Classifications

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  • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07743—External electrical contacts
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  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L21/4814—Conductive parts
  • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
  • H01L21/4867—Applying pastes or inks, e.g. screen printing
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  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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  • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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  • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
  • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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  • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Definitions

• the invention relates to a method of manufacturing portable storage medium provided with flush contacts.
• the invention applies to smart card type supports.
• Chip cards are being used more and more for various operations such as, for example, banking operations, telephone communications operations or various identification operations.
• Contact smart cards include metallizations flush with the surface of the card, defined by the usual standard IS07816.
• These metallizations are intended to come into contact with a read head of a reader for the purpose of electrical data transmission.
• smart cards are thin portable objects whose dimensions are standardized.
• the usual ISO 7810 standard corresponds to a standard format card 85 mm long, 54 mm wide and 0.76 mm thick.
• a conventional method illustrated in FIG. 1 consists in bonding an integrated circuit chip 20 by placing its active face with its contact pads 22 upwards, and by bonding the opposite face to a dielectric support sheet 28.
• the sheet dielectric 28 is itself disposed on a contact grid 24 of a metallic plate of nickel-plated and golden copper.
• Connection wells 21 are formed in the dielectric sheet 28 and connection wires 26 connect the contact pads 22 of the chip 20 to the contact pads of the metal grid 24 via these connection wells 21.
• an encapsulation resin 30, based on epoxy protects the chip 20 and the connection wires 26 welded. The module thus formed is then cut out, then inserted into the cavity of a card body previously produced.
• An object of the present invention is therefore to produce portable storage media of the smart card type at low cost price enabling large-scale production.
• the invention aims to minimize the cost of manufacturing smart cards, which can allow mass production.
• the subject of the invention is therefore a method of manufacturing portable storage media of the smart card type comprising contact pads flush-mounted on a substrate, an integrated circuit chip housed in a cavity formed in the supports, provided with contact pads electrically connected to the flush contact pads, said method comprising a step of producing said contact pads and a step of setting placing said substrate and integrated circuit chip elements in the cavity; mainly characterized in that: the step of producing the contact pads is carried out by printing conductive material on a first face of an adhesive dielectric film, and the positioning step is carried out by fixing the second face of the adhesive dielectric film in said cavity.
• the printing material is a conductive ink.
• the step of placing in the cavity comprises a preliminary step of cutting the adhesive film around the printed patterns to form an adhesive substrate supporting the contact pads, and a step of bonding to the edges of the cavity, the second face of said adhesive substrate serving as a bonding medium.
• the adhesive film has its second face protected by a strip also serving as a support to allow continuous printing of the patterns on said film, constituting the contact pads.
• the adhesive film can be activated.
• the film with adhesive material is heat-activated and is composed of a material belonging in particular to the family of modified PE (polyethylene), to the family of modified PU (polyurethane), or to the family of PP
• the film with adhesive material has a thermosetting phase.
• the support strip is a strip of material based on cellulose or non-stick plastic, in particular paper or siliconized PET.
• the protective film of the film is precut so as to free an area reserved for the chip and the electrical connections and to keep a rigid frame around this area, during the removal of this tape, said frame being removed before the installation of the elements in the cavity.
• the method includes a step of connecting the contact pads to the contact pads of a pattern printed on the adhesive film.
• the electrical connection between the contact pads of the chip and the contact pads is made through the thickness of the adhesive film, the integrated circuit chip being placed on the second face of the film.
• Electrically conductive bosses are produced on the contact pads of the chips.
• the electrical connection between the contact pads of an integrated circuit chip and the contact pads can be established by means of the electrically conductive bosses which are embedded in the thickness of the adhesive film.
• the embedding of the electrically conductive bosses in the thickness of the adhesive film is carried out by applying pressure to the integrated circuit chip.
• the embedding of the electrically conductive bosses in the thickness of the adhesive film is further facilitated by heating the adhesive material.
• the integrated circuit chip is oriented so as to have its contact pads above the printed contact pads, so as to make the connection between the contact pads of the chip and the contact pads.
• the method comprises a step of producing openings in the thickness of the adhesive film opposite the contact pads in order to expose them.
• the electrical connection between the contact pads of the chip and the contact pads is established by means of an electrically conductive resin which is dispensed in the openings and up to the contact pads of the chip.
• the method comprises a step of transfer, prior to connection, of the integrated circuit chip on the adhesive film to form micromodules.
• the various patterns printed on the film are cut either before or after the transfer of the integrated circuit chips to the substrate.
