AU1024301A - Method and device for treating surfaces of objects - Google Patents

Method and device for treating surfaces of objects

Info

Publication number
AU1024301A
AU1024301A AU10243/01A AU1024301A AU1024301A AU 1024301 A AU1024301 A AU 1024301A AU 10243/01 A AU10243/01 A AU 10243/01A AU 1024301 A AU1024301 A AU 1024301A AU 1024301 A AU1024301 A AU 1024301A
Authority
AU
Australia
Prior art keywords
objects
treating surfaces
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU10243/01A
Inventor
Ulrich Schnyder
Reinhard Schwarz
Jurgen Seeberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gebr DECKER & Co KG GmbH
Original Assignee
Decker And Co KG Geb GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Decker And Co KG Geb GmbH filed Critical Decker And Co KG Geb GmbH
Publication of AU1024301A publication Critical patent/AU1024301A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0094—High foaming compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
    • B01F23/235—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids for making foam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • C11D2111/42—
    • C11D2111/44—
AU10243/01A 1999-10-13 2000-10-12 Method and device for treating surfaces of objects Abandoned AU1024301A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19949315 1999-10-13
DE19949315 1999-10-13
PCT/EP2000/010055 WO2001027986A1 (en) 1999-10-13 2000-10-12 Method and device for treating surfaces of objects

Publications (1)

Publication Number Publication Date
AU1024301A true AU1024301A (en) 2001-04-23

Family

ID=7925467

Family Applications (1)

Application Number Title Priority Date Filing Date
AU10243/01A Abandoned AU1024301A (en) 1999-10-13 2000-10-12 Method and device for treating surfaces of objects

Country Status (3)

Country Link
AU (1) AU1024301A (en)
DE (1) DE10050636A1 (en)
WO (1) WO2001027986A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6669902B1 (en) * 2000-11-08 2003-12-30 L'air Liquide - Societe Anonyme A'directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Ozonated foam medium and production system and method for sanitizing a food processing environment
US20030171239A1 (en) 2002-01-28 2003-09-11 Patel Bakul P. Methods and compositions for chemically treating a substrate using foam technology
WO2003064581A1 (en) * 2002-01-28 2003-08-07 Ekc Technology, Inc. Methods and compositions for chemically treating a substrate using foam technology
DE10313692B4 (en) * 2003-03-26 2005-06-23 Werner Rietmann Method for surface and / or depth treatment of at least one semiconductor substrate and Tauchbadvorrichtung thereto
DE102007058503B4 (en) * 2007-12-05 2011-08-25 Siltronic AG, 81737 Process for the wet-chemical treatment of a semiconductor wafer
DE102009053574A1 (en) * 2009-11-06 2011-05-12 Gebr. Schmid Gmbh & Co. Method for producing printed circuit board and photovoltaic module, involves continuously extracting accumulated foam and/or accumulated foam-containing process solution, and partially removing foam and/or process solution by filter unit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB963327A (en) * 1961-03-02 1964-07-08 Ici Australia Ltd Method and apparatus for the removal of adherent deposits
US4360410A (en) * 1981-03-06 1982-11-23 Western Electric Company, Inc. Electroplating processes and equipment utilizing a foam electrolyte
JPS61216330A (en) * 1985-02-13 1986-09-26 Fujitsu Ltd Etching device for semiconductor device
JPS63247384A (en) * 1987-04-03 1988-10-14 Riko Kiyousan Kk Surface treatment of metal by spreading of foamy chemicals
US4849027A (en) * 1987-04-16 1989-07-18 Simmons Bobby G Method for recycling foamed solvents
RU2127926C1 (en) * 1994-12-29 1999-03-20 Акционерное общество закрытого типа "Техномаш МТ" Method and device for deep anisotropic etching of silicon plates
US6090217A (en) * 1998-12-09 2000-07-18 Kittle; Paul A. Surface treatment of semiconductor substrates

Also Published As

Publication number Publication date
WO2001027986A1 (en) 2001-04-19
DE10050636A1 (en) 2001-04-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase