EP1186060A1 - Current-carrying connecting elements for plate conductors consisting of high-temperature supraconductive thin layers - Google Patents

Current-carrying connecting elements for plate conductors consisting of high-temperature supraconductive thin layers

Info

Publication number
EP1186060A1
EP1186060A1 EP00951214A EP00951214A EP1186060A1 EP 1186060 A1 EP1186060 A1 EP 1186060A1 EP 00951214 A EP00951214 A EP 00951214A EP 00951214 A EP00951214 A EP 00951214A EP 1186060 A1 EP1186060 A1 EP 1186060A1
Authority
EP
European Patent Office
Prior art keywords
current
htsl
temperature superconducting
thin layers
connecting elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00951214A
Other languages
German (de)
French (fr)
Inventor
Andreas Stelzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1186060A1 publication Critical patent/EP1186060A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/68—Connections to or between superconductive connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/30—Devices switchable between superconducting and normal states

Definitions

  • the invention relates to current-carrying connecting elements for plate conductors made of high-temperature superconducting thin layers, in particular for resistive current limiting devices in switchgear for power supply and distribution, wherein at least two plate conductors arranged one behind the other are connected in an electrically conductive manner via the current-carrying connecting elements and are provided with electrical contact surfaces for receiving current supply lines.
  • the object on which the invention is based is to substantially improve the current-carrying connecting elements for plate conductors with regard to the undesired heating of the coolant and to design them such that the use of current limiting devices for high currents is also profitable. According to the invention, this is due to the features
  • the high-temperature superconducting tapes are electrically conductively connected to the high-temperature superconducting thin layers via cohesive and / or non-positive conductive connections
  • the high-temperature superconducting tapes have an approximation adapted to the spacing of the plate conductors of the high-temperature superconducting thin layers to be connected to one another arcuate cross-sectional contour reached.
  • the high-temperature superconducting tapes as current-carrying connecting elements for plate conductors, which are connected to the conductor tracks of the high-temperature superconducting thin layers are electrically conductively connected via cohesive and / or non-positive conductive connections, the resistance of the electrical connection is reduced to a minimum and the heat input into the coolant is accordingly kept low.
  • the direct contact points between the high-temperature superconducting tapes and the high-temperature superconducting thin layers are not exposed to inadmissible heating and thus to premature destruction.
  • the almost arch-shaped cross-sectional contour of the high-temperature superconducting tapes which can also be further processed as prefabricated components in automated production processes, allows for very flexible adaptation to different distances between the plate conductors.
  • the high-temperature superconducting thin layers of the plate conductors are arranged in relation to one another in such a way that the high-temperature superconducting tapes with the free ends form the cohesive and / or non-positive conductive connections alternately with their inner contour and / or their outer contour and / or end face, 2.2 the cohesive and / or non-positive guide connections are preferably provided over the entire width of the high-temperature superconducting tapes.
  • partial regions of the plate conductors PL1, Pin are shown, on the front surfaces of which conductor tracks, not shown in more detail, made of high-temperature superconducting thin layer HTLS-DS are applied. Furthermore, it is indicated that the inner contour of the high-temperature superconducting tape HTSL-BD with the front of the first plate conductor PLl and the outside contour of the same high-temperature superconducting tape HTSL-BD with the front of the nth plate conductor PLn via the conductive connections LV electrically conductive with each other are connected.
  • the electrically conductive connections can be LV soldered connections, the soldered joints being able to include the inner and outer contours of the high-temperature superconducting tapes HTSL-BD as well as their end faces if necessary.
  • the lead connections LV are implemented over the entire surface.
  • the high-temperature superconducting tapes only one high-temperature superconducting tape HTSL-BD is shown, have an approximately arcuate cross-sectional contour and can therefore be very easily adapted to different distances between the plate conductors PL1, PLn.
  • HTSL-DS conductor tracks can also have meandering or other types of profile structures in addition to the frequently provided U-profiles.
  • the electrical contact surfaces for receiving the power supply lines, as are necessary in particular for the current limiting devices of the switchgear, are not shown.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Emergency Protection Circuit Devices (AREA)

Abstract

The invention relates to current-carrying connecting elements for plate conductors consisting of high-temperature supraconductive thin layers, especially for resistive current-limiting devices in switchgear assemblies used for supplying and distributing energy. At least two plate conductors that are situated one behind the other are electroconductively connected by the current-carrying connecting elements and are provided with electrical contact surfaces for receiving current supply lines. The current-carrying connecting elements consist of high-temperature supraconductive strips (HTSL-BD) which are electroconductively connected to the high temperature supraconductive thin layers (HTSL-DS) by material and/or nonpositive fit conducting connections (LV). The approximately arch-shaped cross-sectional contour of the high temperature supraconductive strips (HTSL-BD) is adapted to the distance between the high-temperature supraconductive thin layers (HTSL-DS) to be connected. The current-carrying connecting elements and the plate conductors are constituent parts of resistive current-limiting devices in switchgear assemblies used for supplying and distributing energy.

Description

Beschreibungdescription
Stromtragende Verbindungselemente für Plattenleiter aus hochtemperatur-supraleitenden DünnschichtenCurrent-carrying connecting elements for plate conductors made of high-temperature superconducting thin layers
Die Erfindung betrifft stromtragende Verbindungselemente für Plattenleiter aus hochtemperatur-supraleitenden Dünnschichten, insbesondere für resistive Strombegrenzungseinrichtungen in Schaltanlagen der Energieversorgung und -Verteilung, wobei mindestens zwei hintereinander angeordnete Plattenleiter über die stromtragenden Verbindungselemente elektrisch leitend verbunden und mit elektrischen Kontaktflächen zur Aufnahme von Stromzuleitungen versehen sind.The invention relates to current-carrying connecting elements for plate conductors made of high-temperature superconducting thin layers, in particular for resistive current limiting devices in switchgear for power supply and distribution, wherein at least two plate conductors arranged one behind the other are connected in an electrically conductive manner via the current-carrying connecting elements and are provided with electrical contact surfaces for receiving current supply lines.
Stromtragende Verbindungselemente für Plattenleiter aus hochtemperatur-supraleitenden Dünnschichten sind u. a., insbesondere im Zusammenhang mit resistiven Strombegrenzungseinrichtungen, aus der EP 0 829 101 Bl bekannt. Die hier offenbarten Strombegrenzungseinrichtungen sind wegen höherer Span- nungen aus mehreren hintereinander gestapelten doppelseitig beschichteten Plattenleitern zusammengesetzt. Die Leiterbahnen sind aus hochtemperatur-supraleitenden Dünnschichten gebildet und an einem Ende über die Kontaktflächen mittels Verbindungsbrücken elektrisch hintereinander geschaltet. Die an- deren Enden der Leiterbahnen sind über weitere durchgehende Kontaktflächen unmittelbar miteinander verbunden und dienen gleichzeitig zur Aufnahme der Stromzuleitungen. Die Verbindungsbrücken und die Stromzuleitungen werden mit den Kontakt- flächen mittels Löt-, Press- oder Federkontakten elektrisch leitend verbunden. Je nach Art der Kontaktgestaltung stellen sich endliche ohmsche Widerstände ein, an denen durch die im Normalbetrieb fließenden Ströme Wärme erzeugt wird. Da insbesondere die resistiven Strombegrenzungseinrichtungen direkt in die zu schützenden Stromkreise geschaltet sind, wird bei den relativ hohen Betriebsströmen selbst bei niedrigen Kontakt- und Verbindungswiderständen eine nicht unerheb- liehe Wärmemenge freigesetzt, die das Kühlmittel entsprechend erwärmt. Die Wärmeverluste, die sich insbesondere noch mit steigender Anzahl von Plattenleitern entsprechend vervielfachen, können dabei die Größenordnung der Stromzuführungsverluste erreichen bzw. diese sogar noch übersteigen. Die da- durch bedingte unerwünschte Erwärmung des Kühlmittels ist nur mit hohem Aufwand durch Kälteerzeugungsmaschienen mit bekanntermaßen schlechtem Wirkungsgrad auszugleichen. Die der Erfindung zugrundeliegende Aufgabe besteht darin, die stromtragenden Verbindungselementen für Plattenleiter hin- sichtlich der unerwünschten Erwärmung des Kühlmittels wesentlich zu bessern und so auszulegen, daß auch der Einsatz von Strombegrenzungseinrichtungen für hohe Ströme rentabel ist. Erfindungsgemäß wird dies durch die MerkmaleCurrent-carrying connecting elements for plate conductors made of high-temperature superconducting thin layers are known from EP 0 829 101 B1, in particular in connection with resistive current limiting devices. Because of higher voltages, the current limiting devices disclosed here are composed of several stacked double-sided coated plate conductors. The conductor tracks are formed from high-temperature superconducting thin layers and electrically connected in series at one end via the contact areas by means of connecting bridges. The other ends of the conductor tracks are directly connected to one another via further continuous contact areas and at the same time serve to receive the power supply lines. The connecting bridges and the power supply lines are connected to the contact surfaces in an electrically conductive manner by means of solder, press or spring contacts. Depending on the type of contact design, there are finite ohmic resistances at which heat is generated by the currents flowing during normal operation. Since, in particular, the resistive current limiting devices are connected directly into the circuits to be protected, a not inconsiderable amount of heat is released at the relatively high operating currents, even with low contact and connection resistances, which heats the coolant accordingly. The heat losses, which in particular multiply accordingly with an increasing number of plate conductors, can reach the order of magnitude of the power supply losses or even exceed them. The resulting undesired heating of the coolant can only be compensated for at great expense by refrigeration machines with a known poor efficiency. The object on which the invention is based is to substantially improve the current-carrying connecting elements for plate conductors with regard to the undesired heating of the coolant and to design them such that the use of current limiting devices for high currents is also profitable. According to the invention, this is due to the features
1.1 die stromtragenden Verbindungselemente sind durch hochtemperatur-supraleitende Bänder realisiert,1.1 the current-carrying connecting elements are realized by high-temperature superconducting tapes,
1.2 die hochtemperatur-supraleitenden Bänder sind mit den hochtemperatur-supraleitenden Dünnschichten über Stoff- schlüssige und/oder kraftschlüssige Leitverbindungen elektrisch leitend verbunden, 1.3 die hochtemperatur-supraleitenden Bänder weisen eine an den Abstand der Plattenleiter der miteinander zu verbindenden hochtemperatur-supraleitenden Dünnschichten angepaßte, annähernd bogenförmige Querschnittskontur auf, erreicht .1.2 the high-temperature superconducting tapes are electrically conductively connected to the high-temperature superconducting thin layers via cohesive and / or non-positive conductive connections, 1.3 the high-temperature superconducting tapes have an approximation adapted to the spacing of the plate conductors of the high-temperature superconducting thin layers to be connected to one another arcuate cross-sectional contour reached.
Mit dem Einsatz der hochtemperatur-supraleitenden Bänder als stromtragende Verbindungselemente für Plattenleiter, die mit den Leiterbahnen der hochtemperatur-supraleitenden Dünn- schichten über Stoffschlüssige und/oder kraftschlüssige Leit- verbindungen elektrisch leitend verbunden sind, ist der Widerstand der elektrischen Verbindung auf ein Minimum reduziert und damit der Wärmeeintrag in das Kühlmittel entsprechend gering gehalten. Darüber hinaus sind auch die unmittelbaren Kontaktstellen zwischen den hochtemperatur-supraleitenden Bändern und den hochtemperatur-supraleitenden Dünnschichten keiner unzulässigen Erwärmung und damit einer frühzeitigen Zerstörung ausgesetzt.With the use of the high-temperature superconducting tapes as current-carrying connecting elements for plate conductors, which are connected to the conductor tracks of the high-temperature superconducting thin layers are electrically conductively connected via cohesive and / or non-positive conductive connections, the resistance of the electrical connection is reduced to a minimum and the heat input into the coolant is accordingly kept low. In addition, the direct contact points between the high-temperature superconducting tapes and the high-temperature superconducting thin layers are not exposed to inadmissible heating and thus to premature destruction.
Mit der annähernd bogenförmigen Querschnittskontur der hochtemperatur-supraleitende Bänder, die als vorgefertigte Bauteile auch in automatisierten Fertigungsabläufen weiterverarbeitet werden können, ist eine sehr flexible Anpassung an unterschiedliche Abstände der Plattenleiter gegeben.The almost arch-shaped cross-sectional contour of the high-temperature superconducting tapes, which can also be further processed as prefabricated components in automated production processes, allows for very flexible adaptation to different distances between the plate conductors.
Gemäß einer vorteilhaften Ausgestaltung der Erfindung sind die MerkmaleAccording to an advantageous embodiment of the invention, the features are
