EP1111725A2 - Connector for circuit board - Google Patents
Connector for circuit board Download PDFInfo
- Publication number
- EP1111725A2 EP1111725A2 EP00126346A EP00126346A EP1111725A2 EP 1111725 A2 EP1111725 A2 EP 1111725A2 EP 00126346 A EP00126346 A EP 00126346A EP 00126346 A EP00126346 A EP 00126346A EP 1111725 A2 EP1111725 A2 EP 1111725A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- connector
- circuit board
- contact element
- push
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
Definitions
- the invention relates to a connector for mounting on a printed circuit board, which is provided with contact elements, which by means of a solder joint a conductor track of the circuit board are to be connected.
- Connectors are known, whose contact elements as push-through mounting contact elements are formed, that is, in a hole through the conductor track the circuit board. This results in a high one mechanical strength of the connection between printed circuit board and contact element of the connector.
- Connectors are also known, the contact elements of which are surface-mount contact elements are trained, i.e. on the conductor track be soldered on.
- the resulting solder joint offers only a comparative one low mechanical strength, especially with shear loads.
- a higher signal transmission speed can be achieved achieve between contact element and conductor track.
- the object of the invention is to provide a connector the connection between at high signal transmission speed Printed circuit board and connector with high mechanical strength.
- a connector for mounting on a PCB with a carrier body, at least one surface mounting contact element, which is arranged in the carrier body, and at least a push-through contact element, which is also in the carrier body is arranged.
- the push-through mounting contact element is preferably a ground contact. This design is advantageous because the lower signal transmission speed hardly affects.
- the push-through assembly Contact element can also be used generally for signal transmission in the case of signals be used that have a low frequency.
- the surface mount contact elements arranged in two groups are by the push-through contact element from each other are separated.
- the push-through contact element is used as a shield between the two groups of surface mount contact elements, used for signal transmission be so that there is a high crosstalk attenuation.
- the surface mount contact element with a connection area is provided, on which a connection element is arranged, which is relative to the connection area is displaceable.
- This design enables the critical surface thickness of the solder pad between the surface mount contact element and the conductor track in particular easy to adhere to.
- those with particularly tight tolerances have to be manufactured in order to put on the connector the circuit board the required distance of about 0.1 mm between the contact element and to obtain conductor track arises in this embodiment the required distance by moving the Connection element on the connection area by itself.
- Figure 1 is a connector according to a first embodiment of the Invention shown. It is an angled female connector, there the individual contacts are angled by 90 ° and on the connection side of the connector are designed as contact springs.
- the complementary connector that plugs into the connector shown accordingly, is a male connector.
- the embodiment shown can of course also be designed as a male connector. In each In this case, the connector has a large number of contacts, which are in several adjacent columns are arranged. In the sectional view only one of these columns can be seen in FIG.
- the connector shown has an insulating carrier body 10, in which two surface mount contact elements 20 are arranged twice are and a push-through contact element 38, the two Groups of surface mount contact elements 20 from each other separates.
- the push-through mounting contact element 38 can be connected to a ground conductor be connected and serves as a shield between the two Groups of surface mount contact elements 20 used for signal transmission serve.
- the connector comes with its push-through mounting contact element inserted into an opening 50 of a circuit board 52, on the a solder paste was previously applied to the appropriate places. In the connector is pre-fixed in this state. Then the Soldering the contact elements so that the desired electrical connection is achieved with the conductor tracks.
- FIG. 2 is a connector according to a second embodiment of the Invention shown.
- three contact elements used namely an internal push-through contact element 38, which engages in an opening 50 of a circuit board 52, a central one Surface mount contact element 20, which with a connection region 22nd is provided, on which a connecting element 24 is arranged, and an external one Surface mount contact element 53 located on its the PCB facing end is provided with a bend on the circuit board rests and there in a surface mounting technology with a corresponding conductor track can be connected.
- connection element 24 is shown, which in the surface mounting contact elements 20 of the connector shown in Figure 2 is used.
- the connecting element 24 is a spring clip with two Legs 26 formed, which are connected to one another by means of a base 28 are.
- a spacer 30 is provided, which is designed as an embossing that a comparatively pointed apex is created.
- connection element 24 is on the connection area 22 of the surface mounting contact element 20 pushed on and on this by the the resulting clamping force fixes the resulting frictional force.
- connection element of the connection area 22 the one has rectangular cross section, slips, are on one of the legs 26 of the Connection element 24 bent lugs 54 are provided, each other opposite surfaces act as guide surfaces 56. these can attack on the narrow outer surfaces of the connection areas 22 and prevent the connecting element 24 from tipping excessively or even slips.
- the circuit board at the points that connect to the Contact elements are provided, coated with a solder paste.
- the connector is placed on the circuit board, whereby the push-through contact element in the corresponding opening of the PCB penetrates.
- the mounting position shown in Figure 4a is the Contact elements 24 chosen so that the spacer 30 on the circuit board abuts before the push-through mounting contact element 38 completely is inserted into the circuit board.
- the connecting element 24 dips into the there previously applied solder paste, the spacer 30 with its Vertex reliably displaces and penetrates the solder paste so that it is on the PCB rests.
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Die Erfindung betrifft einen Steckverbinder zur Montage auf einer Leiterplatte, der mit Kontaktelementen versehen ist, die mittels einer Lötstelle mit einer Leiterbahn der Leiterplatte verbunden werden sollen.The invention relates to a connector for mounting on a printed circuit board, which is provided with contact elements, which by means of a solder joint a conductor track of the circuit board are to be connected.
Bekannt sind Steckverbinder, deren Kontaktelemente als Durchsteckmontage-Kontaktelementen ausgebildet sind, also in eine Bohrung durch die Leiterbahn der Leiterplatte eingesteckt werden. Dadurch ergibt sich eine hohe mechanische Festigkeit der Verbindung zwischen Leiterplatte und Kontaktelement des Steckverbinders.Connectors are known, whose contact elements as push-through mounting contact elements are formed, that is, in a hole through the conductor track the circuit board. This results in a high one mechanical strength of the connection between printed circuit board and contact element of the connector.
Bekannt sind auch Steckverbinder, deren Kontaktelemente als Oberflächenmontage-Kontaktelemente ausgebildet sind, also auf die Leiterbahn aufgelötet werden. Die sich dabei ergebende Lötstelle bietet nur eine vergleichsweise geringe mechanische Festigkeit, insbesondere bei Scherbelastungen. Allerdings läßt sich eine höhere Signalübertragungsgeschwindigkeit zwischen Kontaktelement und Leiterbahn erzielen.Connectors are also known, the contact elements of which are surface-mount contact elements are trained, i.e. on the conductor track be soldered on. The resulting solder joint offers only a comparative one low mechanical strength, especially with shear loads. However, a higher signal transmission speed can be achieved achieve between contact element and conductor track.
Die Aufgabe der Erfindung besteht darin, einen Steckverbinder zu schaffen, der bei hoher Signalübertragungsgeschwindigkeit eine Verbindung zwischen Leiterplatte und Steckverbinder mit hoher mechanischer Festigkeit ermöglicht.The object of the invention is to provide a connector the connection between at high signal transmission speed Printed circuit board and connector with high mechanical strength.
Diese Aufgabe wird gelöst mit einem Steckverbinder zur Montage auf einer Leiterplatte, mit einem Trägerkörper, mindestens einem Oberflächenmontage-Kontaktelement, das in dem Trägerkörper angeordnet ist, und mindestens einem Durchsteckmontage-Kontaktelement, das ebenfalls in dem Trägerkörper angeordnet ist. Bei diesem Steckverbinder gewährleistet das Durchsteckmontage-Kontaktelement die gute mechanische Verbindung des Trägerkörpers mit der Leiterplatte, während das Oberflächenmontage-Kontaktelement die schnelle Signalübertragung zur Leiterbahn ermöglicht.This problem is solved with a connector for mounting on a PCB, with a carrier body, at least one surface mounting contact element, which is arranged in the carrier body, and at least a push-through contact element, which is also in the carrier body is arranged. This guarantees with this connector Push-through contact element the good mechanical connection of the Carrier body with the circuit board, while the surface mount contact element enables fast signal transmission to the conductor track.
Vorzugsweise ist das Durchsteckmontage-Kontaktelement ein Massekontakt. Diese Gestaltung ist vorteilhaft, da sich dann die niedrigere Signalübertragungsgeschwindigkeit kaum auswirkt. Das Durchsteckmontage- Kontaktelement kann auch allgemein zur Signalübertragung bei Signalen verwendet werden, die eine niedrige Frequenz haben.The push-through mounting contact element is preferably a ground contact. This design is advantageous because the lower signal transmission speed hardly affects. The push-through assembly Contact element can also be used generally for signal transmission in the case of signals be used that have a low frequency.
