AU6403799A - Combination radio frequency identification transponder (rfid tag) and magnetic electronic article suveillance (eas) tag - Google Patents

Combination radio frequency identification transponder (rfid tag) and magnetic electronic article suveillance (eas) tag

Info

Publication number
AU6403799A
AU6403799A AU64037/99A AU6403799A AU6403799A AU 6403799 A AU6403799 A AU 6403799A AU 64037/99 A AU64037/99 A AU 64037/99A AU 6403799 A AU6403799 A AU 6403799A AU 6403799 A AU6403799 A AU 6403799A
Authority
AU
Australia
Prior art keywords
tag
suveillance
eas
radio frequency
frequency identification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU64037/99A
Inventor
Michael John Brady
Thomas Anthony Cofino
Dah-Weih Duan
Richard Joseph Gambino
Paul Andrew Moskowitz
Alejandro Gabriel Schrott
Robert Jacob Von Gutfeld
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intermec IP Corp
Original Assignee
Intermec IP Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intermec IP Corp filed Critical Intermec IP Corp
Publication of AU6403799A publication Critical patent/AU6403799A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2408—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using ferromagnetic tags
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G06K19/041—Constructional details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2414—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
    • G08B13/2417—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags having a radio frequency identification chip
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2434—Tag housing and attachment details
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G08B13/244—Tag manufacturing, e.g. continuous manufacturing processes
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2448—Tag with at least dual detection means, e.g. combined inductive and ferromagnetic tags, dual frequencies within a single technology, tampering detection or signalling means on the tag
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
AU64037/99A 1998-09-30 1999-09-29 Combination radio frequency identification transponder (rfid tag) and magnetic electronic article suveillance (eas) tag Abandoned AU6403799A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10247698P 1998-09-30 1998-09-30
US60102476 1998-09-30
US18150598A 1998-10-28 1998-10-28
US09181505 1998-10-28
PCT/US1999/022504 WO2000036572A1 (en) 1998-09-30 1999-09-29 Combination radio frequency identification transponder (rfid tag) and magnetic electronic article suveillance (eas) tag

Publications (1)

Publication Number Publication Date
AU6403799A true AU6403799A (en) 2000-07-03

Family

ID=26799408

Family Applications (1)

Application Number Title Priority Date Filing Date
AU64037/99A Abandoned AU6403799A (en) 1998-09-30 1999-09-29 Combination radio frequency identification transponder (rfid tag) and magnetic electronic article suveillance (eas) tag

Country Status (3)

Country Link
EP (1) EP1119834A1 (en)
AU (1) AU6403799A (en)
WO (1) WO2000036572A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7109867B2 (en) * 2004-09-09 2006-09-19 Avery Dennison Corporation RFID tags with EAS deactivation ability
AU2005302153B2 (en) * 2004-11-02 2010-09-23 Tyco Fire & Security Gmbh RFID near field microstrip antenna
JP2008519571A (en) * 2004-11-02 2008-06-05 センサーマティック・エレクトロニクス・コーポレーション Serpentine linear RFID near field microstrip antenna
US7812729B2 (en) 2004-11-15 2010-10-12 Sensormatic Electronics, LLC Combination EAS and RFID label or tag with controllable read range using a hybrid RFID antenna
US7804411B2 (en) 2004-11-15 2010-09-28 Sensormatic Electronics, LLC Combination EAS and RFID label or tag using a hybrid RFID antenna
US7804410B2 (en) 2004-11-15 2010-09-28 Sensormatic Electronics, LLC Combination EAS and RFID label or tag
US7304574B2 (en) * 2005-02-10 2007-12-04 Sensormatic Electronics Corporation Alarm investigation using RFID
US7605706B2 (en) 2005-05-13 2009-10-20 The Kennedy Group, Inc. Patch antenna for RFID tag

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2701146A1 (en) * 1993-02-03 1994-08-05 Boutonner Tranier Jean Marc Radiomagnetic detection label
US5939984A (en) * 1997-12-31 1999-08-17 Intermec Ip Corp. Combination radio frequency transponder (RF Tag) and magnetic electronic article surveillance (EAS) material
US5859587A (en) * 1996-09-26 1999-01-12 Sensormatic Electronics Corporation Data communication and electronic article surveillance tag
US6154137A (en) * 1998-06-08 2000-11-28 3M Innovative Properties Company Identification tag with enhanced security

Also Published As

Publication number Publication date
WO2000036572A1 (en) 2000-06-22
EP1119834A1 (en) 2001-08-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase