-20 | 2007-11-12 | 동부일렉트로닉스 주식회사 | Guard ring of semicondutor device |
TWI317812B (en) * | 2006-12-22 | 2009-12-01 | Delta Electronics Inc | Capacitance acceleration sensing structure |
TWI419033B (en) * | 2009-03-05 | 2013-12-11 | Elan Microelectronics Corp | Method for manufacturing two - layer circuit board structure for capacitive touch panel |
US8232810B2 (en) * | 2009-05-12 | 2012-07-31 | Synaptics Incorporated | Extended proximity sensor device with electrostatic discharge protection |
TWI447475B (en) * | 2009-09-07 | 2014-08-01 | Au Optronics Corp | Touch panel |
JP5886489B2 (en) * | 2009-09-21 | 2016-03-16 | 株式会社ワコム | Position detection device |
US8183593B2 (en) * | 2009-10-16 | 2012-05-22 | Oracle America, Inc. | Semiconductor die with integrated electro-static discharge device |
US8570055B2 (en) * | 2009-12-31 | 2013-10-29 | Mapper Lithography Ip B.V. | Capacitive sensing system |
US10194840B2 (en) | 2012-12-06 | 2019-02-05 | Medtronic Minimed, Inc. | Microarray electrodes useful with analyte sensors and methods for making and using them |
KR101376228B1 (en) * | 2013-07-17 | 2014-04-01 | 실리콘 디스플레이 (주) | Fingerprint sensor capable of sensing fingerprint by optical method and capacitive method |
CN104513969B (en) * | 2013-09-27 | 2017-06-06 | 群创光电股份有限公司 | Structure, fingerprint identifier and its manufacture method with quasi cobalt carbon diaphragm |
TWI477400B (en) * | 2013-09-27 | 2015-03-21 | Innolux Corp | Structure with diamond-like carbon, fingerprint identification device and manufacturing method thereof |
CN104680126B (en) | 2014-11-24 | 2018-05-08 | 麦克思智慧资本股份有限公司 | Fingerprint identification device and preparation method thereof |
CN104681486B (en) * | 2015-02-28 | 2017-10-27 | 苏州科阳光电科技有限公司 | The manufacturing process of fingerprint lock core chip |
CN104681522B (en) * | 2015-02-28 | 2017-10-13 | 苏州科阳光电科技有限公司 | Low-power consumption Fingerprint Lock device |
TWI515665B (en) | 2015-03-25 | 2016-01-01 | 速博思股份有限公司 | Finger-swiping biometric recognition apparatus |
CN106203249A (en) * | 2015-05-25 | 2016-12-07 | 义隆电子股份有限公司 | Fingerprint identification device |
TWI553563B (en) * | 2015-05-25 | 2016-10-11 | 義隆電子股份有限公司 | Fingerprint identification device |
US20160371528A1 (en) * | 2015-06-17 | 2016-12-22 | Motorola Mobility Llc | Concealed fingerprint sensor with wake-up and electrostatic discharg |
CN106292865B (en) * | 2015-06-24 | 2019-06-21 | 神盾股份有限公司 | Electronic device |
CN109196648B (en) * | 2016-06-30 | 2022-04-15 | 德州仪器公司 | Contact array optimization for ESD devices |
CN107844732A (en) * | 2016-09-18 | 2018-03-27 | 敦泰电子有限公司 | A kind of fingerprint sensing device, fingerprint sensing module and electronic equipment |
CN108804991B (en) * | 2017-05-07 | 2022-03-18 | 固安翌光科技有限公司 | OLED screen body used as light source of fingerprint identification device and optical fingerprint identification device |
CN107884852A (en) * | 2017-12-15 | 2018-04-06 | 京东方科技集团股份有限公司 | light direction control film and preparation method thereof and fingerprint recognition panel |
CN112996945B (en) * | 2018-07-10 | 2024-04-05 | 耐科思特生物识别集团股份公司 | Heat conduction and protective coating for electronic equipment |
CN112513797A (en) * | 2018-07-17 | 2021-03-16 | 深圳市柔宇科技股份有限公司 | Conductive film, preparation method thereof, touch panel and display device |
DE102019213127A1 (en) * | 2018-08-31 | 2020-03-05 | Mando Corporation | DEVICE FOR A NON-CONTACTIVE SENSOR WITH ESD PROTECTION STRUCTURE |
JP7173662B2 (en) * | 2018-11-16 | 2022-11-16 | ミネベアミツミ株式会社 | detector |
CN111524715B (en) * | 2020-04-29 | 2021-04-06 | 华中科技大学 | Working electrode based on thin film nested structure and electrochemical pressure sensor |
TWI822621B (en) * | 2023-03-30 | 2023-11-11 | 力晶積成電子製造股份有限公司 | Detecting device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6016008A (en) * | 1995-03-30 | 2000-01-18 | Siemens Aktiengesellschaft | Integrated circuit interconnection employing tungsten/aluminum layers |
EP1018697A2 (en) * | 1998-12-30 | 2000-07-12 | STMicroelectronics, Inc. | Apparatus and method for contacting a conductive layer |
US6100126A (en) * | 1996-11-25 | 2000-08-08 | Mosel Vitelic Inc. | Method of making a resistor utilizing a polysilicon plug formed with a high aspect ratio |
WO2001006448A1 (en) * | 1999-07-14 | 2001-01-25 | Veridicom, Inc. | Ultra-rugged i.c. sensor and method of making the same |
EP1073117A2 (en) * | 1999-07-26 | 2001-01-31 | STMicroelectronics, Inc. | Scratch protection for direct contact sensors |
