EP1201109A1 - Method of installing heat source, and micro heat pipe module - Google Patents

Method of installing heat source, and micro heat pipe module

Info

Publication number
EP1201109A1
EP1201109A1 EP00944073A EP00944073A EP1201109A1 EP 1201109 A1 EP1201109 A1 EP 1201109A1 EP 00944073 A EP00944073 A EP 00944073A EP 00944073 A EP00944073 A EP 00944073A EP 1201109 A1 EP1201109 A1 EP 1201109A1
Authority
EP
European Patent Office
Prior art keywords
heat
pipe module
micro
heat pipe
heat source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00944073A
Other languages
German (de)
French (fr)
Inventor
Timo HEIKKILÄ
Carl Kabrell
Reijo Lehtiniemi
Jukka Rantala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Nokia Inc
Original Assignee
Nokia Oyj
Nokia Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Oyj, Nokia Inc filed Critical Nokia Oyj
Publication of EP1201109A1 publication Critical patent/EP1201109A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes

Definitions

  • the invention relates to a method of installing a heat source generating thermal energy on a micro heat pipe module which comprises micro heat pipes for dissipating thermal energy generated by the heat source, in which method the heat source generating thermal energy is installed on one side of the micro heat pipe module.
  • the invention also relates to a micro heat pipe module which comprises micro heat pipes for dissipating thermal energy generated by a heat source and which micro heat pipe module has a side on which the heat source generating thermal energy is installed.
  • Cooling electronic components is an old problem which has become more and more pronounced with increasing integration intensities and power.
  • New methods, such as heat pipes, have lately emerged along with conventional convection cooling.
  • a standard heat pipe is typically a copper cylinder several millimetres in diameter and about nine inches in length, emptied of air and partly filled with a working fluid.
  • a heat pipe conducts thermal energy generated by a heat source, such as an electronic component, from one end of the heat pipe to another as latent heat from the change of phase of a working fluid in the heat pipe.
  • the thermal heat generated by the heat source makes the working fluid boil and vaporise in the hot end of the heat pipe, i.e. the vaporiser of the heat pipe. Due to a generated pressure difference, the vapour moves to the other, cold end of the heat pipe, i.e. the condenser of the heat pipe, where the vapour surrenders it latent heat and returns as fluid back to the vaporiser driven by capillary forces.
  • a heat pipe is an extremely efficient heat conductor, its effective thermal conductivity is typically 10 to 100 times better than that of copper.
  • micro heat pipe modules which comprise very small micro heat pipes placed side by side and a binding agent. These have been used to even out temperature distribution, especially when the heat source is a local one and surrounded by an area considerably cooler in temperature.
  • the micro heat pipe modules are usually attached between the heat source, such as an electronic component generating thermal energy, and another surface, such as a circuit board, cooling plates or the body of an apparatus. Micro heat pipe modules have been disclosed in US patent 5,527,588, for instance.
  • a micro heat pipe module has a limited heat conducting ability.
  • the micro heat pipes cannot function due to a partial drying up, for instance.
  • the internal pressure of a micro heat pipe beneath a heat source such as an electronic component, increases too much and fluid cannot for some reason return to the vaporisation area driven by capillary forces.
  • the object of the invention is achieved by a method characterized in that the side of the micro heat pipe module, on which a heat source generating thermal energy is installed, is coated at least partly with a coating made of a heat conducting material, which coating is arranged to conduct the heat generated by the heat-generating heat source away from the heat- generating heat source along said side of the micro heat pipe module and into the micro heat pipe module.
  • An arrangement of the invention is in a corresponding manner characterized in that the side of the micro heat pipe module, on which the heat-generating heat source is installed, is at least partly coated with a coating made of a heat conducting material, which coating is arranged to conduct the heat generated by the heat-generating heat source away from the heat- generating heat source along said side of the micro heat pipe module and into the micro heat pipe module.