• the step of placing the integrated circuit chip and the printed adhesive substrate in an open cavity formed in the support comprises: the transfer of the micromodule into the cavity by thermocompression on the substrate in order to allow adhesion of the lower face of said substrate on the walls of the cavity, the contact pads being placed on the outside of the cavity and the integrated circuit chip being placed on the inside of the cavity.
• the integrated circuit chip is first placed in the bottom of the cavity so that its active face is oriented towards the opening of the cavity, then,
• the adhesive substrate is transferred so that the printed contact pads are positioned opposite the contact pads of the integrated circuit chip, this transfer consisting of hot lamination. to allow simultaneous electrical connection between the contact pads and the contact pads of the chip and a fixing of the underside of the adhesive film on the walls of the cavity.
• the integrated circuit chip and its electrical connections with the contact pads can also be encapsulated in a protective resin.
• Another object of the invention is a portable support module of the smart card type comprising contact pads carried by a first face of a substrate film, in which the substrate is an adhesive mass and in which the pads are a material. printed carrier.
• the portable support module further includes an integrated circuit chip attached to the second face of said substrate film.
• Another object of the invention is a portable storage medium of the smart card type, comprising such a module.
• FIGS. 2, 3A, 3B diagrams of a patterned strip produced according to a method of the invention, with a view to manufacturing micromodules continuously, said strip being shown respectively in section, top view and bottom view,
• FIGS. 2, 3A and 3B a sectional view of a micromodule produced in accordance with a first embodiment of the connection step of the manufacturing process according to the invention, from the patterned strip illustrated in FIGS. 2, 3A and 3B,
• FIG. 5 a sectional view of another micromodule produced according to a second embodiment
• FIGS. 6A to 6C diagrams of a substrate of another micromodule produced according to a third connection mode according to the method of the invention, said substrate being shown respectively in section, in top view and in bottom view ,
• FIG. 7 a sectional view of a micromodule produced in accordance with the third embodiment of the connection step of the manufacturing method according to the invention from the substrate of Figures 6A to 6C, - Figure 8, a view in section of a smart card comprising the micromodule of FIG. 4,
• FIG. 9 a sectional view of a smart card comprising a substrate according to FIG. 4,
• FIG. 10 a sectional view of a smart card comprising the micromodule of FIG. 5,
• FIG. 11 a sectional view of a smart card comprising the micromodule of FIG. 7.
• Figures 2, 3A, 3B show schematically respectively a sectional view, a top view and a bottom view of a patterned strip intended to allow the production of micromodules continuously.
• This strip consists of an insulating material 100 which is supported by a protective material 110 intended to stiffen it and to drive it continuously.
• the insulating material 100 used is in fact relatively thin and soft so that it must be supported by a more rigid material in order to be able to be driven continuously. This insulating material 100 is intended to form the support of the micromodule. It is described in more detail below.
• the protective material 110 is preferably wider than the insulating material 100 and has perforations 111, distributed regularly along its longitudinal edges, on one of its sides or on its two sides. These perforations 111 are used for driving the strip by a toothed wheel system for automatic strip transport (TAB).
• TAB toothed wheel system for automatic strip transport
• the strip can also be transported using a roller conveyor system, replacing the perforations with targets, printed on the protective material 110 at the same time as the pattern 150 on the dielectric material 100, and whose role is to allow the 'indexing by an optical device.
• the step of producing a micromodule according to a characteristic of the invention consists firstly in making this strip; and more particularly on the upper face, not covered by the protective material 110, of the dielectric material 100; a pattern 150 by printing conductive ink.
• This repeating pattern 150 consists of contact pads 151 of a connection terminal block. These connection pads 151 are close enough to be able to subsequently make an electrical connection with the associated contact pads of an integrated circuit chip. Their thickness is typically about 10mm.
• the printing of conductive ink to form the contact pads 151 can be carried out according to various known techniques. Thus, it can be carried out by pad printing, by an offset printing technique, by inkjet, or finally by screen printing or spraying with the use of a mask ...
• the conductive ink can be constituted by a solvent ink, comprising a polymer resin dissolved in a solvent with conductive fillers, which hardens by evaporation of the solvent.
• the ink can also be a one-component or two-component thermosetting ink, a UV polymerization ink, a solder paste type compound or a metallic alloy.
• This patterned strip therefore makes it possible to manufacture micromodules continuously, from pattern 150, printed repeatedly on this strip, and integrated circuit chips which are then transferred to the strip and connected to each copy of the pattern.