JP2001120519A (en) * | 1999-10-22 | 2001-05-08 | Sony Corp | Semiconductor device for recognizing fingerprint and method for manufacturing the semiconductor device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5328553A (en) * | 1993-02-02 | 1994-07-12 | Motorola Inc. | Method for fabricating a semiconductor device having a planar surface |
US6114862A (en) * | 1996-02-14 | 2000-09-05 | Stmicroelectronics, Inc. | Capacitive distance sensor |
US6483931B2 (en) * | 1997-09-11 | 2002-11-19 | Stmicroelectronics, Inc. | Electrostatic discharge protection of a capacitve type fingerprint sensing array |
US6091082A (en) * | 1998-02-17 | 2000-07-18 | Stmicroelectronics, Inc. | Electrostatic discharge protection for integrated circuit sensor passivation |
JPH11251596A (en) | 1998-02-27 | 1999-09-17 | Matsushita Electric Ind Co Ltd | Thin-film transistor and liquid crystal display device |
US6326227B1 (en) * | 1998-12-30 | 2001-12-04 | Stmicroelectronics, Inc. | Topographical electrostatic protection grid for sensors |
EP1059602B1 (en) * | 1999-06-10 | 2006-12-13 | Nippon Telegraph and Telephone Corporation | Surface shape recognition apparatus |
DE19935910A1 (en) * | 1999-07-30 | 2001-02-08 | Siemens Ag | Passivation layer structure |
JP2001067460A (en) | 1999-08-26 | 2001-03-16 | Sony Corp | Fingerprint reader and fingerprint collation device |
JP4522529B2 (en) | 2000-03-29 | 2010-08-11 | 株式会社半導体エネルギー研究所 | Semiconductor device and manufacturing method thereof |
US6515488B1 (en) * | 2001-05-07 | 2003-02-04 | Stmicroelectronics, Inc. | Fingerprint detector with scratch resistant surface and embedded ESD protection grid |
JP3887252B2 (en) * | 2002-03-15 | 2007-02-28 | 日本電信電話株式会社 | Manufacturing method of surface shape recognition sensor |
US20040070407A1 (en) * | 2002-10-11 | 2004-04-15 | Ming Fang | Fingerprint detector with improved sensing surface layer |
JP4724488B2 (en) * | 2005-02-25 | 2011-07-13 | 日立オートモティブシステムズ株式会社 | Integrated microelectromechanical system |
-
2002
- 2002-03-20 JP JP2002077937A patent/JP3980387B2/en not_active Expired - Fee Related
- 2002-10-24 TW TW091124737A patent/TW555959B/en not_active IP Right Cessation
- 2002-10-24 US US10/279,008 patent/US7009410B2/en not_active Expired - Lifetime
- 2002-11-06 EP EP08006692A patent/EP1944722B1/en not_active Expired - Fee Related
- 2002-11-06 EP EP02024737A patent/EP1347407B1/en not_active Expired - Fee Related
- 2002-11-06 DE DE60232576T patent/DE60232576D1/en not_active Expired - Lifetime
- 2002-11-25 CN CN02152825XA patent/CN1217186C/en not_active Expired - Fee Related
- 2002-11-26 KR KR1020020073847A patent/KR100997380B1/en active IP Right Grant
-
2005
- 2005-12-16 US US11/304,795 patent/US7364931B2/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6016008A (en) * | 1995-03-30 | 2000-01-18 | Siemens Aktiengesellschaft | Integrated circuit interconnection employing tungsten/aluminum layers |
US6100126A (en) * | 1996-11-25 | 2000-08-08 | Mosel Vitelic Inc. | Method of making a resistor utilizing a polysilicon plug formed with a high aspect ratio |
EP1018697A2 (en) * | 1998-12-30 | 2000-07-12 | STMicroelectronics, Inc. | Apparatus and method for contacting a conductive layer |
WO2001006448A1 (en) * | 1999-07-14 | 2001-01-25 | Veridicom, Inc. | Ultra-rugged i.c. sensor and method of making the same |
EP1073117A2 (en) * | 1999-07-26 | 2001-01-31 | STMicroelectronics, Inc. | Scratch protection for direct contact sensors |
JP2001120519A (en) * | 1999-10-22 | 2001-05-08 | Sony Corp | Semiconductor device for recognizing fingerprint and method for manufacturing the semiconductor device |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 22 9 March 2001 (2001-03-09) * |
Also Published As
Publication number | Publication date |
---|---|
EP1347407A2 (en) | 2003-09-24 |
US7364931B2 (en) | 2008-04-29 |
US7009410B2 (en) | 2006-03-07 |
JP2003269906A (en) | 2003-09-25 |
US20060099726A1 (en) | 2006-05-11 |
KR20030076184A (en) | 2003-09-26 |
JP3980387B2 (en) | 2007-09-26 |
EP1944722A3 (en) | 2008-12-31 |
CN1217186C (en) | 2005-08-31 |
EP1347407B1 (en) | 2009-06-10 |
EP1944722B1 (en) | 2011-10-26 |
TW555959B (en) | 2003-10-01 |
CN1445537A (en) | 2003-10-01 |
DE60232576D1 (en) | 2009-07-23 |
US20030179001A1 (en) | 2003-09-25 |
KR100997380B1 (en) | 2010-11-30 |
EP1944722A2 (en) | 2008-07-16 |
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