Vorzugsweise ist weiterhin vorgesehen, daß vier Oberflächenmontage-Kontaktelemente und ein Durchsteckmontage-Kontaktelement vorgesehen sind, wobei die Oberflächenmontage-Kontaktelemente in zwei Gruppen angeordnet sind, die durch das Durchsteckmontage-Kontaktelement voneinander getrennt sind. Bei dieser Gestaltung dient das Durchsteckmontage-Kontaktelement als Abschirmung zwischen den beiden Gruppen von Oberflächenmontage-Kontaktelementen, die zur Signalübertragung verwendet werden, so daß sich eine hohe Übersprech-Dämpfung ergibt.It is also preferably provided that four surface mount contact elements and a push-through contact element is provided are, the surface mount contact elements arranged in two groups are by the push-through contact element from each other are separated. With this design, the push-through contact element is used as a shield between the two groups of surface mount contact elements, used for signal transmission be so that there is a high crosstalk attenuation.
Gemäß einer bevorzugten Ausführungsform der Erfindung ist vorgesehen, daß das Oberflächenmontage-Kontaktelement mit einem Anschlußbereich versehen ist, auf dem ein Anschlußelement angeordnet ist, das relativ zu dem Anschlußbereich verschiebbar ist. Diese Gestaltung ermöglicht es, die bei der Oberflächenmontagetechnik kritische Dicke des Lötpolsters zwischen dem Oberflächenmontage-Kontaktelement und der Leiterbahn in besonders einfacher Weise einzuhalten. Anders als bei herkömmlichen Oberflächenmontage-Kontaktelementen, die mit besonders engen Toleranzen gefertigt werden müssen, um nach dem Aufsetzen des Steckverbinders auf die Leiterplatte den erforderlichen Abstand von etwa 0,1 mm zwischen Kontaktelement und Leiterbahn zu erhalten, stellt sich bei dieser Ausführungsform der erforderliche Abstand durch entsprechend weite Verschiebung des Anschlußelementes auf dem Anschlußbereich von selbst ein.According to a preferred embodiment of the invention, that the surface mount contact element with a connection area is provided, on which a connection element is arranged, which is relative to the connection area is displaceable. This design enables the critical surface thickness of the solder pad between the surface mount contact element and the conductor track in particular easy to adhere to. Unlike conventional surface mount contact elements, those with particularly tight tolerances have to be manufactured in order to put on the connector the circuit board the required distance of about 0.1 mm between the contact element and to obtain conductor track arises in this embodiment the required distance by moving the Connection element on the connection area by itself.
Vorteilhafte Ausgestaltungen der Erfindung ergeben sich aus den Unteransprüchen.Advantageous embodiments of the invention result from the subclaims.
Die Erfindung wird nachfolgend anhand von verschiedenen Ausführungsformen beschrieben, die in den beigefügten Zeichnungen dargestellt sind. In diesen zeigen:
- Figur 1
- eine Schnittansicht eines Steckverbinders gemäß einer ersten Ausführungsform der Erfindung;
- Figur 2
- eine Schnittansicht eines Steckverbinders gemäß einer zweiten Ausführungsform der Erfindung;
- Figur 3
- in einer isometrischen Ansicht ein Anschlußelement, das bei dem in Figur 2 gezeigten Steckverbinder verwendet wird; und
- Figuren 4a und 4b
- jeweils in einer geschnittenen schematischen Ansicht einen Steckverbinder gemäß einer weiteren Ausführungsform in einem Zustand vor der Montage sowie nach der Montage an einer Leiterplatte.
- Figure 1
- a sectional view of a connector according to a first embodiment of the invention;
- Figure 2
- a sectional view of a connector according to a second embodiment of the invention;
- Figure 3
- in an isometric view, a connection element which is used in the connector shown in Figure 2; and
- Figures 4a and 4b
- each in a sectional schematic view of a connector according to another embodiment in a state before assembly and after assembly on a circuit board.
In Figur 1 ist ein Steckverbinder gemäß einer ersten Ausführungsform der Erfindung gezeigt. Es handelt sich hier um eine abgewinkelte Federleiste, da die einzelnen Kontakte um jeweils 90° abgewinkelt sind und auf der Anschlußseite des Steckverbinders als Kontaktfedern ausgebildet sind. Der komplementäre Steckverbinder, der in den gezeigten Steckverbinder eingesteckt wird, ist dementsprechend eine Messerleiste. Die gezeigte Ausführungsform kann natürlich auch als Messerleiste ausgebildet sein. In jedem Fall weist der Steckverbinder eine Vielzahl von Kontakten auf, die in mehreren nebeneinanderliegenden Spalten angeordnet sind. In der Schnittdarstellung von Figur 1 ist nur eine einzige dieser Spalten zu sehen.In Figure 1 is a connector according to a first embodiment of the Invention shown. It is an angled female connector, there the individual contacts are angled by 90 ° and on the connection side of the connector are designed as contact springs. The complementary connector that plugs into the connector shown accordingly, is a male connector. The embodiment shown can of course also be designed as a male connector. In each In this case, the connector has a large number of contacts, which are in several adjacent columns are arranged. In the sectional view only one of these columns can be seen in FIG.
Der gezeigte Steckverbinder weist einen isolierenden Trägerkörper 10 auf,
in welchem zweimal zwei Oberflächenmontage-Kontaktelemente 20 angeordnet
sind sowie ein Durchsteckmontage-Kontaktelement 38, das die beiden
Gruppen von Oberflächenmontage-Kontaktelementen 20 voneinander
trennt. Das Durchsteckmontage-Kontaktelement 38 kann mit einem Masseleiter
verbunden werden und dient als Abschirmung zwischen den beiden
Gruppen von Oberflächenmontage-Kontaktelementen 20, die zur Signalübertragung
dienen.The connector shown has an
Der Steckverbinder wird bei der Montage mit seinem Durchsteckmontage-Kontaktelement
in eine Öffnung 50 einer Leiterplatte 52 eingesetzt, auf die
vorher an den entsprechenden Stellen eine Lötpaste aufgebracht wurde. In
diesem Zustand ist der Steckverbinder vorfixiert. Anschließend erfolgt die
Verlötung der Kontaktelemente, so daß die gewünschte elektrische Verbindung
mit den Leiterbahnen erzielt ist.The connector comes with its push-through mounting contact element
inserted into an opening 50 of a
In Figur 2 ist ein Steckverbinder gemäß einer zweiten Ausführungsform der
Erfindung gezeigt. Bei dieser Ausführungsform werden drei Kontaktelemente
verwendet, nämlich ein innenliegendes Durchsteckmontage-Kontaktelement
38, das in eine Öffnung 50 einer Leiterplatte 52 eingreift, ein mittig liegendes
Oberflächenmontage-Kontaktelement 20, das mit einem Anschlußbereich 22
versehen ist, auf dem ein Anschlußelement 24 angeordnet ist, und ein auβenliegendes
Oberflächenmontage-Kontaktelement 53, das an seinem der
Leiterplatte zugewandten Ende mit einer Umbiegung versehen ist, die auf
der Leiterplatte aufliegt und dort in einer Oberflächenmontagetechnik mit einer
entsprechenden Leiterbahn verbunden werden kann.In Figure 2 is a connector according to a second embodiment of the
Invention shown. In this embodiment, three contact elements
used, namely an internal push-through
In Figur 3 ist das Anschlußelement 24 gezeigt, das bei den Oberflächenmontage-Kontaktelementen
20 des in Figur 2 gezeigten Steckverbinders
verwendet wird. Das Anschlußelement 24 ist als federnde Klammer mit zwei
Schenkeln 26 ausgebildet, die mittels eines Bodens 28 miteinander verbunden
sind. Am Boden ist auf der vom Anschlußbereich 22 abgewandten Seite
ein Abstandshalter 30 vorgesehen, der als Prägung so ausgebildet ist, daß
ein vergleichsweise spitzer Scheitel entsteht.In Figure 3, the
Das Anschlußelement 24 ist auf den Anschlußbereich 22 des Oberflächenmontage-Kontaktelementes
20 aufgeschoben und an diesem durch die aus
der wirkenden Klemmkraft resultierende Reibungskraft fixiert. Um zu verhindern,
daß das Anschlußelement von dem Anschlußbereich 22, der einen
rechteckigen Querschnitt hat, abrutscht, sind an einem der Schenkel 26 des
Anschlußelementes 24 abgebogene Nasen 54 vorgesehen, deren einander
gegenüberliegende Flächen als Führungsflächen 56 wirken. Diese können
an den schmalen Außenflächen der Anschlußbereiche 22 angreifen und
verhindern, daß das Anschlußelement 24 übermäßig stark abkippt oder gar
abrutscht.The
Anhand von Figur 4 wird nun die Montage einer weiteren Ausführungsform eines Steckverbinders an einer Leiterplatte beschrieben. Es handelt sich bei dieser Ausführungsform um eine gerade Federleiste, wobei in einer einzigen Reihe hintereinanderliegend Oberflächenmontage-Kontaktelemente und Durchsteckmontage-Kontaktelemente vorgesehen sind.The assembly of a further embodiment is now based on FIG described a connector on a circuit board. It is about this embodiment around a straight female connector, being in a single Row of surface mounting contact elements and Push-through contact elements are provided.
