EP1283528A2 - Low impedance electrical resistor and method of making it - Google Patents

Low impedance electrical resistor and method of making it Download PDF

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Publication number
EP1283528A2
EP1283528A2 EP02015940A EP02015940A EP1283528A2 EP 1283528 A2 EP1283528 A2 EP 1283528A2 EP 02015940 A EP02015940 A EP 02015940A EP 02015940 A EP02015940 A EP 02015940A EP 1283528 A2 EP1283528 A2 EP 1283528A2
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EP
European Patent Office
Prior art keywords
resistance
resistors
strips
layer
metal
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02015940A
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German (de)
French (fr)
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EP1283528B1 (en
EP1283528A3 (en
Inventor
Ullrich Dr. Hetzler
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IsabellenHuette Heusler GmbH and Co KG
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IsabellenHuette Heusler GmbH and Co KG
Isabellen Huette GmbH
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Priority claimed from DE2001139323 external-priority patent/DE10139323C1/en
Priority claimed from DE2001153273 external-priority patent/DE10153273A1/en
Application filed by IsabellenHuette Heusler GmbH and Co KG, Isabellen Huette GmbH filed Critical IsabellenHuette Heusler GmbH and Co KG
Publication of EP1283528A2 publication Critical patent/EP1283528A2/en
Publication of EP1283528A3 publication Critical patent/EP1283528A3/en
Application granted granted Critical
Publication of EP1283528B1 publication Critical patent/EP1283528B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/003—Apparatus or processes specially adapted for manufacturing resistors using lithography, e.g. photolithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Definitions

  • the invention relates to a low-resistance electrical resistor and a method for its production according to the preamble of the independent claims. In particular acts low-resistance precision resistors for current measurement purposes in SMD or chip design.
  • the separation of the resistors can be done with a laser cutting machine or preferably by breaking the adhesive film after double-sided Etching through the metal layers along the intended Separation lines are made.
  • This known method is relative consuming. Above all, however, it is hardly possible thanks to this necessary etching resistors with precisely defined resistance values to create. It is particularly difficult to apply the alloy foil galvanized connection contacts by etching structure without the underlying alloy metal attack, with the precision also by the for the etching Typical undefined shape of the end faces of the connection contacts is affected, which is not exactly perpendicular to Surface, but more or less concave down to the alloy surface run.
  • connection contacts are used to manufacture SMD measuring resistors a bonded to a substrate, structured in the usual way Resistance foil if necessary after galvanic pre-tinning the connection areas as a paste using the screen printing process applied to the film and then melted into compact "beads". The desired precise resistance value can also be found here can only be achieved by subsequent adjustment.
  • These resistors are separated by stamping, as is also the case with comparable other known components is common.
  • the invention has for its object a method for Specify the manufacture of precision resistors of the type under consideration, that is easier than comparable known methods and in particular the formation of the connection contacts without etching allows.
  • precision resistances can be done with a few simple operations be made in the milliohm range that with resistance tolerances of max. ⁇ 5% no subsequent Require adjustment.
  • connection contacts nor the Alloy areas have to be etched, with the disadvantages the etching structuring, namely the Formation of leaking, non-vertical etching flanks leading to large fluctuations in the resistance value and poor reproducibility to lead.
  • the second requirement for the production according to the invention is more precise Resistance is the creation of a defined width. This is preferably done by sawing the galvanized resistance layer reached.
  • Sawing results in much higher accuracy and reproducibility of the resistances than with other separation methods such as etching, stamping and z. B. also in itself possible use of lasers. In addition, by sawing is the number that can be produced for a given usable area Resistances are maximized.
  • the process is suitable for for the production of extremely low-resistance Resistors in the range of about 0.5, for example Large quantities of m ⁇ to 5 m ⁇ , but resistors can also be used with even lower or higher resistance values be, e.g. B. 0.01-50 m ⁇ . With a modified design with particularly thin resistance foils, the resistance value can also be easily raised, e.g. up to 100 m ⁇ .
  • the resistors are also flexible and can be almost any size depending on the desired load capacity or be made small. Since the manufactured according to the invention Resistance consists essentially only of metal and the organic used in the known methods mentioned Adhesive layer either completely eliminated or, if available, does not have to dissipate heat, it has the advantage of high temperature resistance and high resilience. In the for this resistance typical applications, it is sufficient to use the heat loss derived via the connection contacts, for example in a Circuit board, on the surface of which the resistors according the SMD technology.
  • a bare is in the first step rectangular sheet 1 made of a metallic resistance alloy covered with a photoresist layer 2, which in the Photolithography usual way through a photomask (not shown) can be exposed.
  • the sheet 1 can be practical Cases a usable area of z. B. have about 300 x 400 mm and be between 0.1 and 1 mm thick. It preferably exists made of one of the proven Cu-based resistance alloys such as z. B. CuMnl2Ni or the like.
  • Mask serving structure consists of a multitude of themselves over the entire width or length of the upper one in the drawing Surface of the sheet 1 or at least the surface to be used extending parallel strip 2 ', as a rule the same width and same, over the entire length of the strip have constant mutual distances.
  • the photoresist layer 2 Before, after or simultaneously with the photolithographic Structuring the photoresist layer 2 is the bottom of the Sheet 1 covered with a protective film 3, which in the subsequent Galvanizing is a metallization of the sheet metal underside prevented.
  • the photoresist strips are in the process stage according to FIG. 1D) 2 'removed and replaced by protective lacquer.
  • the protective lacquer strips 5 can, for example, by hand Spatulas or squeegees can be applied. You prevent one Metallization of the areas between the copper strips 4 of the sheet 1 in a subsequent galvanic reinforcement the copper strip and later protect as well like the protective film 3, the surface of the alloy area of the finished resistance.
  • further copper can be galvanically applied to the copper strip 4 Copper to strengthen the contacts and / or an additional one Metal to be deposited.
  • tin 6 the copper surface is protected from tarnishing and that later soldering the resistor onto a circuit board or The like. Relieved. Form the strips 4 with the tin layer 6 the connection contacts of the individual resistors to be generated.
  • connection contacts provided sheet 1 longitudinally perpendicular to the Sheet surface and groups running perpendicular to each other separated from cutting planes.
  • the cutting planes of one of these both groups run parallel to the copper strips 4 and thus to one of the edges of the sheet 1 through the entire sheet and are each in the middle of one of the copper strips 4, the thereby being cut into two equal strips, along the arrows 7 in Fig. 1E) and in Fig. F).
  • Fig. F as the last or penultimate stage of the process the isolated resistance or one along the second group of cutting planes shown strips to be divided.
  • the cutting planes of the second group also run parallel to the other sheet edge through the entire sheet along the side edges of the individual resistors.
  • the single resistance created after the last process step is shown schematically (not to scale) in Fig. 2.
  • the finished resistor consists of the rectangular one Alloy sheet metal piece 1 ', at the opposite ends of which rectangular connection contacts 4 'and 4' 'with the tin layers 6 ', 6' 'are electroplated.
  • the by galvanic cutting of copper possibly in several layers are preferably relatively thick, i.a. for good Input and output of the current in or out of the alloy guarantee.
  • the thickness of the copper can be approximate 50-100 ⁇ m.
  • the resistance has the opposite Ends of flat end faces 9 of the connection contacts and the sheet metal piece 1 'itself, which is exactly perpendicular to the Align the sheet level with each other. The same applies to the two lateral end faces 8 of the contacts and the sheet metal piece 1'.
  • The is between the connection contacts Protective lacquer layer 5 ', while the surface facing away from the contacts of the resistance is still covered by the protective film 3 ' can be.
  • the modified resistor shown in Fig. 3 differs from the design according to FIG. 2 only in that instead of the relatively thick sheet metal piece covered with the protective film 3 ' 1 'a much thinner resistance film 11 has been used is that on a double-sided adhesive serving as a protective film Adhesive film 13 has been attached.
  • the resistance foil 11 whose thickness is less than 100 ⁇ m e.g. down to 20 ⁇ m is for the purpose of manageability, i.e. for mechanical Stabilization using the protective and adhesive film 13 been fixed on a substrate 18, for example can be a 0.5 mm thick aluminum sheet.
  • connection contacts 14 with the tin layers 16 and Protective lacquer layer 15 correspond to the embodiment according to FIG. 2, and also the manufacture of the modified resistor takes place essentially according to that described with reference to FIG. 1 Method with the proviso that instead of in the step of FIG. 1A of the relatively thick sheet 1 from the thin resistance film 11, the double-sided adhesive film 13 and the substrate 18 existing laminate is used, the adhesive film 13 and the substrate 18 can replace the protective film 3.
  • the values of the resistors produced in this way can typically in the order of 50 or 100 m ⁇ .

Abstract

Low impedance electrical resistor comprises a flat rectangular metal element (1') made of a resistor alloy, and connecting contacts (4', 4'') galvanized on opposite ends of the main surface of the metal element. The end faces of the metal element and the connecting contacts on these ends and the side surface (8) of the metal element perpendicular to the end faces and the connecting contacts are aligned with each other perpendicular to the plane of the main surface of the metal element. An Independent claim is also included for a process for producing the above low impedance electrical resistor using photolithographic production of a covering mask formed by parallel strips, galvanization of a layer only on the surface supporting the covering mask, and separation of the galvanized layer. Preferred Features: The metal element is a foil fixed on a substrate with its side facing away from the connecting contacts.

Description

Die Erfindung betrifft einen niederohmigen elektrischen Widerstand und ein Verfahren zu seiner Herstellung gemäß dem Oberbegriff der unabhängigen Patentansprüche. Insbesondere handelt es sich um niederohmige Präzisionswiderstände für Strommesszwecke in SMD- oder Chipbauweise.The invention relates to a low-resistance electrical resistor and a method for its production according to the preamble of the independent claims. In particular acts low-resistance precision resistors for current measurement purposes in SMD or chip design.

Bei einem aus der EP 0841668 A1 bekannten Verfahren zum Herstellen von SMD-Messwiderständen mit Widerstandswerten im Milliohmbereich wird zunächst ein Laminat aus einem als Substrat dienenden Kupferblech, einer Folie aus einer Widerstandslegierung auf Cu-Basis und einer zwischen ihnen befindlichen wärmeleitenden Klebefolie gebildet. Auf der freien Oberseite der Legierungsfolie werden dann Anschlusskontaktbereiche für die einzelnen Widerstände photolithographisch definiert, galvanisch verkupfert und mit Nickel überzogen. Nach der galvanischen Metallisierung wird die eigentliche Struktur der Widerstände und ihrer Anschlusskontakte durch Ätzen erzeugt. Die Widerstandsstruktur kann die übliche Vierpol- und/oder Mäanderform haben. Das Vereinzeln der Widerstände kann mit einer Laserschneidanlage oder vorzugsweise durch Zerbrechen der Klebefolie nach beidseitigem Durchätzen der Metallschichten längs der vorgesehenen Trennlinien erfolgen. Dieses bekannte Verfahren ist relativ aufwendig. Vor allem aber ist es kaum möglich, durch das bisher notwendige Ätzen Widerstände mit genau definierten Widerstandswerten zu erzeugen. Besonders schwierig ist es, auf die Legierungsfolie aufgalvanisierte Anschlusskontakte durch Ätzen zu strukturieren, ohne das darunter befindliche Legierungsmetall anzugreifen, wobei die Präzision außerdem durch die für das Ätzen typische undefinierte Form der Stirnflächen der Anschlusskontakte beeinträchtigt wird, die nicht genau senkrecht zur Oberfläche, sondern mehr oder weniger konkav bis in die Legierungsoberfläche verlaufen.In a method for manufacturing known from EP 0841668 A1 of SMD measuring resistors with resistance values in the milliohm range is first a laminate from a as a substrate serving copper sheet, a foil made of a resistance alloy based on Cu and a thermally conductive between them Adhesive film formed. On the free top of the alloy foil then become contact areas for the individual Resistors defined photolithographically, galvanically copper-plated and coated with nickel. After the galvanic metallization will the actual structure of the resistors and their connection contacts generated by etching. The resistance structure can have the usual four-pole and / or meandering shape. The separation of the resistors can be done with a laser cutting machine or preferably by breaking the adhesive film after double-sided Etching through the metal layers along the intended Separation lines are made. This known method is relative consuming. Above all, however, it is hardly possible thanks to this necessary etching resistors with precisely defined resistance values to create. It is particularly difficult to apply the alloy foil galvanized connection contacts by etching structure without the underlying alloy metal attack, with the precision also by the for the etching Typical undefined shape of the end faces of the connection contacts is affected, which is not exactly perpendicular to Surface, but more or less concave down to the alloy surface run.

Bei einem anderen, aus der EP 0484756 B1 bekannten Verfahren zum Herstellen von SMD-Messwiderständen werden Anschlusskontakte einer auf ein Substrat geklebten, in üblicher Weise strukturierten Widerstandsfolie ggf. nach einer galvanischen Vorverzinnung der Anschlussbereiche als Paste im Siebdruckverfahren auf die Folie aufgebracht und dann in kompakte "Perlen" umgeschmolzen. Auch hier kann der gewünschte präzise Widerstandswert nur durch anschließendes Abgleichen erreicht werden. Das Vereinzeln dieser Widerstände erfolgt in der Praxis durch Stanzen, wie es auch bei vergleichbaren weiteren bekannten Bauelementen üblich ist.In another method known from EP 0484756 B1 Connection contacts are used to manufacture SMD measuring resistors a bonded to a substrate, structured in the usual way Resistance foil if necessary after galvanic pre-tinning the connection areas as a paste using the screen printing process applied to the film and then melted into compact "beads". The desired precise resistance value can also be found here can only be achieved by subsequent adjustment. The In practice, these resistors are separated by stamping, as is also the case with comparable other known components is common.

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zum Herstellen von Präzisionswiderständen der betrachteten Art anzugeben, das einfacher ist als vergleichbare bekannte Verfahren und insbesondere die Bildung der Anschlusskontakte ohne Ätzen ermöglicht.The invention has for its object a method for Specify the manufacture of precision resistors of the type under consideration, that is easier than comparable known methods and in particular the formation of the connection contacts without etching allows.

Diese Aufgabe wird durch das in den Patentansprüchen angegebene Verfahren gelöst.This object is achieved by what is stated in the claims Procedure solved.

Erfindungsgemäß können mit wenigen einfachen Arbeitsgängen Präzisionswiderstände im Milliohm-Bereich hergestellt werden, die mit Widerstandstoleranzen von maximal ± 5% keinen nachträglichen Abgleich erfordern. Weder die Anschlusskontakte noch die Legierungsbereiche müssen geätzt werden, womit die Nachteile der ätztechnischen Strukturierung vermieden werden, nämlich die Ausbildung auslaufender, nicht senkrechter Ätzflanken, die zu großen Schwankungen des Widerstandswertes und schlechter Reproduzierbarkeit führen. According to the invention, precision resistances can be done with a few simple operations be made in the milliohm range that with resistance tolerances of max. ± 5% no subsequent Require adjustment. Neither the connection contacts nor the Alloy areas have to be etched, with the disadvantages the etching structuring, namely the Formation of leaking, non-vertical etching flanks leading to large fluctuations in the resistance value and poor reproducibility to lead.

Vorteilhaft wirkt sich aus, dass erfindungsgemäß nach fotolithografischer Definition der Abscheidungsflächen die vergleichsweise dicken Kupfer-Kontaktschichten sehr genau galvanisch abgeschieden werden können, wobei insbesondere die zu der Hauptfläche des Bleches bzw. einer die Wiederstandslage bildenden Folie senkrechte Ausbildung und die Position der dem aktiven Widerstandsbereich zugewandten Flanken wichtig sind.The fact that according to the invention is more photolithographic has an advantageous effect Definition of the deposition areas the comparative thick copper contact layers very precisely galvanically can be deposited, in particular the to Main surface of the sheet or one of the resistance layers Slide vertical training and the position of the active Flanks facing resistance are important.

Die zweite Voraussetzung zur erfindungsgemäßen Herstellung genauer Widerstände ist die Erzeugung einer definierten Breite. Vorzugsweise wird dies durch Zersägen der galvanisierten Widerstandslage erreicht.The second requirement for the production according to the invention is more precise Resistance is the creation of a defined width. This is preferably done by sawing the galvanized resistance layer reached.

Durch das Sägen ergibt sich eine wesentlich höhere Genauigkeit und Reproduzierbarkeit der Widerstände als bei anderen Trennverfahren wie Ätzen, Stanzen und z. B. auch bei der an sich ebenfalls möglichen Verwendung von Lasern. Außerdem kann durch das Sägen die Anzahl der bei einer gegebenen Nutzfläche herstellbaren Widerstände maximiert werden.Sawing results in much higher accuracy and reproducibility of the resistances than with other separation methods such as etching, stamping and z. B. also in itself possible use of lasers. In addition, by sawing is the number that can be produced for a given usable area Resistances are maximized.