  • Preferred embodiments of the arrangement of the invention are set forth in the dependent claims 5 to 9.
  • the solution of the invention increases the maximum power transmission capacity of a micro heat pipe module by reducing the local heat load at the heat source.
  • the solution is based on the use of a coating, i.e. more exactly a thermal pre-levelling material.
  • thermal energy generated by the heat source diffuses along the pre-levelling layer in lateral direction, the local heat load on the top surface of the micro heat pipe module at the heat source decreases and the micro heat pipe module can function longer at a higher component power before a local operational limit is reached.
  • the coating can also act as a galvanic insulation layer, and it can be machined, if necessary.
  • the figure shows a micro heat pipe module 1 which comprises micro heat pipes 3 for dissipating thermal energy generated by a heat source 2, such as an electronic component.
  • a heat source 2 such as an electronic component.
  • the operation of such a micro heat pipe 3 is known per se and is, therefore, not described herein in more detail.
  • the micro heat pipe module 1 has a side 4 on which the heat source 2 generating thermal energy is installed.
  • the figure shows a micro heat pipe module 1 in the shape of a rectangular prism, having six sides, of which at least one is intended for the heat source 2 generating thermal energy.
  • the side 4 of the micro heat pipe module 1 on which the heat source 2 generating thermal energy is installed, is at least partly coated with a coating 5.
  • the coating 5 is made of a heat conducting material.
  • the coating 5 is arranged to conduct the heat generated by the heat source 2 generating thermal energy away from the heat source 2 generating thermal energy along said side 4 of the micro heat pipe module 1 and to the micro heat pipe module 1.
  • the coating 5 is thus arranged to distribute thermal energy from the heat source 2 to a wider area and consequently, the local heat load peak at the heat source 2 and in its immediate vicinity becomes smaller. Due to the distribution of the heat load from the heat source 2 generating thermal energy by means of the coating 5 to a wider area and on therefrom to the micro heat pipe module 1 , the micro heat pipe module 1 is able to function longer at a higher component power before reaching a local operational limit.
  • the side 4 of the micro heat pipe module 1 on which the heat source 2 generating thermal energy is installed, is preferably substantially completely coated with the coating 5.
  • the heat source 2 generating thermal energy is preferably installed on the coating 5 as shown in the figure.
  • the heat conducting material of the coating 5 preferably comprises metal, preferably copper metal. Copper and copper metals are known for their good heat conductivity. A electrically conductive plane can be formed with a copper metal or another metal on the surface of the micro heat pipe module 1 , and the heat source 2 can be directly grounded to it. It is also easy to solder the heat source 2 to a copper metal, which provides an excellent heat conductivity and ground conductivity.
  • the coating 5 can preferably comprise graphite or diamond-like carbon.
  • the coating 5 can also act as a galvanic insulation layer which insujates various electronic components from each other and/or from the micro heat pipe module 1 so that electrical current cannot flow from one electronic component to another.
  • the invention also relates to a method of installing a heat source 2 generating thermal energy on a micro heat pipe module 1 which comprises micro heat pipes 3 for dissipating the thermal energy generated by the heat source 2. In the method, a heat source 2 generating thermal energy is installed on one side 4 of a micro heat pipe module 1.
  • said side 4 of the micro heat pipe module 1 on which the heat source 2 generating thermal energy is installed, is at least partly coated with a coating 5 made of a heat conducting material.
  • the coating 5 is arranged to conduct the heat generated by the heat-generating heat source 2 away from the heat-generating heat source 2 along said side 4 of the micro heat pipe module 1 and to the micro heat pipe module 1.
  • Said side 4 is preferably coated substantially completely.
  • the heat source 2 generating thermal energy is preferably installed on the coating 5.

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a method of installing a heat source generating thermal energy on a micro heat pipe module and to a micro heat pipe module. The micro heat pipe module (1) has micro heat pipes (3) for dissipating the thermal energy generated by the heat source (2) generating thermal energy, and the micro heat pipe module (1) has a side (4) on which the heat source (2) generating thermal energy is installed. The side (4) of the micro heat pipe module (1), on which the heat source (2) generating thermal energy is installed, is at least partly coated with a coating (5) made of a heat conducting material, which coating (5) is arranged to conduct the heat generated by the heat source (2) generating thermal energy away from the heat source (2) generating thermal energy along said side (4) of the micro heat pipe module (1) and to the micro heat pipe module (1).

Description

METHOD OF INSTALLING HEAT SOURCE, AND MICRO HEAT PIPE MODULE
BACKGROUND OF THE INVENTION
The invention relates to a method of installing a heat source generating thermal energy on a micro heat pipe module which comprises micro heat pipes for dissipating thermal energy generated by the heat source, in which method the heat source generating thermal energy is installed on one side of the micro heat pipe module.
The invention also relates to a micro heat pipe module which comprises micro heat pipes for dissipating thermal energy generated by a heat source and which micro heat pipe module has a side on which the heat source generating thermal energy is installed.
Cooling electronic components is an old problem which has become more and more pronounced with increasing integration intensities and power. New methods, such as heat pipes, have lately emerged along with conventional convection cooling. A standard heat pipe is typically a copper cylinder several millimetres in diameter and about nine inches in length, emptied of air and partly filled with a working fluid.
A heat pipe conducts thermal energy generated by a heat source, such as an electronic component, from one end of the heat pipe to another as latent heat from the change of phase of a working fluid in the heat pipe. The thermal heat generated by the heat source makes the working fluid boil and vaporise in the hot end of the heat pipe, i.e. the vaporiser of the heat pipe. Due to a generated pressure difference, the vapour moves to the other, cold end of the heat pipe, i.e. the condenser of the heat pipe, where the vapour surrenders it latent heat and returns as fluid back to the vaporiser driven by capillary forces. A heat pipe is an extremely efficient heat conductor, its effective thermal conductivity is typically 10 to 100 times better than that of copper. Until now, heat pipes have usually been installed in such a manner that for each heat source, such as an electronic component, there is one separate heat pipe conducting heat to a condenser. If one circuit board has several electronic components requiring cooling, placing heat pipes in an efficient manner is difficult, awkward and requires space. This problem has been solved by means of micro heat pipe modules which comprise very small micro heat pipes placed side by side and a binding agent. These have been used to even out temperature distribution, especially when the heat source is a local one and surrounded by an area considerably cooler in temperature. The micro heat pipe modules are usually attached between the heat source, such as an electronic component generating thermal energy, and another surface, such as a circuit board, cooling plates or the body of an apparatus. Micro heat pipe modules have been disclosed in US patent 5,527,588, for instance. The method has its limitations, however. A micro heat pipe module has a limited heat conducting ability. When a local heat load increases too much at a heat source, the micro heat pipes cannot function due to a partial drying up, for instance. In such a case, the internal pressure of a micro heat pipe beneath a heat source, such as an electronic component, increases too much and fluid cannot for some reason return to the vaporisation area driven by capillary forces. There are also several other reasons which may stop the heat pipes from functioning. They all have in common that there is too high a local heat load at a heat source, and if the heat source is an electronic component, the result often is that it is destroyed.
BRIEF DESCRIPTION OF THE INVENTION
It is thus an object of the invention to develop a method of installing a heat source generating thermal energy on a micro heat pipe module and a micro heat pipe module so as to solve the above problems.
The object of the invention is achieved by a method characterized in that the side of the micro heat pipe module, on which a heat source generating thermal energy is installed, is coated at least partly with a coating made of a heat conducting material, which coating is arranged to conduct the heat generated by the heat-generating heat source away from the heat- generating heat source along said side of the micro heat pipe module and into the micro heat pipe module.
Preferred embodiments of the method of the invention are set forth in the dependent claims 2 and 3.