2.1 die hochtemperatur-supraleitenden Dünnschichten der Plattenleiter sind derart zueinander angeordnet, daß die hochtemperatur-supraleitenden Bänder mit den freien Enden jeweils wechselseitig mit ihrer Innenkontur und/oder ihrer Außenkontur und/oder Stirnfläche die stoffschlüssigen und/oder kraftschlüssigen Leitverbindungen bilden, 2.2 die stoffschlüssigen und/oder kraftschlüssigen Leitverbindungen sind vorzugsweise vollflächig über die gesamte Breite der hochtemperatur-supraleitenden Bänder ausgeführt , vorgesehen.2.1 the high-temperature superconducting thin layers of the plate conductors are arranged in relation to one another in such a way that the high-temperature superconducting tapes with the free ends form the cohesive and / or non-positive conductive connections alternately with their inner contour and / or their outer contour and / or end face, 2.2 the cohesive and / or non-positive guide connections are preferably provided over the entire width of the high-temperature superconducting tapes.
Mit der wechselseitig gebildeten Leitverbindung ist eine automatisierte Herstellung der Verbindungen erheblich erleichtert und darüber hinaus mit der vollflächigen Wirkung bei stoffschlüssigen und/oder kraftschlüssigen Leitverbindungen ein besonders geringer Übergangswiderstand gegeben.With the mutually formed lead connection, automated production of the connections is made considerably easier and moreover with the full-surface effect cohesive and / or non-positive lead connections given a particularly low contact resistance.
Die Erfindung wird durch ein figürlich dargestelltes Ausfüh- rungsbeispiel näher erläutert, in dem die zum Verständnis wesentlichen Teile auszugsweise und lediglich in einer Prinzipdarstellung gezeigt sind.The invention is explained in more detail by means of a figurative exemplary embodiment in which the parts essential for understanding are shown in extracts and only in a basic illustration.
Im Ausführungsbeispiel sind Teilbereiche der Plattenleiter PLl, Pin abgebildet, auf deren Frontflächen nicht näher dargestellte Leiterbahnen aus hochtemperatur-supraleitender Dünnschicht HTLS-DS aufgebracht sind. Des Weiteren ist angedeutet, daß die Innenkontur des hochtemperatur-supraleitenden Bandes HTSL-BD mit der Frontseite des ersten Plattenleiters PLl und die Außenkontur des gleichen hochtemperatur- supraleitenden Bandes HTSL-BD mit der Frontseite des nten Plattenleiters PLn über die Leit erbindungen LV elektrisch leitend miteinander verbunden sind. Die elektrisch leitenden Verbindungen können als Leitverbindungen LV LötVerbindungen sein, wobei die Lötstellen neben den Innen- und Außenkonturen der hochtemperatur-supraleitenden Bänder HTSL-BD im Bedarfsfall auch deren Stirnflächen mit einschließen können. Die Leitverbindungen LV sind vollflächig ausgeführt. Darüber hinaus weisen die hochtemperatur-supraleitenden Bänder, darge- stellt ist lediglich ein hochtemperatur-supraleitendes Band HTSL-BD, eine annähernd bogenförmige Querschnittkontur auf und können dadurch sehr einfach an ggf. unterschiedliche Abstände der Plattenleiter PLl, PLn angepaßt werden.In the exemplary embodiment, partial regions of the plate conductors PL1, Pin are shown, on the front surfaces of which conductor tracks, not shown in more detail, made of high-temperature superconducting thin layer HTLS-DS are applied. Furthermore, it is indicated that the inner contour of the high-temperature superconducting tape HTSL-BD with the front of the first plate conductor PLl and the outside contour of the same high-temperature superconducting tape HTSL-BD with the front of the nth plate conductor PLn via the conductive connections LV electrically conductive with each other are connected. The electrically conductive connections can be LV soldered connections, the soldered joints being able to include the inner and outer contours of the high-temperature superconducting tapes HTSL-BD as well as their end faces if necessary. The lead connections LV are implemented over the entire surface. In addition, the high-temperature superconducting tapes, only one high-temperature superconducting tape HTSL-BD is shown, have an approximately arcuate cross-sectional contour and can therefore be very easily adapted to different distances between the plate conductors PL1, PLn.
Die durch die hochtemperatur-supraleitenden DünnschichtenThe through the high-temperature superconducting thin layers
HTSL-DS nicht dargestellte Leiterbahnen können neben den häufig vorgesehenen U-Profilen auch meanderförmige oder andersgeartete Profilstrukturen aufweisen. Die elektrischen Kontaktflächen zur Aufnahme der Stromzuleitungen, wie sie insbesondere für die Strombegrenzungseinrichtungen der Schaltanlagen notwendig sind, sind aus Gründen ei- ner vereinfachten Darstellung nicht abgebildet. HTSL-DS conductor tracks, not shown, can also have meandering or other types of profile structures in addition to the frequently provided U-profiles. For reasons of a simplified illustration, the electrical contact surfaces for receiving the power supply lines, as are necessary in particular for the current limiting devices of the switchgear, are not shown.

Claims

Patentansprüche claims
1. Stromtragende Verbindungselemente für Plattenleiter aus hochtemperatur-supraleitenden Dünnschichten, insbesondere für resistive Strombegrenzungseinrichtungen in Schaltanlagen der Energieversorgung und -Verteilung, wobei mindestens zwei hintereinander angeordnete Plattenleiter über die stromtragenden Verbindungselemente elektrisch leitend verbunden und mit elektrischen Kontaktflächen zur Aufnahme von Stromzuleitungen versehen sind, g e k e n n z e i c h n e t d u r c h die Merkmale 1.1 die stromtragenden Verbindungselemente sind durch hochtemperatur-supraleitende Bänder (HTSL-BD) realisiert, 1.2 die hochtemperatur-supraleitenden Bänder (HTSL-BD) sind mit den hochtemperatur-supraleitenden Dünnschichten (HTSL-DS) über stoffschlüssige und/oder kraftschlüssige Leitverbindungen (LV) elektrisch leitend verbunden, 1.3 die hochtemperatur-supraleitenden Bänder (HTSL-BD) wei- sen eine an den Abstand der Plattenleiter (PL...) der miteinander zu verbindenden hochtemperatur- supraleitenden Dünnschichten (HTSL-DS) angepaßte, annähernd bogenförmige Querschnittskontur auf .1.Current-carrying connecting elements for plate conductors made of high-temperature superconducting thin layers, in particular for resistive current limiting devices in switchgear for power supply and distribution, at least two plate conductors arranged one behind the other being electrically conductively connected via the current-carrying connecting elements and provided with electrical contact surfaces for receiving current supply lines, characterized by the Features 1.1 the current-carrying connecting elements are realized by high-temperature superconducting tapes (HTSL-BD), 1.2 the high-temperature superconducting tapes (HTSL-BD) are made with the high-temperature superconducting thin layers (HTSL-DS) via cohesive and / or non-positive conductive connections (LV ) electrically connected, 1.3 the high-temperature superconducting tapes (HTSL-BD) point to the distance between the plate conductors (PL ...) of the high-temperature superconductors to be connected end thin layers (HTSL-DS) adapted, approximately arc-shaped cross-sectional contour.
2. Stromtragende Verbindungselemente für Plattenleiter aus hochtemperatur-supraleitenden Dünnschichten nach Patentanspruch 1, g e k e n n z e i c h n e t d u r c h die Merkmale 2.1 die hochtemperatur-supraleitenden Dünnschichten (HTSL- DS) der Plattenleiter (PL...) sind derart zueinander angeordnet, daß die hochtemperatur-supraleitenden Bänder (HTSL-BD) mit den freien Enden jeweils wechselseitig mit ihrer Innenkontur und ihrer Außenkontur und/oder Stirn- flächen die Stoffschlüssigen und/oder kraftschlüssige2. Current-carrying connecting elements for plate conductors made of high-temperature superconducting thin layers according to claim 1, characterized by features 2.1, the high-temperature superconducting thin layers (HTSL-DS) of the plate conductors (PL ...) are arranged in such a way that the high-temperature superconducting tapes (HTSL -BD) with the free ends alternately with their inner contour and their outer contour and / or forehead- surface the cohesive and / or non-positive