Das Verfahren eignet sich u.a. für die Herstellung extrem niederohmiger Widerstände beispielsweise im Bereich von etwa 0,5 mΩ bis 5 mΩ in großen Stückzahlen, doch können auch Widerstände mit noch niedrigeren oder mit höheren Widerstandswerten hergestellt werden, z. B. 0,01-50 mΩ. Bei einer modifizierten Bauform mit besonders dünnen Widerstandsfolien kann der Widerstandswert auch problemlos noch weiter angehoben werden, z.B. bis auf 100 mΩ. Die Widerstände sind darüber hinaus flexibel und können je nach gewünschter Belastbarkeit fast beliebig groß oder klein hergestellt werden. Da der erfindungsgemäß hergestellte Widerstand im Wesentlichen nur aus Metall besteht und die bei den erwähnten bekannten Verfahren verwendete organische Kleberschicht entweder ganz entfällt oder, soweit vorhanden, keine Wärme ableiten muss, hat er den Vorteil hoher Temperaturbeständigkeit und hoher Belastbarkeit. In den für diesen Widerstand typischen Anwendungsfällen genügt es, die Verlustwärme über die Anschlusskontakte abzuleiten, beispielsweise in eine Schaltungsplatte, auf deren Oberfläche die Widerstände gemäß der SMD-Technik montiert werden.The process is suitable for for the production of extremely low-resistance Resistors in the range of about 0.5, for example Large quantities of mΩ to 5 mΩ, but resistors can also be used with even lower or higher resistance values be, e.g. B. 0.01-50 mΩ. With a modified design with particularly thin resistance foils, the resistance value can also be easily raised, e.g. up to 100 mΩ. The resistors are also flexible and can be almost any size depending on the desired load capacity or be made small. Since the manufactured according to the invention Resistance consists essentially only of metal and the organic used in the known methods mentioned Adhesive layer either completely eliminated or, if available, does not have to dissipate heat, it has the advantage of high temperature resistance and high resilience. In the for this resistance typical applications, it is sufficient to use the heat loss derived via the connection contacts, for example in a Circuit board, on the surface of which the resistors according the SMD technology.

An den in der Zeichnung dargestellten Ausführungsbeispielen wird die Erfindung näher erläutert. Es zeigen

Fig. 1
die verschiedenen Schritte oder Stufen des Verfahrens;
Fig. 2
eine schematische schrägbildliche Darstellung eines erfindungsgemäß hergestellten Widerstands, und
Fig. 3
eine modifizierte Bauform des Widerstands.
The invention is explained in more detail using the exemplary embodiments illustrated in the drawing. Show it
Fig. 1
the different steps or stages of the procedure;
Fig. 2
is a schematic oblique representation of a resistor manufactured according to the invention, and
Fig. 3
a modified design of the resistor.

Gemäß Fig. 1A) wird im ersten Verfahrensschritt ein blankes rechteckiges Blech 1 aus einer metallischen Widerstandslegierung mit eine Photoresistschicht 2 bedeckt, die in der bei der Photolithographie üblichen Weise durch eine Photomaske (nicht dargestellt) belichtet werden kann. Das Blech 1 kann in praktischen Fällen eine Nutzfläche von z. B. etwa 300 x 400 mm haben und zwischen 0,1 und 1 mm dick sein. Es besteht vorzugsweise aus einer der bewährten Widerstandslegierungen auf Cu-Basis wie z. B. CuMnl2Ni od. dgl.According to FIG. 1A), a bare is in the first step rectangular sheet 1 made of a metallic resistance alloy covered with a photoresist layer 2, which in the Photolithography usual way through a photomask (not shown) can be exposed. The sheet 1 can be practical Cases a usable area of z. B. have about 300 x 400 mm and be between 0.1 and 1 mm thick. It preferably exists made of one of the proven Cu-based resistance alloys such as z. B. CuMnl2Ni or the like.

Im nächsten Schritt gemäß Fig. 1B) wird in ebenfalls an sich bekannter Weise durch partielles Entfernen die photolithographische Struktur der Photoresistschicht 2 gebildet. Diese als Abdeckmaske dienende Struktur besteht aus einer Vielzahl sich über die gesamte Breite oder Länge der in der Zeichnung oberen Oberfläche des Bleches 1 oder wenigstens der zu nutzenden Oberfläche erstreckender paralleler Streifen 2', die in der Regel die gleiche Breite und gleiche, über die gesamte Streifenlänge gleichbleibende gegenseitige Abstände haben. In the next step according to FIG. 1B) is also in itself known way by partially removing the photolithographic Structure of the photoresist layer 2 is formed. This as Mask serving structure consists of a multitude of themselves over the entire width or length of the upper one in the drawing Surface of the sheet 1 or at least the surface to be used extending parallel strip 2 ', as a rule the same width and same, over the entire length of the strip have constant mutual distances.

Vor, nach oder gleichzeitig mit der photolithographischen Strukturierung der Photoresistschicht 2 wird die Unterseite des Bleches 1 mit einer Schutzfolie 3 bedeckt, die bei der anschließenden Galvanisierung eine Metallisierung der Blechunterseite verhindert.Before, after or simultaneously with the photolithographic Structuring the photoresist layer 2 is the bottom of the Sheet 1 covered with a protective film 3, which in the subsequent Galvanizing is a metallization of the sheet metal underside prevented.

Fig. 1C) zeigt die Verfahrensstufe nach der galvanischen Abscheidung von Kupfer auf den zwischen den Streifen 2' der Abdeckmaske frei gelassenen Blechstreifen. Die abgeschiedenen Kupferstreifen 4 erstrecken sich folglich ebenfalls mit untereinander gleicher Breite und gleichen, über die gesamte Streifenlänge gleichbleibenden gegenseitigen Abständen über die gesamte Breite oder Länge der Nutzenoberfläche des Bleches 1.1C) shows the process stage after the galvanic deposition of copper on the between the strips 2 'of the mask blank sheet metal strip. The secluded Copper strips 4 consequently also extend with one another same width and same, over the entire length of the strip constant mutual distances across the entire Width or length of the panel surface 1.