An arrangement of the invention is in a corresponding manner characterized in that the side of the micro heat pipe module, on which the heat-generating heat source is installed, is at least partly coated with a coating made of a heat conducting material, which coating is arranged to conduct the heat generated by the heat-generating heat source away from the heat- generating heat source along said side of the micro heat pipe module and into the micro heat pipe module. Preferred embodiments of the arrangement of the invention are set forth in the dependent claims 5 to 9.
The solution of the invention increases the maximum power transmission capacity of a micro heat pipe module by reducing the local heat load at the heat source. The solution is based on the use of a coating, i.e. more exactly a thermal pre-levelling material. When thermal energy generated by the heat source diffuses along the pre-levelling layer in lateral direction, the local heat load on the top surface of the micro heat pipe module at the heat source decreases and the micro heat pipe module can function longer at a higher component power before a local operational limit is reached.
The coating can also act as a galvanic insulation layer, and it can be machined, if necessary.
In addition, it is possible to use a more extensive material selection, such as plastics, as the cold surface in connection with the solution of the invention.
BRIEF DESCRIPTION OF THE FIGURES
In the following, the invention will be described by means of preferred embodiments and with reference to the attached drawing which shows a side view schematic of a micro heat pipe module of the invention.
DETAILED DESCRIPTION OF THE INVENTION
The figure shows a micro heat pipe module 1 which comprises micro heat pipes 3 for dissipating thermal energy generated by a heat source 2, such as an electronic component. The operation of such a micro heat pipe 3 is known per se and is, therefore, not described herein in more detail. The micro heat pipe module 1 has a side 4 on which the heat source 2 generating thermal energy is installed. The figure shows a micro heat pipe module 1 in the shape of a rectangular prism, having six sides, of which at least one is intended for the heat source 2 generating thermal energy. The side 4 of the micro heat pipe module 1 , on which the heat source 2 generating thermal energy is installed, is at least partly coated with a coating 5.
The coating 5 is made of a heat conducting material. The coating 5 is arranged to conduct the heat generated by the heat source 2 generating thermal energy away from the heat source 2 generating thermal energy along said side 4 of the micro heat pipe module 1 and to the micro heat pipe module 1. The coating 5 is thus arranged to distribute thermal energy from the heat source 2 to a wider area and consequently, the local heat load peak at the heat source 2 and in its immediate vicinity becomes smaller. Due to the distribution of the heat load from the heat source 2 generating thermal energy by means of the coating 5 to a wider area and on therefrom to the micro heat pipe module 1 , the micro heat pipe module 1 is able to function longer at a higher component power before reaching a local operational limit.
The side 4 of the micro heat pipe module 1 , on which the heat source 2 generating thermal energy is installed, is preferably substantially completely coated with the coating 5.
The heat source 2 generating thermal energy is preferably installed on the coating 5 as shown in the figure.
Several heat conducting materials can be used as the coating 5, and several coating techniques are possible.
The heat conducting material of the coating 5 preferably comprises metal, preferably copper metal. Copper and copper metals are known for their good heat conductivity. A electrically conductive plane can be formed with a copper metal or another metal on the surface of the micro heat pipe module 1 , and the heat source 2 can be directly grounded to it. It is also easy to solder the heat source 2 to a copper metal, which provides an excellent heat conductivity and ground conductivity. The coating 5 can preferably comprise graphite or diamond-like carbon.
The coating 5 can also act as a galvanic insulation layer which insujates various electronic components from each other and/or from the micro heat pipe module 1 so that electrical current cannot flow from one electronic component to another. The invention also relates to a method of installing a heat source 2 generating thermal energy on a micro heat pipe module 1 which comprises micro heat pipes 3 for dissipating the thermal energy generated by the heat source 2. In the method, a heat source 2 generating thermal energy is installed on one side 4 of a micro heat pipe module 1.
In the method said side 4 of the micro heat pipe module 1 , on which the heat source 2 generating thermal energy is installed, is at least partly coated with a coating 5 made of a heat conducting material. The coating 5 is arranged to conduct the heat generated by the heat-generating heat source 2 away from the heat-generating heat source 2 along said side 4 of the micro heat pipe module 1 and to the micro heat pipe module 1.
Said side 4 is preferably coated substantially completely.
The heat source 2 generating thermal energy is preferably installed on the coating 5.
It is obvious to a person skilled in the art that while technology advances, the basic idea of the invention can be implemented in many different ways. The invention and its embodiments are thus not restricted to the examples described above, but can vary within the scope of the claims.

Claims

1. A method of installing a heat source (2) generating thermal energy on a micro heat pipe module (1) which comprises micro heat pipes (3) for dissipating the thermal energy generated by the heat source (2), in which method a heat source (2) generating thermal energy is installed on one side (4) of the micro heat pipe module (1), characterized by coating at least partly the side (4) of the micro heat pipe module (1), on which the heat source (2) generating thermal energy is installed, with a coating (5) made of a heat conducting material, which coating (5) is arranged to conduct the heat generated by the heat-generating heat source (2) away from the heat-generating heat source (2) along said side (4) of the micro heat pipe module (1) and to the micro heat pipe module (1).
2. A method as claimed in claim 1, characterized in that said side (4) is coated substantially completely.
3. A method as claimed in claim 1 or 2, characterized in that the heat source (2) generating thermal energy is installed on the coating
(5).
4. A micro heat pipe module (1) which has micro heat pipes (3) for dissipating the thermal energy generated by the heat source (2) generating thermal energy, and which micro heat pipe module (1) has a side (4) on which the heat source (2) generating thermal energy is installed, characterized in that the side (4) of the micro heat pipe module (1), on which the heat source (2) generating thermal energy is installed, is at least partly coated with a coating (5) made of a heat conducting material, which coating (5) is arranged to conduct the heat generated by the heat-generating heat source (2) away from the heat-generating heat source (2) along said side (4) of the micro heat pipe module (1 ) and to the micro heat pipe module (1 ).
5. A micro heat pipe module as claimed in claim 4, characterized in that the side (4) of the micro heat pipe module (1 ), on which the heat source (2) generating thermal energy is installed, is substantially completely coated with the coating (5).
6. A micro heat pipe module as claimed in claim 4, characterized in that the coating (5) comprises metal, preferably copper.
7. A micro heat pipe module as claimed in claim 4, characterized in that the coating (5) comprises graphite.
8. A micro heat pipe module as claimed in claim 4, characterized in that the coating (5) comprises diamond-like carbon.
9. A micro heat pipe module as claimed in claim 4, characterized in that the heat source (2) generating thermal energy is installed on the coating (5).
EP00944073A 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module Withdrawn EP1201109A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI991509A FI991509L (en) 1999-07-01 1999-07-01 Method for installing a heat source generating thermal energy on a micro heat pipe module and micro heat pipe module
FI991509 1999-07-01
PCT/FI2000/000596 WO2001003484A1 (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module

Publications (1)

Publication Number Publication Date
EP1201109A1 true EP1201109A1 (en) 2002-05-02

Family

ID=8555006

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00944073A Withdrawn EP1201109A1 (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module

Country Status (5)

Country Link
US (1) US20020121359A1 (en)
EP (1) EP1201109A1 (en)
AU (1) AU5830900A (en)
FI (1) FI991509L (en)
WO (1) WO2001003484A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US7147045B2 (en) 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US7305843B2 (en) 1999-06-08 2007-12-11 Thermotek, Inc. Heat pipe connection system and method
WO2002080270A1 (en) * 2001-03-30 2002-10-10 Thermotek, Inc. Cooling apparatus having low profile extrusion
WO2003046463A2 (en) 2001-11-27 2003-06-05 Parish Overton L Stacked low profile cooling system and method for making same
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US7198096B2 (en) 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US20070130769A1 (en) * 2002-09-03 2007-06-14 Moon Seok H Micro heat pipe with pligonal cross-section manufactured via extrusion or drawing
US20040112572A1 (en) * 2002-12-17 2004-06-17 Moon Seok Hwan Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing
DE102007053090B4 (en) * 2007-11-07 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Heat sink and cooling arrangement for electrical components and method for producing a heat sink and a cooling arrangement for electrical components
EP2327947B1 (en) * 2009-11-30 2012-02-22 ABB Research Ltd Heat exchanger
US9513059B2 (en) 2011-02-04 2016-12-06 Lockheed Martin Corporation Radial-flow heat exchanger with foam heat exchange fins
US9951997B2 (en) 2011-02-04 2018-04-24 Lockheed Martin Corporation Staged graphite foam heat exchangers
WO2012106603A2 (en) 2011-02-04 2012-08-09 Lockheed Martin Corporation Shell-and-tube heat exchangers with foam heat transfer units
WO2013086388A2 (en) * 2011-12-08 2013-06-13 Lockheed Martin Corporation System and method for desalination of water using a graphite foam material
US11057983B2 (en) 2019-01-30 2021-07-06 Rohde & Schwarz Gmbh & Co. Kg PCB assembly and method of manufacturing a PCB assembly
DE102021111632B4 (en) * 2021-05-05 2025-05-22 Vacon Oy Method for cooling a device, such as an electric motor drive or a general current transformer, and device, such as an electric motor drive or a general current transformer, for carrying out the cooling method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355942A (en) * 1991-08-26 1994-10-18 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
JP3311421B2 (en) * 1993-04-02 2002-08-05 古河電気工業株式会社 High density heat dissipation type circuit board
JPH0853100A (en) * 1994-08-10 1996-02-27 Mitsubishi Electric Corp Honeycomb sandwich panel with embedded heat pipe
US5598632A (en) * 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
DE29719778U1 (en) * 1997-11-07 1999-04-01 Duewag Ag, 47829 Krefeld Power semiconductor module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0103484A1 *

Also Published As

Publication number Publication date
WO2001003484A1 (en) 2001-01-11
FI991509A7 (en) 2001-01-02
FI991509L (en) 2001-01-02
AU5830900A (en) 2001-01-22
US20020121359A1 (en) 2002-09-05

Similar Documents

Publication Publication Date Title
US20020121359A1 (en) Method of installing heat source, and micro heat pipe module
US5933323A (en) Electronic component lid that provides improved thermal dissipation
US4204246A (en) Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block
US4120019A (en) Apparatus for cooling electrical components
US6661664B2 (en) Electronic module with high cooling power
US4951740A (en) Bellows heat pipe for thermal control of electronic components
US5924482A (en) Multi-mode, two-phase cooling module
US6863117B2 (en) Capillary evaporator
CN101437387B (en) Conduction cooled circuit board assembly
US3852806A (en) Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
US20060187639A1 (en) Electronic component cooling and interface system
US20110038122A1 (en) Phase Change Heat Spreader Bonded to Power Module by Energetic Multilayer Foil
US7295441B1 (en) Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe
US11495519B2 (en) Apparatus for thermal management of electronic components
US6481491B2 (en) Cooling apparatus based on heat energy bound to working fluid in phase transition
JP2010079403A (en) Cooling system for electronic equipment
JPH10227585A (en) Heat spreader and cooler using it
CN112512201B (en) Printed circuit board with embedded phase change heat dissipation device
US20020117292A1 (en) Arrangement for dissipating thermal energy generated by heat source
JPH06216555A (en) Heat pipe type cooling device for electronic parts
JPH0320070B2 (en)
CN2894198Y (en) Heat transfer structure of a heat dissipation circuit board and heat pipe
JPS5833429Y2 (en) Electrically insulated heat pipe
WO2000011423A1 (en) Heat exchanger for conducting elsewhere heat energy generated by heat source
WO2002011506A2 (en) Vapor chamber with integrated pin array

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20011206

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20040103