EP1105248A1 - Per age par laser de trous dans des materiaux - Google Patents
Per age par laser de trous dans des materiauxInfo
- Publication number
- EP1105248A1 EP1105248A1 EP99957032A EP99957032A EP1105248A1 EP 1105248 A1 EP1105248 A1 EP 1105248A1 EP 99957032 A EP99957032 A EP 99957032A EP 99957032 A EP99957032 A EP 99957032A EP 1105248 A1 EP1105248 A1 EP 1105248A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- laser
- wavelength
- holes
- wavelengths
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 title claims abstract description 136
- 238000005553 drilling Methods 0.000 title claims abstract description 64
- 230000005855 radiation Effects 0.000 claims abstract description 108
- 238000000034 method Methods 0.000 claims abstract description 74
- 239000002019 doping agent Substances 0.000 claims abstract description 40
- 238000010521 absorption reaction Methods 0.000 claims abstract description 35
- 239000003989 dielectric material Substances 0.000 claims abstract description 25
- 230000003287 optical effect Effects 0.000 claims description 17
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 16
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 12
- 239000001569 carbon dioxide Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 235000013824 polyphenols Nutrition 0.000 claims 1
- 238000003491 array Methods 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract description 2
- 230000009102 absorption Effects 0.000 description 24
- 230000003595 spectral effect Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 2
- 229910052689 Holmium Inorganic materials 0.000 description 2
- 229910017502 Nd:YVO4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 2
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
Definitions
- the or each or some of the materials which are doped may be a dielectric material.
- the or each or some of the materials which are doped may be a polymer, dielectric material.
- the or each or some of the materials which are doped may be a resin, epoxy, phenolic, polyimide, or polytetrafluoethylene material, or an oxide ceramic material, nitride ceramic material or carbide ceramic material.
- the or each or some of the materials which are doped may contain embedded fibres such as aramid, glass, silica or carbon which provide added reinforcing strength.
- the or each or some of the materials which are not doped may be a non-dielectric material, e.g. a metal material, e.g.
- the methods may comprise using a laser radiation source comprising one or more gas excimer, copper vapour, HF, DF, carbon monoxide, or liquid dye lasers.
- the methods may comprise using a laser radiation source comprising one or more lasers and one or more optical elements which act to change the wavelength of the radiation produced by the or each laser.
- the optical element or elements may be nonlinear, and may comprise a harmonic generator, a wavelength mixer, an optical parametric oscillator or an optical parametric amplifier, or a combination of any of these.
- the methods may comprise using a laser radiation source comprising a combination of any of the above lasers.
- Figure 2 illustrates a four-layer printed circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Laser Beam Printer (AREA)
Abstract
L'invention concerne des procédés et dispositif (1) de perçage par laser d'un ou plusieurs trous dans un ou plusieurs matériaux (9) à l'aide d'une source de rayonnement laser (2) émettant un rayonnement possédant une (ou des) longueur(s) d'onde, ces procédés étant caractérisés en ce que l'on a traité au moins certains des matériaux (9) afin de changer leurs profondeurs d'absorption par rapport à la (aux) longueur(s) d'onde du rayonnement laser. On peut traiter le (les) matériau(x) (9) en leur ajoutant un ou plusieurs dopants, ces matériaux (9) pouvant comprendre des matériaux diélectriques, et on les utilise dans la construction de boîtiers d'interconnexion électrique, tels que des plaquettes de circuit imprimé ou des tableaux de connexion, des matrices de contact à boules, ou des boîtiers multipuces. La qualité des trous produits est supérieure à celle obtenue lorsque l'on perce un matériau non dopé à l'aide de la même source de rayonnement laser.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9812725.1A GB9812725D0 (en) | 1998-06-13 | 1998-06-13 | The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages |
GB9812725 | 1998-06-13 | ||
PCT/GB1999/001875 WO1999065639A1 (fr) | 1998-06-13 | 1999-06-14 | Perçage par laser de trous dans des materiaux |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1105248A1 true EP1105248A1 (fr) | 2001-06-13 |
Family
ID=10833672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99957032A Withdrawn EP1105248A1 (fr) | 1998-06-13 | 1999-06-14 | Per age par laser de trous dans des materiaux |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1105248A1 (fr) |
JP (1) | JP2002518181A (fr) |
GB (1) | GB9812725D0 (fr) |
WO (1) | WO1999065639A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1277648C (zh) * | 2000-05-23 | 2006-10-04 | 住友重机械工业株式会社 | 激光钻孔加工方法 |
GB2457720A (en) * | 2008-02-23 | 2009-08-26 | Philip Thomas Rumsby | Method for laser processing on the opposite sides of thin transparent substrates |
DE102014010175A1 (de) * | 2014-07-09 | 2016-01-14 | Hydac Filtertechnik Gmbh | Filterelement |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4894115A (en) * | 1989-02-14 | 1990-01-16 | General Electric Company | Laser beam scanning method for forming via holes in polymer materials |
DE4000561A1 (de) * | 1990-01-10 | 1991-07-11 | Laser Lab Goettingen Ev | Energiestrahlablationsverfahren |
JPH0577425A (ja) * | 1991-02-21 | 1993-03-30 | Hewlett Packard Co <Hp> | ノズルプレートおよびその製造方法 |
EP0925141A2 (fr) * | 1996-08-27 | 1999-06-30 | British Polythene Limited | Appareil destine a perforer des matieres de type bande continue |
-
1998
- 1998-06-13 GB GBGB9812725.1A patent/GB9812725D0/en not_active Ceased
-
1999
- 1999-06-14 EP EP99957032A patent/EP1105248A1/fr not_active Withdrawn
- 1999-06-14 WO PCT/GB1999/001875 patent/WO1999065639A1/fr not_active Application Discontinuation
- 1999-06-14 JP JP2000554501A patent/JP2002518181A/ja active Pending
Non-Patent Citations (1)
Title |
---|
See references of WO9965639A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1999065639A1 (fr) | 1999-12-23 |
JP2002518181A (ja) | 2002-06-25 |
GB9812725D0 (en) | 1998-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6576869B1 (en) | Method and apparatus for drilling microvia holes in electrical circuit interconnection packages | |
US5841099A (en) | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets | |
KR100258287B1 (ko) | 다층 타겟에 경유로를 형성하는 방법과 자외선 레이저 시스템(Ultraviolet laser system and method for forming vias in multi-layered targets) | |
US8415586B2 (en) | Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses | |
US4959119A (en) | Method for forming through holes in a polyimide substrate | |
EP0787219B1 (fr) | Procede laser de plaquage de traversees | |
US6713719B1 (en) | Method and device for laser drilling laminates | |
US20050087522A1 (en) | Laser processing of a locally heated target material | |
CN101175598A (zh) | 用于双头激光微加工系统的合成脉冲重复率处理 | |
Zheng et al. | Investigation of laser via formation technology for the manufacturing of high density substrates | |
GB2338201A (en) | Laser drilling of holes in materials | |
Gan et al. | Laser drilling of micro-vias in PCB substrates | |
EP1105248A1 (fr) | Per age par laser de trous dans des materiaux | |
CN1882408A (zh) | 对局部加热的目标材料的激光加工 | |
KR100504234B1 (ko) | 레이저천공 가공방법 | |
JP3830830B2 (ja) | レーザ加工方法 | |
JP2000202664A (ja) | レ―ザ穴あけ加工方法 | |
Illyefalvi-Vitéz et al. | Recent advancements in MCM-L imaging and via generation by laser direct writing | |
JP3343812B2 (ja) | バイアホール形成方法及びレーザ加工装置 | |
JP2002126886A (ja) | レーザ穴あけ加工装置 | |
Illyefalvi-Vitéz et al. | Laser via generation into flexible substrates | |
Lei et al. | Micro-via drilling applications with solid-state harmonic UV laser systems | |
JP3245820B2 (ja) | レーザ穴あけ加工方法 | |
Holiat | MSE 542 Flexible Electronics Term Paper I May 11, 2006 I | |
Venkat et al. | Laser processing-the future of HDI manufacturing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20010110 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT CH DE ES FR GB IT LI SE |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20030103 |