EP1181716A4 - Microwave bonding of mems component - Google Patents

Microwave bonding of mems component

Info

Publication number
EP1181716A4
EP1181716A4 EP00928252A EP00928252A EP1181716A4 EP 1181716 A4 EP1181716 A4 EP 1181716A4 EP 00928252 A EP00928252 A EP 00928252A EP 00928252 A EP00928252 A EP 00928252A EP 1181716 A4 EP1181716 A4 EP 1181716A4
Authority
EP
European Patent Office
Prior art keywords
mems component
microwave bonding
microwave
bonding
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00928252A
Other languages
German (de)
French (fr)
Other versions
EP1181716A1 (en
Inventor
Martin B Barmatz
John D Mai
William T Pike
Nasser K Budra
Henry W Jackson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
California Institute of Technology CalTech
Original Assignee
California Institute of Technology CalTech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by California Institute of Technology CalTech filed Critical California Institute of Technology CalTech
Publication of EP1181716A1 publication Critical patent/EP1181716A1/en
Publication of EP1181716A4 publication Critical patent/EP1181716A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
EP00928252A 1999-04-22 2000-04-20 Microwave bonding of mems component Withdrawn EP1181716A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13084299P 1999-04-22 1999-04-22
US130842P 1999-04-22
PCT/US2000/010685 WO2000065641A1 (en) 1999-04-22 2000-04-20 Microwave bonding of mems component

Publications (2)

Publication Number Publication Date
EP1181716A1 EP1181716A1 (en) 2002-02-27
EP1181716A4 true EP1181716A4 (en) 2006-05-24

Family

ID=22446626

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00928252A Withdrawn EP1181716A4 (en) 1999-04-22 2000-04-20 Microwave bonding of mems component

Country Status (3)

Country Link
EP (1) EP1181716A4 (en)
AU (1) AU4651300A (en)
WO (1) WO2000065641A1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57132334A (en) * 1981-02-06 1982-08-16 Mitsubishi Electric Corp Soldering method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2708170B1 (en) * 1993-07-19 1995-09-08 Innovation Dev Cie Gle Electronic circuits with very high conductivity and great finesse, their manufacturing processes, and devices comprising them.

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57132334A (en) * 1981-02-06 1982-08-16 Mitsubishi Electric Corp Soldering method

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
BUDRAA N K ET AL: "LOW PRESSURE AND LOW TEMPERATURE HERMETIC WAFER BONDING USING MICROWAVE HEATING", TECHNICAL DIGEST OF THE IEEE INTERNATIONAL MEMS '99 CONFERENCE. 12TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS. ORLANDO, FL, JAN. 17 - 21, 1999, IEEE INTERNATIONAL MICRO ELECTRO MECHANICAL SYSTEMS CONFERENCE, NEW YORK, NY : IE, 17 January 1999 (1999-01-17) - 21 January 1999 (1999-01-21), pages 490 - 492, XP000830796, ISBN: 0-7803-5195-9 *
PATENT ABSTRACTS OF JAPAN vol. 006, no. 230 (E - 142) 16 November 1982 (1982-11-16) *
See also references of WO0065641A1 *

Also Published As

Publication number Publication date
WO2000065641A1 (en) 2000-11-02
WO2000065641A8 (en) 2001-05-03
AU4651300A (en) 2000-11-10
EP1181716A1 (en) 2002-02-27
WO2000065641A9 (en) 2002-07-11

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Legal Events

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