Zunächst wird die Leiterplatte an den Stellen, die zur Verbindung mit den
Kontaktelementen vorgesehen sind, mit einer Lötpaste beschichtet. Anschließend
wird der Steckverbinder auf die Leiterplatte aufgesetzt, wobei
das Durchsteckmontage-Kontaktelement in die entsprechende Öffnung der
Leiterplatte eindringt. Dabei ist die in Figur 4a gezeigte Montagestellung der
Kontaktelemente 24 so gewählt, daß der Abstandshalter 30 an der Leiterplatte
anliegt, bevor das Durchsteckmontage-Kontaktelement 38 vollständig
in die Leiterplatte eingeschoben ist. Im Verlauf des Aufsetzens des Steckverbinders
auf die Leiterplatte taucht das Anschlußelement 24 in die dort
vorher aufgebrachte Lötpaste ein, wobei der Abstandshalter 30 mit seinem
Scheitel die Lötpaste zuverlässig verdrängt und durchdringt, so daß er auf
der Leiterplatte aufliegt. Dies gewährleistet, daß der Boden 28 in allen übrigen
Bereichen einen vorbestimmten, von der Höhe des Abstandshalters
vorgegebenen Abstand von der Leiterplatte aufweist, der vorzugsweise 0,1
mm beträgt und vollständig mit der Lötpaste gefüllt ist. Im Verlauf des Aufsetzens
ergibt sich auch eine Relativverschiebung zwischen dem Anschlußelement
24 und dem Anschlußbereich 22, wodurch die Schenkel 26
des als Klammer ausgebildeten Anschlußelementes weiter auf den Anschlußbereich
22 aufgeschoben werden. Dieser Zustand, in welchem die
elektrische Verbindung zwischen dem Anschlußelement 24 und dem Anschlußbereich
22 sowie der optimale Abstand zwischen dem Boden des Anschlußelementes
und der Leiterbahn unabhängig von den jeweils vorliegenden
Toleranzen gewährleistet ist, ist in Figur 4b gezeigt.First, the circuit board at the points that connect to the
Contact elements are provided, coated with a solder paste. Subsequently
the connector is placed on the circuit board, whereby
the push-through contact element in the corresponding opening of the
PCB penetrates. The mounting position shown in Figure 4a is the
Sobald der Steckverbinder korrekt auf die Leiterplatte aufgesetzt ist, kann
die Verlötung der Oberflächenmontage-Kontaktelemente erfolgen, wobei
aufgrund des präzise eingehaltenen Abstandes zwischen dem Boden des
Anschlußelementes 24 und der Leiterplatte eine zuverlässige Verlötung gewährleistet
ist. Dieser Abstand zwischen dem Boden 28 des Anschlußelementes
24 und der Leiterplatte wird nicht beeinflußt von Toleranzen des
Steckverbinders oder von Oberflächenunebenheiten der Leiterplatte, da
eventuelle Toleranzen durch ein unterschiedlich weites Aufschieben des
Anschlußelementes auf den Anschlußbereich 22 des OberflächenmontageKontaktelementes
ausgeglichen werden.As soon as the connector is correctly placed on the circuit board
the surface mounting contact elements are soldered, whereby
due to the precisely maintained distance between the bottom of the
Claims (4)
daß das Durchsteckmontage-Kontaktelement ein Massekontakt ist.Connector according to claim 1, characterized in
that the push-through contact element is a ground contact.
daß vier Oberflächenmontage-Kontaktelemente (20) und ein Durchsteckmontage-Kontaktelement (38) vorgesehen sind, wobei die Oberflächenmontage-Kontaktelemente in Gruppen angeordnet sind, die durch das Durchsteckmontage-Kontaktelement voneinander getrennt sind.Connector according to claim 1, characterized in
that four surface mount contact elements (20) and a push-through mount contact element (38) are provided, the surface mount contact elements being arranged in groups which are separated from one another by the push-through mount contact element.
gekennzeichnet,
daß das Oberflächenmontage-Kontaktelement (20) mit einem Anschlußbereich (22) versehen ist, auf dem ein Anschlußelement (24) angeordnet ist, das relativ zu dem Anschlußbereich verschiebbar ist.Connector according to one of the preceding claims, characterized
featured,
that the surface mounting contact element (20) is provided with a connection area (22) on which a connection element (24) is arranged, which is displaceable relative to the connection area.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19960857A DE19960857A1 (en) | 1999-12-16 | 1999-12-16 | Connectors |
| DE19960857 | 1999-12-16 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP1111725A2 true EP1111725A2 (en) | 2001-06-27 |
| EP1111725A3 EP1111725A3 (en) | 2002-12-11 |
| EP1111725B1 EP1111725B1 (en) | 2004-04-28 |
Family
ID=7932996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP00126346A Expired - Lifetime EP1111725B1 (en) | 1999-12-16 | 2000-12-02 | Connector for circuit board |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6544048B2 (en) |
| EP (1) | EP1111725B1 (en) |
| CN (1) | CN1203585C (en) |
| CA (1) | CA2328676C (en) |
| DE (2) | DE19960857A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7170742B2 (en) * | 2001-09-26 | 2007-01-30 | Lg Electronics Inc. | Peripheral device mounting holder and portable computer including the holder |
| US7475123B2 (en) * | 2002-11-18 | 2009-01-06 | Sap Ag | Web service integration |
| US7165974B2 (en) * | 2004-10-14 | 2007-01-23 | Corning Gilbert Inc. | Multiple-position push-on electrical connector |
| EP2346121B1 (en) * | 2009-10-30 | 2015-06-17 | Panasonic Corporation | Receptacle and electronic apparatus |
| TWM525568U (en) * | 2015-11-12 | 2016-07-11 | 宣德科技股份有限公司 | Electrical connector |
| WO2020014449A1 (en) | 2018-07-12 | 2020-01-16 | Samtec, Inc. | Cable connector system |
| WO2020076785A1 (en) * | 2018-10-09 | 2020-04-16 | Samtec, Inc. | Cable connector systems |
| DE102021109720A1 (en) | 2021-04-19 | 2022-10-20 | Turck Holding Gmbh | Circuit board, electrical connector module and manufacturing process |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3926802A1 (en) * | 1988-08-16 | 1990-02-22 | Itt Ind Ltd | ELECTRICAL CONNECTOR |
| DE19604432A1 (en) * | 1996-02-07 | 1997-08-14 | Siemens Ag | Contacting arrangement for circuit board using feed in contacts and through contacts |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4632476A (en) * | 1985-08-30 | 1986-12-30 | At&T Bell Laboratories | Terminal grounding unit |
| US5597313A (en) * | 1986-06-19 | 1997-01-28 | Labinal Components And Systems, Inc. | Electrical connectors |
| US5295867A (en) * | 1992-12-23 | 1994-03-22 | Itt Corporation | Edge connector shield |
| JPH10255881A (en) * | 1997-03-07 | 1998-09-25 | Molex Inc | Electric connector provided with signal and ground terminals |
| EP1020956A1 (en) * | 1999-01-15 | 2000-07-19 | Molex Incorporated | Surface mount connector having improved terminal structure |
-
1999
- 1999-12-16 DE DE19960857A patent/DE19960857A1/en not_active Ceased
-
2000
- 2000-12-02 EP EP00126346A patent/EP1111725B1/en not_active Expired - Lifetime
- 2000-12-02 DE DE50006239T patent/DE50006239D1/en not_active Expired - Lifetime
- 2000-12-15 US US09/737,984 patent/US6544048B2/en not_active Expired - Lifetime
- 2000-12-15 CN CNB00135695XA patent/CN1203585C/en not_active Expired - Fee Related
- 2000-12-15 CA CA002328676A patent/CA2328676C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3926802A1 (en) * | 1988-08-16 | 1990-02-22 | Itt Ind Ltd | ELECTRICAL CONNECTOR |
| DE19604432A1 (en) * | 1996-02-07 | 1997-08-14 | Siemens Ag | Contacting arrangement for circuit board using feed in contacts and through contacts |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19960857A1 (en) | 2001-06-28 |
| DE50006239D1 (en) | 2004-06-03 |
| CN1203585C (en) | 2005-05-25 |
| EP1111725A3 (en) | 2002-12-11 |
| CA2328676C (en) | 2004-07-20 |
| US6544048B2 (en) | 2003-04-08 |
| US20020137370A1 (en) | 2002-09-26 |
| CN1300117A (en) | 2001-06-20 |
| CA2328676A1 (en) | 2001-06-16 |
| EP1111725B1 (en) | 2004-04-28 |
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