Classifications

• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B13/00—Burglar, theft or intruder alarms
  • G08B13/22—Electrical actuation
  • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
  • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
  • G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
  • G08B13/2408—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using ferromagnetic tags
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
  • G06K19/041—Constructional details
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B13/00—Burglar, theft or intruder alarms
  • G08B13/22—Electrical actuation
  • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
  • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
  • G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
  • G08B13/2414—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
  • G08B13/2417—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags having a radio frequency identification chip
• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B13/00—Burglar, theft or intruder alarms
  • G08B13/22—Electrical actuation
  • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
  • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
  • G08B13/2428—Tag details
  • G08B13/2434—Tag housing and attachment details
• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B13/00—Burglar, theft or intruder alarms
  • G08B13/22—Electrical actuation
  • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
  • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
  • G08B13/2428—Tag details
  • G08B13/2437—Tag layered structure, processes for making layered tags
• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B13/00—Burglar, theft or intruder alarms
  • G08B13/22—Electrical actuation
  • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
  • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
  • G08B13/2428—Tag details
  • G08B13/2437—Tag layered structure, processes for making layered tags
  • G08B13/244—Tag manufacturing, e.g. continuous manufacturing processes
• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B13/00—Burglar, theft or intruder alarms
  • G08B13/22—Electrical actuation
  • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
  • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
  • G08B13/2428—Tag details
  • G08B13/2448—Tag with at least dual detection means, e.g. combined inductive and ferromagnetic tags, dual frequencies within a single technology, tampering detection or signalling means on the tag
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/0102—Calcium [Ca]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01078—Platinum [Pt]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01079—Gold [Au]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/102—Material of the semiconductor or solid state bodies
  • H01L2924/1025—Semiconducting materials
  • H01L2924/10251—Elemental semiconductors, i.e. Group IV
  • H01L2924/10253—Silicon [Si]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/30—Technical effects
  • H01L2924/301—Electrical effects
  • H01L2924/3025—Electromagnetic shielding