• Each printed pattern 150 can be cut either before or after the transfer of the chip, in order to separate it from the rest of the strip.
• a dielectric substrate is then obtained forming the support of a previously printed connection terminal block, constituted by the contact pads 151.
• the dielectric material 100 which forms the main support of the integrated circuit chips.
• This dielectric material 100 also has the distinction of being an adhesive.
• This adhesive material can be reactivated in temperature for example. It may also be envisaged that this adhesive material can be reactivated by another method, such as by the application of pressure for example.
• this dielectric adhesive material 100 supports the contact pads 151 printed and intended to be flush with the surface of a smart card, while the lower face has the property of being adhesive when activated so that it is intended to allow the fixing of the micromodule in the card body.
• the adhesive material 100 belongs for example to the family of modified PE (polyethylenes), to the family of modified PU (polyurethanes) or to the family of PP
• thermosetting material (polypropylenes) modified or copolyamides or phenolics.
• it will not be sticky at room temperature so that it can be handled in the same way as a conventional plastic sheet. It can also contain a certain amount of thermosetting material.
• the adhesive material 100 used is a non-self-adhesive thermoplastic reaction glue, supplied on a roll in particular by the company BEIERSDORF under the reference TESA 8420. It especially comprises a mixture of phenolic resin and nitrile rubber. It is able to exhibit a thermoplastic behavior (or a phase) alone, and a thermosetting phase as a function of the temperature.
• the heat-activatable material has a non-reversible (or non-reactivable) state after specific activation.
• the thickness of this thermo-adhesive film 100 is relatively thin, this is why the film is not rigid enough to be driven without support. This thickness is preferably between 30 and 60 mm.
• the sheet of protective material 110 can be made of paper, cardboard or plastic of the type PET (Polyethylene terephthalate) and it is slightly silicone for example. It is rigid enough to allow the patterned band to advance.
• this material is preferably precut along the precut lines 112, in order to free an area 113, reserved for the transfer of the chip, and to keep a rigid reinforcement 114 capable of preserving a certain rigidity of the strip and to simultaneously protect the heat-activated adhesive material to prevent its early activation.
• a step of the method comprising the formation of a micromodule, an integrated circuit chip is transferred and its contact pads are connected to the contact pads 151 previously printed.
• the integrated circuit chip can be transferred according to different types of assembly.
• a first method consists in transferring the chip 200 to the other face (lower face) of the heat-activatable adhesive support 100, so that the active face of the chip 200, with its contact pads 210, is oriented towards the underside of the support.
• electrically conductive bosses 220 are produced on the contact pads 210 of the chip 200, prior to the postponement of the latter. These bosses 220 advantageously become embedded in the thickness of the heat-activatable adhesive substrate 100 and thus make it possible to establish the electrical connection between the contact pads 210 of the chip 200 and the contact pads 151 which are associated with them.
• the electrically conductive bosses 220 are preferably produced according to a geometry having aggressive edges, for example according to a conical geometry, in order to more easily pass through the heat-activatable adhesive material 100.
• This adhesive material being thin or soft, has the characteristic of being easily perforable.
• the bosses 220 are for example produced by depositing a metal, or by screen printing of conductive ink, or else by growth of a stainless coating, in particular of electrolytic type.
• the thickness of the bosses 220 is, in this case, established so that it is equivalent to or slightly less than the sum of the thicknesses of the contact pads 151 printed and of the substrate made of heat-activatable adhesive material 100. Their thickness is therefore preferably between 40 and 50 mm.
• FIG. 5 A variant of this first transfer method is illustrated in FIG. 5. This variant consists in transferring the chip 230 according to a “flip chip” type assembly on the upper face of the substrate 100, supporting the contact pads 151 previously printed.
• the bosses 232 produced on the contact pads 231 of the chip 230 preferably have a thickness approximately equal to, or slightly less than, that of the contact pads 151.
• the transfer of the chip is preferably carried out by hot compression. Heating thus makes it possible to soften the conductive ink constituting the contact pads 151.
• the interconnection assembly obtained is allowed to cool in ambient air so that the conductive ink regains its solid state and its initial shape. In this case, it is also preferred to protect the chip 230 and the electrical connections in a protective resin.
• the chip can also be transferred to freshly produced printing, drying being carried out online.
• FIGS. 6A to 6C and 7. Another method for transferring the chip is illustrated in FIGS. 6A to 6C and 7.
• small openings 130 are made in the thickness of the dielectric adhesive film 100, opposite the ranges of contact 151 previously printed in order to expose them. This operation consisting of forming the openings
• the chip 250 is then transferred to the rear side on the side of the adhesive opposite the contact pads.
