EP1193029A4 - Method and device for grinding double sides of thin disk work - Google Patents

Method and device for grinding double sides of thin disk work

Info

Publication number
EP1193029A4
EP1193029A4 EP00960972A EP00960972A EP1193029A4 EP 1193029 A4 EP1193029 A4 EP 1193029A4 EP 00960972 A EP00960972 A EP 00960972A EP 00960972 A EP00960972 A EP 00960972A EP 1193029 A4 EP1193029 A4 EP 1193029A4
Authority
EP
European Patent Office
Prior art keywords
thin disk
double sides
disk work
grinding double
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00960972A
Other languages
German (de)
French (fr)
Other versions
EP1193029B1 (en
EP1193029A1 (en
Inventor
Tadahiro Kato
Shunichi Ikeda
Kenji Ohkura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
JTEKT Machine Systems Corp
Original Assignee
Shin Etsu Handotai Co Ltd
Koyo Machine Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd, Koyo Machine Industries Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of EP1193029A1 publication Critical patent/EP1193029A1/en
Publication of EP1193029A4 publication Critical patent/EP1193029A4/en
Application granted granted Critical
Publication of EP1193029B1 publication Critical patent/EP1193029B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP00960972A 1999-09-24 2000-09-13 Double side grinding process for thin disklike work Expired - Lifetime EP1193029B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP26997999 1999-09-24
JP26997999 1999-09-24
PCT/JP2000/006250 WO2001021356A1 (en) 1999-09-24 2000-09-13 Method and device for grinding double sides of thin disk work

Publications (3)

Publication Number Publication Date
EP1193029A1 EP1193029A1 (en) 2002-04-03
EP1193029A4 true EP1193029A4 (en) 2004-05-06
EP1193029B1 EP1193029B1 (en) 2005-08-31

Family

ID=17479893

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00960972A Expired - Lifetime EP1193029B1 (en) 1999-09-24 2000-09-13 Double side grinding process for thin disklike work

Country Status (7)

Country Link
US (1) US6726525B1 (en)
EP (1) EP1193029B1 (en)
JP (1) JP3829239B2 (en)
KR (1) KR100706626B1 (en)
DE (1) DE60022356T2 (en)
TW (1) TW450875B (en)
WO (1) WO2001021356A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10142400B4 (en) * 2001-08-30 2009-09-03 Siltronic Ag Improved local flatness semiconductor wafer and method of making the same
US6726565B2 (en) * 2001-09-21 2004-04-27 Igt Gaming device having an input-output value bonus scheme
JP2004050334A (en) * 2002-07-18 2004-02-19 Daisho Seiki Kk Vertical double head surface grinding machine for brake disk working
KR100954534B1 (en) * 2002-10-09 2010-04-23 고요 기카이 고교 가부시키가이샤 Both side grinding method and both side grinder of thin disc-like work
US20050164605A1 (en) * 2003-12-18 2005-07-28 Carl Zeiss Smt Ag Device and method for surface working
JP3993856B2 (en) * 2004-01-22 2007-10-17 光洋機械工業株式会社 Double-head surface grinding machine
JP2006231471A (en) * 2005-02-25 2006-09-07 Speedfam Co Ltd Double-sided polishing machine and its sizing controlling method
JP2006231470A (en) * 2005-02-25 2006-09-07 Speedfam Co Ltd Sizing method and device of double-sided polishing machine
US7785173B2 (en) * 2005-07-05 2010-08-31 Supfina Machine Co. Superfinishing machine and method
US7601049B2 (en) * 2006-01-30 2009-10-13 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
US7662023B2 (en) * 2006-01-30 2010-02-16 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
US7930058B2 (en) * 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
US20080233286A1 (en) * 2007-03-20 2008-09-25 Honeywell International Inc. Method and apparatus for removing carbonized pitch from the surface of a pitch infiltrated disk
US8118662B2 (en) * 2007-10-23 2012-02-21 Igt Gaming system, gaming device and method for providing player selection of modifiers to game components
US8262455B2 (en) 2007-10-23 2012-09-11 Igt Gaming device and method for providing player selection of modifiers to game components
US8109824B2 (en) 2008-11-11 2012-02-07 Igt Gaming system, gaming device and method providing accumulation game
US9082257B2 (en) 2011-09-30 2015-07-14 Igt Gaming system and method providing a community selection game providing bonus game selection
US9017141B2 (en) 2013-01-04 2015-04-28 White Drive Products, Inc. Deburring machine and method for deburring
JP6672207B2 (en) * 2016-07-14 2020-03-25 株式会社荏原製作所 Apparatus and method for polishing a surface of a substrate
CN110539220A (en) * 2019-09-24 2019-12-06 北京航天新风机械设备有限责任公司 Ring body end surface grinding device
CN112223020A (en) * 2020-10-13 2021-01-15 苏州青众创业服务有限公司 Grinding device for numerical control machining
CN112247706A (en) * 2020-10-23 2021-01-22 江苏诚品环保科技有限公司 Environment-friendly polishing edge sawing machine for processing formaldehyde-free furniture board
EP4047635A1 (en) 2021-02-18 2022-08-24 Siltronic AG Method of manufacturing wafers from a cylindrical rod of semiconductor material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19739265A1 (en) * 1996-09-09 1998-03-12 Koyo Machine Ind Co Double-sided grinding device for thin disc-like workpieces
JPH10277894A (en) * 1997-04-04 1998-10-20 Nippei Toyama Corp Machining method of wafer and surface grinding machine as well as grinding tool

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774348A (en) * 1971-04-30 1973-11-27 Litton Industries Inc Horizontal double disc grinder with anti-vacuum control
US3846940A (en) * 1973-03-08 1974-11-12 Litton Industries Inc Double disc grinder
JPS61146460A (en) * 1984-12-19 1986-07-04 Hitachi Seiko Ltd Surface grinding method
US5121572A (en) * 1990-11-06 1992-06-16 Timesavers, Inc. Opposed disc deburring system
US5755613A (en) * 1994-08-31 1998-05-26 Matsushita Electric Industrial Co., Ltd. Two grinder opposed grinding apparatus and a method of grinding with the apparatus
DE19513383C2 (en) * 1995-04-08 1997-11-20 Supfina Grieshaber Gmbh & Co Device for double-sided fine machining or superfinishing of disk-shaped workpieces
JP3664188B2 (en) 1995-12-08 2005-06-22 株式会社東京精密 Surface processing method and apparatus
US5934983A (en) * 1996-04-08 1999-08-10 Kabushiki Kaisha Kobe Seiko Sho Double-side grinding method and double-side grinder
JPH09277158A (en) * 1996-04-15 1997-10-28 Speedfam Co Ltd Streak pattern forming method and device thereof for disc
JP3230149B2 (en) * 1997-02-07 2001-11-19 光洋機械工業株式会社 Double-side grinding machine for thin disk-shaped work
JP3094124B2 (en) * 1996-09-09 2000-10-03 光洋機械工業株式会社 Double-side grinding machine for thin disk-shaped work
JPH10180602A (en) * 1996-12-20 1998-07-07 Koyo Mach Ind Co Ltd Double grinding device for disklike sheet workpiece
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
JP3664357B2 (en) * 1998-01-27 2005-06-22 三菱住友シリコン株式会社 Wafer grinding equipment
JPH11254282A (en) * 1998-03-04 1999-09-21 Super Silicon Kenkyusho:Kk Duplex grinding device and duplex polishing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19739265A1 (en) * 1996-09-09 1998-03-12 Koyo Machine Ind Co Double-sided grinding device for thin disc-like workpieces
JPH10277894A (en) * 1997-04-04 1998-10-20 Nippei Toyama Corp Machining method of wafer and surface grinding machine as well as grinding tool

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 01 29 January 1999 (1999-01-29) *
See also references of WO0121356A1 *

Also Published As

Publication number Publication date
EP1193029B1 (en) 2005-08-31
WO2001021356A1 (en) 2001-03-29
TW450875B (en) 2001-08-21
DE60022356D1 (en) 2005-10-06
US6726525B1 (en) 2004-04-27
DE60022356T2 (en) 2006-06-22
KR20010082307A (en) 2001-08-29
KR100706626B1 (en) 2007-04-13
EP1193029A1 (en) 2002-04-03
JP3829239B2 (en) 2006-10-04

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