Definitions

• the present invention relates to an identification tag and more particularly to an identification tag having a large number of bits of information, where the identification tag has an electronic article surveillance function which is difficult to defeat.
• Radio frequency identification transponders have been developed in the last years to take advantage of the fall in semiconductor logic and memory prices. Such tags are available having a single silicon chip attached to a wire or patch antenna. Such tags, however, may be shielded from the high frequency RF used to communicate with the tags. The anti-theft properties of RFID tags are suspect.
• EAS tags are much less easily shielded from the low frequency magnetic detection fields. Such EAS tags as described below, however, have possibilities of storing only a few bits of information.
• Barkhausen jump effect is characterized by a tendency for magnetization induced in a magnetic material to change in discrete steps as an external magnetic field is increased or decreased. (The material is said to be a non-linear magnetic material if the magnetisation of the material is not proportional to the external magnetic field.) A large temporal flux change, df./dt, occurs when such a step takes place, and a sizable voltage may be induced in a sensing or pickup coil.
• U.S. Pat. No. 5,181,020 describes a thin-film magnetic tag having a magnetic thin film formed on a polymer substrate and a method for producing the same.
• the thin film exhibits a large Barkhausen discontinuity without intentional application of external torsional or tensile stress on use.
• a particular disclosed use is as a marker or tag for use in an article surveillance system wherein articles may be identified by interrogating the tagged article in a cyclic magnetic field of a predetermined frequency in a surveillance area and detecting a harmonic wave of the magnetic field generated by the tag in the surveillance area.
• This conventional system is only a single bit element using a single Barkhausen layer with no ability to develop a code to distinguish items.
• U.S. Pat. No. 5,313,192 describes another single bit tag which relies on the Barkhausen effect.
• the tag of this invention is selected to include a first component comprised of a soft magnetic material which constitutes the bulk of the tag.
• a second component comprised of a semi-hard or hard magnetic material is integral with the first component.
• the tag is conditioned such that the second component has activating and deactivating states for placing the tag in active and deactivated states, respectively.
• Such conditioning includes subjecting the composite tag to predetermined magnetic fields during thermal processing stages. By switching the second component between its activating and deactivating states the tag can be switched between its active and deactived states.
• a reusable tag with desired step changes in flux which is capable of deactivation and reactivation is thereby realized.
• U.S. Pat. No. 4,980,670 describes a one bit magnetic tag formed from a magnetic material having domains with a pinned wall configuration.
• the resulting hysteresis characteristic for that material is such that upon subjecting the material to an applied alternating magnetic field, the magnetic flux of the material undergoes a regenerative step change in flux (Barkhausen jump) at a threshold value when the field increases to the threshold value from substantially zero and undergoes a gradual change in flux when the field decreases from the threshold value to substantially zero.
• the tag may be deactivated by preventing the domain walls from returning to their pinned condition by, for example, application of a field of sufficiently high frequency and/or amplitude.
• U.S. Pat. No. 4,940,966 describes the use of a plurality of magnetic elements in predetermined associations (e.g. with predetermined numbers of magnetic elements and with predetermined spacings between said elements), for identifying or locating preselected categories of articles.
• predetermined associations e.g. with predetermined numbers of magnetic elements and with predetermined spacings between said elements
• each particular association of magnetic elements gives rise to a magnetic signature whereby the article or category of article carrying each of the predetermined associations can be recognized and/or located.
• U.S. Pat. No. 4,660,025 describes a marker for use in an electronic surveillance system.
• the marker which can be in the form of a wire or strip of magnetic amorphous metal, is characterized by having retained stress and a magnetic hysteresis loop with a large Barkhausen discontinuity.
• a regenerative reversal of the magnetic polarization of the marker occurs and results in the generation of a harmonically rich pulse that is readily detected and easily distinguished.
• U.S. Pat. No. 5,175,419 describes a method for interrogating an identification tag comprised of a plurality of magnetic, thin wires or thin bands which have highly rectangular hysteresis curves and different coercive forces.
• the wires or bands are preferably of amorphous material, but means for obtaining the highly rectangular hysteresis curves and different coercive forces are not taught; nor is the concept taught of using a time varying magnetic field superimposed on a ramp field for interrogation.
• U.S. Pat. No. 5,729,201 describes an inexpensive multibit magnetic tag is described which uses an array of amorphous wires in conjunction with a magnetic bias field.
• the tag is interrogated by the use of a ramped field or an ac field or a combination of the two.
• the magnetic bias is supplied either by coating each wire with a hard magnetic material which is magnetized or by using magnetized hard magnetic wires or foil strips in proximity to the amorphous wires.
• Each wire switches at a different value of the external interrogation field due to the differences in the magnetic bias field acting on each wire.