• the chip and its electrical connections can be encapsulated in an insulating resin in order to better protect them against external aggressions of climatic or mechanical order for example.
• Figure 8 shows schematically a sectional view of a storage medium of the chip card type with flush contacts according to a first embodiment.
• This embodiment consists in transferring, in an open cavity 310 of a card body 300, the micromodule M1 obtained according to the first embodiment illustrated in FIG. 4.
• the upper face of the module M1 is defined as being the face intended to be flush with the surface of the card 300.
• the contact pads 151 are produced to ISO standards for example and serve as access contacts for the smart card.
• the card body 300 is produced according to a conventional method, for example by injecting plastic material into a mold.
• the cavity 310 is obtained either by milling the card body, or at the time of manufacture by injection of the card body, which is more economical.
• the cavity 310 has a shape adapted to the geometry of the micromodule. It may for example have a star shape, or a bowl shape with two flat bottoms PI and P2, or a bowl shape with a flat bottom and inclined walls.
• the card shown is in the form of a bowl with two flat bottoms.
• the first Pli flat bottom is made to serve as a support for the substrate 100 of the micromodule, and over a depth corresponding to the thickness of this substrate 100.
• the second flat bottom P12 is, for its part, intended to receive the part of the electronic micromodule Ml comprising the integrated circuit chip 200 possibly coated in a protective resin.
• the armature of protective material which may be preserved throughout the manufacture of the micromodule is permanently removed.
• the underside of the substrate 100 of the micromodule is then locally activated, by heating, at the location of the frame, in order to make it adhesive.
• the micromodule M1 is transferred into the cavity 310, by thermocompression so that the interior face of the substrate 100, made adhesive by heat, adheres to the first base pad PI in order to fix the module.
• the substrate 100 therefore has a double function; it serves as a support for the module and also for fixing the module when it is inserted into the card body 300.
• the module can also be placed in a molding space of the card body and the body is directly molded.
• FIG. 9 shows schematically a sectional view of a smart card with flush contact made according to an alternative embodiment illustrated in FIG. 4.
• the MPI module does not include the chip. Simultaneously with the formation of the open cavity 310 in the card body 300, the chip of the integrated circuit 200, reserved for the MPI module, is embedded in the bottom of the cavity.
• the adhesive support 100 of the module is then transferred so that the contact pads 151 printed are positioned opposite the contact pads 210 of the integrated circuit chip 200.
• FIG. 10 shows schematically a sectional view of a smart card with flush contacts according to an alternative embodiment, comprising the micromodule M2 obtained according to an alternative embodiment and as illustrated in Figure 5.
• the micromodule M2 is transferred into the cavity 410 of the card body 400 by thermocompression in order to activate the underside of the support 100 and to make it adhesive.
• the thermocompression step is ensured by means of a tool 430 whose shape is adapted to that of the cavity 410.
• the tool 430 used for thermocompression preferably comprises a recess 431 intended to protect the chip 230 from the micromodule.
• the chip can also be encapsulated in a protective resin 420.
• FIG. 11 shows schematically a sectional view of another smart card with flush contacts comprising the micromodule M3 obtained according to the second embodiment and as illustrated in FIG. 7.
• the transfer of the micromodule M3 into the 510 cavity of a card body 500 is made as previously described, that is to say by thermocompression using a tool whose shape is adapted to that of the cavity 510.
• the method of manufacturing a smart card according to the invention comprises a reduced number of steps and does not use expensive materials.
• the support film for the contact pads allows the micromodule to be fixed in the cavity of a card body without the use of glue. Consequently, the micromodules and the flush contact smart cards produced according to the invention have a considerably reduced manufacturing cost.
• the adhesive material can be mechanically reinforced, in particular by reinforcing fibers made of glass fibers or other embedded in the mass.

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• Engineering & Computer Science (AREA)
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• Condensed Matter Physics & Semiconductors (AREA)
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• 1999
  • 1999-02-08 FR FR9901454A patent/FR2789505B1/fr not_active Expired - Fee Related
• 2000
  • 2000-01-24 AU AU30590/00A patent/AU3059000A/en not_active Abandoned
  • 2000-01-24 CN CN00803573A patent/CN1384979A/zh active Pending
  • 2000-01-24 EP EP00900651A patent/EP1153432A1/de not_active Withdrawn
  • 2000-01-24 WO PCT/FR2000/000151 patent/WO2000048250A1/fr not_active Application Discontinuation

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