In der Verfahrensstufe gemäß Fig. 1D) sind die Photoresiststreifen 2' entfernt und durch Schutzlack ersetzt worden. Die Schutzlackstreifen 5 können beispielsweise von Hand durch Spachteln oder Rakeln aufgebracht werden. Sie verhindern eine Metallisierung der zwischen den Kupferstreifen 4 liegenden Bereiche des Bleches 1 bei einer nachfolgenden galvanischen Verstärkung der Kupferstreifen und schützen im übrigen später ebenso wie die Schutzfolie 3 die Oberfläche des Legierungsbereiches des fertigen Widerstands.The photoresist strips are in the process stage according to FIG. 1D) 2 'removed and replaced by protective lacquer. The protective lacquer strips 5 can, for example, by hand Spatulas or squeegees can be applied. You prevent one Metallization of the areas between the copper strips 4 of the sheet 1 in a subsequent galvanic reinforcement the copper strip and later protect as well like the protective film 3, the surface of the alloy area of the finished resistance.

Gemäß Fig. 1E) kann auf den Kupferstreifen 4 galvanisch weiteres Kupfer zur Verstärkung der Kontakte und/oder ein zusätzliches Metall abgeschieden werden. Durch eine Zinnschicht 6 auf der Kupferoberfläche wird diese vor Anlaufen geschützt und das spätere Auflöten des Widerstands auf eine Schaltungsplatte od. dgl. erleichtert. Die Streifen 4 mit der Zinnschicht 6 bilden die Anschlusskontakte der zu erzeugenden einzelnen Widerstände.According to FIG. 1E) further copper can be galvanically applied to the copper strip 4 Copper to strengthen the contacts and / or an additional one Metal to be deposited. Through a layer of tin 6 the copper surface is protected from tarnishing and that later soldering the resistor onto a circuit board or The like. Relieved. Form the strips 4 with the tin layer 6 the connection contacts of the individual resistors to be generated.

Nun können die insoweit bereits fertig gestellten Präzisionswiderstände vereinzelt werden. Zu diesem Zweck wird das mit den Anschlusskontakten versehene Blech 1 längs senkrecht zu der Blechoberfläche und senkrecht zueinander verlaufender Gruppen von Schnittebenen zertrennt. Die Schnittebenen der einen dieser beiden Gruppen verlaufen parallel zu den Kupferstreifen 4 und somit zu einem der Ränder des Bleches 1 durch das gesamte Blech und liegen jeweils in der Mitte eines der Kupferstreifen 4, die dadurch jeweils in zwei gleiche Streifenteile zertrennt werden, längs der Pfeile 7 in Fig. 1E) und in Fig. F). In Fig. F) ist als letzte oder vorletzte Verfahrensstufe der vereinzelte Widerstand oder ein noch längs der zweiten Gruppe von Schnittebenen zu zerteilender Streifen dargestellt. Die Schnittebenen der zweiten Gruppe verlaufen parallel zu dem anderen Blechrand ebenfalls durch das gesamte Blech längs der seitlichen Ränder der einzelnen Widerstände.Now the precision resistors that have already been completed can be used be isolated. For this purpose, the Connection contacts provided sheet 1 longitudinally perpendicular to the Sheet surface and groups running perpendicular to each other separated from cutting planes. The cutting planes of one of these both groups run parallel to the copper strips 4 and thus to one of the edges of the sheet 1 through the entire sheet and are each in the middle of one of the copper strips 4, the thereby being cut into two equal strips, along the arrows 7 in Fig. 1E) and in Fig. F). In Fig. F) as the last or penultimate stage of the process the isolated resistance or one along the second group of cutting planes shown strips to be divided. The cutting planes of the second group also run parallel to the other sheet edge through the entire sheet along the side edges of the individual resistors.

Diese Vereinzelung der Widerstände erfolgt am besten durch Zersägen an den einzelnen Schnittebenen. Das Sägen hat den Vorteil, dass sehr präzise die jeweils gewünschten Abmessungen der Widerstände mit zu der Blechebene genau senkrechten ebenen Schnittflächen gewährleistet werden können. Hierfür geeignete Präzisionssägemaschinen, die z. B. optisch mit dem galvanisierten Blech ausgerichtet (referenziert) werden können und mit hoher Genauigkeit im µm-Bereich arbeiten, sind an sich bekannt und im Handel erhältlich. Das Blech wird zum Zersägen zweckmäßig auf eine Unterlage geklebt, von deren Klebeschicht die vereinzelten Widerstände dann problemlos gelöst werden können. Zweckmäßig wird das galvanisierte Blech zunächst längs einer der beiden Gruppen von Schnittebenen in einzelne Streifen zersägt, die dann ihrerseits zur Bildung der einzelnen Widerstände zersägt werden. Je nach Art der Sägemaschine könnten theoretisch auch mehrere Streifen gleichzeitig abgesägt bzw. zersägt werden. Aus einem Blech mit dem oben als Beispiel erwähnten Nutzen von ca. 300 x 400 mm lassen sich auf die hier beschriebene Weise mehrere 10.000 Widerstände aussägen. This separation of the resistors is best done by sawing at the individual cutting levels. Sawing has the advantage that the required dimensions of the Resistors with levels exactly perpendicular to the sheet level Cut surfaces can be guaranteed. Suitable for this Precision sawing machines, e.g. B. optically with the galvanized Sheet can be aligned (referenced) and with high Working accuracy in the µm range are known per se and commercially available. The sheet is useful for sawing glued to a base, of which the isolated layer of adhesive Resistors can then be easily solved. Appropriately, the galvanized sheet is first along one sawn the two groups of cutting planes into individual strips, which then in turn form the individual resistances be sawn. Depending on the type of sawing machine could theoretically sawn or sawn several strips at the same time become. From a sheet with the example mentioned above 300 x 400 mm can be used on the one described here Saw out several 10,000 resistors.

Der nach dem letzten Verfahrensschritt entstandene einzelne Widerstand ist schematisch (nicht maßstabsgetreu) in Fig. 2 dargestellt. Der fertige Widerstand besteht aus dem rechteckigen Legierungsblechstück 1', an dessen entgegengesetzten Enden die rechteckigen Anschlusskontakte 4' und 4'' mit den Zinnschichten 6', 6'' aufgalvanisiert sind. Die durch das galvanische Abschneiden von Kupfer ggf. in mehreren Schichten gebildeten Anschlusskontakte sind vorzugsweise relativ dick, u.a. um guten Eingang und Ausgang des Stroms in die bzw. aus der Legierung zu gewährleisten. Beispielsweise kann die Dicke des Kupfers ungefähr 50-100 µm betragen.The single resistance created after the last process step is shown schematically (not to scale) in Fig. 2. The finished resistor consists of the rectangular one Alloy sheet metal piece 1 ', at the opposite ends of which rectangular connection contacts 4 'and 4' 'with the tin layers 6 ', 6' 'are electroplated. The by galvanic cutting of copper, possibly in several layers are preferably relatively thick, i.a. for good Input and output of the current in or out of the alloy guarantee. For example, the thickness of the copper can be approximate 50-100 µm.

Wie ersichtlich ist, hat der Widerstand an den genannten entgegengesetzten Enden ebene Stirnflächen 9 der Anschlusskontakte und des Blechstücks 1' selbst, die genau senkrecht zu der Blechebene miteinander fluchten. Dasselbe gilt für die beiden seitlichen Stirnflächen 8 der Anschlusskontakte und des Blechstücks 1'. Zwischen den Anschlusskontakten befindet sich die Schutzlackschicht 5', während die den Kontakten abgewandte Oberfläche des Widerstands noch von der Schutzfolie 3' bedeckt sein kann.As can be seen, the resistance has the opposite Ends of flat end faces 9 of the connection contacts and the sheet metal piece 1 'itself, which is exactly perpendicular to the Align the sheet level with each other. The same applies to the two lateral end faces 8 of the contacts and the sheet metal piece 1'. The is between the connection contacts Protective lacquer layer 5 ', while the surface facing away from the contacts of the resistance is still covered by the protective film 3 ' can be.

Der in Fig. 3 dargestellte modifizierte Widerstand unterscheidet sich von der Bauform nach Fig. 2 nur dadurch, dass anstelle des mit der Schutzfolie 3' bedeckten relativ dicken Blechstücks 1' eine wesentlich dünnere Widerstandsfolie 11 verwendet worden ist, die auf einer als Schutzfolie dienenden doppelseitig klebenden Klebefolie 13 befestigt worden ist. Die Widerstandsfolie 11, deren Dicke weniger als 100 µm z.B. bis herunter zu 20 µm betragen kann, ist zum Zweck der Handhabbarkeit, d.h. zur mechanischen Stabilisierung mittels der Schutz- und Klebefolie 13 auf einem Substrat 18 fixiert worden, bei dem es sich beispielsweise um ein 0,5 mm dickes Aluminiumblech handeln kann. The modified resistor shown in Fig. 3 differs differs from the design according to FIG. 2 only in that instead of the relatively thick sheet metal piece covered with the protective film 3 ' 1 'a much thinner resistance film 11 has been used is that on a double-sided adhesive serving as a protective film Adhesive film 13 has been attached. The resistance foil 11 whose thickness is less than 100 µm e.g. down to 20 µm is for the purpose of manageability, i.e. for mechanical Stabilization using the protective and adhesive film 13 been fixed on a substrate 18, for example can be a 0.5 mm thick aluminum sheet.

Die Anschlusskontakte 14 mit den Zinnschichten 16 und die Schutzlackschicht 15 entsprechen der Ausführungsform nach Fig. 2, und auch die Herstellung des modifizierten Widerstands erfolgt im Wesentlichen nach dem anhand von Fig. 1 beschriebenen Verfahren mit der Maßgabe, dass im Schritt gemäß Fig. 1A anstelle des relativ dicken Bleches 1 das aus der dünnen Widerstandsfolie 11, der doppelseitigen Klebefolie 13 und dem Substrat 18 bestehende Laminat verwendet wird, wobei die Klebefolie 13 und das Substrat 18 die Schutzfolie 3 ersetzen können. Die Werte der auf diese Weise hergestellten Widerstände können typisch in der Größenordnung von 50 oder auch 100 mΩ liegen.The connection contacts 14 with the tin layers 16 and Protective lacquer layer 15 correspond to the embodiment according to FIG. 2, and also the manufacture of the modified resistor takes place essentially according to that described with reference to FIG. 1 Method with the proviso that instead of in the step of FIG. 1A of the relatively thick sheet 1 from the thin resistance film 11, the double-sided adhesive film 13 and the substrate 18 existing laminate is used, the adhesive film 13 and the substrate 18 can replace the protective film 3. The values of the resistors produced in this way can typically in the order of 50 or 100 mΩ.

Anstelle des aufgeklebten Aluminiumsubstrats 18 könnte die Handhabbarkeit einer ggf. sehr dünnen Widerstandsfolie wie der Folie 11 in Fig. 3 auch durch ein zur mechanischen Stabilisierung der Folie geeignetes nichtmetallisches Substrat ermöglicht werden, so dass sich ein Widerstand ergibt, der bis auf das dünnere Folienstück anstelle des Blechstücks 1' und das dickere nichtmetallische Substrat anstelle der Schutzfolie 3' dem Ausführungsbeispiel nach Fig. 2 entspricht (bzw. dem Ausführungsbeispiel nach Fig. 3, in dem die Klebefolie 13 und das Substrat 18 durch eine einzige Substratschicht ersetzt sind, auf die die Widerstandsfolie 11 aufgeklebt sein kann).Instead of the glued-on aluminum substrate 18, the Manageability of a possibly very thin resistance film like that 3 in FIG. 3 also by means of mechanical stabilization suitable non-metallic substrate of the film so that there is a resistance that thinner piece of film instead of sheet 1 'and the thicker non-metallic substrate instead of the protective film 3 'the embodiment 2 corresponds (or the embodiment 3, in which the adhesive film 13 and the substrate 18 are replaced by a single substrate layer on which the Resistance film 11 can be glued).

Claims (13)

Niederohmiger elektrischer Widerstand, bestehend aus einem flachen rechteckigen Metallstück (1', 11) aus einer Widerstandslegierung und auf die eine Hauptfläche des Metallstücks an entgegengesetzten Enden aufgalvanisierten Anschlusskontakten (4', 4'', 14),
   wobei die Stirnflächen (7) des Metallstücks (1', 11) und der Anschlusskontakte (4', 4'', 14) an diesen Enden und die senkrecht zu diesen Stirnflächen (7) angrenzenden Seitenflächen (8) des Metallstücks (1') und der Anschlusskontakte (4', 4'', 14) jeweils senkrecht zu der Ebene der Hauptfläche des Metallstücks (1', 11)miteinander fluchten.Low-resistance electrical resistor, consisting of a flat rectangular metal piece (1 ', 11) made of a resistance alloy and connecting contacts (4', 4 '', 14) galvanized onto one main surface of the metal piece at opposite ends,
the end faces (7) of the metal piece (1 ', 11) and the connecting contacts (4', 4 '', 14) at these ends and the side faces (8) of the metal piece (1 ') adjoining these end faces (7) perpendicularly and the connection contacts (4 ', 4'', 14) are each aligned perpendicular to the plane of the main surface of the metal piece (1', 11). Widerstand nach Anspruch 1, dadurch gekennzeichnet, dass sein Widerstandswert zwischen etwa 0,5 mΩ und etwa 5,0 mΩ beträgt.Resistor according to claim 1, characterized in that its resistance value is between approximately 0.5 mΩ and approximately 5.0 mΩ. Widerstand nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das Metallstück eine Folie (11) ist, die auf ihrer den Anschlusskontakten (14) abgewandten Seite auf einem Substrat (18) befestigt ist.Resistor according to Claim 1 or 2, characterized in that the metal piece is a film (11) which is fastened on a substrate (18) on its side facing away from the connection contacts (14). Widerstand nach Anspruch 3, dadurch gekennzeichnet, dass die Folie (11) weniger als 100 µm dick ist.Resistor according to claim 3, characterized in that the film (11) is less than 100 µm thick. Widerstand nach Anspruch 3 oder 4, dadurch gekennzeichnet, dass sein Widerstandswert größer als 10 mΩ und vorzugsweise größer als 50 mΩ ist.Resistor according to claim 3 or 4, characterized in that its resistance value is greater than 10 mΩ and preferably greater than 50 mΩ. Verfahren zur Herstellung niederohmiger elektrischer Widerstände, bei dem auf photolithographisch definierte Bereiche einer aus einer metallischen Widerstandslegierung in Form eines Bleches (1) oder einer Folie (11) bestehenden Lage galvanisch ein Metall zur Bildung von Anschlusskontakten (4) für eine Vielzahl einzelner Widerstände abgeschieden und die mit den Anschlusskontakten (4) versehene Lage (1, 11) in die einzelnen Widerstände zerteilt wird, gekennzeichnet durch die Verfahrensschritte photolithographische Erzeugung einer Abdeckmaske, die durch eine Vielzahl sich über die eine Oberfläche der Lage (1, 11) erstreckender paralleler Streifen (2') mit gleichmäßigen gegenseitigen Abständen gebildet wird; Galvanisierung der Lage (1, 11) nur auf ihrer die Abdeckmaske tragenden Oberfläche zur Abscheidung des Anschlusskontaktmetalls auf den zwischen den parallelen Maskenstreifen (2') liegenden Widerstandsstreifen; und Zertrennen der galvanisierten Lage (1, 11) längs senkrecht zu deren Oberfläche und senkrecht zueinander verlaufender Gruppen von Schnittebenen, von denen die einen Schnittebenen (7) parallel zu den Anschlusskontaktstreifen (4) je einen der Anschlusskontaktstreifen zertrennen, während die anderen Schnittebenen die Widerstände an ihren quer zu den Anschlusskontaktstreifen (4) verlaufenden Rändern voneinander trennen. Process for the production of low-resistance electrical resistors, in which a metal for the formation of connection contacts (4) for a large number of individual resistors is electrodeposited on photolithographically defined areas of a layer consisting of a metallic resistance alloy in the form of a sheet (1) or a foil (11) and the layer (1, 11) provided with the connection contacts (4) is divided into the individual resistors, characterized by the method steps photolithographic production of a mask, which is formed by a plurality of parallel strips (2 '), which extend over the one surface of the layer (1, 11) and are at equal mutual spacings; Galvanization of the layer (1, 11) only on its surface carrying the mask for the deposition of the connection contact metal on the resistance strips lying between the parallel mask strips (2 '); and Cutting the galvanized layer (1, 11) longitudinally perpendicular to its surface and groups of cutting planes running perpendicular to each other, of which the one cutting plane (7) parallel to the connection contact strips (4) each cut one of the connection contact strips, while the other cutting planes connect the resistors separate their edges running transversely to the connection contact strips (4). Verfahren nach Anspruch 6, dadurch gekennzeichnet, dass die galvanisierte Lage (1, 11) zum Vereinzeln der Widerstände zersägt wird.A method according to claim 6, characterized in that the galvanized layer (1, 11) is sawn to separate the resistors. Verfahren nach Anspruch 6 oder 7, dadurch gekennzeichnet, dass vor der Galvanisierung die Rückseite der Lage (1) mit einer Schutzfolie (3) bedeckt wird.A method according to claim 6 or 7, characterized in that the back of the layer (1) is covered with a protective film (3) before the galvanization. Verfahren nach einem der Ansprüche 6 bis 8, dadurch gekennzeichnet, dass nach der Abscheidung des Anschlusskontaktmetalls die Maskenstreifen (2') entfernt und an ihrer Stelle ein Schutzlack (5) aufgebracht wird. Method according to one of claims 6 to 8, characterized in that after the deposition of the connection contact metal, the mask strips (2 ') are removed and a protective lacquer (5) is applied in their place. Verfahren nach einem der Ansprüche 6 bis 9, dadurch gekennzeichnet, dass auf die Anschlusskontaktstreifen (4) vor dem Vereinzeln der Widerstände galvanisch mindestens eine zusätzliche Schicht (6) aus demselben Metall oder aus einem anderen Metall aufgebracht wird.Method according to one of claims 6 to 9, characterized in that at least one additional layer (6) made of the same metal or of a different metal is galvanically applied to the connection contact strips (4) before the resistors are separated. Verfahren nach einem der Ansprüche 6 bis 10, dadurch gekennzeichnet, dass ein Blech (1) oder eine Folie (11) aus einer Cu-Legierung zur Bildung der Anschlusskontaktstreifen verkupfert wird und die Kupferstreifen (4) verzinnt werden.Method according to one of claims 6 to 10, characterized in that a sheet (1) or a foil (11) made of a copper alloy is copper-plated to form the connection contact strips and the copper strips (4) are tinned. Verfahren nach einem der Ansprüche 6 bis 11, dadurch gekennzeichnet, dass Länge, Breite und Dicke der nach dem Vereinzeln der Widerstände verbleibenden Blechstücke (1') und der gegenseitige Abstand der verbleibenden Anschlusskontakte (4', 4'') für Widerstandswerte zwischen etwa 0,1 mΩ und etwa 5 mΩ bemessen werden.Method according to one of claims 6 to 11, characterized in that the length, width and thickness of the sheet metal pieces (1 ') remaining after the separation of the resistors and the mutual spacing of the remaining connection contacts (4', 4 '') for resistance values between approximately 0 , 1 mΩ and about 5 mΩ. Verfahren nach einem der Ansprüche 6 bis 11, dadurch gekennzeichnet, dass die Abdeckmaske auf einer aus der Widerstandslegierung bestehenden, weniger als 100 µm dicken Folie erzeugt wird, die durch Befestigung auf einem Substrat (18) handhabbar gemacht wird, und dass Länge, Breite und Dicke der nach dem Vereinzeln der Widerstände verbleibenden Folienstücke (11) für Widerstandswerte von mehr als 10 mΩ und vorzugsweise mehr als 50 mΩ bemessen werden.Method according to one of claims 6 to 11, characterized in that the mask is produced on a foil made of the resistance alloy, less than 100 µm thick, which is made manageable by attachment to a substrate (18), and that length, width and Thickness of the pieces of film (11) remaining after the separation of the resistors is measured for resistance values of more than 10 mΩ and preferably more than 50 mΩ.
EP02015940A 2001-08-10 2002-07-17 Low impedance electrical resistor and method of making it Expired - Lifetime EP1283528B1 (en)