• U.S. Patents and the following related U.S. Patents assigned to the assignee of the present invention are hereby incorporated by reference: 5,528,222; 5,550.547; 5,552,778; 5,554,974; 5,538,803; 5,563,583; 5,565,847; 5,606,323; 5,521,601; 5,635,693; 5,673,037; 5,682,143; 5,680,106; 5,729,201; and 5,729,607.
• U.S. Patent applications assigned to the assignee of the present invention include: serial No. 08/303,965 filed Sept. 9, 1994 entitled RF Group Select Protocol, by Cesar et al.; serial No.
• An RFID tag is combined with a magnetic EAS tag.
• the conducting elements of the RFID tag such as the antenna or the parasitic elements used to tune the antenna characteristics may be wholly or partially made from a non-linear magnetic material which produces a large signal in a magnetic EAS detection field.
• the non-linear magnetic material may be coated or electroplated or electrolessly plated with a good electrical conductor to enhance the antenna characteristics of the RFID tag.
• the non-linear magnetic material may be advantageously connected to dielectric material used to support and/or encapsulate the antenna and electronic components of the RFID tag.
• FIG. 1 shows block diagram of an RF tag of the invention
• FIG. 2 shows a block diagram of an RFID tag
• FIG. 3 shows an elevation sketch of a physical layout for the sketch of FIG. 2
• FIG. 4 shows an alternative arrangement of FIG. 2;
• FIG. 5 shows perspective sketch of a preferred alternative antenna arrangement for an RFID tag
• FIG. 6 shows a perspective sketch of a patch antenna mounted coplanar with a non-linear magnetic material
• FIG. 7 shows an elevation sketch of the apparatus of FIG. 5; and FIG. 8 shows an elevation sketch of the apparatus of FIG. 6 showing the supporting dielectric material.
• FIG. 1 shows block diagram of an RF tag 10 having tag electronics 12, a tag memory 14, and a tag power supply 16 connected to a tag antenna 18.
• the tag antenna 18 is shown in this embodiment made from a non-linear magnetic material 17.
• Such non- linear magnetic materials may have electrical conductivity insufficient for high quality antennas, and an alternative most preferred embodiment is to coat the non-linear magnetic material with a good electrical conducting material 19 such as copper, gold, or a conducting polymer.
• the conducting material 19 need only be as thick as the skin depth of the high frequency RF signals sent to the RFID tag 10.
• Such conducting material 19 may be coated on the non-linear magnetic material 17 by coating processes well known in the art such as evaporation, electroplating, or electroless plating.
• FIG. 2 shows a sketch of an RFID tag 10 having a tag antenna 18 electrically and spatially separated from a non- linear magnetic material 17.
• the non-linear material is shown as a wire placed as a parasitic element to a dipole antenna 18 of the RFID tag 10.
• a preferred embodiment in this case also is to have the non-linear material 17 coated with an electrically conducting material if the electrical resistivity of the non-linear material 17 is too high.
• FIG. 3 shows an elevation sketch of a physical layout for the sketch of FIG. 2.
• the dipole antenna 18 is connected to a silicon chip 34 containing the tag memory, tag electronics, and tag power supply by wires 36 and 38.
• the antenna 18 and the chip 34 are mounted on a dielectric material 32.
• the non-linear material 17 is mounted on the opposite side of the dielectric material 32 to the antenna 18 and chip 34.
• the non- linear material 17 may once again be coated with a good electrical conductor.
• FIG. 4 shows an alternative arrangement of FIG. 2.
• the silicon chip 34, the antenna 18, and the non- linear material 17 are all mounted on the same side of a supporting structure made of dielectric 32.
• the non-linear material 17 may once again preferrably be coated with a good electrical conductor.
• FIG. 5 shows perspective sketch of a preferred alternative antenna arrangement for an RFID tag.
• a silicon chip 34 is electrically attached to an electrially conducting patch antenna 50.
• the silicon chip is also electrically attached to an electrically conducting ground plane 52, which is spatially separated from the patch antenna 50 by a dielectric material (not shown).
• the electrically conducting ground plane 52 is made from non-linear magnetic material 17.
• the non-linear material 17 may once again preferrably be coated with a good electrical conductor.
• FIG. 6 shows a perspective sketch of a patch antenna mounted coplanar with a non- linear magnetic material 17.
• the magnetic material may be in the form of a wire or in the form of a sheet as shown in the diagram.
• FIG. 7 shows an elevation sketch of the apparatus of FIG. 5.
• the dielectric material 32 supporting the patch antenna, the chip 34, and the ground plane 52 is explicitly shown.
• the alternative embodiment having a conducting material 19 coating the non-linear material is also shown.
• the material of the patch antenna 50 is alternatively made of a non-linear magnetic material instead of the ground plane 52.
• the non-linear material 17 may once again preferably be coated with a good electrical conductor.
• FIG. 8 shows an elevation sketch of the apparatus of FIG. 6 showing the supporting dielectric material 32.

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• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• General Physics & Mathematics (AREA)
• Automation & Control Theory (AREA)
• Computer Security & Cryptography (AREA)
• Electromagnetism (AREA)
• Theoretical Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Burglar Alarm Systems (AREA)

Applications Claiming Priority (5)

Publications (1)

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ID=26799408

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Country Status (3)

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Family Cites Families (4)

• 1999
  • 1999-09-29 AU AU64037/99A patent/AU6403799A/en not_active Abandoned
  • 1999-09-29 EP EP99951636A patent/EP1119834A1/de not_active Withdrawn
  • 1999-09-29 WO PCT/US1999/022504 patent/WO2000036572A1/en not_active Application Discontinuation

Non-Patent Citations (1)

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