EP1305639A4 - Accelerometer with re-entrant grooves - Google Patents

Accelerometer with re-entrant grooves

Info

Publication number
EP1305639A4
EP1305639A4 EP01939582A EP01939582A EP1305639A4 EP 1305639 A4 EP1305639 A4 EP 1305639A4 EP 01939582 A EP01939582 A EP 01939582A EP 01939582 A EP01939582 A EP 01939582A EP 1305639 A4 EP1305639 A4 EP 1305639A4
Authority
EP
European Patent Office
Prior art keywords
accelerometer
entrant grooves
entrant
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01939582A
Other languages
German (de)
French (fr)
Other versions
EP1305639A1 (en
Inventor
Robert P Ried
Arjun Selvakumar
Howard D Goldberg
Martin A Schmidt
Lianzhong Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ion Geophysical Corp
Original Assignee
Ion Geophysical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ion Geophysical Corp filed Critical Ion Geophysical Corp
Publication of EP1305639A1 publication Critical patent/EP1305639A1/en
Publication of EP1305639A4 publication Critical patent/EP1305639A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/16—Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
    • G01V1/18—Receiving elements, e.g. seismometer, geophone or torque detectors, for localised single point measurements
    • G01V1/181—Geophones
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
EP01939582A 2000-05-30 2001-05-29 Accelerometer with re-entrant grooves Withdrawn EP1305639A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20793400P 2000-05-30 2000-05-30
US207934P 2000-05-30
PCT/US2001/017254 WO2001092895A1 (en) 2000-05-30 2001-05-29 Accelerometer with re-entrant grooves

Publications (2)

Publication Number Publication Date
EP1305639A1 EP1305639A1 (en) 2003-05-02
EP1305639A4 true EP1305639A4 (en) 2004-03-24

Family

ID=22772562

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01939582A Withdrawn EP1305639A4 (en) 2000-05-30 2001-05-29 Accelerometer with re-entrant grooves

Country Status (5)

Country Link
EP (1) EP1305639A4 (en)
AU (1) AU2001265084A1 (en)
CA (1) CA2410909A1 (en)
NO (1) NO20025744L (en)
WO (1) WO2001092895A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10117257A1 (en) * 2001-04-06 2002-10-17 Eads Deutschland Gmbh Micromechanical capacitive acceleration sensor
US7969262B2 (en) * 2004-10-27 2011-06-28 Epcos Ag Reduction of air damping in MEMS device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4993143A (en) * 1989-03-06 1991-02-19 Delco Electronics Corporation Method of making a semiconductive structure useful as a pressure sensor
US5228341A (en) * 1989-10-18 1993-07-20 Hitachi, Ltd. Capacitive acceleration detector having reduced mass portion
US5350189A (en) * 1991-07-24 1994-09-27 Hitachi, Ltd. Capacitance type accelerometer for air bag system
US5616514A (en) * 1993-06-03 1997-04-01 Robert Bosch Gmbh Method of fabricating a micromechanical sensor
EP0863392A1 (en) * 1997-03-04 1998-09-09 STMicroelectronics S.r.l. A method of manufacturing pressure microsensors
US6041653A (en) * 1997-09-18 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Acceleration sensor and a method of producing same
EP1043770A1 (en) * 1999-04-09 2000-10-11 STMicroelectronics S.r.l. Formation of buried cavities in a monocrystalline semiconductor wafer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0454190A3 (en) * 1986-09-22 1992-01-08 Nippondenso Co., Ltd. Semiconductor accelerometer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4993143A (en) * 1989-03-06 1991-02-19 Delco Electronics Corporation Method of making a semiconductive structure useful as a pressure sensor
US5228341A (en) * 1989-10-18 1993-07-20 Hitachi, Ltd. Capacitive acceleration detector having reduced mass portion
US5350189A (en) * 1991-07-24 1994-09-27 Hitachi, Ltd. Capacitance type accelerometer for air bag system
US5616514A (en) * 1993-06-03 1997-04-01 Robert Bosch Gmbh Method of fabricating a micromechanical sensor
EP0863392A1 (en) * 1997-03-04 1998-09-09 STMicroelectronics S.r.l. A method of manufacturing pressure microsensors
US6041653A (en) * 1997-09-18 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Acceleration sensor and a method of producing same
EP1043770A1 (en) * 1999-04-09 2000-10-11 STMicroelectronics S.r.l. Formation of buried cavities in a monocrystalline semiconductor wafer

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
KLAASSEN E H ET AL: "SILICON FUSION BONDING AND DEEP REACTIVE ION ETCHING: A NEW TECHNOLOGY FOR MICROSTRUCTURES", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 52, no. 1/3, 1 March 1996 (1996-03-01), pages 132 - 139, XP000483098, ISSN: 0924-4247 *
See also references of WO0192895A1 *
YUN C H ET AL: "SOI on buried cavity patterns using ion-cut layer transfer", SOI CONFERENCE, 1998. PROCEEDINGS., 1998 IEEE INTERNATIONAL STUART, FL, USA 5-8 OCT. 1998, NEW YORK, NY, USA,IEEE, US, 5 October 1998 (1998-10-05), pages 165 - 166, XP010309922, ISBN: 0-7803-4500-2 *

Also Published As

Publication number Publication date
WO2001092895A1 (en) 2001-12-06
NO20025744L (en) 2003-01-28
AU2001265084A1 (en) 2001-12-11
CA2410909A1 (en) 2001-12-06
EP1305639A1 (en) 2003-05-02
NO20025744D0 (en) 2002-11-29

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20021223

AK Designated contracting states

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

RIN1 Information on inventor provided before grant (corrected)

Inventor name: YU, LIANZHONG

Inventor name: SCHMIDT, MARTIN A.

Inventor name: GOLDBERG, HOWARD D.

Inventor name: SELVAKUMAR, ARJUN

Inventor name: RIED, ROBERT P.

RIC1 Information provided on ipc code assigned before grant

Ipc: 7G 01P 1/00 B

Ipc: 7G 01P 15/08 B

Ipc: 7G 01P 15/00 A

A4 Supplementary search report drawn up and despatched

Effective date: 20040210

RBV Designated contracting states (corrected)

Designated state(s): AT BE CH CY DE DK FR GB LI NL

17Q First examination report despatched

Effective date: 20050419

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20051101