Leitverbindungen (LV) bilden, 2.2 die stoffschlüssigen und/oder kraftschlüssigen Leitverbindungen (LV) sind vorzugsweise vollflächig über die gesamte Breite der hochtemperatur-supraleitenden Bänder (HTSL-BD) ausgeführt. Form lead connections (LV), 2.2 the cohesive and / or non-positive lead connections (LV) are preferably carried out over the entire width of the high-temperature superconducting tapes (HTSL-BD).
EP00951214A 1999-06-16 2000-06-14 Current-carrying connecting elements for plate conductors consisting of high-temperature supraconductive thin layers Withdrawn EP1186060A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19928324 1999-06-16
DE19928324A DE19928324A1 (en) 1999-06-16 1999-06-16 Current-carrying connecting elements for plate conductors made of high-temperature superconducting thin layers
PCT/DE2000/001909 WO2000077864A1 (en) 1999-06-16 2000-06-14 Current-carrying connecting elements for plate conductors consisting of high-temperature supraconductive thin layers

Publications (1)

Publication Number Publication Date
EP1186060A1 true EP1186060A1 (en) 2002-03-13

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EP00951214A Withdrawn EP1186060A1 (en) 1999-06-16 2000-06-14 Current-carrying connecting elements for plate conductors consisting of high-temperature supraconductive thin layers

Country Status (5)

Country Link
EP (1) EP1186060A1 (en)
JP (1) JP2003502848A (en)
CA (1) CA2376976A1 (en)
DE (1) DE19928324A1 (en)
WO (1) WO2000077864A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10122085A1 (en) * 2000-05-15 2001-12-06 Theva Duennschichttechnik Gmbh Superconductive switch element for altering electrical resistance has HF magnetic radiation used for switching between superconductive and normally conducting modes
DE10131609B4 (en) * 2001-06-29 2005-08-11 Siemens Ag Device having a circuit of the semiconductor power electronics and having a capacitor having a protective device
DE10230086A1 (en) * 2002-06-27 2004-01-22 Siemens Ag Current limiters for limiting electrical currents

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Publication number Priority date Publication date Assignee Title
FI89643C (en) * 1990-08-17 1993-10-25 Neuromag Oy Superconducting joint for thin film components and method for its manufacture
US5331735A (en) * 1993-04-28 1994-07-26 General Electric Company Method of forming a flexible connector
FR2714544B1 (en) * 1993-12-27 1996-02-02 Alsthom Cge Alcatel Current limiter.
DE4434819C5 (en) * 1994-09-29 2004-05-27 Abb Research Ltd. Current limiting device

Non-Patent Citations (1)

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Title
See references of WO0077864A1 *

Also Published As

Publication number Publication date
WO2000077864A1 (en) 2000-12-21
CA2376976A1 (en) 2000-12-21
DE19928324A1 (en) 2000-12-21
JP2003502848A (en) 2003-01-21

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