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DE10139323 2001-08-10
DE2001139323 DE10139323C1 (en) 2001-08-10 2001-08-10 Low resistance electrical resistor consists of a rectangular piece of sheet metallic resistance alloy with connection contacts galvanized onto the opposite ends
DE2001153273 DE10153273A1 (en) 2001-10-29 2001-10-29 Low impedance electrical resistor used as a precision resistor for measuring current comprises a flat rectangular metal element made of a resistor alloy, and connecting contacts
DE10153273 2001-10-29

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DE10338041B3 (en) * 2003-08-19 2005-02-24 Isabellenhütte Heusler GmbH KG Electrical resistance, especially surface mount current measurement resistance, has resistance element surface in aperture set back perpendicularly relative to common plane at connection elements
CN102969099A (en) * 2008-09-05 2013-03-13 韦沙戴尔电子公司 Resistor and method for making same

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DE3201434A1 (en) * 1982-01-19 1983-09-08 Siemens AG, 1000 Berlin und 8000 München Chip-type electrical component
US4532186A (en) * 1982-06-16 1985-07-30 Nitto Electric Industrial Co., Ltd. Circuit substrate with resistance layer and process for producing the same

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US3296574A (en) * 1962-12-21 1967-01-03 Tassara Luigi Film resistors with multilayer terminals
DE3201434A1 (en) * 1982-01-19 1983-09-08 Siemens AG, 1000 Berlin und 8000 München Chip-type electrical component
US4532186A (en) * 1982-06-16 1985-07-30 Nitto Electric Industrial Co., Ltd. Circuit substrate with resistance layer and process for producing the same

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Publication number Priority date Publication date Assignee Title
DE10338041B3 (en) * 2003-08-19 2005-02-24 Isabellenhütte Heusler GmbH KG Electrical resistance, especially surface mount current measurement resistance, has resistance element surface in aperture set back perpendicularly relative to common plane at connection elements
CN102969099A (en) * 2008-09-05 2013-03-13 韦沙戴尔电子公司 Resistor and method for making same
US9916921B2 (en) 2008-09-05 2018-03-13 Vishay Dale Electronics, Llc Resistor and method for making same
CN102969099B (en) * 2008-09-05 2018-04-06 韦沙戴尔电子公司 Resistor and its manufacture method

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ES2229026T3 (en) 2005-04-16
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EP1283528A3 (en) 2003-07-16
ATE279779T1 (en) 2004-10-15

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